激光注入功率对激光辅助化学气相沉积金刚石薄膜的影响

对激光注入功率对激光辅助化学气相沉积金刚石薄膜的影响进行了数值模拟计算和实验研究. 应用二维气相输运模型和包括34个基元反应的化学动力学模型,对LACVD化学气相动力学进行了数值模拟研究;结果表明激光平均注入功率对衬底表面的CH3、H的浓度有影响,而对衬底表面的H2、C2H3的浓度则无影响.本文应用层堆积模型,以CH3作为SP3(金刚石)相生长的前驱物,而C2H3作为SP2(石墨)相生长的前驱物,其中SP3相的相对含量标志金刚石薄膜的质量,模拟计算研究了激光平均注入功率对金刚石薄膜生长速度和生长质量的影响. 实验利用XeCl(308 nm)准分子激光器作为碳源气体的解离光源,激光器单脉冲能量200 mJ,脉冲重复率2～8 Hz;丙酮为碳源气体;H2为辅助气体,通过2000°C的灯丝预先解离;(CH3)2CO/H2为0.4%;P型硅为衬底,温度870°C;生长出高质量金刚石薄膜;实验结果表明平均注入激光功率对金刚石薄膜的生长速度和质量有重要影响.理论计算结果与实验结果吻合.(OE11)     

液相法电沉积类金刚石薄膜的结构分析

采用脉冲直流电源,以甲醇有机溶液作为碳源,在低温(60 ℃～70 ℃)常压条件下,在(100)硅片上沉积了类金刚石薄膜.用扫描电镜、透射电镜、电子衍射谱和拉曼光谱表征了薄膜的表面形貌和结构.结果表明:类金刚石薄膜致密均匀,表面粗糙度小;Raman光谱在1 332 cm-1附近有一强峰,与金刚石的特征峰接近;电子衍射谱的分析结果表明薄膜中含有多晶金刚石和石墨碳相.     

基于金刚石薄膜的微间隙室制备

采用金刚石薄膜作为阴-阳极间绝缘介质层是一种新型的微间隙室(MGC)结构。该文详细介绍和讨论了采用常规的微细加工工艺制备基于金刚石薄膜介质层的MGC的制备技术,其典型结构为阳极微条宽20μm,微条间隔180μm,器件探测区面积为38 mm×34 mm。采用热丝CVD法制备的金刚石薄膜作为阴-阳极间绝缘介质层,厚7~8μm,具有(100)晶面结构。金刚石的刻蚀采用反应离子刻蚀,Cr作掩膜,O2和SF6为刻蚀气体,刻蚀速率为79 nm/min,与Cr的刻蚀比约为20:1。实验结果表明,采用的微加工结合自套准工艺可很好地解决金刚石薄膜的制备、图形化及金属阳极电极与金刚石薄膜的相互套准等金刚石薄膜的可加工性及兼容性问题,并制备出采用金刚石薄膜作为电极间绝缘介质层的新型MGC结构。     

脉冲激光沉积类金刚石膜技术

脉冲激光沉积(PLD)技术制备类金刚石(DLC)薄膜存在着金刚石相含量较低、石墨颗粒多、薄膜与衬底附着力差、膜内应力大等技术难题,为此,研究人员研究出了多种技术措施,如通过引入背景气体、超快激光、偏压、磁场以及加热等措施提高了薄膜金刚石相含量;采用金刚石或丙酮靶材、减小单脉冲能量等措施减少了石墨颗粒;采用间歇沉积、真空退火、超快激光等措施减少了膜内应力;合理没计过渡层改善了膜与衬底间的附着力等.这些技术有力地推动了脉冲激光沉积技术的发展.     

氮气压强对脉冲激光沉积类金刚石薄膜和红外光学特性的影响

为了研究氮气压强对脉冲激光沉积(PLD)类金刚石(DLC)薄膜和红外光学特性的影响,在脉冲激光沉积类金刚石薄膜的实验过程中,把沉积腔抽真空到10-5Pa,再在沉积腔中分别充入10-3、10-2和10-1Pa的氮气来沉积类金刚石薄膜。用拉曼光谱仪和X射线光电子能谱仪(XPS)对类金刚石薄膜的微结构与组成进行检测分析;用原子力显微镜(AFM)对薄膜的表面形貌进行检测分析;用傅里叶变换红外光谱仪(FTIR)对类金刚石薄膜的红外光透射谱进行检测分析。实验结果表明,沉积腔中的氮气压强从10-3Pa增加到10-1Pa时,类金刚石薄膜中sp3键含量增加;C-O和C=O含量减少;石墨晶粒尺寸减小;薄膜表面粗糙度显著增大。与此同时,氮气压强增加还导致类金刚石薄膜对红外光的增透作用减弱、增透范围变窄。     

掺N类金刚石薄膜的制备及微观结构分析

采用直流磁控溅射法,在光学玻璃衬底上沉积类金刚石(DLC)和掺N类金刚石薄膜(DLC:N)。用喇曼光谱、X射线光电子能谱(XPS)、傅里叶红外光谱(FTIR)等研究分析了所制备薄膜的微观结构。喇曼光谱的结果表明,掺N类金刚石膜仍具有典型的类金刚石膜结构,在类金刚石薄膜中掺N不仅有助于提高膜中sp3/sp2的比例,而且还能阻止sp2键向石墨相的转化,稳定并优化薄膜的类金刚石属性。FTIR表明,薄膜中N与C原子形成了C—N、CN及C≡N等键合方式。XPS谱表明,掺N类金刚石膜中除了C和N元素外,还出现了少量的O元素,而C1s和N1s的解谱显示,掺N后的类金刚石膜中的C、N结合能发生了明显的移动,由计算得出薄膜中N的含量为13.5%。薄膜的表面形貌图(AFM)表明,在类金刚石薄膜中掺N能够改善其表面形貌。     

金刚石薄膜的反应离子刻蚀

反应离子刻蚀是金刚石薄膜图形化的一种有效方法。研究了用Ｏ２及与Ａｒ的混合气体进行金刚石薄膜图形化刻蚀的主要工艺参数（射频功能、工作气压、气体流量、反应气体成分与比例等）对刻蚀速率和刻蚀界面形貌的影响，兼顾刻蚀速率和刻蚀平滑程度等关键因素，建立了金刚石薄膜刻蚀的优化工艺参数，达到了较满意的图形效果。     

金刚石薄膜研究进展述评

本文综述了金刚石薄膜(DTF)研究的最新进展,着重分析了金刚石薄膜的制备方法、成膜机理和各种性能表征技术。最后将金刚石薄膜和类金刚石薄膜进行了简单比较。     

类金刚石薄膜的Raman光谱分析及红外光谱特性

用酒精和氢气的混合气体为工作气体 ,在不同的酒精浓度下 (1 0 % ,1 5% ,2 0 % )下利用微波等离子体化学气相沉积法在较低温度下 (450～ 50 0℃ )以单晶硅为衬底制备出类金刚石薄膜样品。 Raman光谱分析了酒精浓度对薄膜中金刚石成份的含量的影响。红外光谱分析表明薄膜的红外光透过率与薄膜的表面形貌、薄膜结构有关。酒精浓度为 1 0 %时得到的金刚石薄膜的红外光透过率最高 ,达到 62～ 72 % ,同时透过率曲线因薄膜干涉而引起的振荡也最为显著。     

硫掺杂纳米金刚石薄膜的图形化生长

利用电子增强热丝化学气相沉积(EACVD)技术,以CH4/H2/H2S/Ar为工作气体,SiO2/Si为衬底,制备了硫掺杂金刚石薄膜。研究了利用光刻技术实现薄膜的图形化生长。结果表明:以SiO2作掩模的光刻技术能够使得硫掺杂金刚石薄膜在光滑SiO2/Si基片上很好地图形化生长。Hall效应检测表明硫掺杂金刚石薄膜为n型,给出了n型金刚石/p-Si异质结的反向I-V特性曲线。     

Nano-WO3 film modified macro-porous silicon（MPS） gas sensor

We prepared macro-porous silicon（MPS） by electrochemical corrosion in a double-tank cell on the surface of single-crystalline P-type silicon.Then,nano-WO₃ films were deposited on MPS layers by DC facing target reactive magnetron sputtering.The morphologies of the MPS and WO₃/MPS samples were investigated by using a field emission scanning electron microscope.The crystallization of WO₃ and the valence of the W in the WO₃/MPS sample were characterized by X-ray diffraction and X-ray photoelectron spectroscopy,respectively. The gas sensing properties of MPS and WO₃/MPS gas sensors were thoroughly measured at room temperature. It can be concluded that:the WO₃/MPS gas sensor shows the gas sensing properties of a P-type semiconductor gas sensor.The WO₃/MPS gas sensor exhibits good recovery characteristics and repeatability to 1 ppm NO₂.The addition of WO₃ can enhance the sensitivity of MPS to NO₂.The long-term stability of a WO₃/MPS gas sensor is better than that of an MPS gas sensor.The sensitivity of the WO₃/MPS gas sensor to NO₂ is higher than that to NH₃ and C₂H₅OH.The selectivity of the MPS to NO₂ is modified by deposited nano-WO₃ film.     

Fabrication of a 100%fill-factor silicon microlens array

正A simple method has been developed for the fabrication of a silicon microlens array with a 100%fill factor and a smooth configuration.The microlens array is fabricated by using the processes of photoresist(SU8- 2005) spin coating,thermal reflow,thermal treatment and reactive ion etching(RIE).First,a photoresist microlens array on a single-polished silicon substrate is fabricated by both thermal reflow and thermal treatment technologies. A typical microlens has a square bottom with size of 25μm,and the distance between every two adjacent microlenses is 5μm.Secondly,the photoresist microlens array is transferred to the silicon substrate by RIE to fabricate the silicon microlens array.Experimental results reveal that the silicon microlens array could be formed by adjusting the quantities of the reactive ion gases of SF_6 and O_2 to proper values.In this paper,the quantities of SF_6 and O_2 are 60 sccm and 50 sccm,respectively,the corresponding etch ratio of the photoresist and the silicon substrate is 1 to 1.44.The bottom size and height of a typical silicon microlens are 30.1μm and 3μm,respectively. The focal lengths of the microlenses ranged from 15.4 to 16.6μm.     

Tungsten oxide nanostructures:controllable growth and field emission

正Non-fully oxidized tungsten oxide(WO_(3-x)) nanostructures with controllable morphology were fabricated by adjusting the gas pressure in chemical vapor deposition.The comparative field emission(FE) measurements showed that the obtained W_(18)O_(49) nanowires have excellent FE property.The turn-on field was 7.1 V/μm for 10μA/cm~2 and the observed highest current density was 4.05 mA/cm~2 at a field of 17.2 V/μm.Good electron emission reproducibility was also observed during thermal evaporation and desorption testing.     

激光沉积红外窗口高性能类金刚石膜技术

类金刚石(DLC)膜具有宽光谱高透射率、高硬度、高热传导及高稳定性等优点,是红外窗口增透保护膜的优选,但现有方法制备的类金刚石膜难以满足高马赫数或海上盐雾等恶劣条件下的应用。激光法相比其他制备方法具有诸多优点,介绍了激光法制备DLC膜的原理及特点,并分析了实现工程应用的难题及关键技术。采用激光沉积法制备出综合性能优异的类金刚石膜,纳米硬度高达44 GPa、内应力仅0.8 GPa、临界刮擦载荷附着力为59.1 mN。正面镀DLC膜,背面镀普通增透膜的硫化锌、硅、锗等红外窗口的平均透射率达82%~91%。实现了150 mm基片的激光法大尺寸均匀薄膜,膜厚不均匀性≤±2%。制备的DLC膜红外窗口通过军标环境适应性试验,并已实现工程化应用。     

碳纳米管薄膜的电泳沉积及其场发射性能研究

利用电泳沉积法在铝片上制备了碳纳米管薄膜冷阴极。通过扫描电镜、Raman光谱观察分析了表面形貌和结构,并对场发射性能进行了测试。经过研磨处理的碳纳米管薄膜样品,开启电场为2V／μm,当电场强度为4V／μm时电流密度达到2600μA／cm^2,发光点密度大于10^4／cm^2。     

Dual Process Dielectric Formation for Decoupling Capacitors on Flexible Substrates

Large area, high density integrated capacitors within printed wiring boards can provide a substantial decoupling capacitance with very low parasitic inductance. Tantalum pentoxide (Ta₂O₅) is an excellent dielectric for this application due to the relatively high dielectric constant (~ 22-24), however the difficulty of fabricating large, defect-free capacitors has thus far prevented the realization of practical applications. This work demonstrates high performance capacitors with Ta₂O₅ dielectric developed with a two step oxidation scheme consisting of reactive sputtering followed by anodization. Thin films of Ta₂O₅ were deposited by reactive sputtering on silicon and also on Upilex^reg covered glass wafers using dc magnetron sputtering with a gas flow ratio of 10/90 O₂/Ar. In the two-step oxidation scheme, anodization is performed after reactively sputtering tantalum oxide films to obtain a densifled oxide structure. The electrical and physical properties of these two step sputtered/ anodized tantalum oxide films are shown to be superior to those of tantalum oxide films prepared by either anodization or sputtering alone. This work has shown that Ta₂O₅ is a potential dielectric for integrated capacitors that could be used in advanced packaging applications.     

基于可调谐CO2激光器的SF6差分光声检测研究

为了对电力场所SF₆气体浓度进行有效监测,采用光声光谱气体检测技术,基于波长可调谐CO₂激光器,设计了一套大气环境下的SF₆痕量气体检测系统,并提出一种差分光声光谱技术以提升光声系统的检测灵敏度。结果表明,所设计的SF₆气体检测光声系统的共振中心频率为1066Hz,品质因数为32.04,光声池常数为89.74Pa·m·W-1;利用单谱线光声法,在激光谱线10P12处检测SF₆气体的灵敏度为0.06×10-6（体积分数）;采用差分光声光谱气体技术后,在激光谱线10P12和10P16处3W强度调制光的照射下,光声系统的灵敏度提升到0.02×10-6（体积分数）。差分光声光谱技术能有效降低噪声影响,提升光声检测系统的灵敏度,具有一定的实用价值。     

A stacked capacitor technology with ECR plasma MOCVD(Ba,Sr)TiO3 and RuO2/Ru/TiN/TiSixstorage nodes for Gb-scale DRAMs

A Gb-scale DRAM stacked capacitor technology with (Ba,Sr)TiO₃ thin films is described, The four-layer RuO₂/Ru/TiN/TiSi_x, storage node configuration allows 500°C processing and fine-patterning down to the 0.20 μm size by electron beam lithography and reactive ion etching. Good insulating (Ba_0.4Sr_0.6)TiO₃ (BST) films with an SiO₂ equivalent thickness of 0.65 nm on the electrode sidewalls and leakage current of 1×10^{-/6 A}cm² at 1 V are obtained by ECR plasma MOCVD without any post-deposition annealing, A lateral step coverage of 50% for BST is observed on the 0.2 μm size storage node pattern, and the BST thickness on the sidewalls is very uniform, thanks to the ECR downflow plasma. Using this stacked capacitor technology, a sufficient cell capacitance of 25 fF for 1 Gb DRAMs can be achieved in a capacitor area of 0.125 μm² with only the 0.3 μm high-storage electrodes     

基于组合激光光源的双组分微量气体检测系统

CH₄和C₂H₂是变压器发生故障时两种重要的特征气体。为了实现对变压器中溶解的微量CH₄和C₂H₂气体含量检测的需求, 采用激光光声光谱气体检测技术, 通过分析CH₄和C₂H₂气体的近红外吸收谱线, 选取合适的激光光源并确定激光调制参数; 设计并搭建了一套以双激光光源和非共振光声池为核心的光声光谱微量CH₄和C₂H₂气体检测系统, 获得了系统对CH₄和C₂H₂气体检测灵敏度和低含量检测误差。结果表明, CH₄和C₂H₂气体分别在体积分数为0~1000×10-6和0~500×10-6的范围内具有良好的线性响应, 每10-6体积分数的检测响应度分别为5.8969μV和16.1831μV; 在低含量CH₄/C₂H₂混合气体对系统的重复性和精度测试中, CH₄气体体积分数为3.00×10-6时的检测最大绝对误差为0.30×10-6, C₂H₂气体体积分数为0.50×10-6时的检测最大绝对误差为0.20×10-6。此研究结果满足测量误差的技术指标要求, 实现了对微量CH₄和C₂H₂气体的高灵敏度检测。     

1.65μm CH4低温吸收光谱特性研究

在CH₄吸收光谱参数运用于对地球大气以及外星球的遥感探测和模拟上,CH₄光谱参数的准确性十分重要,尤其是在低温情况下的光谱参数。HITRAN数据库中CH₄给出的低温情况下的参数并不完整,同时存在较大的误差.为了对1.65μm的CH₄低温吸收光谱进行测量,采用窄线宽的二极管激光器作为光源,结合自主设计的低温装置,测量了CH₄的低温吸收光谱特性,同时给出6039.70 cm^-1处CH₄的低温吸收光谱作为典型给以阐述,并对吸收谱线自展宽系数的温度依赖系数的测定方法进行了讨论。