钎焊金刚石锯片加工HRB400钢的模型及试验分析

尝试以HRB400螺纹钢的切屑厚度为切入点,对单层钎焊金刚石锯片锯切性能进行研究。建立锯片切割螺纹钢理论模型,通过计算得单颗金刚石最大锯切厚度值。通过试验得到的切屑类型有剪切屑及少量熔球屑,对剪切屑厚度值进行测量并与切屑厚度理论计算值进行比较,发现两者之间的数值吻合很好。经过分析得到螺纹钢锯切加工模型,探讨金钢石锯片加工钢铁材料时的锯切机理。     

刚性的球头铣刀切削力模型

基于切削力与切屑负载之间的经验关系,通过对球头铣刀的微分化方法,建立了球头铣刀基本切削力模型,并着重研究刀具的径向跳动对径向未变形切屑厚度的影响,提出了刚性的球刀铣刀切削力模型,最后用切槽实验对模型进行了验证。     

微细切削中侧刃的切削影响研究

尺度效应是微切削工艺中的一种特殊现象,通常用最小未变形切屑厚度来判定尺度效应发生的临界点。为了更好地理解微细铣削的切削机理,对铣刀钝圆半径与尺度效应之间的关系进行深入研究是有必要的。由于在铣削加工过程中,刀具大多数为径向进给,侧刃为主要切削刃,因此这里对仅有侧刃参与切削的情况进行了仿真与试验研究。通过对仿真中切屑形貌与试验中表面粗糙度的分析,分别确定了仿真与试验的最小未变形切屑厚度值。仿真与试验结果表明,微细铣削的两种工艺方式对最小未变形切屑厚度的影响有限,最小未变形切屑厚度为（0.28～0.40）倍的铣刀钝圆半径。同时,工件的材料属性对刀具侧刃的最小未变形切屑厚度有一定的影响。本研究可以用于指导微细铣削加工中对于不同刀具钝圆半径及工件材料加工参数的选择和量化,提高工件加工质量具有重要参考价值。     

高速干切削过程的三维有限元仿真与试验

针对淬硬轴承钢的干态车削过程,在Abaqus中建立考虑PCBN刀尖半径的热力耦合三维有限元切削模型。首次仿真预测出周期性绝热剪切引起的三维锯齿形切屑,并且切屑在刀屑接触面上的特征线和材料挤压流动方向,以及切屑自由表面沿进给量方向和沿切削深度方向的切屑形态与实际加工形成的切屑形态都能够很好的吻合。通过对切削力、切削温度,切削力和切屑形态预测分析,并与实验数据的比较,揭示了刀尖半径和主偏角对切削过程的影响。研究发现:刀尖半径增大到0.8mm时,工件材料挤压变形更显著,平均切向力增大了17N,与实验结果比较相符。斜角切削过程中材料受到的挤压变形力更大,温升更加明显,最高温度达到1289℃,与试验测量的切削区平均温度1100℃接近;预测的平均切向力为150N,与实验值相差只有7%。     

航空铝合金7075-T7451薄壁件铣削加工模拟及变形预测

在考虑刀具变形、工件及刀具材料性能参数的基础上,建立了三维斜角切削力有限元模型,利用有限元分析软件ABAQUS6.8对航空铝合金7075-T7451材料进行了铣削仿真模拟,获得了切削力、工件变形情况、上层材料对下层材料切削力的影响、切屑形状与大小等规律。其次,针对航空铝合金7075-T7451材料铣削过程进行了切削试验,结果表明所提出的切削力有限元模型具有可行性,可以有效地预测薄壁件的铣削加工变形。     

金刚石刀具振动切削颗粒增强金属基复合材料的切削机理研究

金属基复合材料(MMCs)具有强度高、密度小的特点,可广泛应用于航空航天和汽车领域,但是这种材料的难加工特性限制了其进一步推广。采用超声振动切削可以降低切削力和切削热效应,对于难加工材料和难加工零件的精密加工具有特效[1]。本文采用金刚石刀具进行切削试验,对超声振动切削金属基复合材料的切屑形态、切屑变形系数和剪切角、切削表面微观形貌与粗糙度、加工表面残余应力及刀具磨损等几方面进行了深入的研究,并与非振动切削方法进行了对比。     

单颗金刚石磨粒切削氮化硅陶瓷仿真与试验研究

为探索氮化硅陶瓷单颗磨粒切削加工的机理,进行单颗金刚石磨粒切削氮化硅陶瓷的仿真与试验。选用截角八面体模拟金刚石磨粒,基于Johnson-Holmquist ceramic硬脆材料本构模型,采用有限元网格法进行单颗磨粒直线切削仿真,分析工件材料的切屑去除、划痕形貌、应力动态变化与分布、切削力变化等现象,以及工艺参数对切削力的影响。制备单颗金刚石磨粒工具,在平面磨床上进行单颗磨粒切削氮化硅陶瓷的试验,进一步分析划痕形貌、切削力的变化,并验证有限元仿真的正确性。研究表明,划痕光直平整,塑性隆起很少,边缘存在较大尺寸的破碎,划痕内有局部小尺寸的破碎;划痕的深度和宽度比磨粒的切削深度和宽度尺寸略大。应力与切削力存在动态波动。随着砂轮速度的增加,切向力和法向力减小;随着切削深度的增加,切向力和法向力增大。切削力比在4～6之间变化。     

圆柱齿轮滚切力可视化及切削参数对滚切力的影响研究

滚齿是重要的齿轮加工工艺之一,其加工成形过程复杂,并且涉及较多切削参数。为了量化切削参数对滚切力的影响,研究了一种基于三维几何仿真的滚齿切削力预测方法。根据滚刀和工件的几何参数以及切削参数确定加工过程中滚刀和工件的相对位置和运动关系,在CAD环境中实现滚齿运动过程的三维仿真,并得到未变形切屑的三维模型;根据选定的切削力模型,利用未变形切屑模型的截面尺寸计算单个切削刃的瞬时切削力,得到滚齿的整体受力过程;定量分析了不同切削参数对滚齿切削力的影响。该预测模型有助于滚齿加工工艺过程的优化设计,以提升加工质量和效率,降低加工成本。     

机械传动件深槽面磨削加工切削力和切削速度分析

为了提高深槽结构件表面的磨削加工精度,本文采用信号过滤的方式对磨削力进行测定,研究砂轮转速对深槽磨削加工面磨削力和表面形貌的影响。研究结果表明:当砂轮转速增大后,引起切向切削力与法向切削力的同时下降,法向切削力比切向切削力高。砂轮转速增大会引起磨削区内产生更多的磨粒数量,最大未变形切屑厚度发生减小,导致成屑磨粒的切入深度降低。     

考虑刀杆柔性的球头铣刀切削力模型的研究

建立了球头铣刀切削力模型，并基于刀具弹性变形模型及刀具避让的切屑厚度数学表达式，建立了切屑厚度与刀具变形量、刀具切削参数之间的数学关系，并提出了切削力收敛算法。最后，通过切削实验对切削力模型进行了验证。     

EFFECT OF CRYSTALLOGRAPHIC ORIENTATION ON CUTTING FORCES AND SURFACE FINISH IN DUCTILE CUTTING OF KDP CRYSTALS

In order to investigate the influence of material anisotropy in ductile cutting of Potassium Dihydrogen Phosphate (KDP) crystals, experiments of face cutting of (001) plane of KDP crystals are carried out by using an ultra-precision lathe with a single point diamond tool. The cutting forces, surface finish, and surface roughness in all crystallographic orientations of the machined surface are measured, and a power spectrum analysis method is used to reveal the cutting force patterns. The experimental results show that the cutting forces and surface roughness vary greatly with different crystallographic orientations of KDP crystal, and that amplitude variation of cutting forces and surface finish is closely related with the cutting parameter of the maximum undeformed chip thickness. With the maximum undeformed chip thickness below 30 nm, the amplitude variation of cutting force and surface finish is minimized, and a super-smooth surface with consistent surface finish in all the crystallographic orientations can be achieved. The surface roughness is 2.698 nm (Ra) measured by Atomic Force Microscope (AFM). These findings provide criteria for achieving a large-scale KDP crystal with consistent super-smooth surface using ductile cutting technology.     

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

Ductile mode cutting of silicon wafers can be achieved under certain cutting conditions and tool geometry. An experimental investigation of the critical undeformed chip thickness in relation to the tool cutting edge radius for the brittle-ductile transition of chip formation in cutting of silicon wafers is presented in this paper. Experimental tests for cutting of silicon wafers using diamond tools of different cutting edge radii for a range of undeformed chip thickness are conducted on an ultra-precision lathe. Both ductile and brittle mode of chip formation processes are observed in the cutting tests. The results indicate that ductile cutting of silicon can be achieved at certain values of the undeformed chip thickness, which depends on the tool cutting edge radius. It is found that in cutting of silicon wafers with a certain tool cutting edge radius there is a critical value of undeformed chip thickness beyond which the chip formation changes from ductile mode to brittle mode. The ductile-brittle transition of chip formation varies with the tool cutting edge radius. Within the range of cutting conditions in the present study, it has also been found that the larger the cutting edge radius, the larger the critical undeformed chip thickness for the ductile-brittle transition in the chip formation.     

An experimental study of edge radius effect on cutting single crystal silicon

According to the hypothesis of ductile machining, brittle materials undergo a transition from brittle to ductile mode once a critical undeformed chip thickness is reached. Below this threshold, the energy required to propagate cracks is believed to be larger than the energy required for plastic deformation, so that plastic deformation is the predominant mechanism of material removal in machining these materials in this mode. An experimental study is conducted using diamond cutting for machining single crystal silicon. Analysis of the machined surfaces under a scanning electron microscope (SEM) and an atomic force microscope (AFM) identifies the brittle region and the ductile region. The study shows that the effect of the cutting edge radius possesses a critical importance in the cutting operation. Experimental results of taper cutting show a substantial difference in surface topography with diamond cutting tools of 0° rake angle and an extreme negative rake angle. Cutting with a diamond cutting tool of 0° rake angle could be in a ductile mode if the undeformed chip thickness is less than a critical value, while a ductile mode cutting using the latter tool could not be found in various undeformed chip thicknesses.     

Research on single-point diamond fly-grooving of brittle materials

The purpose of this paper is to investigate the machining mechanisms that accompany the single-point diamond fly-cutting operation in grooving of brittle materials. Single-point diamond fly-cutting is widely used in precision machining of free-form optics, semiconductor devices, and micro-electromechanical system (MEMS) components among many others. The undeformed chip zone was analyzed and its relation to the critical brittle/ductile transition depth of cut was discussed. Then, a mechanics-based model was proposed to describe the material stress condition under the diamond tool. The machining parameters were incorporated into the model to understand fly-cutting behavior. It was shown that the fly-cutting technique is highly suitable for the ductile removal of brittle materials by generating large compressive pressures in the chip formation zone. This condition can be further enhanced by a small feedrate and a large negative rake angle of the diamond tool used. The theoretical results were substantiated and verified by fly-grooving experiments performed on mono-crystalline silicon.     

径向跳动对球面铣刀切削力的影响研究

研究了径向跳动对刀齿的实际切削半径、切屑形状以及切屑厚度的影响机理。研究了各刀齿沿刀刃螺旋线的切削微元实际切削半径的数学表示和变化规律,实际切削半径的变化改变了刀齿的切削路径,使各刀齿上切屑形状分布不均匀。建立了三维切削下切屑厚度的数学表示,提出了递延累加切屑厚度计算算法。实验验证表明,计算的切削力与测量结果能很好地吻合,瞬时切削力、切削力峰值、平均切削力的预测精度达到85%以上。     

单晶硅料摆辅助多金刚线切片的锯切力模型研究

料摆辅助多金刚线切片技术是实现硬脆材料高精高效加工行之有效的工艺技术,探明其工艺参数、锯切力和切片质量的定量关系,具有重要的现实意义。在研究金刚线运动轨迹的基础上,推导了考虑线弓影响的切割长度变化公式;结合压痕断裂力学和试验研究,建立并验证了料摆辅助切片的锯切力模型。开展了不同工艺参数对锯切力的影响分析,结果表明,料摆辅助加工可以降低锯切力近50%;摆动角度对最大切割力的影响较小,但摆角增大会加剧"锯齿形波动"周期内的锯切力极值幅度,摆动角速度对"锯齿形波动"的周期影响较大;在恒定进给速度条件下,进给速度越高,锯切力越大;在变速进给条件下,最大锯切力可降低12%左右。进一步进行了摆角分别为0°、3°、5°和7°的多金刚线切割单晶硅实验,试验表明,料摆辅助切片加工有助于减少硅片表面因脆性崩裂产生的表面材料破损、深凹坑等缺陷;相较于普通切片加工,在摆角5°工况时,工件的表面粗糙度和硬化层厚度最大分别降低30.1%和20.1%。     

NANOSCALE CUTTING OF MONOCRYSTALLINE SILICON USING MOLECULAR DYNAMICS SIMULATION

It has been found that the brittle material, monocrystalline silicon, can be machined in ductile mode in nanoscale cutting when the tool cutting edge radius is reduced to nanoscale and the undeformed chip thickness is smaller than the tool edge radius. In order to better understand the mechanism of ductile mode cutting of silicon, the molecular dynamics (MD) method is employed to simulate the nanoscale cutting of monocrystalline silicon. The simulated variation of the cutting forces with the tool cutting edge radius is compared with the cutting force results from experimental cutting tests and they show a good agreement. The results also indicate that there is silicon phase transformation from monocrystalline to amorphous in the chip formation zone that can be used to explain the cause of ductile mode cutting. Moreover, from the simulated stress results, the two necessary conditions of ductile mode cutting, the tool cutting edge radius are reduced to nanoscale and the undeformed chip thickness should be smaller than the tool cutting edge radius, have been explained.     

Improved dynamic cutting force model in ball-end milling. Part I: theoretical modelling and experimental calibration

An accurate cutting force model of ball-end milling is essential for precision prediction and compensation of tool deflection that dominantly determines the dimensional accuracy of the machined surface. This paper presents an improved theoretical dynamic cutting force model for ball-end milling. The three-dimensional instantaneous cutting forces acting on a single flute of a helical ball-end mill are integrated from the differential cutting force components on sliced elements of the flute along the cutter-axis direction. The size effect of undeformed chip thickness and the influence of the effective rake angle are considered in the formulation of the differential cutting forces based on the theory of oblique cutting. A set of half immersion slot milling tests is performed with a one-tooth solid carbide helical ball-end mill for the calibration of the cutting force coefficients. The recorded dynamic cutting forces are averaged to fit the theoretical model and yield the cutting force coefficients. The measured and simulated dynamic cutting forces are compared using the experimental calibrated cutting force coefficients, and there is a reasonable agreement. A further experimental verification of the dynamic cutting force model will be presented in a follow-up paper.     

Prediction of cutting forces in helical milling process

The prediction of cutting forces is important for the planning and optimization of machining process in order to reduce machining damage. Helical milling is a kind of hole-machining technique with a milling tool feeding on a helical path into the workpiece, and thus, both the periphery cutting edges and the bottom cutting edges all participated in the machining process. In order to investigate the characteristics of discontinuous milling resulting in the time varying undeformed chip thickness and cutting forces direction, this paper establishes a novel analytic cutting force model of the helical milling based on the helical milling principle. Dynamic cutting forces are measured and analyzed under different cutting parameters for the titanium alloy (Ti–6Al–4V). Cutting force coefficients are identified and discussed based on the experimental test. Analytical model prediction is compared with experiment testing. It is noted that the analytical results are in good agreement with the experimental data; thus, the established cutting force model can be utilized as an effective tool to predict the change of cutting forces in helical milling process under different cutting conditions.     

磷酸二氢钾晶体飞切过程中温度场的分布及其对切屑形貌的影响

研究了磷酸二氢钾(KDP)晶体飞切加工过程中温度场的分布,探索了切削温度对KDP晶体切削过程的影响。首先,采用热力耦合有限元分析对KDP晶体切削过程进行了仿真,获得了不同切削深度下材料内部温度场的分布。分别使用飞切机床和纳米压痕仪在不同速度下切削KDP晶体,发现不同切削速度下形成的切屑的微观形貌存在显著差异,分析指出这可能是由于在不同切削速度下切削区域温度差异导致的。最后,对低速加工过程中获得的切屑进行加热试验,并观测了不同温升条件下切屑微观形貌的变化。飞切加工仿真实验显示:当切深为200nm时,切削区域的温度达到110℃;而实际实验结果表明:当温度超过100℃时,切屑的微观形貌会发生明显变化。综合仿真及实验结果可知:在KDP晶体飞切加工过程中切削区域的温度将超过100℃,因此在对KDP晶体切削机理进行研究时,必须考虑温度对材料力学性能及其去除过程的影响。