Strength prediction of T-peel joints by a hybrid spot-welding/adhesive bonding technique

The need of joining methods that best meet the design requirements has led to the increased use of adhesive joints at the expense of welding, fastening and riveting. Hybrid weld-bonded joints are obtained by combining adhesive bonding with a welded joint, providing superior strength and stiffness, and higher resistance to peeling and fatigue. In the present work, an experimental and numerical study of welded, adhesive and hybrid (weld-bonded) T-peel joints under peeling loads is presented. The brittle Araldite® AV138, the moderately ductile Araldite® 2015 and the ductile Sikaforce® 7752 were the considered adhesives. An analysis of the experimental values and a comparison of these values with Finite Element Method (FEM) results in Abaqus® were carried out, which included a stress analysis in the adhesive and strength prediction by Cohesive Zone Models (CZM) considering failure simulation of both the adhesive layer and weld-nugget. It was found that the Sikaforce® 7752 performs best in the bonded and hybrid configurations. The good agreement between the experimental and numerical results enabled the validation of CZM to predict the strength of adhesive and hybrid T-peel joints, giving a basis for reducing the design time and enabling the optimization of these joints.     

Testing different cohesive law shapes to predict damage growth in bonded joints loaded in pure tension

ABSTRACT

Adhesive bonding is a widely used joining method because of specific advantages compared to the traditional fastening methods. Cohesive zone modelling (CZM) is currently the most widely used technique for strength prediction. CZM supposes the characterization of the CZM laws in tension and shear. This work evaluated the tensile fracture toughness (G_IC) and CZM laws of bonded joints with three adhesives by the double-cantilever beam (DCB) test. The experimental work consisted of the adhesives’ tensile fracture characterization by the J-integral technique. As the main novelty of this work, the precise shape of the cohesive law of adhesives ranging from brittle to highly ductile was defined by the direct method, using a digital image correlation method to evaluate the tensile relative displacement (δ_n) of the adhesive layer at the crack tip and adherends’ rotation at the crack tip (?_o). Moreover, finite element (FE) simulations permitted assessing the accuracy of triangular, trapezoidal and linear-exponential CZM laws in predicting the experimental behaviour of the DCB bonded joints with markedly distinct behaviours. As output of this work, fracture data and information regarding the applicability of these CZM laws to each type of adhesive is provided, allowing the subsequent strength prediction of bonded joints.     

Adhesive Selection for Single Lap Bonded Joints: Experimentation and Advanced Techniques for Strength Prediction

The integrity of multi-component structures is usually determined by their unions. Adhesive-bonding is often used over traditional methods because of the reduction of stress concentrations, reduced weight penalty, and easy manufacturing. Commercial adhesives range from strong and brittle (e.g., Araldite® AV138) to less strong and ductile (e.g., Araldite® 2015). A new family of polyurethane adhesives combines high strength and ductility (e.g., Sikaforce® 7888). In this work, the performance of the three above-mentioned adhesives was tested in single lap joints with varying values of overlap length (L_O). The experimental work carried out is accompanied by a detailed numerical analysis by finite elements, either based on cohesive zone models (CZM) or the extended finite element method (XFEM). This procedure enabled detailing the performance of these predictive techniques applied to bonded joints. Moreover, it was possible to evaluate which family of adhesives is more suited for each joint geometry. CZM revealed to be highly accurate, except for largely ductile adhesives, although this could be circumvented with a different cohesive law. XFEM is not the most suited technique for mixed-mode damage growth, but a rough prediction was achieved.     

Strength Improvement of Adhesively-Bonded Joints Using a Reverse-Bent Geometry

Adhesive bonding of components has become more efficient in recent years due to the developments in adhesive technology, which has resulted in higher peel and shear strengths, and also in allowable ductility up to failure. As a result, fastening and riveting methods are being progressively replaced by adhesive bonding, allowing a big step towards stronger and lighter unions. However, single-lap bonded joints still generate substantial peel and shear stress concentrations at the overlap edges that can be harmful to the structure, especially when using brittle adhesives that do not allow plasticization in these regions. In this work, a numerical and experimental study is performed to evaluate the feasibility of bending the adherends at the ends of the overlap for the strength improvement of single-lap aluminium joints bonded with a brittle and a ductile adhesive. Different combinations of joint eccentricity were tested, including absence of eccentricity, allowing the optimization of the joint. A Finite Element stress and failure analysis in ABAQUS^® was also carried out to provide a better understanding of the bent configuration. Results showed a major advantage of using the proposed modification for the brittle adhesive, but the joints with the ductile adhesive were not much affected by the bending technique.     

Optimization study of hybrid spot-welded/bonded single-lap joints

Joining of components with structural adhesives is currently one of the most widespread techniques for advanced structures (e.g., aerospace or aeronautical). Adhesive bonding does not involve drilling operations and it distributes the load over a larger area than mechanical joints. However, peak stresses tend to develop near the overlap edges because of differential straining of the adherends and load asymmetry. As a result, premature failures can be expected, especially for brittle adhesives. Moreover, bonded joints are very sensitive to the surface treatment of the material, service temperature, humidity and ageing. To surpass these limitations, the combination of adhesive bonding with spot-welding is a choice to be considered, adding a few advantages like superior static strength and stiffness, higher peeling and fatigue strength and easier fabrication, as fixtures during the adhesive curing are not needed. The experimental and numerical study presented here evaluates hybrid spot-welded/bonded single-lap joints in comparison with the purely spot-welded and bonded equivalents. A parametric study on the overlap length (L_O) allowed achieving different strength advantages, up to 58% compared to spot-welded joints and 24% over bonded joints. The Finite Element Method (FEM) and Cohesive Zone Models (CZM) for damage growth were also tested in Abaqus^® to evaluate this technique for strength prediction, showing accurate estimations for all kinds of joints.     

Mechanical characterization of adhesive joints with dissimilar substrates for marine applications

The simplicity and efficiency of the adhesive joints have increased more and more their use in many fields. In ship construction the need to join different materials, such as the bonding of the hull/deck, the sea chest, the portholes, the windshields, the panels of cabins, etc. leads to choosing increasingly the adhesive joints. In this work we have evaluated the effects of both SMP (Silyl Modified Polymer) based adhesives and sealants on single lap joints (SLJs) with dissimilar substrates. Three pairs of single lap joints were taken into account among dissimilar adherends: stainless steel (AISI 316) with PMMA (or Altuglas^®) and monolithic composite laminates bonded with glass or PMMA. Before tensile testing some SLJ samples were subjected to a three-dimensional computed tomographic analysis to evaluate how the presence of possible defects in the adhesive layer affects the failure mode. A design of experiments was defined in order to quantify the effect of the considered factors and their correlation. The obtained maximum tensile stress values confirm the data provided by the manufacturer, approximately between 2 and 2.5 MPa, showing generally cohesive fracture. Finally the considered SMP adhesives and sealants are well suited for the chosen different substrates, although special attention should be placed on the glass–GFRP joint as it is confirmed by statistical analysis.     

Modelling adhesive joints with cohesive zone models: effect of the cohesive law shape of the adhesive layer

Adhesively-bonded joints are extensively used in several fields of engineering. Cohesive Zone Models (CZM) have been used for the strength prediction of adhesive joints, as an add-in to Finite Element (FE) analyses that allows simulation of damage growth, by consideration of energetic principles. A useful feature of CZM is that different shapes can be developed for the cohesive laws, depending on the nature of the material or interface to be simulated, allowing an accurate strength prediction. This work studies the influence of the CZM shape (triangular, exponential or trapezoidal) used to model a thin adhesive layer in single-lap adhesive joints, for an estimation of its influence on the strength prediction under different material conditions. By performing this study, guidelines are provided on the possibility to use a CZM shape that may not be the most suited for a particular adhesive, but that may be more straightforward to use/implement and have less convergence problems (e.g. triangular shaped CZM), thus attaining the solution faster. The overall results showed that joints bonded with ductile adhesives are highly influenced by the CZM shape, and that the trapezoidal shape fits best the experimental data. Moreover, the smaller is the overlap length (L_O), the greater is the influence of the CZM shape. On the other hand, the influence of the CZM shape can be neglected when using brittle adhesives, without compromising too much the accuracy of the strength predictions.     

Stress-free temperature in a mixed-adhesive joint

Adhesive joints used in supersonic aircraft fuselage need to withstand low (?55°C), as well as high (200°C) temperatures. However, there are no adhesives suitable for the whole temperature range. A solution would be a joint with a combination of a low-temperature adhesive and a high-temperature adhesive, called a mixed-adhesive joint. In a bonded joint, the thermal stresses are generated essentially by the different thermal expansion properties of the adhesive and the adherends and, to a lesser extent, by the shrinkage of the adhesive produced by curing. The case of a mixed-adhesive joint is more complicated because there are two adhesives with different glass transition temperatures (T _g). To determine the stress-free temperature in a mixed adhesive joint, sandwich specimens of aluminium–adhesive–CFRP (carbon-fibre-reinforced plastic) were fabricated and the thermal strains were measured with strain gauges. In a mixed adhesive joint, two stress-free temperatures were found: the stress-free temperature of the high temperature adhesive, which is its cure temperature, and the stress-free temperature of the low temperature adhesive, which is its T _g.     

Effect of Adhesive Ductility on Cyclic Debond Mechanism in Composite-to-Composite Bonded Joints

An investigation of an adhesively bonded composite joint with a brittle adhesive was conducted to characterize both the static and fatigue debond growth mechanism under mode I and mixed mode I-II loadings. The bonded system consisted of graphite/epoxy adherends bonded with FM-400 adhesive. Two specimen types were tested: (1) a double-cantilever-beam specimen for mode I loading and (2) a cracked-lap-shear specimen for mixed mode I-II loading. In all specimens tested, failure occurred in the form of debond growth either in a cohesive or adhesive manner. The total strain-energy-release rate is not the criterion for cohesive debond growth under static and fatigue loading in the birttle adhesive as observed in previous studies with the ductile adhesives. Furthermore, the relative fatigue resistance and threshold value of cyclic debond growth in terms of its static fracture strength is higher in the brittle adhesive than its counterpart in the ductile adhesive.     

Validation of pure tensile and shear cohesive laws obtained by the direct method with single-lap joints

Joining with structural adhesives in the aeronautical industry dates back to some decades, although only more recently this technique has been implemented to load bearing parts in other industries. This technique enables joining steel with aluminium or fibre-reinforced composites, with a major weight advantage. Cohesive Zone Models (CZM) are an accurate design method for bonded structures but, depending on the adhesive type and specimen's geometry, the accuracy of the strength predictions may be highly compromised by the choice of the cohesive laws. This work presents a validation of tensile and shear CZM laws of three adhesives obtained by the direct method applied to Double-Cantilever Beam (DCB) and End-Notched Flexure (ENF) tests, respectively. The validation is carried out by considering a mixed-mode bonded geometry (the single-lap joint) with different overlap lengths (L_O) and adhesives of distinct ductility. Initially, the precise shape of the cohesive law in tension and shear of the adhesives is estimated, followed by their simplification to parameterized triangular, trapezoidal and linear-exponential CZM laws. Validation of the CZM laws was accomplished by direct comparison of the load-displacement (P-δ) curves and maximum load (P_m) of the single-lap joints as a function of the tested L_O values. The strength predictions were accurate for a CZM law shape consistent with the adhesive type, although the differences between CZM shapes were not too significant.     

Cleavage behavior of bonds made with adherends capable of plastic yield

The failure behavior of adhesive joints under cleavage stresses depends upon the thickness of the adherend. With thick, rigid adherends failure occurs by rapidly propagated adhesive rupture. Thinner adherends can exhibit plastic flexural yield, the subsequent adhesive failure then being progressive and strain-limited, and occurring only in the region of bond directly adjacent to the yielding adherend. A fairly sharp discontinuity between these two types of behavior occurs over a small range of adherend thickness T. Work to rupture can differ by more than an order of magnitude, for otherwise identical joints having T above or below the transitional range (around T_c). For T > T_c the applied load P causing rupture is proportional to T^1.5 while the moment arm remains constant, as predicted by Yurenka. For T < T_c the turning moment during failure is proportional to T² and is substantially independent of the nature of the adhesive. Empirically, the radius of the yielded adherend after failure is proportional to T. The manner of interaction of various adhesive mechanical properties in defining P in the two ranges and, thereby, T_c, are related to this and other empirical correlations. The initial free moment arm in the joint, L, determines the stability of peel at initiation of adhesive rupture. Reducing L leads ultimately to instability. The change of controlling factors as L → 0 is discussed.     

Accuracy of cohesive laws with different shape for the shear behaviour prediction of bonded joints

The use of adhesive bonding as a joining technique is increasingly being used in many industries because of its convenience and high efficiency. Cohesive Zone Models (CZM) are a powerful tool for the strength prediction of bonded joints, but they require an accurate estimation of the tensile and shear cohesive laws of the adhesive layer. This work evaluated the shear fracture toughness (J_IIC) and CZM laws of bonded joints for three adhesives with distinct ductility. The End-Notched Flexure (ENF) test geometry was used. The experimental work consisted of the shear fracture characterization of the bond by the J-integral. Additionally, by this technique, the precise shape of the cohesive law was defined. For the J-integral, digital image correlation was used for the evaluation of the adhesive layer shear displacement at the crack tip during the test, coupled to a Matlab sub-routine for extraction of this parameter automatically. Finite Element Method (FEM) simulations were carried out in Abaqus® to assess the accuracy of triangular, trapezoidal and linear-exponential CZM laws in predicting the experimental behaviour of the ENF tests. As output of this work, fracture data is provided in shear for the selected adhesives, allowing the subsequent strength prediction of bonded joints.     

Glass/epoxy composites and aluminium alloy joint using Kevlar® intermediate layer and nanoclay-reinforced epoxy adhesive

Adhesive lap joint between glass fibre/epoxy composites and aluminium alloy (2014 T4) was prepared by an in situ moulding process using a matched die mould. The surface of aluminium alloy was treated with chromic acid before adhesive bonding. Lap shear strength and fatigue life were evaluated in tensile mode and tension–compression mode (at 40% of lap shear load of adhesive joint), respectively. Knurling on the surface of aluminium alloy improved the lap shear strength of the adhesive joint but did not influence the fatigue life of the same. Lap shear strength and fatigue life of adhesive joint made with neat epoxy adhesive and reinforcement of an intermediate layer of Kevlar^® between glass/epoxy composite and aluminium alloy were observed to be 0.44?kg/mm² and 3.6?×?10⁵ cycles, respectively. In another case, lap shear strength and fatigue life of similar type of adhesive joint made from nanoclay (Cloisite 30B)-reinforced epoxy adhesive and without reinforcement of an intermediate layer of Kevlar^® were observed to be 0.38?kg/mm² and 2.3?×?10⁵ cycles, respectively. Whereas, lap shear strength and fatigue life of adhesive joint made from nanoclay-reinforced epoxy adhesive along with the reinforcement of an intermediate layer of Kevlar^® were 0.48?kg/mm² and 3.9?×?10⁵ cycles, respectively. Therefore, adhesive joint made from nanoclay-reinforced epoxy adhesive along with the reinforcement of an intermediate layer of Kevlar^® was the best.     

Effect of Adhesive Type and Thickness on the Lap Shear Strength

The effect of the adhesive thickness on the bond strength of single-lap adhesive joints is still not perfectly understood. The classical elastic analyses predict that the strength increases with the adhesive thickness, whereas experimental results show the opposite. Various theories have been proposed to explain this discrepancy, but more experimental tests are necessary to understand all the variables.

The objective of the present study was to assess the effect of the adhesive thickness on the strength of single-lap joints for different kinds of adhesives. Three different adhesives were selected and tested in bulk. The strain to failure in tension ranged from 1.3% for the most brittle adhesive to 44% for the most ductile adhesive. The adherend selected was a high-strength steel to keep the adherends in the elastic range and simplify the analysis. Three thicknesses were studied for each adhesive: 0.2, 0.5, and 1 mm.

A statistical analysis of the experimental results shows that the lap shear strength increases as the bondline gets thinner and the adhesive gets tougher.     

Comparison between the ENF and 4ENF fracture characterization tests to evaluate GIIC of bonded aluminium joints

ABSTRACT

Adhesively bonded joints have been increasingly used in structural applications over mechanical joints. Cohesive Zone Modelling (CZM) is the most widespread technique to predict the strength of these joints, and it uses the tensile fracture toughness (G_IC) and the shear fracture toughness (G_IIC). Different fracture characterization methods are available for shear loadings, among which the End-Notched Flexure (ENF) is undoubtedly the most popular. The 4-Point End-Notched Flexure (4ENF) is also available. This work consists of a detailed comparison between the ENF and 4ENF tests for the experimental estimation of G_IIC of bonded aluminium joints. Three adhesives were used: a strong and brittle (Araldite® AV138), a less strong but with intermediate ductility (Araldite® 2015) and a highly ductile (SikaForce®7752). Different data reduction methods were tested, and the comparison included the load-displacement (P-δ) curves, resistance curves (R-curves) and measured G_IIC. It was found that the ENF test presents a simpler setup and has a higher availability of reliable data reduction methods, one of these not requiring measuring the crack length (a) during its growth. For the 4ENF test, only one test method proved to be accurate, and the test geometry revealed to be highly affected by friction effects.     

Numerical assessment of the Double-Cantilever Beam and Tapered Double-Cantilever Beam tests for the GIC determination of adhesive layers

ABSTRACT

Fracture mechanics-based techniques have become very popular in the failure prediction of adhesive joints. The most commonly used is cohesive zone modeling (CZM). For both conventional fracture mechanics and CZM, the most important parameters are the tensile and shear critical strain energy release rates (G_IC and G_IIC, respectively). The most common tests to estimate G_IC are the Double-Cantilever Beam (DCB) and the Tapered Double-Cantilever Beam (TDCB) tests. The main objective of this work is to compare the DCB and TDCB tests to obtain the G_IC of adhesive joints. Three adhesives with varying ductilities were used to verify their influence on the precision of the typical methods of data reduction. For both tests, methods that do not need the measurement of crack length (a) were tested. A CZM analysis was considered to reproduce the experimental load–displacement (P-δ) curves and obtain the tensile CZM laws of each tested adhesive, to test the suitability of the data reduction methods, and to study the effect of the CZM parameters on the outcome of the simulations. The CZM models accurately reproduced the experimental tests and confirmed that the data reduction methods for the TDCB test tend to underestimate G_IC for ductile adhesives.     

A Preliminary Study of the Use of Kynar® Piezoelectric Film to Measure Peel Stresses in Adhesive Joints

A variety of test techniques have been developed to test the performance of adhesives bonded in situ within joints. Most of these techniques measure strength, fracture toughness, or adhesive modulus of the bonded joint. Techniques to measure actual stress or strain values within a bonded joint are quite few in number. The Krieger gage¹ is able to measure the average shear displacement along a 12.5 mm. gage length of a thick adherend joint. It has been used primarily to measure in situ shear moduli of adhesives. Brinson and his colleagues² proposed bonding strain gages within adhesive joints to measure strains within the adhesive. Unfortunately, these gages are only sensitive to the lateral strains and not shear or peel strains. Because the lateral strains are dominated by the behavior of the adherends rather than the adhesive, the information which can be gained is incomplete.     

Novel conductive adhesives for surface mount applications

Electrically conductive adhesives (ECAs) have been explored as a tin/lead (Sn/Pb) solder alternative for attaching encapsulated surface mount components on rigid and flexible printed circuits. However, limited practical use of conductive adhesives in surface mount applications is found because of the limitations and concerns of current commercial ECAs. One critical limitation is the significant increase of joint resistance with Sn/Pb finished components under 85°C/85% relative humidity (RH) aging. Conductive adhesives with stable joint resistance are especially desirable. In this study, a novel conductive adhesive system that is based on epoxy resins has been developed. Conductive adhesives from this system show very stable joint resistance with Sn/Pb‐finished components during 85°C/85% RH aging. One ECA selected from this system has been tested here and compared with two popular commercial surface mount conductive adhesives. ECA properties studied included cure profile, glass transition temperature (T_g), bulk resistivity, moisture absorption, die shear adhesion strength, and shift of joint resistance with Sn/Pb metallization under 85°C/85% RH aging. It was found that, compared to the commercial conductive adhesives, our in‐house conductive adhesive had higher T_g, comparable bulk resistivity, lower moisture absorption, comparable adhesion strength, and most importantly, much more stable joint resistance. Therefore, this conductive adhesive system should have better performance for surface mount applications than current commercial surface mount conductive adhesives. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 399–406, 1999     

Parametric study of adhesive joints with composites

Adhesively-bonded joints are increasingly used in aeronautical industry. Adhesive joints permit to join complex shapes and reduce the weight of structures. The need to reduce the weight of airplanes is also increasing the use of composites. Composites are very anisotropic: in the fibre directions, unidirectional composites can be very strong and stiff, whereas the transverse and shear properties are much lower. Bonded joints experience peel loading, so the composite may fail in transverse tension before the adhesive fails. That is why it is important to study these joints and try to find reliable ways to predict the strength of joints with composite adherends. The main goal of this study was to understand the failure in adhesive joints with composites, bonded with adhesives with different characteristics, and find reliable ways to predict them. Experimental tests were carried with single lap joints with composite adherends and different adhesives, brittle and ductile, with several overlap lengths. A Cohesive Zone Model (CZM) was taken into consideration to predict the results observed during the experimental tests. The experimental results were also compared with simple analytical models and the suitability of each model was evaluated for each bonded system.     

Comparative evaluation of the Double-Cantilever Beam and Tapered Double-Cantilever Beam tests for estimation of the tensile fracture toughness of adhesive joints

The continuous development observed in bonded joints, along with the improvements of the adhesives’ properties, are resulting in an increase of the bonded joint applications, as well as the variety of applications. Regarding the strength prediction of adhesive joints, two highly relevant methods are Fracture Mechanics and Cohesive Zone Models (CZM). By Fracture Mechanics, this is usually carried out by an energetic analysis. CZM enable the simulation of damage initiation and propagation. The tensile critical strain energy release rate (G_Ic) of adhesives is one of the most important parameters for predicting the joint strength. Two of the most commonly used tests are the Double-Cantilever Beam (DCB) and the Tapered Double-Cantilever Beam (TDCB). This work aims to assess the capability of the DCB and TDCB test to estimate the value of G_Ic of adhesive joints. Three types of adhesives with different levels of ductility are used, to study the accuracy of the typical data reduction methods under conditions that are not always consistent with Linear Elastic Fracture Mechanics (LEFM) principles. For both test protocols, methods that do not require measurement of the crack length (a) during the test are evaluated. In the DCB test, these are the Compliance Calibration Method (CCM), Corrected Beam Theory (CBT) and Compliance-Based Beam Method (CBBM). The methods used in the TDCB test are the Simple Beam Theory (SBT), CCM and CBT. With few exceptions, the results were consistent between the different methods considered for each test. The discrepancy of results is higher when comparing the two types of tests, except for the brittle adhesive. It was concluded that the data reduction methods for the TDCB test are too conservative to measure G_Ic of ductile adhesives.