防锈钝化工艺在表面处理中的应用

为了解决钢铁件在加工过程中的锈蚀问题 ,必须对金属基材进行防锈处理 ;为了提高磷化工件存放期的耐蚀性 ,避免过早返黄 ,同样需要进行钝化处理 (通常锌系膜提高耐蚀能力 30 %～ 50 % ,铁系膜提高 1倍 )。尽管传统的水基防锈剂使用方便 ,成本低、安全 ,其缺点是在金属表面易发生流淌 ,水份蒸发后金属工件表面常留下白霜[1] ;而普通的磷化膜钝化剂 ,多数采用含铬工艺 ,污染环境。为此 ,笔者研制一种通用性无铬防锈钝化粉 ,兼有金属防锈和磷化膜钝化的双重功能 ,现作简单介绍。1　无铬防锈钝化粉　　无铬防锈钝化粉组成为 :无机盐防锈剂 4 0 %…     

双氧水在表面处理中应用

双氧水在表面处理中应用周长虹，罗和平（武汉市日用五金科研所，４３００６４）李贤成（四川西南光学仪器厂，６３８６５２）双氧水在电镀工艺中使用十分广泛，它是一种镀液净化剂、铜件氧化促进剂、铜件酸洗蚀刻剂、铝和钢铁件化学抛光剂、铅锡合金退除剂等，是电镀工作...     

日本关于燃料罐用表面处理钢板的研究

汽车油箱用表面处理钢板一般使用镀铅锡合金钢板（热浸镀Pb-8％Sn合金钢板）,其原因在于含Pb的电镀钢板具有良好的焊锡性、耐蚀性和润滑性（挤压成型性）等。     

国际表面处理展新技术撷英

第十六届中国国际表面处理展于2003年11月5日-7日在上海世贸商城举行,展览期间主办方共安排了9场技术讲座,其中2场为涂装设备及电泳涂装方面的,另外7场是电镀及化学镀方面的。这些讲座基本上反映了当前国际上表面处理的研发热点,值得国内同行参考.     

景观钢桁架表面改性及其耐蚀性

先对景观钢桁架用Q345钢进行热浸镀锌,再进行硅酸盐钝化.研究了硅酸钠溶液中SiO2与Na2O物质的量比[n(SiO2)/n(Na2O)]对钝化膜微观形貌和耐蚀性的影响.结果表明,钝化后的热浸镀锌层表面未发生显著变化.当n(SiO2)/n(Na2O)为3.0～4.0时,试样的表面形貌较佳,无微孔缺陷.随着n(SiO2)...     

电刷镀技术在化学镀前处理的应用

通过电刷镀技术在化学镀前处理的应用及传统处理方法的比较得出，电刷镀技术在化学镀前处理方面的应用有其独到的优点。     

表面准备的最佳方法

为任何化学镀镍的零件选择一套合适的镀前处理工艺,应该是一个需要考虑的重大事项。影响选择最佳镀前处理工艺的因素有:基材的性质、零件的几何形状与所用设备的局限性。本文所述的常用做法及因特殊情况所作的修正,都是为取得良好的结果所必需的。     

前处理在镁及镁合金表面强化中的应用

用浸锌法研究了时间，温度和浓度等参数在镁合金表面强化中的作用，确定了最佳浸锌条件，获得了结合力良好的化学镀镍层，使镁合金表面强化前处理工艺取得了新进展。     

三价铬钝化在绝缘子金具热镀锌上的应用

传统的钝化为六价铬酸盐钝化法,对环境和人体有毒害作用,已严格限制使用。参照国内外有关三价铬酸盐钝化发展动态和经验,在试验的基础上,优选一组三价铬钝化配方,并运用到绝缘子金具热镀锌镀层的生产工艺中。采用5%NaCl水溶液盐雾试验,96h没有出现白锈,取得了比较满意的效果。     

化学镀在纳米材料表面改性中的应用

纳米材料具有传统材料所没有的许多崭新特性,已成为当今材料科学和凝聚态物理研究的前沿热点领域.化学镀可有效地改善纳米材料的使用性能.介绍了化学镀法对纳米Cu、Al2O3、金刚石、Si3N4粉体材料和碳纳米管表面进行改性的研究进展及其在各领域中的应用.     

Surface modification of ABS by photocatalytic treatment for electroless copper plating

Surface roughness of acrylonitrile–butadiene–styrene (ABS) resin prior to metallization is treated generally with sulphuric/chromic acid system. However, the presence of chrominum (VI) ion imposes serious environmental problems. In this work, TiO₂ photocatalytic treatment was used to enhance the adhesion strength between the ABS surface and the electroless copper film. Effects of the TiO₂ content, irradiation time and UV power upon the surface topography, surface characterization and the adhesion strength were investigated. The results indicated that the surface hydrophilicity of ABS resin and the adhesion strength between the electroless copper film and ABS surface increased with an increase in the UV power and a prolongation in irradiation time, and did not increase linearly with an increase of TiO₂ content. Though the surface topography of ABS changed little, the adhesion strength reached 1.25?kN/m, which was higher than that in the optimal H₂SO₄–MnO₂ colloid. The surface chemistry results indicated that –COOH and –OH groups formed with the photocatalytic treatment and the absorption strengths increased with the UV power. XPS analysis results further demonstrated that the contents of C=O and –COOH reached 6.4 and 4.9% with the photocatalytic treatment, which was much higher than that of the H₂SO₄–MnO₂ colloid (3.9 and 3.1%). The high contents of C=O and –COOH groups enhanced the surface hydrophilicity of the ABS resin and improved the adhesion strength between the electroless copper film and ABS resin. The results indicated that the photocatalytic treatment was an environment-friendly and effective method to replace the commercial wet chemical process for ABS surface modification.     

基体表面粗糙度对化学镀镍层耐蚀性的影响

基体表面粗糙度影响着化学镀镍层的耐蚀性。使用扫描电镜观察了不同基体表面粗糙度时镀层的表面形貌,采用动电位极化和交流阻抗等技术考察了基体表面粗糙度对镀层耐蚀性的影响。结果表明:当Q345钢基体表面粗糙度为1.81μm时,表面沉积的Ni-P化学镀层的胞状物大小不一,镀层的平整性差,自腐蚀电流密度大,腐蚀速率相对较高;当基体表面粗糙度下降到0.39μm和0.17μm时,镀层表面胞状物的大小趋于一致,且镀层的平整性提高,镀层更容易发生钝化,自腐蚀电流密度下降,耐蚀性得到了改善。     

非胶体钯活化PET塑料化学镀铜的研究

研究了PET塑料表面化学镀铜的表面预处理以及化学镀铜工艺对化学镀铜的影响，PET塑料经过碱性高锰酸钾处理后，表面的粗糙度大大增加，提高了塑料表面对金属镀层的附着力。研究表明，化学镀铜的速度与温度、pH值以及甲醛含量等因素相关，最佳pH为12．5，最佳温度为50℃，甲醛的最佳含量为15mL／L。     

黄铜化学镀锡及其形貌变化过程的研究

讨论了黄铜化学镀锡工艺过程中氯化亚锡和次磷酸钠的质量浓度、pH值、温度以及时间对镀层沉积速率的影响,获得较好的工艺参数如下:氯化亚锡10 g/L,硫脲30 g/L,次磷酸钠5 g/L,pH值2,60℃,4 min,在此条件下获得纯锡镀层.简要分析了不同时间下黄铜表面形貌的变化情况及其原因.     

碳酸钙在化学镀表面上的结垢与脱除

The scaling process of calcium carbonate on a low-energy heat transfer surface clectroless plating surface was investigated in a simulated cooling water system. Owing to the very low surface energy, the electroless plating surface exhibited less scaling susceptibility. A longer induction period and a lower scaling rate were obtained on the low-energy surface compared to copper surface under identical conditions. The calcite particles obtained on the electroless plating surface during the induction period were larger in size than those on copper surface because fewer cryst~s formed and grew at the same time on the |ow-energy surface. With increasing surface temperature, the induction period reduced and the scaling rate increased for the low-energy surface. When initial surface temperature was fixed, an increase in fluid velocity would reduce the induction period and increase the scaling rate due to the diffusion effect. However, when the heat flux was fixed, an increase in fluid velocity would decrease the surface temperature, and lead to a longer induction period and a lower scaling rate. The removal experiments of calcium carbonate scale indicated that during post induction period, the detachment was not obvious, while during the induction period, apparent removal of crystal particles was obtained on the electroless plating surface owing to the weak adhesion force. The more frequently the transient high hydrodynamic force acted, the more the detached crystal particles were.     

铝及铝合金表面处理技术新进展

本文简要介绍了目前铝及铝合金表面处理技术的进展.简单介绍了各种常见的处理方法。重点介绍了稀士转化膜法、化学镀镍技术以及激光技术在铝及铝合金材料表面处理中的应用.另对近年来新出现的工艺如硅烷化法、磷化底漆法、离子注入法等做了简单介绍.     

Gold wire bondability of electroless gold plating using disulfiteaurate complex

Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.     

氨水在电镀工业中的应用

以２５篇参考文献综述了氨水在电镀铜、钯、金、铂、锡铋、钯镍、锌和化学镀镍磷、钴磷、砷锌、镍铜合金以及在缓蚀、除膜、氧化、抛光、退镀等方面的应用，并提出隶使用中应注意的问题。