共查询到19条相似文献,搜索用时 78 毫秒
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通过对10号优质碳素结构钢、玻璃熔封件的热应力计算,阐明了10号优质碳素结构钢、玻璃熔封结构的可行性。通过采取控制玻璃用量、合理设计孔口、烧结模具、优化工艺过程等手段,解决了熔封件玻璃开裂、漏气和管壳的抗蚀性等问题。机械和温度应力试验表明,采用该材料的金属电子封装外壳漏气速率不超过1×10-3Pa.cm3/s,并能承受24h盐雾试验。 相似文献
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《电子与封装》2017,(12):1-4
结构和工艺设计优化已经成为封装必不可少的步骤。随着探测器封装尺寸越来越小以及可靠性要求的不断提高,气密性封装结构向表面贴装、超薄型、芯片与封装体面积比更高的方向转变,封装结构和封装工艺的设计成为可靠性、成品率和成本的关键。骑跨式贴片半导体辐射探测器陶瓷封装中,存在芯片粘接衬底、密封环、引脚与HTCC陶瓷件钎焊处有Ag72Cu28焊料堆积、爬行的现象,以及芯片的Au80Sn20焊接层存在空洞大而又无法通过X射线照相或芯片粘接的超声检测来筛选剔除不合格的问题,分析原因并通过优化封装结构、改进封装工艺等解决封装的质量和可靠性。实际生产结果表明,结构优化、工艺改进有效地简化了外壳结构,减少了制造工序步骤,并提高了芯片烧结质量和成品率,降低了封装成本。 相似文献
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大功率LED封装界面材料的热分析 总被引:10,自引:0,他引:10
基于简单的大功率LED器件的封装结构,利用ANSYS有限元分析软件进行了热分析,比较了四种不同界面材料LED封装结构的温度场分布。同时对纳米银焊膏低温烧结和Sn63Pb37连接时的热应力分布进行了对比,得出纳米银焊膏低温烧结粘接有着更好的热机械性能。 相似文献
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为满足碳化硅二极管在高温(大于200 ℃)、高压(大于20 kV)环境下的应用需求,采用注浆成型的陶瓷加工工艺制作了一款三腔室外壳。与传统塑料封装相比,陶瓷外壳提高了器件的工作温度和绝缘耐压特性,发挥了碳化硅材料的高温应用优势。针对高低温循环试验后因材料形变导致陶瓷外壳开裂的问题,使用Ansys软件仿真了温度变化导致的结构应力,并优化了外壳隔墙结构,优化后的外壳结构通过了环境应力试验。参照此结构可以采用单腔室、双腔室、多腔室的结构开发出不同电压等级外壳。同样,参照此结构可以采用不同大小的腔室开发出不同正向整流能力的外壳。 相似文献
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钢基体(如10#钢)外壳在混合集成电路中大量使用,该外壳生产时,会接触或产生大量氢气。研究表明,密封电子器件中的氢会导致砷化镓、氮化镓等半导体芯片失效,影响器件长期可靠性。本文研究了电子封装用钢基体外壳内部的氢含量,分析了当前典型制备工艺下氢含量的产生原因,对比了不同镀种外壳的氢含量差异,并讨论了产生差异的原因。针对烧结及镀覆工序展开除氢试验,对经过低温/高温激发的封盖密封外壳,进行了氢含量测试,并获得了氢含量规律。研究结果为外壳制备提供了建议,也为外壳后续使用提供了依据。 相似文献
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气密封装工艺技术是混合电路制造的关键技术。在可靠性要求较高的场合,对混合电路产品提出了水汽含量、漏气率和粒子碰撞噪声检测(PIND)合格率的指标要求。封装内部的多余物对电子器件的可靠性带来严重影响。主要从盒体的表面镀层方面进行讨论,分析了不同的金属化结构和不同的镀层厚度对气密封装的影响。实验表明,当封装使用的压力较大时,化学镀镍外壳的镀层容易出现裂纹,造成外壳锈蚀。外壳使用化学镀镍、电镀金结构时,其PIND不合格率较高。当镀层厚度超标时,不仅PIND不合格率较高,也会出现漏气问题。 相似文献
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本文评述了在金属材料领域中应用离子注入技术的现状;阐明了提高离子注入效益的一条新途径:不仅以离子注入技术改变工模具的性能,延长其使用寿命,而且以离子注入技术来显著提高金属产品的质量。文末还对进一步发展离子注入的前景做了展望。 相似文献
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Andrew Martin Boyce S. Chang Zachariah Martin Dipak Paramanik Christophe Frankiewicz Souvik Kundu Ian D. Tevis Martin Thuo 《Advanced functional materials》2019,29(40)
Exploiting interfacial excess (Γ), Laplace pressure jump (ΔP), surface work, and coupling them to surface reactivity have led to the synthesis of undercooled metal particles. Metastability is maintained by a core–shell particle architecture. Fracture of the thin shell leads to solidification with concomitant sintering. Applying Scherer's constitutive model for load‐driven viscous sintering on the undercooled particles implies that they can form conductive traces. Combining metastability to eliminate heat and robustness of viscous sintering, an array of conductive metallic traces can be prepared, leading to plethora of devices on various flexible and/or heat sensitive substrates. Besides mechanical sintering, chemical sintering can be performed, which negates the need of either heat or load. In the latter, connectivity is hypothesized to occur via a Frenkel's theory of sintering type mechanism. This work reports heat‐free, ambient fabrication of metallic conductive interconnects and traces on all types of substrates. 相似文献
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介绍了片式多层瓷介电容器用10Pd90Ag内电极浆料的研制结果,该材料采用10Pd90Ag合金粉,配合优选的有机载体,非常适合与低于960℃的烧结温度的瓷料匹配,可以节约大量成本。 相似文献
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In typical power electronic modules several semiconductor dies such as MOSFET or IGBT are soldered to a DBC substrate. During module production the quality of the solder layers can be monitored by the use of X-ray inspection and the void rate can be determined. Recently, the more robust Ag-sinter technology is deployed for attaching the power dies to the substrate, especially for high reliability or high temperature requirements. Besides voiding also adhesion problems can occur during sintering due to multiple reasons (e.g. contamination). In contrast to volume defects, pure adhesion problems cannot be detected by means of X-rays. Accordingly, other methods have to be applied for process monitoring. The present investigation compares the advantages and disadvantages of different non-destructive imaging techniques towards the detection of defects in sinter layers. Besides X-ray, Scanning Acoustic Microscopy (SAM) and Lock-in Thermography methods (DLIT + ILIT) were studied and evaluated in terms of suitability for detecting different defect types, resolution (minimum defect sizes), inspection time and possible integration into the assembly process. 相似文献
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喷墨印制PCB用新型纳米银导电油墨的研发现状及趋势 总被引:5,自引:1,他引:4
喷墨打印加成法制造电路板,可明显改善传统减成法效率低、成本高、污染重等缺点,因而受到业内广泛关注。该方法所使用的新型功能材料纳米银导电油墨,因具有烧结温度低、导电性能好等优点,近年来成为全球电子油墨行业的研发热点之一。文章详细介绍了纳米银油墨在印制电子产品电路制作领域的应用,并对喷印纳米金属油墨的技术要求、纳米银油墨的特点及主要不足进行了评述,重点展示了全球纳米银油墨的产品开发动态,同时对新型喷印纳米金属油墨的制备与研发提出了一些建议。 相似文献
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Presented is a fabrication process of stainless steel micro components. The fabrication process is divided into two main parts. In the first part, high quality SU-8 master moulds and their negative replicas from soft moulds are produced using photolithography and soft moulding techniques, respectively. The second part includes preparation of stainless steel slurry, filling the soft mould, obtaining the green parts, de-binding and sintering to the finial parts. The metallic slurry is investigated in details and the optimum dispersant and binder are obtained. Two different sintering conditions are investigated, vacuum and forming gas atmospheres. The effect of sintering atmospheres and temperatures on both density and linear shrinkage of the micro components are studied in details. The results show high quality micro components the same quality as the master moulds. The maximum sintered density and linear shrinkage are obtained when the samples are sintered in vacuum at 1350 °C and found to be 98.1% and 17.97%, respectively. The surface roughness of the sintered micro components is also investigated. 相似文献