Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder.The effects of Ag particle addition on the microstrueture of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound (IMC) layer of the Sn-0.7Cu solder and the composite solder reinforced with l vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.     

Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

The formation and the growth of Cu-Sn intermetallic compound （IMC） layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce （only 0.1%,mass fraction） into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.     

5554铝合金异种焊料焊接的显微组织及力学性能

在5554铝合金钨极氩弧焊焊接工艺基础上,利用万能拉伸试验机、光学显微镜和显微硬度测试仪等仪器,比较了5554铝合金异种焊料焊接接头的微观组织结构和力学性能。结果表明,随着焊料含镁量的增加,焊接接头的力学性能都得到了不同程度的降低,而且随着镁含量的增加,焊接热裂纹越明显。三种焊料焊接的接头显微硬度均比母材低,通过试验验证,得出焊后保温是导致这一结果的主要原因。     

时效处理对CuCrSnZn/SnAgCu钎料接头界面及剪切性能影响

为了探讨引线框架铜合金与无铅钎料钎焊接头界面性能,采用扫描电镜及万能材料实验机,分析了引线框架用CuCrSnZn合金与SnAgCu系无铅钎料钎焊接头,在160℃时效不同时间的过程中界面形貌及接头剪切性能的演变过程.结果表明,时效前,钎焊接头界面处形成了一层长针状的Cu6Sn5;不同时间时效处理后,接头界面IMC层厚度有不同程度的增加,Cu6Sn5变长变粗,逐渐离开界面进入钎料内部,靠近铜合金片材基体的一侧会出现极薄的一层Cu3Sn层.无铅钎料钎焊接头时效25h剪切强度可到27.3 MPa,其后逐渐降低.未时效、时效25 h和50 h断裂发生在钎料基体内部,时效至300 h,断裂位置向界面金属间化合物处转移,剪切断口断裂形式逐渐由韧性断裂向脆性断裂转变.     

Sn-Ag-xCu-Bi-Ni/Cu焊点界面IMC演变

为了研究低银无铅焊点界面金属间化合物(IMC)的形成与演变,以低银无铅焊点Sn-Ag-xCu-Bi-Ni/Cu为研究对象,研究了钎料中Cu质量分数对界面IMC厚度、形貌和成分的影响.实验结果表明,随着钎料中Cu质量分数的增加,回流焊后焊点IMC层厚度变薄,IMC晶粒尺寸增大,IMC晶粒形貌由颗粒状转变为棱柱状以及鹅卵石状,同时界面IMC成分发生由(Cu,Ni)6Sn5向Cu6Sn5的转变.高温时效后,界面IMC层厚度增长.当钎料中Cu质量分数超过1%时,时效后生成较厚的Cu3Sn化合物层,对焊点可靠性不利.钎料中Cu质量分数应控制在1%以下.     

Microstructural evolution and mechanical properties of aging high nitrogen austenitic stainless steels

The microstructural evolution of 18Cr18Mn2Mo0.77N high nitrogen austenitic stainless steel in aging treatment was investigated by optical microscopy (OM), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The results show that hexagonal intergranular and cellular Cr2N with a=0.478 nm and c=0.444 nm and body-centered cubic intermetallic χ phase with a=0.892 nm precipitate gradually in the isothermal aging treatment. The matrix nitrogen depletion due to the intergranular Cr2N pre...     

Correlation between microstructural features and tensile strength for friction welded joints of AA-7005 aluminum alloy

Similar friction welded joints of AA-7005 aluminum rods were fabricated using different combinations of process parameters such as friction pressure(1.0, 1.5 and 2.0 MPa) and friction time(10, 15 and 20 s). Interfacial microstructure and formation of intermetallic compounds at the joint interface were evaluated via scanning electron microscopy(SEM) equipped with energy dispersive spectrum(EDS), and optical microscopy(OM). Microstructural observations reveal the formation of intermetallic phases during the welding process which cannot be extruded from the interface. Theses phases influence the tensile strength of the resultant joints. From the tensile characteristics viewpoint, the greatest tensile strength value of 365 MPa is obtained at 1.5 MPa and 15 s. Finally, the role of microstructural features on tensile strength of resultant joints is discussed.     

SnZnPr-xAu无铅钎料性能与组织

研究了微量纳米Au颗粒对SnZnPr无铅钎料性能与组织的影响。研究结果表明,微量的纳米Au颗粒可以显著改善SnZnPr钎料的润湿性和焊点力学性能,通过优化设计证明纳米Au颗粒的最佳添加量为0.1%,但添加纳米Au颗粒过量时,钎料的润湿性明显下降,焊点的力学性能基本不变。对SnZnPr和SnZnPr-0.1Au钎料组织研究发现0.1%纳米Au颗粒可以显著细化基体组织,特别是减小富Zn相的尺寸,通过纳米压痕实验证明0.1%纳米颗粒可以显著提高SnZnPr钎料的抗蠕变性能,热循环实验证明0.1%纳米Au颗粒可以将QFP100器件SnZnPr焊点热疲劳寿命提高12.3%,主要归因于纳米颗粒对位错的钉扎作用。     

电连接器激光软钎焊焊点的热疲劳寿命预测

通过建立Micro-USB电连接器有限元模型，采用Anand统一性本构方程描述焊点在循环温度载荷作用下的力学行为；借助ANSYS软件分析模拟焊点应力应变分布和变化情况；运用基于塑性应变的Coffin-Manson方程，计算激光软钎焊焊点在热循环温度作用下的热疲劳寿命。结果表明，电连接器激光软钎焊焊点在热循环作用下，最大应力应变位于中间部位的焊点与金属Pin相互接触处，其疲劳寿命最低，为1 146次，从而确定易发生失效的危险部位。该结论可为电连接器的设计、制作和测试提供理论依据。     

Localized Corrosion and Stress Corrosion Cracking Behavior of AA7003 in a 3.5 wt% NaCl Aqueous Solution

The microstructure,localized corrosion (LC) and stress corrosion cracking (SCC) behavior of 7003 aluminum alloy (AA7003) under various aging treatments (peak aging (PA),double peak aging (DPA),regression and re-aging (RRA)) were investigated by means of transmission electron microscope (TEM),scanning electron microscopy (SEM),electrochemical impendence spectroscopy (EIS) and slow strain rate tensile test.The results of TEM showed a discontinuous distribution of grain boundary precipitates of AA7003 under DPA and RRA treatments,which is beneficial for increasing the resistance of LC and SCC.Meanwhile,LC was found initiating firstly on intermetallics which caused the dissolution of surrounding matrix,then pitting holes were formed and developed into matrix.In addition,the SCC process of AA7003 could be divided into two stages,i e,initial pre-cracking and breeding cracking.The EIS analysis,cross-section morphologies and fracture surfaces of specimens indicated that DPA and RRA treatments significantly decreased the crack growth rate during breeding cracking stage,especially for RRA treatment.     

Preparation and characterization of copper-nickel bulk nanocrystals

Copper-nickel nanoparticle was directly prepared by flow-levitation method(FL) and sintered by vacuum sintering of powder(VSP) method. Several characterizations, such as transmission electron microscopy(TEM), scanning electron microscopy(SEM), X-ray diffraction(XRD), differential thermal analysis(DTA), and energy-dispersive X-ray spectroscopy(EDX) were used to investigate the prepared nanostructures. The results of the study show that FL method could prepare high purity Cu-Ni nanocrystals of uniform spheres with size distribution between 20 and 90 nm. After sintering the bulk nanocrystalline copper-nickel has obvious thermal stability and the surface Webster hardness increases with the rising sintering temperature. At the temperature of 900 ℃, the specimen shows higher surface Webster hardness, which is about two times of traditional materials. When the sintering temperature arrives at 1 000 ℃ the relative density of bulk nanocrystals can reach 97.86 percent. In this paper, the variation tendency of porosity, phase and particles size of bulk along with the changing of sintering temperature have been studied.     

Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm

Solder bumps are widely used in surface mount components, which provide electrical and mechanical connection between the chip/package and the substrate. As the solder bump getting smaller in dimension and pitch, it becomes more difficult to inspect the solder defects hidden in the IC package. In this paper, an intelligent inspection method using the scanning acoustic microscopy(SAM) and the fuzzy C-means(FCM) algorithm was investigated. A flip chip package of FA10 was chosen as the test sample. The SAM tests of FA10 were carried out in C-scan mode. The sub-image of every solder bump was segmented from the SAM image. The statistical features were then calculated and adopted for clustering of solder bumps using the FCM algorithm. The recognition results of FCM reached a high accuracy of 94.3%. The intelligent system is effective for defect inspection in high density packages.     

Effect of one-step aging on microstructure and properties of a novel Al-Zn-Mg-Cu-Zr alloy

The effect of one-step aging temper on the mechanical properties, electrical conductivity and the microstructure of a novel Al-7.5Zn-1.6Mg-1.4Cu-0.12Zr alloy has been investigated. The results indicated that with elevating the aging temperature from 100℃ to 160℃, the aging response rate was greatly accelerated, and the UTS at peak aging condition decreased, while the corresponding TYS increased. However, the electrical conductivity of the alloy became higher. After aging for 24 h at 120℃, the peak UTS and TYS values were achieved as 591 MPa and 541 MPa, respectively; but the alloy achieved a lower conductivity, 20.4 MS/m. When T6 temper was performed at 140℃ for 14 h, the UTS decreased only by 1% of the former, whereas the TYS and the electrical conductivity increased obviously, which were up to 559 MPa and 22.6 MS/m, respectively. The major strengthening precipitates of the peak-aged alloy were GP zones and η′ phase. The precipitates in both the matrix and the grain boundary became coarser with rising aging temperature. There were obvious PFZs along the grain boundary both in T6 conditions aged at 140℃ and 160℃.     

交联度对XLPE/OMMT纳米复合材料水树枝老化特性的影响

电力系统日益提升的电压等级和复杂的运行环境,对电缆绝缘材料提出了更多、更高要求,工作在潮湿和强电场的极端环境下的绝缘材料应具有优越的电气、热和力学性能。而聚合物基纳米复合电介质以其独特的结构和优异的电气、力学及化学等性能获得了广泛关注。纳米复合材料的性能依赖于纳米粒子与交联所形成的微观结构形态的稳定性,为了从微观结构方面研究交联度对纳米复合材料水树枝老化特性的影响,通过调控交联时间,制备了两种不同交联度的交联聚乙烯/蒙脱土(XLPE/OMMT)纳米复合材料,并进行了加速水树枝老化试验。通过偏光显微镜观察水树枝形貌,统计水树枝长度和引发概率,并测试凝胶含量表征纳米复合试样的交联度;利用傅里叶红外光谱(FTIR)分析老化前后试样的化学组成变化,计算表征纳米复合试样老化程度的羰基指数和亚甲基指数;采用扫描电子显微镜(SEM)对比老化前和老化后、水树区和非水树区结晶形态的变化,研究水树枝生长对晶体结构的破坏。实验结果表明：纳米复合材料的交联度影响了水树枝的引发概率,正交联状态下试样的水树枝形貌稀疏,分形维数和占空比小;试样老化过程中存在电化学降解现象,羰基基团增多;适当的交联度,可以使三维网状结构更加完善,试样的晶体尺寸差异性减小,晶体分布均匀,且老化后晶体破坏程度降低。有机化蒙脱土(OMMT)片层与基体之间形成牢固的界面作用力,增强了分子链韧性,且OMMT的屏障效应与完善的交联网络,共同作用阻碍了水分子的扩散和聚集,抑制了微观水隙的产生,提高了纳米复合材料的耐水树枝能力。     

CSP焊点焊后残余应力分析与预测

该文建立了芯片尺寸封装(CSP)焊点有限元分析模型并对其进行了再流焊焊后残余应力应变分析.以焊点直径、焊点高度、焊盘直径和焊点间距为输入参数,焊后残余应力为输出参数进行了灵敏度分析.选取灵敏度分析结果中对残余应力影响显著的因子作为输入,建立了带动量项神经网络预测模型,对CSP焊点焊后残余应力进行了预测.结果表明,置信度...     

Influence of deformation and heat treatment on electrical conductivity of CuMoCr alloy

The solution heat treatment,cold deformation and subsequent aging were performed on CuMoCr alloy.And the influence of deformation and aging treatment on the electrical conductivity of CuMoCr alloy was studied through metallograph,transmission electron microscopy(TEM) and electrical conductivity measurement.Results show that deformation without subsequent aging can reduce the electrical conductivity of CuMoCr alloy,but deformation followed by the optimum aging treatment can effectively improve the electrical conductivity of CuMoCr alloy.Aging at 500 ℃ for 4 h after 80% deformation,the much better electrical conductivity of CuMoCr alloy can be obtained.Reduction of Cr content in the Cu matrix could be the reason for the enhancement of electrical conductivity.     

CCGA焊点热疲劳寿命统计分析与评价优化

通过对 CCGA焊点形态参数与热疲劳寿命进行正交回归分析 ,得出了 CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。利用得到的焊点形态参数与热疲劳寿命的关系表达式 ,采用优化程序对基于焊点热可靠性的焊点形态进行了评价优化 ,得到了优化后的焊点形态参数。     

CCGA焊点热循环加载条件下应力应变有限元分析

SMT焊点在热循环加载条件下的应力应变过程分析是 SMT焊点可靠性研究的重要内容。SMT焊点的可靠性问题主要是焊点在热循环过程中 ,由于陶瓷芯片载体与基板材料之间的热膨胀失配而导致焊点的蠕变疲劳失效。以 CCGA焊点为例 ,利用 CCGA三维焊点形态预测表面节点输出结果 ,将焊点形态分析三维表面模型转换为焊点应力应变有限元分析三维实体模型 ,从而建立了 CCGA焊点可靠性分析模型 ,采用三维有限元方法分析了 CCGA焊点在热循环条件下的应力应变过程。在此基础上 ,对 CCGA焊点疲劳寿命进行了计算     

凝固冷速与时效时间对CaMgSn形态的影响

针对CaMgSn形貌对Mg-Sn-Ca系合金的力学性能具有重要的影响,研究了慢冷、快冷及时效处理对CaMgSn组织形貌的影响规律.分别采用光学显微镜、扫描电镜、X射线衍射仪和维氏硬度计对比分析了不同处理条件对Mg-3Sn-2Ca-3Cu（质量分数/%）合金微观组织、相结构和硬度的影响.Mg-3Sn-2Ca-3Cu合金慢冷组织主要由α-Mg、CaMgSn、Mg2Ca、CuMg2和Mg2Sn构成,其中CaMgSn为粗大的棒状相;快冷及时效处理后,CaMgSn的形态发生了明显的改变,在时效48 h时,转变为近球状形貌.时效处理后,合金的维氏硬度得到了明显的提高,在时效48 h时达到最高值77.随时效时间延长,表现为硬度的降低和第二相与基体的脱离.     

Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints

Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.