Surface micromachining of unfired ceramic sheets

Conventional surface micromachining techniques including photolithography and both wet and dry etching have been directly applied to an unfired sheet of yttria-stabilized zirconia ceramic material. Reversible bonding methods were investigated for affixing unfired ceramic samples to silicon handle wafers in order to perform photolithography. Three types of photoresist were investigated. Thin film photoresist allowed a line-width feature size of 8 μm to be obtained. Thick film photoresist exhibited a coverage gradient after being spun on. Chemical etching was successfully performed isotropically with concentrated hydrofluoric acid. A dry thick film resist applied by lamination provided coverage during plasma etching. Neither an oxygen plasma nor a mixture of sulfur hexafluoride and oxygen plasma proved successful at etching the unfired ceramic. Embossing was performed on the meso-scale with feature shrinkage of approximately 45% after sintering.     

Microfluidic chips for capillary electrophoresis with integrated electrodes for capacitively coupled conductivity detection based on printed circuit board technology

A simple and low budget microfabrication method compatible with mass production was developed for the integration of electrodes for capacitively coupled contactless conductivity detection (C4D) in Lab on a Chip devices. Electrodes were patterned on a printed circuit board using standard processing. This was followed by lamination-photolithography-lamination to cover the electrodes in dry film photoresist (DFR) using an office laminator. This resulted in a flush, smooth surface on top of the detection electrodes, enabling subsequent integration of a microfluidic network at a distance dictated by the thickness of the DFR (17 μm, 30 μm and 60 μm were used in this work). This process was applied to create two types of detectors, re-usable detectors to be used in combination with a separate microfluidic network and integrated detectors where the microfluidic network is irreversibly sealed to the detector. A poly(dimethylsiloxane) (PDMS) slab containing the microfluidic network was positioned on top of the re-usable detectors to create the PDMS hybrid devices. The integrated DFR devices were created by patterning and sealing the microchannel in DFR using subsequent lamination and lithographic steps. The sensitivity of the C4D made using this new technology for small inorganic cations was between 6 and 20 μM, which is comparable with devices made using significantly more advanced technologies. Where the 17 μm film slightly improved the sensitivity, the use of 30 μm thick insulating films was preferred as these did not impose significant restrictions on the applicable field strengths.     

Fabrication of electrostatic MEMS microactuator based on X-ray lithography with Pb-based X-ray mask and dry-film-transfer-to-PCB process

Lithographie Galvanoformung Abformung (LIGA) is a promising approach for fabrication of high aspect ratio 3D microactuator for dual-stage slider in hard disk drive. However, this approach involves practically challenging X-ray lithography and structural transfer processes. In this work, electrostatic MEMS actuator is developed based on a LIGA approach with cost-effective X-ray lithography and dry-film-transfer-to-PCB process. X-ray lithography is performed with X-ray mask based on lift-off sputtered Pb film on mylar substrate and photoresist application using casting-polishing method. High quality and high aspect ratio SU8 microstructures with inverted microactuator pattern have been achieved with the interdigit spacing of ~5 μm, vertical sidewall and a high aspect ratio of 29 by X-ray lithography using the low-cost Pb based X-ray mask. A new dry-film-transfer-to-PCB is employed by using low-cost dry film photoresist to transfer electroplated nickel from surface-treated chromium-coated glass substrate to printed circuit board (PCB) substrate. The dry film is subsequently released everywhere except anchor contacts of the electrostatic actuator structure. The fabricated actuator exhibits good actuation performance with high displacement at moderate operating voltage and suitably high resonance frequency. Therefore, the proposed fabrication process is a promising alternative to realize low-cost MEMS microactuator for industrial applications.     

Disposable microfluidic blood cuvette for measuring hemoglobin concentration

This paper presents a new air-bubble free microfluidic blood cuvette for the measurement of hemoglobin concentration. The microfluidic blood cuvette was filled with blood samples by capillary force, and hemoglobin levels in the blood were determined by measuring absorbance at the wavelength of 530 nm. Two different microfluidic blood cuvettes with dual and single sidewall microchannels were investigated. The microfluidic blood cuvette was fabricated using a polymethyl methacrylate substrate and a dry film photoresist. During the blood-filling process, air was trapped in the dual-sided wall-type cuvettes, while no air trapping occurred in the single sidewall-type cuvettes. The sensitivity of the hemoglobin measurements was more linear in a 105 μm deep microchannel than in a 35 μm deep microchannel.     

Pyrex 7740玻璃深刻蚀掩模研究

玻璃湿法深刻蚀掩模常采用低压化学气相沉积(LPCVD)多晶硅、Cr/Au金属层+光刻胶等,但往往会在玻璃中引入应力,影响后期应用(如阳极键合),而且Cr/Au金属层价格昂贵。为避免以上缺点,引入了SX AR—PC 5000/40保护胶+WBR2075干膜作为玻璃的刻蚀掩模,在HF︰NH4F,HF︰HCl,HF︰HCl︰NH4F刻蚀溶液中进行了大量实验。实验结果表明:SX AR—PC 5000/40抗腐蚀能力强,且成功实现了对Pyrex 7740玻璃131μm的深刻蚀。整个工艺过程与IC工艺兼容,可以进行圆片级批量加工。实验结果对圆片级封装和其他MEMS器件的制作有一定参考作用。     

A new method for fast anodic bonding in microsystem technology

Other than temperature and voltage, load plays a key role in anodic bonding process. In this paper we present a new design of top electrode (cathode) for anodic bonding machine by which the bonding time has been reduced up to 30 % in case of bare silicon wafer at ?400 V and approximate 52 % in case of oxidized silicon wafer with Pyrex glass bonding at ?800 V. Experimentally it has been observed there was no bonding in oxidized silicon wafer with Pyrex glass up to ?600 V by using standard design while it has been successfully bonded at same voltage (?600 V) by using new design.     

Investigation in the interface adhesion strength between SU-8 photoresist and metal substrate by ultrasonic treatment

During the fabrication process of metal microstructures and microdevices by ultraviolet Lithographie Galvanoformung Abformung technology of SU-8, it is common for interface separation and bind failure due to the poor adhesion strength between SU-8 photoresist and metal substrate. In this paper, ultrasonic wave was introduced into the lithography process to improve the interface adhesion strength. Scratch test method was adopted to measure the interface adhesion strengths between SU-8 photoresist and metal substrate without ultrasonic treatment and with ultrasonic treatment under different ultrasonic conditions. The effects and corresponding mechanisms of ultrasonic time and ultrasonic power on the interface adhesion strength between SU-8 photoresist and metal substrate were investigated. The results showed that due to the input of the ultrasonic vibration, the crosslink network characteristics of SU-8 photoresist were changed. The internal stress in SU-8 photoresist was reduced and the interface adhesion strength was improved. The interface adhesion strength firstly increased and then decreased with the increase of ultrasonic time. The maximum interface adhesion work was 0.427 J/m² at an optimized ultrasonic time of 10 min, which was higher than that of the sample without ultrasonic treatment by 39.5 %. Besides, in the experimental conditions, the interface adhesion strength first increased and then decreased with the increase of the ultrasonic power and the maximum interface adhesion strength attained at the ultrasonic power of 352 W. The ultrasonic treatment method can effectively improve the interface adhesion strength, so as to increase the product yield and performance.     

Rapid soda-lime glass etching process for producing microfluidic channels with higher aspect ratio

This paper presents a simple method to produce microfluidic channels in soda-lime glasses with the aspect ratio >0.5 utilizing a modified wet etching protocol. A low-cost positive photoresist (PR) layer is used as the etching mask for the wet etching process. Prior to the PR and primer coating procedure, a UV activation process is adopted for enhancing the binding strength of the hexamethyldisilazane primer layer and the glass substrate, resulting in an better adhesion for the PR layer. A fast etching recipe is also developed by increasing the acidity and the temperature of the buffered oxide (BOE) etchant. Since the photoresist etching mask does not peel during the etching process shortly, the structure of the etching mask forms a barrier and results in a different diffusion rate for the etchant inside the etched trench structure. A slower etching rate for the glass is observed at the undercut region such that the proposed anisotropic etching pattern can be achieved. Results show that the etching rate of the modified glass etching process is as high as 7.7 μm/min which is much faster than that of pure BOE etchant (0.96 μm/min). Sealed microfluidic channel with the aspect ratio of around 0.62 is produced with the developed method. The method developed in the present study provides a rapid and efficient way to produce microfluidic channels with higher aspect ratio.     

Solder bonding with a buffer layer for MOEMS packaging using induction heating

In this paper, the selective induction heating technology is applied to glass–glass and glass–silicon solder bonding for MOEMS (optical MEMS) packaging. The Ni bumping with a buffer layer is successful to release the thermal stress for avoiding delamination. The Au wetting layer must be thick enough to prevent from being solved entirely into Sn, and it will improve bonding strength. The bonding specimens are soaked into 25°C water and placed into 85°C/85% RH oven, respectively. No moisture penetrates into the cavity after 1 day in both test conditions. In the test condition of 125°C leakage-test liquid (Galden HS260), no bubble is observed. The lowest bonding strength is 3 MPa.     

Solder bonding with a buffer layer for MOEMS packaging using induction heating

In this paper, the selective induction heating technology is applied to glass–glass and glass–silicon solder bonding for MOEMS (optical MEMS) packaging. The Ni bumping with a buffer layer is successful to release the thermal stress for avoiding delamination. The Au wetting layer must be thick enough to prevent from being solved entirely into Sn, and it will improve bonding strength. The bonding specimens are soaked into 25°C water and placed into 85°C/85% RH oven, respectively. No moisture penetrates into the cavity after 1 day in both test conditions. In the test condition of 125°C leakage-test liquid (Galden HS260), no bubble is observed. The lowest bonding strength is 3 MPa.

     

一种基于感光干膜-铟锡氧化物电极的简易细胞阻抗传感器实现细胞形态学和阻抗信息同时检测

加工一种基于感光干膜-铟锡氧化物DFP-ITO( Dry Film Photoresist-Indium Tin Oxide)电极的细胞阻抗生物传感器并实现细胞形态学和阻抗信息同时检测。35μm厚的感光干膜层压在ITO导电玻璃表面上作为绝缘层,通过照相制版技术在感光干膜绝缘层上蚀刻不同直径圆孔;以DFP-ITO作为工作电极,通过夹具和测量小池与Ag/AgCl参比电极、Pt丝对电极相连构成三电极阻抗测量系统;考察了不同直径DFP-ITO工作电极阻抗谱特征;通过细胞粘附实验及细胞毒性实验考察了感光干膜细胞生物相容性;通过光学显微镜和阻抗谱技术分别对接种在DFP-ITO电极上人肺癌细胞株A549粘附、增殖过程中的形
　　态学和阻抗信息进行检测和分析。研究结果发现不同直径DFP-ITO电极具有相似的阻抗特性;充分固化的感光干膜表面适宜A549细胞粘附且无明显的细胞毒性;基于DFP-ITO电极构建的细胞阻抗传感器能够通过光学显微镜获取A549细胞形态学数据,同时通过阻抗谱技术能够解析A549细胞粘附、增殖过程中的细胞质膜电容、细胞-细胞间隙电阻、细胞-ITO电极间隙电阻变化。本文发展了基于DEP-ITO电极的细胞阻抗传感器结构简单,可实现细胞形态学和阻抗信息的双通道获取,未来可用于细胞生理病理学行为和药物细胞毒性研究。     

Inclination of mold pattern’s sidewalls by combined technique with photolithography at defocus-positions and electroforming

We succeeded in achieving inclined sidewalls in a positive-tone photoresist structure by adjusting the focus offsets in a projection ultraviolet (UV) lithography system. In our experiments, highly precise patterns on Ni-electroformed mold were replicated from a photoresist master. The practicality of the mold was then evaluated by thermal nanoimprint experiments on polycarbonate (PC). When the focus offsets became small by moving the UV image plane (defined by wafer surface) closer to the lens the inclined angles of the photoresist walls increased. In this work, the release force was measured using a desktop nanoimprint system equipped with a load cell that measured not only the compression power but also the tensile force in the de-molding process. Starting from the glass transition temperature T _g (144°C) of PC, the heating temperature in the molding process was changed by increments of 10°C resulting in T _g + 10, T _g + 20, and T _g + 30°C. The result showed that the release force decreased with increasing incline angles. It was observed that the more inclined the sidewalls of the mold pattern were, further small the release forces became, and the mold pattern became to be defended from deformation.     

Manufacture of microfluidic glass chips by deep plasma etching, femtosecond laser ablation, and anodic bonding

Two dry subtractive techniques for the fabrication of microchannels in borosilicate glass were investigated, plasma etching and laser ablation. Inductively coupled plasma reactive ion etching was carried out in a fluorine plasma (C₄F₈/O₂) using an electroplated Ni mask. Depth up to 100 μm with a profile angle of 83°–88° and a smooth bottom of the etched structure (Ra below 3 nm) were achieved at an etch rate of 0.9 μm/min. An ultrashort pulse Ti:sapphire laser operating at the wavelength of 800 nm and 5 kHz repetition rate was used for micromachining. Channels of 100 μm width and 140 μm height with a profile angle of 80–85° were obtained in 3 min using an average power of 160 mW and a pulse duration of 120 fs. A novel process for glass–glass anodic bonding using a conductive interlayer of Si/Al/Si has been developed to seal microfluidic components with good optical transparency using a relatively low temperature (350°C).     

Direct dry film optical bonding ‐ A low‐cost,robust, and scalable display lamination technology

Abstract— A robust, repeatable, low‐cost lamination process that utilizes pressure‐sensitive adhesive (PSA) to directly bond substrates to displays, such as LC, OLED, plasma, and electrophoretic displays, has been developed. These substrates can vary in intent and serve as protective covers, reflection mitigation, heaters, filters, touch screens, environmental barriers, etc. The resultant assembly is very rugged (shock, impact, and vibration resistant), while maximizing optical performance. This paper briefly describes the traditional liquid bonding technologies and compares them to dry‐film bonding. A section of the paper focuses on the enhanced optical and environmental performances of dry‐film bonded displays. This paper may also serve as a brief review of optical‐bonding technologies.     

PMMA to Polystyrene bonding for polymer based microfluidic systems

A thermal bonding technique for Poly (methylmethacrylate) (PMMA) to Polystyrene (PS) is presented in this paper. The PMMA to PS bonding was achieved using a thermocompression method, and the bonding strength was carefully characterized. The bonding temperature ranged from 110 to 125 °C with a varying compression force, from 700 to 1,000 N (0.36–0.51 MPa). After the bonding process, two kinds of adhesion quantification methods were used to measure the bonding strength: the double cantilever beam method and the tensile stress method. The results show that the bonding strength increases with a rising bonding temperature and bonding force. The results also indicate that the bonding strength is independent of bonding time. A deep-UV surface treatment method was also provided in this paper to lower the bonding temperature and compression force. Finally, a PMMA to PS bonded microfluidic device was fabricated successfully.     

Fabrication of microfluidic device channel using a photopolymer for colloidal particle separation

We have developed a method of fabricating microfluidic device channels for bio-nanoelectronics system by using high performance epoxy based dry photopolymer films or dry film resists (DFRs). The DFR used was with a trademark name Ordyl SY355 from Elga Europe. The developing and exposing processes as well as the time taken in making the channels are recorded. Finally from those recorded methods, the accurate procedures and time taken for DFR development and exposure have been found and ultimately been consistently used in fabricating our channels. These channels were patterned and sandwiched in between two glass substrates. In our advance, the channel was formed for the colloidal particle separation system. They can be used for handling continuous fluid flow and particle repositioning maneuver using dielectrophoresis that have showed successful results in the separation.     

Fabrication of chamber for piezo inkjet printhead by SU-8 photolithography technology and bonding method

The chamber is an important part of the inkjet printhead. However, the present fabrication methods of chamber suffer from a low alignment resolution between nozzle plates and piezoelectric structure and residual SU-8 removing problems during chamber fabricating process. In this paper, a SU-8 chamber was fabricated by using ultraviolet (UV) photolithography and SU-8 thermal bonding method. By this method, the infilling problem of the chamber during thermal bonding process was solved, and low alignment resolution problem of conventional UV exposure system during assembly process was avoided. The thickness of the SU-8 nozzle plate was optimized, and the influence of bonding parameters on the deformation of chamber was analyzed. The simulation results show that the optimal thickness of the SU-8 nozzle plate is 40 μm and the optimal bonding parameters are bonding temperature of 50 °C, bonding pressure of 160 kPa and bonding time of 6 min. The tensile test results show the bonding strength of the SU-8 chamber is 2.1 MPa by using the optimized bonding parameter.     

Silver (Ag) as a novel masking material in glass etching for microfluidics applications

In this paper, we report the use of a single masking film for deep glass etching in hydrofluoric acid (HF). Thin film silver (Ag) is the key masking material in this work enabling a simple and low cost fabrication of microfluidic structures. The Ag film was deposited by evaporation and etched in a diluted nitric acid and de-ionized water solution at a ratio of 1:3. Surface morphology for different thicknesses of Ag film and its correlation to the maximum achievable etch depth is analyzed. AFM results shows low roughness values (<5 nm), indicating the Ag films are of smooth surface. With a 100 nm Ag film, a 220 μm etch depth in borosilicate glass substrates were produced and by further thickening the Ag to 300 nm, etch depths exceeding 300 μm were successfully achieved. SEM images show that thinner Ag films are of finer grains, potentially a source for pinholes formation where rapid penetration of HF along the grain boundaries peels off the Ag film from the glass surface. However, the Ag film was found not to react with HF. The process was demonstrated in the fabrication of cavities for integration with other microfluidic devices.     

Laminated paper-based analytical devices (LPAD): fabrication, characterization, and assays

Paper-based microfluidic devices have recently garnered an increasing interest in the literature. The majority of these devices were produced by patterning hydrophobic zones in hydrophilic paper via photoresist or wax. Others were created by cutting paper using a laser. Here, we present a fabrication method for producing devices by simple craft-cutting and lamination, in a way similar to making an identification (ID) card. The method employs a digital craft cutter and roll laminator to produce laminated paper-based analytical devices (LPAD). Lamination with a plastic backing provides the mechanical strength for a paper device. The approach of using a craft cutter and laminator makes it possible to rapid-prototype LPAD with no more difficulty than producing a typical ID card, at very low cost. Devices constructed using this method have been exploited for simultaneous detection of bovine serum albumin (BSA) and glucose in synthetic urine with colorimetric assays. Both BSA and glucose are detectable at clinically relevant concentrations, with the detection limit at 2.5 μM for BSA and 0.5 mM for glucose.     

Roll manufacturing of flexible microfluidic devices in thin PMMA and COC foils by embossing and lamination

Microfluidics on foil is gaining momentum due to a number of advantages of employing thin films combined with the capability of cost-effective high-volume manufacturing of devices. In this work, ultra-thin, flexible Y-microreactors with microchannels of 100 μm width and 30 μm depth were fabricated in thermoplastic polymer foils. The fluidic pattern was hot roll embossed in 125 μm thick poly-methyl-methacrylate (PMMA) and 130 μm thick cyclic-olefin-copolymer (COC) films using a dry-etched microstructured silicon wafer as a flat embossing tool in a laminator. The sealing of the channels was performed with two different techniques, one based on lamination of SU8 dry film resist (DFR) and the other one based on spin-coated poly-dimethylsiloxane (PDMS). Testing of the interconnected microreactor was carried out using two dye colorant solutions to demonstrate mixing.