金属膜固定电阻器的成膜材料及工艺

Ni-Cr系合金是一种应用非常广泛的金属膜电阻器的合金材科。它具有电阻率高、方电阻值大、电阻温度系数小、薄膜与基体附着牢固、熔点低、易于用真空蒸发法制成薄膜的特点。 国内生产金属膜电阻器习惯于粉料蒸发,而国外同时存在三种不同的成膜材料和两种成膜工艺。本文着重讨论了采用国产Cr20Ni80合金线,增加时效处理工艺制成的薄膜及其性能。     

激光热处理对化学沉积Ni-P合金薄膜性能的影响

用扫描电镜(SEM)观察了化学沉积Ni-P合金薄膜/单晶硅基体的结构与颗粒度,利用X射线衍射(XRD)技术测试了其化学沉积后的残余应力,测量了激光热处理后残余应力的变化规律,分析了残余应力对磨损性能及界面结合强度的影响。实验结果表明,化学沉积Ni-P合金薄膜/硅基体的残余应力均表现为拉应力,经过激光热处理后残余应力发生了变化,由高值的拉应力变为低值的拉应力或压应力;薄膜残余应力对其磨损性能有明显的影响,其磨损量随着残余应力的减小而减小;薄膜与基体结合强度随着残余应力的增大而减小,合理地选择激光热处理参数可以精确地控制薄膜残余应力,提高其结合强度。     

激光加工薄膜电路和集成电路

本文研究了使用钇铝柘榴石激光器作为一种热加工集成电路工具的可能性。结果指出,这样一种激光器可完成确成电阻器的几何形状、微调电阻器阻值、制造间隙电容器以及确定互连电路。已在各种薄膜和电镀膜上对由激光加工产生的图案作了验证。蒸发线条(间隙)易达到薄膜为0.25密耳和电镀膜为0.4密耳的精细程度。特别是在好的控制条件下,可以得到更细的线条。这些薄膜可以除去,而对基片表面影响极小。基片的热影响区能限制到小于薄膜的厚度。较好的激光输出控制和较短的脉冲宽度能减少这一厚度。已经制成0.04平方时、电容量接近20微微法,用蓝宝石作基片的间隙电容器,并且对实验提出了改进。钽薄膜能形成电阻器的几何形状,而且可用激光除去金属或氧化电阻膜来微调其公差。电阻器通常可微调成小于±0.1%的公差。进一步发展有可能组合这些激光加工过程成为一种单一步骤、自动制造某些类型集成电路的程序。我们评论激光加工的一些技术问题,并且讨论使用 Q 突变钇铝拓榴石激光器来直接加工光刻用的掩模。     

内嵌式电阻器之发展

1 电阻器的原理及特性 不管何种形式的电阻器,必定由电阻率(Resistivity)较高的“导体”所制成,且所呈现的电阻值也应在某种公差之内。此种常用的电阻素材     

集成电路镍铬薄膜的电阻特性与热处理效应

在利用磁控溅射方法制作用于ＩＣ的镍铬薄膜电阻过程中，发现在对薄膜热处理时薄膜的电阻特性发生了有规律的变化，这种变化不是单纯的线性增大或减小。针对这种现象，我们经过分析认为，由于金属膜薄的电阻率不同于块状金属的电阻率，已不是定值，它与金属膜厚有着一定的关系，而热处理所产生的凝聚效应、氧化效应、和稳态效应对不同厚度的薄膜电阻率的影响程度是不一样的，因此电阻经热处理后的变化值最终表现出不同的变化趋势。这一现象的发现对我们今后在ＩＣ镍铬合金薄膜电阻的设计优化方面具有较高的参考意义。     

金属电阻率及电阻器的辐照损伤

本文概述了辐照对金属、单项固溶体合金的电阻率及电阻器的影响,包括核能和空间环境的辐照类型及辐照效应,金属及合金在室温辐照后的电阻率变化及机理,电阻器的辐射容限及在空间环境下参数退化的评价、     

陶瓷基体含鉀鈉对薄膜电阻器負荷寿命的影响

本文叙述了几种薄膜电阻器的材料和对瓷体表面的一般要求。测试了基体的高温绝缘电阻特性;研究了不同基体对三种薄膜电阻器负荷寿命的影响。金属膜电阻器的试验指出:直流负荷时,开始阻值变化呈半永久性,薄膜的电化学腐蚀破坏是逐渐的、比较长期的。这一过程与试验条件有关:当降低比负荷功率时可以减缓这一效应;基体中鉀、钠含量不同,这一效应有显著差别。 文中指出了改善薄膜电阻器直流老化性能的一些可能措施。根据新、老瓷体电阻器的负荷寿命对比的结果,作者认为有效的措施是:采用以碱士金属氧化物为助熔剂的陶瓷基体。     

Cu导体RF溅射NiCr薄膜电阻器的电性能

<正> NiCr是制造精密薄膜电阻器最常用的电阻材料之一,其电阻率范围较宽,TCR低,电性能稳定性好。NiCr薄膜电阻器的接触金属一般采用Ti-Pd-Au系多层导体(国内多数用NiCr/Au系——译者)。随着金     

微波电路用共面电极TaNx薄膜片式电阻器

采用反应溅射方法制作TaNx电阻薄膜,并通过溅射Ni、Au形成双层共面电极。研究了溅射条件对电阻薄膜组分的影响以及此类电阻器的微波特性。结果显示,溅射工作真空度小于0.5Pa,氮气体积分数大于5%时,可以得到阻值稳定的六方晶体结构TaNx电阻薄膜,其共面电极的电阻器使用频率上限大于20GHz。     

提高金属膜电阻器可靠性的途径

介绍了采用射频反应工艺制备的ＡｌＮ薄膜对金属膜电阻器性能的影响，通过功率老化、高温贮存试验和电阻温度系数的测量，结果表明在陶瓷基体上淀积ＡｌＮ薄膜可以提高金属膜电阻器的可靠性。     

Quantitative Analysis of Resistance Variations in Nickel-Phosphorus (NiP) Resistors

Embedded resistors can be fabricated by plating resistive Nickel-Phosphorus (NiP) alloy to form resistors on circuit boards. As-deposited NiP alloy resistors typically have poor resistance tolerances and require tuning by costly laser trimming to meet specifications. The cost of the resistors can be reduced if the tolerances can be reduced without laser trimming. In this study, a group of parameters affecting patterning accuracies, plating and sheet resistivities were varied to evaluate their effects on the resistance tolerances of electroless-plated NiP resistors. The effect of the substrate on sheet resistivity variations was also characterized. Design guidelines to obtain NiP resistors with low tolerance without laser trimming arc discussed.     

An assessment of the applicability of embedded resistor trimming and rework

The successful use of embedded resistors in many applications will require that the fabricated resistors be trimmed prior to lamination into printed circuit boards to attain required design tolerances. Depending on the application, the economic value of the board being fabricated, and the process used to create the embedded resistors, it may also be prudent to consider reworking resistors that are incorrectly trimmed or with initial values that are too large (untrimmable resistors). This paper uses a model of the resistor/board yield coupled with a cost model of the trim and rework processes to identify conditions under which applications should neither trim nor rework, trim but not rework, or perform both trimming and rework of embedded resistors, as a function of the design tolerance for the resistors and the accuracy with which the embedded resistors can be fabricated. Example results are presented for several applications ranging from small boards with a high density of embedded resistors to large boards with a low density of embedded resistors. Distinct regions of trimming and rework applicability that are nearly application independent can be identified as a function of design tolerance, printing/plating/etching variation, and the characteristics of the trimming process.     

Quantitative Analysis of Resistance Tolerance of Polymer Thick Film Printed Resistors

Low cost methodologies of resistor fabrications are needed for cost effective embedding of resistors into polymeric substrates. Polymer thick film resistors (PTFRs) are low temperature processable, low cost resistors with a wide resistivity range. The electrical resistance variation of these resistors is in the range of around plusmn20% after deposition and trimming procedure is employed to tune the resistances to meet specifications. This adds to the cost and complicates the fabrication process when the resistors are embedded. In this study, the influences of PTFRs geometries on the resistance tolerances were investigated. Results indicated that the resistance accuracy of stencil printed resistors was markedly higher than that of the screen-printed resistors. The screen-printed resistor edge geometries were observed to be rough. Finite element method analyses revealed that the resistance tolerances were associated with edge roughness. Remedies to reduced variations were proposed and the relationship between resistance tolerances and aperture orientations was also outlined     

不锈钢化学镀Ni-P合金镀层的性能研究

讨论了不锈钢上化学镀Ni-P合金镀层的工艺,重点是不锈钢基体的前处理工艺、镀液温度和PH值.对镀层成分和结构的分析、结合力测试表明,用文中提出的前处理工艺对不锈钢基体处理后,再进行化学镀能获得性能可靠的Ni-P合金镀层.     

PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法研究

文章研究了在PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法。基于埋入电阻在挠性及刚性PCB板中的应用,分别研究了Ni-P合金在无卤的FR-4、无卤的PI两种PCB基材上镀层厚度与试验时间之间的关系,初步得出了在两种不同基材上化学沉积Ni-P合金的规律,该规律对后期的试验具有重要的指导作用。     

An approach to ensure stability of precision laser trimmed thick film resistors

In view of its complete automation, very high throughput, least in process variation, etc., laser trimming has been an industry standard in thick film technology. Random variations in print thickness, uncertainty of sheet resistivity in a paste lot and other process variations in a production line make it difficult to ensure a reasonably good yield for high precision resistors, where the tolerances under consideration are of the order of ±0.30%. Special attention has to be given to the resistor configuration type of laser cut and post trim processing. The studies were performed on samples drawn from a regular production line which contained two resistor—one with AR (L/W) > 1 where an L cut/Vernier cut combination was used for trimming and the other with AR < 1 where a P cut/Vernier cut combination was used. The post trim resistors' performance was studied under two conditions—one at room temperature and the other after baking at 150°C for 100hr and then maintained at room temperature. These studies lead to the conclusion that for high precision resistors the resistors should be so designed that the L cut/Vernier cut combination can be adopted for trimming. Secondly the trimmed resistor should be stored at 150°C for a period of 100 hr to make the post trim behaviour more predictable and also to achieve better yield.     

纳米化学复合镀的开发及在PCB制造中的应用研究

化学镀表面处理技术使用范围很广,镀层均匀、装饰性好;在防护性能方面,能提高产品的耐蚀性和使用寿命;在功能性方面,能提高加工件的耐磨性和导电性、润滑性能等特殊功能,因而成为表面处理技术的一个重要部分。钠米化学复合镀是在化学镀液中加入纳米粒子,使其与化学镀层共沉积的工艺技术。文章主要研究在化学镀Ni-P中加入纳米颗粒,在基体表面沉积具有镀厚均匀、耐磨、耐腐蚀、可焊的纳米复合镀层,阐明镀液组成和工艺条件对沉积速率、镀液稳定性、镀层与基体的结合力的影响,获得钠米化学复合镀技术的工艺参数,并对纳米复合镀层的性能进行了研究。     

Calculation of the resistance value of laser-trimmable planar resistors in an interactive mask-layout design system

The calculation method is especially suited for diffused resistors in integration processes and metal-film resistors in thin-film processes which can be adjusted by laser trimming. The method is based on a special application of Green's boundary formula. By modeling the resistor in a special way, the potential problem is reduced to a single-boundary problem. As a consequence, the calculation time and the necessary computer memory are reduced while the accuracy reduction remains small in practical cases. Therefore, the calculation can be carried out on a small computer, making interactive computer design of laser-trimmable resistors on IC layouts more feasible and less expensive. The computing time typically amounts to a few seconds. The method is illustrated by practical examples.     

激光熔敷PdCuSi合金非晶涂层的研究

研究了采用５ｋＷＣＯ２连续激光器和２００ＷＹＡＧ脉冲激光器在Ｃｕ基材上进行熔敷ＰｄＣｕＳｉ合金非晶态涂层，讨论了两种激光器辐照条件下该合金的非晶形成能力和Ｎｉ－Ｐ非晶预镀层的作用。     

化学镀镍铜磷在钕铁硼表面处理上的应用研究

为提高钕铁硼表面镀层的耐蚀性,使其具有更高的经济附加值,采用在化学镀镍磷合金液中添加适量的铜离子及其复合络合剂,制得镍铜磷三元合金。研究了镍离子、铜离子、次亚磷酸钠、复合络合剂添加量,沉积温度、pH值对合金镀层沉积速度的影响。利用中性盐雾试验比较了其与电镀镍、化学镀镍磷合金的耐蚀性能。结果表明：化学镀镍铜磷合金能明显提高钕铁硼表面处理后的耐蚀能力。