Underwater shock consolidation of Mg–SiC composites

The shock consolidation of magnesium (Mg)/silicon carbide (SiC) composites using axisymmetric explosive fabrication setup is reported. Pure Mg and SiC powders are consolidated in a three-layered cylindrical assembly with the energy being derived from a high-detonation velocity explosive. The pressure of underwater shock wave is experimentally measured and simulated using AUTODYN 2D. Microstructural characterization of the samples revealed a well-flown Mg matrix enveloping near homogeneous SiC particles. Occasional clustering of SiC particles and interparticle melting is evidenced. Results of microhardness revealed that the presence of SiC particulates led to a substantial increase in the hardness of the composite. Fractography results indicate the lack of formation of ductile dimples, which is attributed to the presence of discontinuous SiC particles. The strengthening mechanism, the absence of reaction products, the structure–property correlation of the shock consolidated composite are discussed.     

An investigation of the effect of SiC particle size on Cu–SiC composites

In this study mechanical properties of copper were enhanced by adding 1 wt.%, 2 wt.%, 3 wt.% and 5 wt.% SiC particles into the matrix. SiC particles of having 1 μm, 5 μm and 30 μm sizes were used as reinforcement. Composite samples were produced by powder metallurgy method and sintering was performed in an open atmospheric furnace at 700 °C for 2 h. Optical and SEM studies showed that the distribution of the reinforced particle was uniform. XRD analysis indicated that the dominant components in the sintered composites were Cu and SiC. Relative density and electrical conductivity of the composites decreased with increasing the amount of SiC and increased with increasing SiC particle size. Hardness of the composites increased with both amount and the particle size of SiC particles. A maximum relative density of 98% and electrical conductivity of 96% IACS were obtained for Cu–1 wt.% SiC with 30 μm particle size.     

Fabrication of Al–Cu laminated composites by diffusion rolling procedure

Abstract

A diffusion rolling procedure was employed for the fabrication of Al–Cu laminated composites; the microstructure and mechanical properties of the interface were investigated. With diffusion bonding initially, intermetallic compounds (IMCs) occurred at the Al/Cu interface. After plastic deformation by rolling the laminated composites, the interface strip of IMCs broke and became discontinuous equiaxed particulates. Compared with roll bonding with heat treatment and diffusion bonding, the shear tensile strength of two-stage processed Al/Cu interface reached a maximum value equivalent to 90% of that of Al. Therefore, it is concluded that the diffusion rolling procedure yielded the highest strength of Al–Cu laminated composites.     

Transient liquid phase diffusion bonding of continuous SiC fibre reinforced Ti–6AI–4V composite to Ti–6AI–4V alloy

Abstract

A continuous SiC fibre reinforced Ti–6Al–4V composite was diffusion bonded in transient liquid phase to Ti–6Al–4V alloy plate using Ti–Cu–Zr amorphous filler metal. Joint strength increased with bonding time up to 1·8 ks and reached the maximum value of 850 MN m^?2 which corresponded to 90% of the tensile strength of Ti–6Al–4V. The extent of deformation of Ti–6Al–4V in the vicinity of the bonding interface was small compared with that of solid diffusion bonding because of the low bonding pressure. The bonding layer had an acicular microstructure which was composed of Ti₂Cu and α titanium with dissolved zirconium. Brittle products such as (Ti, Zr )₅ Si₃ or (Ti, Zr )₅ Si₄ were formed at the interface between the SiC fibres and the filler metal. These products existed only at the end of fibres, in very small amounts, therefore joint strength was not significantly affected by the products.

MST/1989     

Sinter-HIP of polymer-derived Al2O3–SiC composites with high SiC contents

Submicrometer Al₂O₃ composites with more than 20 vol.% of SiC particles were produced using a multiple infiltration of porous bodies with a liquid polymer SiC precursor. The fully dense composites were successfully densified using a sinter-HIP process. Parameters of sintering and HIP steps are discussed with respect to both densification and microstructure evolution of the composites. The initial pressure during the sintering step plays an important role for the preparation of fully dense composites with a submicrometer alumina matrix at 1750 °C. Optimized densification schedule of sinter-HIP represents a novel approach of densification at relatively mild conditions compared to previously reported or common densification methods of Al₂O₃–SiC composites with high SiC content, such as pressureless sintering, hot pressing and post-HIPing. The method expands the possibilities for preparation of alumina based composites with SiC volume fraction > 20 vol.%, filling the gap in available literature data.     

Encapsulation and microwave hybrid processing of Al 6061–Graphene–SiC composites

The demand for new aluminum alloy–based metal matrix composites with combinations of novel reinforcements, processed through innovative methods are very much needed for critical engineering applications. With this perspective, the current research work is aimed at the development of Al 6061 composites reinforced with two-dimensional Graphene nanoflake-encapsulated SiC. Ultrasonic liquid processing method is used to disperse the Graphene flake and the mixture is ball milled by adding SiC to achieve the encapsulation. Subsequently, the Al 6061 powder is added to the milled mixture and consolidated through uniaxial vacuum hot press followed by microwave hybrid sintering. Scanning electron microscope (SEM) analysis, X-ray diffraction analysis, hardness, density, and microstructure analysis were carried out on developed composites. Raman analysis was carried out to analyze the distortion on Graphene physical structure during various processing stages. Further, effects on novel combination of material with combined processing approach on flexural and tribological behavior have been analyzed.     

The analysis on transverse tensile behavior of SiC/Ti–6Al–4V composites by finite element method

A two-dimensional finite element model is created to investigate the effects of temperature and residual stress on transverse tensile behaviors for SiC/Ti–6Al–4V composites with square fiber array. The spring elements are used to simulate interfacial debonding when interfacial radial stress, composed of residual radial stress and radial stress introduced by the applied transverse tensile stress, reaches interfacial bonding strength. The results indicate that temperature has an obvious influence on the collapse stress of composites due to the change of matrix strength with temperature. And the higher temperature is, the lower collapse stress is. Residual radial stress can increase the applied stress required to cause interfacial debonding, but has a little influence on the collapse stress of the composites.     

Role of Ti in direct active bonding of SiC substrate using Sn–Ag–Ti alloy filler

Journal of Materials Science: Materials in Electronics - Low-temperature active bonding of silicon carbide substrate using Sn3.5Ag4Ti(Ce,Ga) active solder filler was carried out at...     

Effect of the SiC particle size on the dry sliding wear behavior of SiC and SiC–Gr-reinforced Al6061 composites

The effect of size of silicon carbide particles on the dry sliding wear properties of composites with three different sized SiC particles (19, 93, and 146 μm) has been studied. Wear behavior of Al6061/10 vol% SiC and Al6061/10 vol% SiC/5 vol% graphite composites processed by in situ powder metallurgy technique has been investigated using a pin-on-disk wear tester. The debris and wear surfaces of samples were identified using SEM. It was found that the porosity content and hardness of Al/10SiC composites decreased by 5 vol% graphite addition. The increased SiC particle size reduced the porosity, hardness, volume loss, and coefficient of friction of both types of composites. Moreover, the hybrid composites exhibited lower coefficient of friction and wear rates. The wear mechanism changed from mostly adhesive and micro-cutting in the Al/10SiC composite containing fine SiC particles to the prominently abrasive and delamination wear by increasing of SiC particle size. While the main wear mechanism for the unreinforced alloy was adhesive wear, all the hybrid composites were worn mainly by abrasion and delamination mechanisms.     

Interfacial adhesion energies of Ru–Mn direct plateable diffusion barriers prepared by atomic layer deposition for advanced Cu interconnects

The effects of Mn addition and post-annealing on the interfacial decohesion energies of Ru direct plateable diffusion barrier layer prepared by atomic layer deposited (ALD) for advanced Cu interconnect applications were systematically evaluated using a four-point bending test. The interfacial decohesion energy increased with the addition of Mn to the Ru thin films and further increased after post-annealing at 500 °C for 30 min in a hydrogen atmosphere, and the interfacial decohesion energies were 3.63, 6.74, and 20.09 J/m² for the as-deposited Cu/Ru/SiO₂, as-deposited Cu/Ru-4.2 at.%Mn/SiO₂, and annealed Cu/Ru-4.2 at.%Mn/SiO₂, respectively. The scanning transmission electron microscopy (STEM) and energy dispersive spectroscopy (EDS) analysis results clearly indicated that the Mn in the annealed ALD Ru–Mn film diffused toward a Ru/SiO₂ interface and Mn silicate was formed at the Ru/SiO₂ interface. Additionally, the results of the X-ray photoelectron spectroscopy (XPS) analysis clearly showed that MnSiO₃ and MnSi were formed at the Ru/SiO₂ interface. Consequently, the findings of the XPS and STEM/EDS study revealed that there was an adequate correlation between the interfacial decohesion energy and the MnSi and MnSiO₃ bond formed at the Ru–Mn /SiO₂ interface. Therefore, a properly annealed ALD Ru-4.2Mn thin film appears to be a hopeful diffusion barrier layer candidate with strong interfacial reliability for advanced Cu interconnects.

     

Ultrasonic Electrodeposition of Cu–SiC Electrodes for EDM

Cu-SiC composite electrodes composed of both a Cu matrix and dispersed inert SiC particles were fabricated for electrical discharge machining (EDM) using the ultrasonic-aided electrodeposition technique. The influence of ultrasonic power on the surface morphology, content of SiC particles, and EDM wear rate of the fabricated Cu-SiC composite electrode were investigated. Results show that the incorporation of SiC particles into the composite electrode was enhanced and that the uniformity of particle distribution in the Cu matrix improved when the ultrasonic dispersion was initiated during electrodeposition. The composite that was generated at low ultrasonic power contained more SiC than that produced at high ultrasonic power. Moreover, the Cu-SiC electrode fabricated at low ultrasonic power displayed the least erosion wear during EDM.     

Kinetics of reactive diffusion between Ta and Cu–9.3Sn–0.3Ti alloy

Tantalum is used as a diffusion barrier in the superconducting Nb₃Sn composite-wire manufactured by the bronze method. In order to examine the consumption behavior of the Ta barrier during annealing in the bronze method, the kinetics of the reactive diffusion between Ta and a bronze was experimentally observed using sandwich diffusion couples composed of Ta and a Cu–9.3Sn–0.3Ti alloy. The (Cu–Sn–Ti)/Ta/(Cu–Sn–Ti) diffusion couples were isothermally annealed at temperatures of T = 973–1053 K for various times up to t = 1462 h. Owing to annealing, Ta₉Sn is formed as a uniform layer at the initial (Cu–Sn–Ti)/Ta interface in the diffusion couple, and gradually grows mainly toward Ta. The mean thickness of the Ta₉Sn layer is proportional to a power function of the annealing time. However, the exponent of the power function is equal to unity at t < t _c but smaller than 0.5 at t > t _c. Thus, the transition of the rate-controlling process for the growth of Ta₉Sn occurs at t = t _c. The critical annealing time t _c takes values of 1.83 × 10⁶, 4.63 × 10⁵, and 5.98 × 10⁵ s at T = 973, 1023, and 1053 K, respectively. The growth of Ta₉Sn is controlled by the interface reaction at the migrating Ta₉Sn/Ta interface in the early stages with t < t _c but by the volume and boundary diffusion across the Ta₉Sn layer in the late stages with t > t _c. Due to the transition of the rate-controlling process, the growth rate is always much smaller for Ta₉Sn than for Nb₃Sn. As a result, Ta works as an effective barrier against the diffusion of Sn from the bronze to the Cu stabilizer in the superconducting Nb₃Sn composite-wire.     

Studies on mechanical and dry sliding wear of Al6061–SiC composites

Particulate reinforced Al-MMCs exhibits better mechanical properties and improved wear resistance over other conventional alloys. In the present paper, the experimental results of the mechanical and tribological properties of Al6061–SiC composites are presented. The composites of Al6061 containing 2–6 wt% SiC were prepared using liquid metallurgy route. The experimental results showed that the density of the composites increase with increased SiC content and agrees with the values obtained through the rule of mixtures. The hardness and ultimate tensile strength of Al6061–SiC composites were found to increase with increased SiC content in the matrix at the cost of reduced ductility. The wear properties of the composites containing SiC were superior to that of the matrix material.     

Wetting behavior and interfacial microstructure of palladium- and silver-based braze alloys with C–C and SiC–SiC composites

High-temperature sessile-drop wettability tests were conducted on unpolished C–C and SiC–SiC composite substrates using commercial braze alloys Palco (Pd-35Co), Palni (Pd-40Ni), Cusil-ABA (63Ag–35.3Cu–1.75Ti), and Ticusil (68.8Ag–26.7Cu–4.5Ti). Observations revealed non-uniform, anisotropic spreading, copious braze infiltration of the composite substrates, particularly C–C composite, and Ti enrichment at the composite/braze interface together with dissolution of Si (from SiC–SiC composite) in braze and diffusion of Co (from Palco) in the composite. The droplet/composite contact region near the droplet center revealed intimate and microstructurally sound bonding. However, inter-laminar shear cracking within the SiC–SiC composite in contact with Ticusil, Palco, and Palni, and partial substrate/droplet de-cohesion near the edge of the droplet were also observed. In Palco and Palni droplets, fiber tows in the contact region de-laminated from the main body of the composite via inter-laminar shear cracking resulting in fiber flotation, segregation, and surface degradation. The study is one of the first empirical enquiries into the complex wetting and spreading behavior of brazes on commercial C–C and SiC–SiC composites.     

MicroRaman spectroscopy of protective coatings deposited onto C/C–SiC composites

Abstract

MicroRaman spectroscopy has been used in the present work to investigate the structure and composition of pyrolytic carbon (PyC) and SiC protective coatings formed under various chemical vapour deposition conditions. Analysis of spectra obtained during Raman line mapping experiments on samples with graded Si_xC_y layer in the region of about 700–1000 cm^?1 allows information to be extracted on different SiC polytypes. It was found that the graded SiC layered sample contained a mixture of 3C–SiC and 6H–SiC polytypes at the film/substrate interface, but for the major part of this layer the 3C–SiC (β-SiC) phase predominates. For pure PyC films, it was found that the formation of PyC layer begins at 1200°C and the layer formed at this temperature is more uniform with slightly larger crystallite size (～3 nm) compared to that in the layer formed at 1300°C.     

Electroless Ni–Mo–P diffusion barriers with Pd-activated self-assembled monolayer on SiO2

Ternary Ni-based amorphous films can serve as a diffusion barrier layer for Cu interconnects in ultralarge-scale integration (ULSI) applications. In this paper, electroless Ni–Mo–P films deposited on SiO₂ layer without sputtered seed layer were prepared by using Pd-activated self-assembled monolayer (SAM). The solutions and operating conditions for pretreatment and deposition were presented, and the formation of Pd-activated SAM was demonstrated by XPS (X-ray photoelectron spectroscopy) analysis and BSE (back-scattered electron) observation. The effects of the concentration of Na₂MoO₄ added in electrolytes, pH value, and bath temperature on the surface morphology and compositions of Ni–Mo–P films were investigated. The microstructures, diffusion barrier property, electrical resistivity, and adhesion were also examined. Based on the experimental results, the Ni–Mo–P alloys produced by using Pd-activated SAM had an amorphous or amorphous-like structure, and possessed good performance as diffusion barrier layer.     

Multiscale aggregating discontinuities method for micro–macro failure of composites

The application of a multiscale method, called the multiscale aggregating discontinuities (MAD) method, to the failure analysis of composites is described. Two distinct features of the MAD method are the use of perforated unit cells, and the extraction of coarse-grained failure information. In the perforated unit cell, all subdomains of the unit cell that are not strictly elliptic are excluded, which enables the decomposition of its stable and unstable material. By means of these concepts, it is possible to compute an equivalent discontinuity at the macroscale, including both the direction and the magnitude of the discontinuity. This equivalent discontinuity is then passed to the macroscale along with the computed stress from the unit cell. The macroscale discontinuity is injected into the macro model by the extended finite element method (XFEM) procedure. In this paper, the method is improved by adding hourglass modes to the unit cell deformations, which better model growing cracks. Several examples comparing the MAD method with direct numerical simulations are presented.     

Production and properties of steel–TiC composites for Wear applications

Abstract

Fe–(WTi)C composite granules containing up to 80 wt-% carbide have been produced by a selfpropagating high temperature synthesis reaction. These can be readily distributed in conventional steel melts. Additions up to 17 wt-% carbide have been made to a 0·4 wt-%C steel which was subsequently cast and hot rolled to plate. The microstructures of cast, rolled, and heat treated. samples display a homogeneous distribution of carbides which do not significantly affect the rolling performance of the steels. The carbides and grain refinement in heat treated samples result in a marked improvement in mechanical properties. The most significant improvement as a fraction of carbide additions is seen in abrasive wear performance.

MST/3196     

The method of fundamental solutions with dual reciprocity for diffusion and diffusion–convection using subdomains

The method of fundamental solutions (MFS), first proposed in the 1960s, has recently reappeared in the literature and solutions of an extraordinary accuracy have been reported using relatively few data points. The method requires no mesh and therefore no integration, and has been recently combined with dual reciprocity method (DRM) for treating inhomogeneous terms. The objective of this paper is the combination of the two methods for treating convective terms which are derivatives of the problem variable. First the formulation of the methods for mixed Neumann–Dirichlet boundary conditions is considered, as both these types of boundary condition are necessary for this type of problem. Next a formulation for the usual Crank–Nickleson and Galerkin time-stepping procedures is obtained for both diffusion and diffusion–convection and the use of the subdomain technique with MFS is considered. Finally results obtained for some test problems are presented including a diffusion convection problem with variable velocity using both a single domain and a division into subregions, the convective terms being modeled using DRM. Results are compared with exact solutions and in some cases with DRBEM examples from the literature.     

Cross-property connections for copper–graphite composites

Copper–graphite composite materials in the range of 0–10 vol% of carbon phase were prepared from the mixture of copper and graphite powders by hot isostatic pressing. The microstructure, mechanical (tensile strength, elongation to fracture) and physical (electrical and thermal conductivity) properties of composite samples were investigated, and the cross-property connections were calculated. It was shown that electrical and thermal conductivity cross-property (Lorenz number) is almost constant and increases only slightly (no more than 10 % increase was observed). This implies that in the investigated composition range the Lorenz number of a copper–graphite composite system behaves according to Franz–Wiedemann law for pure metals at constant temperature. On the contrary, the conductivity to tensile strength cross-property connections showed significant linear increase (over 200 % in the investigated composition range) for both electrical conductivity and thermal conductivity of composite materials. The cross-property connections of conductivity to the elongation to fracture exhibit a nonlinear dependence on the volume fraction of graphite.