超高频感应连续钎焊立方氮化硼磨粒的界面反应机理

采用超高频感应连续钎焊工艺,在不同扫描速度条件下实现了立方氮化硼(CBN)磨粒、Ag-Tu-Ti合金以及基体三者之间的钎焊连接。采用扫描电子显微镜(SEM)和X射线能谱仪(EDX)观察钎焊后的CBN磨粒界面新生化合物形貌。结果表明:随着扫描速度的变化,在CBN磨粒表面生成颗粒状TiN化合物以及针状和六棱柱状的TiB2化合物。其中,TiN尺寸为100 nm左右,而TiB2尺寸小于200 nm。在超高频感应连续钎焊CBN磨粒表面首先生成颗粒状TiN层,然后在TiN层外围形成柱状TiB2层,最终形成CBN/TiN/TiB2/钎料结构。当扫描速度为0.5 mm/s时,可以获得较好的界面新生化合物层结构。     

高温钎焊立方氮化硼界面微结构

以Ag-Cu-Ti合金为钎料采用真空钎焊的方法在优化的钎焊温度和时间下，实现了立方氮化硼(CBN)与砂轮基体的牢固连接。运用扫描电镜(SEM)、X射线能谱仪(EDS)及X射线粉末衍射仪(XRD)对连接界面的微观组织以及CBN表面生成物的三维形貌、化学成分、物相结构进行了综合分析。结果表明，钎料中的元素Ti向CBN表面扩散富集，生成了针状TiB2和TiN，在磨粒与钎料界面形成化学冶金结合，这是CBN与Ag-Cu-Ti钎料间有良好浸润性和高结合强度的主要原因。磨削对比试验表明钎焊CBN砂轮比电镀CBN砂轮具有更高的磨粒把持强度。     

钛基钎料真空钎焊立方氮化硼的分析

采用Ti-Zr-Ni-Cu钎料在优化钎焊温度和时间下对CBN磨粒进行了真空钎焊试验,实现了CBN与钢基体的高强度连接.采用SEM对CBN表面化合物三维形貌进行了观察分析,采用EDS分析了CBN表面化合物及钎料与钢基体界面成分变化,采用XRD对焊后的CBN磨粒及其表面的化合物进行了物相分析,最后对CBN试样进行了断口分析.结果表明,CBN表面生成了Ti元素的的针状、块状化合物TiB2和TiN,磨粒与钎料间界面形成化学冶金结合,这正是CBN与Ti-Zr-Ni-Cu有良好润湿性和高强度连接的主要原因.断口形貌的分析表明,CBN与Ti-Zr-Ni-Cu钎料间的断口发生在CBN磨粒内部,说明CBN磨料与Ti-Zr-Ni-Cu合金钎料的结合强度大于CBN磨粒本身的强度.     

立方氮化硼钎焊制备磨料砂轮的工艺及性能研究

利用Ag-Cu-Ti活性钎料在真空炉中钎焊,制备了单层钎焊CBN(立方氮化硼)磨料砂轮。实验结果表明,Ag-Cu-Ti合金钎料对立方氮化硼表现出良好的浸润性,并将立方氮化硼牢牢钎焊住。扫描电镜、X-射线能谱和X-射线衍射对界面微区组织的分析研究表明,钎焊过程中Ag-Cu-Ti合金钎料中的Ti向立方氮化硼磨粒界面富集,并与立方氮化硼磨料表面的N和B元素发生反应生成TiN和TiB2。     

活性元素Ti在CBN与钎料结合界面的特征

通过扫描电镜、能谱仪、X射线衍射仪研究了Ag-Cu-Ti钎料中的活性元素Ti在钎料与立方氮化硼（CBN）磨粒高温钎焊结合界面的扩散现象，并运用动力学分析对界面反应层的生长过程及反应激活能进行了探讨。结果表明：钎焊过程中，钎料中的活性元素Ti明显向磨粒侧扩散偏聚并发生化学反应，实现了磨粒与基体材料的牢固结合；钎焊CBN磨粒表面生成的TiB2和TiN化合物形貌接近平衡状态下生长的理想形貌；界面反应层在钎焊温度1153K～1193K，保温时间5min～20min之间依据抛物线生长法则所得扩散激活能值表明其生长过程主要受新生TiN影响。     

Ni-Cr钎料钎焊镀钛CBN界面微观结构分析

采用Ni-Cr钎料真空钎焊镀钛CBN磨粒和45号钢。用扫描电子显微镜、能谱仪、X射线衍射仪综合分析镀钛CBN磨粒的焊后形貌,磨粒与Ni-Cr钎料连接界面的微观结构和钎焊后磨粒表面的生成物。发现:钎焊过程中Ni-Cr钎料沿钛镀层爬升,对磨粒浸润性良好。焊后CBN磨粒出露部分的钛镀层在Ni原子的扩散下转变为Ni-Ti金属层。而在钎料包埋处,磨粒的钛镀层在钎焊过程中与CBN、Ni-Cr钎料相互扩散反应,生成了一层以NiTi和Ni_0.3Ti_0.7N为主的中间层,实现镀钛CBN磨粒和Ni-Cr钎料的冶金结合。      

AgCuTi合金钎焊单层立方氮化硼砂轮

为研制我国新一代单层钎焊CBN(立方氮化硼 )磨料砂轮 ,尝试Ni-Cr和Ag -Cu-Ti两种活性钎料 ,在真空炉中钎焊。试验结果表明 ,Ni-Cr合金钎料对CBN磨料不浸润 ,钎焊后CBN磨料全部脱落 ;而Ag -Cu -Ti合金钎料对CBN则表现出良好的浸润性并将CBN牢牢钎焊住。借助扫描电镜、X射线能谱和X射线衍射对界面微区组织的分析研究表明 ,钎焊过程中Ag -Cu -Ti合金钎料中的Ti向CBN磨料界面富集 ,并与CBN磨料表面的N和B元素反应生成TiN和TiB ,这是实现Ag -Cu -Ti合金钎料与CBN磨料高结合强度的关键因素。断口形貌的分析研究表明 ,CBN与Ag -Cu -Ti合金钎料间的断口发生在Ag -Cu -Ti合金钎料层 ,说明CBN磨料与Ag -Cu -Ti合金钎料的结合强度已超过了Ag-Cu -Ti合金钎料本身强度。最后将研制出的单层钎焊CBN磨料砂轮与传统电镀CBN砂轮进行了重负荷磨削对比试验 ,钎焊砂轮表现出明显的优势     

石墨自润滑钎焊CBN砂轮磨削镍基高温合金温度的试验研究

利用石墨自润滑钎焊CBN砂轮和陶瓷CBN砂轮进行了高温合金GH4169磨削对比试验,采用夹丝半人工热电偶方法测量工件表面磨削温度,并运用扫描电镜、能谱仪对砂轮表面磨粒的微观形貌及元素分布情况进行分析。结果表明:在相同磨削条件下,多层自润滑钎焊CBN砂轮磨削GH4169高温合金的磨削温度比陶瓷结合剂CBN砂轮低100℃左右;砂轮表层的磨粒表面形成一层石墨薄膜,有助于减小摩擦,从而降低磨削温度。     

钎焊CBN砂轮与陶瓷CBN砂轮磨削粉末冶金高温合金的加工性能对比研究

采用钎焊CBN砂轮和陶瓷CBN砂轮进行FGH96粉末冶金高温合金磨削对比试验,从磨削力与温度、表面粗糙度以及砂轮磨损等方面对CBN砂轮磨削性能进行评价。结果表明:钎焊CBN砂轮磨削力接近或低于陶瓷CBN砂轮的; 在较低进给速度下(≤360 mm/min),钎焊CBN砂轮磨削温度与陶瓷CBN砂轮的相近,在较高进给速度下(≥540 mm/min),陶瓷CBN砂轮的磨削温度明显高于钎焊CBN砂轮的; 在正常磨削条件下,钎焊CBN砂轮磨削后工件的表面粗糙度低于陶瓷CBN砂轮的,且表面粗糙度R_a均在0.800 μm以下,平均表面粗糙度R_a分别为0.508 μm和0.529 μm。钎焊CBN砂轮工作面磨粒发生材料黏附、磨耗磨损,磨削表面出现材料涂覆等现象;除磨耗磨损、黏附和砂轮堵塞外,由于磨粒破碎和脱落,陶瓷CBN砂轮易在其磨削表面形成深沟槽,降低磨削表面质量。综合分析发现,钎焊CBN砂轮磨削FGH96的性能要优于陶瓷CBN砂轮的。      

自蔓延高温烧结制备碳化钛陶瓷结合剂CBN复合材料

采用Ti/C/CBN粉体为原料,通过自蔓延高温烧结(SHS)技术,制备了TiC结合剂CBN复合材料。研究了Al添加剂与CBN粒度对烧结试样的物相组成与显微形貌的影响。研究结果表明:Ti/C/CBN试样(质量分数为10%CBN)反应后可生成TiC为主相的材料,同时CBN与Ti反应生成TiN和TiB2。但在反应后CBN发生严重的热损伤,颗粒上出现大量裂纹。在原料中添加适量Al,可避免CBN严重的热损伤,同时生成TiN、TiB2、Al3Ti、AlB2等物相。SHS反应后,较粗粒度的CBN颗粒表面会形成平均粒径约2.3μm的表面组织,而较细粒度的CBN颗粒与基体反应程度较大,部分CBN与基体元素反应形成过渡层,过渡层中组织的平均粒径约0.8μm。     

Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu–Sn–Ti active filler alloy

In order to develop the new generation superhard abrasive tools of diamond and cubic boron nitride (CBN), the brazing joint experiments of diamond/CBN crystals and AISI 1045 steel matrix using Cu–Sn–Ti active filler powder alloy were investigated in vacuum furnace. The brazing temperature was 930 °C and the dwelling time was 20 min. Interfacial characteristics of the brazing joint among the diamond/CBN grains, the active filler layer and the steel substrate were analyzed using scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction techniques. The results indicated that Ti element in the Cu–Sn–Ti alloys diffused preferentially to the surface of diamond/CBN grits to form a Ti-rich reaction layer in the brazed joints by microanalyses. Moreover, the TiC, TiN and TiB₂ phases in diamond/CBN interface and Cu–Ti phase in steel interface were confirmed by X-ray diffraction phase analysis. The wetting and bonding reactions on diamond/CBN by melting Cu–Sn–Ti alloy were realized through the interfacial reaction products like TiC, TiN and TiB₂ compounds during the brazing process. The adhesive strength experiments of the joint interfaces revealed that the grains were not pulled out from the bond interface. The reliable bonding strength of brazed diamond/CBN grains to the steel substrate can meet the application requirements of high efficiency machining in the industrial field.     

Interfacial reaction between cubic boron nitride and Ti during active brazing

Thermodynamic and reaction process analyses were performed to understand the joining characteristic during high temperature brazing between cubic boron nitride (CBN) grit and a silver-base filler alloy containing Ti as an active element. Experimental information on the microstructure of the brazed joint, the composition of the interface, and the shape of the compounds formed on the surface of the grit was obtained by scanning electron microscopy, energy-dispersive x-ray, and x-ray diffraction. The results indicate that Ti in the molten filler alloy facilitated good wetting between the solid CBN crystals and braze filler alloy. The transition layer formed by the interaction of TiN and TiB₂ was one of the key factors in joining the CBN and steel substrate.     

Invar合金与Si_3N_4陶瓷钎焊接头界面组织和性能研究

采用Ag Cu Ti活性钎料对Invar合金和Si3N4陶瓷进行钎焊连接,研究了接头界面组织及其形成机制,分析了钎焊工艺参数对接头界面结构和性能的影响。结果表明,钎焊过程中液态钎料中的活性元素Ti与Si3N4陶瓷发生反应,在陶瓷界面形成致密的Ti N和Ti5Si3反应层;同时,Invar合金向液态钎料中溶解,与活性元素Ti反应生成脆性的Fe2Ti和Ni3Ti化合物。钎焊温度和保温时间影响Si3N4陶瓷界面反应层的厚度以及接头中Fe2Ti和Ni3Ti脆性化合物的形成量和分布,这两方面共同决定着接头的抗剪强度。当钎焊温度为870℃,保温15 min时,接头的平均抗剪强度最大值达到92.8 MPa,此时接头的断裂形式呈现沿Si3N4陶瓷基体和界面反应层的复合断裂模式。     

Influence of Ti on microstructure and strength of c-BN/ Cu-Ni-Sn-Ti composites

The c-BN grain has been brazed with Cu-Ni-Sn-Ti filler metal in vacuum at 1373 K holding for 600 s. The microstructure of the interface between c-BN grain and Cu-Ni-Sn-Ti filler metal has been studied using scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS). The composition of the interface has been analyzed by X-ray diffraction analyzer (XRD). Experimental results showed that the reaction layer appeared at the interface between the c-BN grain and the filler metal. The reaction layer mainly consisted of TiN, TiB and TiB₂. And the thickness of the reaction layer increases with the increase of Ti content in the filler metal. When Ti content in the filler metal exceeds 15 wt.%, microcracks form at c-BN side of the interface because of the increase of TiN, CuTi and Cu₃Ti₂ brittle phases and residual stresses, leading to a decrease of the tensile strength of c-BN/Cu-Ni-Sn-Ti composites. Ti content in the filler metal had obvious influence on microstructure and strength of c-BN/ Cu-Ni-Sn-Ti composites. The maximum tensile strength reached 105.1 MPa with 10 wt.% Ti content in the filler metal.     

Brazing of TiBw/TC4 composite and Ti60 alloy using TiZrNiCu amorphous filler alloy

TiB_w/TC4 composite was brazed to Ti60 alloy successfully using TiZrNiCu amorphous filler alloy, and the interfacial microstructures and mechanical properties were characterized by SEM, EDX, XRD and universal tensile testing machine. The typical interfacial microstructure was TiB_w/TC4 composite/β-Ti + TiB whiskers/(Ti, Zr)₂(Ni, Cu) intermetallic layer/β-Ti/Ti60 alloy when being brazed at 940 °C for 10 min. The interfacial microstructure evolution was influenced strongly by the diffusion and reaction between molten fillers and the substrates. Increasing brazing temperature decreased the thickness of brittle (Ti, Zr)₂(Ni, Cu) intermetallic layer, which disappeared finally when the brazing temperature exceeded 1020 °C. Fracture analyses indicated that cracks were initialized in the brittle intermetallic layer when (Ti, Zr)₂(Ni, Cu) phase existed in the brazing seam. The maximum average shear strength of joints reached 368.6 MPa when brazing was conducted at 1020 °C. Further increasing brazing temperature to 1060 °C, the shear strength was decreased due to the formation of coarse lamellar (α+β)-Ti structure.     

Analysis on brazed diamond joints with modified Cu-based filler alloy

Filler alloy can strongly influence the performance of brazed monolayer diamond grinding tools. Cu-Sn-Ti and modified Cu-based filler alloy added with Ni-Cr-B-Si were used to braze diamond. The morphology of the diamond and the microstructure of the filler alloy were analyzed by SEM, EDS, and XRD. The hardness of the alloy was also determined with a microhardness tester. The results show that filler alloy containing Cu, Sn metal powder, and 16%Ni-Cr-B-Si is suitable for brazing diamond. The morphology of the brazed diamond is intact, and the filler alloy catalyzes the chemical metallurgical bonding with the diamond. Different kinds of carbide are formed on different crystal faces of the diamond. Cu-based dendrites, Cu_5.6Sn, Cu₃Sn, and Ni₃Sn are formed on the filler alloy during solidification. The hardness of the modified Cu-based filler alloy increases with increasing proportion of Ni-Cr-B-Si added. In particular, the hardness of the modified Cu-based filler alloy containing 16 wt% Ni-Cr-B-Si reaches 340–360 HV0.3, which is three times the hardness of the Cu-Sn-Ti filler metal.