一种精确检测半导体二极管正向电特性的新方法

提出了一种基于串联模式精确地检测半导体二极管正向电特性的新方法.利用该方法,不仅可以得到二极管在不同电压下的串联电阻、结电容、结电压、理想化因子等值,还能判断一个实际的二极管有无界面层存在并得到其界面层阻抗值.用此方法对Ni/n-GaN肖特基二极管进行了检测,所有的实验结果与理论分析相符合.实验中确认了在GaN肖特基二极管中结的负电容和具有非线性电阻和电容的界面层的存在.     

低电阻GaN基太赫兹空气桥结构平面肖特基二极管

提出了通过增大欧姆接触电极包围角提高GaN基太赫兹肖特基二极管的截止频率的方法,该方法减小了空气桥结构平面肖特基二极管的串联电阻,进而提高了器件的截止频率.设计并制备了不同欧姆接触电极包围角的空气桥结构平面肖特基二极管,通过对器件Ⅰ-Ⅴ特性及C-V特性的测量,可知随着欧姆接触电极包围角的增大,肖特基二极管的串联电阻减小,而肖特基二极管的总电容并没有受影响.欧姆接触电极全包围结构的肖特基二极管截止频率为264 GHz,约为欧姆接触电极包围角为180°器件的1.6倍.     

一种精确检测半导体二极管正向电特性的新方法

提出了一种基于串联模式精确地检测半导体二极管正向电特性的新方法.利用该方法,不仅可以得到二极管在不同电压下的串联电阻、结电容、结电压、理想化因子等值,还能判断一个实际的二极管有无界面层存在并得到其界面层阻抗值.用此方法对Ni/ n- Ga N肖特基二极管进行了检测,所有的实验结果与理论分析相符合.实验中确认了在Ga N肖特基二极管中结的负电容和具有非线性电阻和电容的界面层的存在.     

大功率660 nm半导体激光器的电流电压特性

利用Zn扩散形成非吸收窗口技术,制备了大功率红光660 nm半导体激光器。对封装后的器件进行电流电压(I-V)特性测试。由于材料本身串联电阻的影响,半导体激光器的I-V曲线不再符合理想二极管I-V特性方程。通过数据拟合,得到半导体激光器的串联电阻约为0.5Ω。测试中还发现了两种异常I-V曲线,分别源于器件并联电阻及寄生二极管的影响。对每种I-V曲线建立了电路模型,并推导了I-V特性方程。分析认为制作过程中的金属工艺、烧结工艺和Zn扩散工艺等都会影响半导体激光器的电流分布及I-V特性。I-V特性测试可以用于半导体激光器的工艺监控与失效分析等。     

GaN基SBD功率器件研究进展

作为第三代宽禁带半导体器件,GaN基肖特基势垒二极管(SBD)功率器件具有耐高温、耐高压和导通电阻小等优良特性,在功率器件方面具有显著的优势。概述了基于功率应用的GaN SBD功率器件的研究进展。根据器件结构,介绍了基于材料特性的GaN SBD和基于AlGaN/GaN异质结界面特性的GaN异质结SBD。根据器件结构对开启电压的影响,对不同阳极结构器件进行了详细的介绍。阐述了不同的肖特基金属的电学特性和热稳定性。分析了表面处理,包括表面清洗、表面等离子体处理和表面钝化对器件漏电流的影响。介绍了终端保护技术,尤其是场板技术对击穿电压的影响。最后探讨了GaN基SBD功率器件未来的发展趋势。     

GaN基肖特基器件中的反常电容特性

研究了测试频率为0.3～1.5MHz时GaN基肖特基器件的电容特性.实验发现,在Au/i-GaN肖特基器件的电容-电压(C-V)特性曲线中,出现了峰和负值电容,而Au/i-Al0.45Ga0.55N肖特基器件的C-V特性曲线中则既没有峰也没有负值电容的出现.对肖特基器件的电流-电压(I-V)特性和C-V特性进行参数提取和分析后认为,负值电容和峰的出现源于界面态的俘获和损耗,但较大的串联电阻将减弱界面态的作用.     

基于双肖特基接触GaN薄膜特性参数测试新方法

提出了一种GaN薄膜电学参量测试新方法.该方法基于双肖特基结二极管结构,利用非对称的电极图形获取整流特性,从而省去了复杂的欧姆接触形成工艺,可方便地导出电子电导迁移率和肖特基接触理想因子等特征参数.对残留载流子浓度为7×1016 cm-3 的非故意掺杂GaN薄膜进行了试验,新方法得到Ni/Au-GaN肖特基接触的理想因子为2.8,GaN薄膜方块电阻为491Ω和电子电导迁移率为606cm2/(V·s).这些典型参数与利用欧姆接触实验和普通Ni/Au-GaN肖特基二极管测试所得结果较为吻合.该方法为半导体薄膜测试提供了新思路,可推广用于难以形成良好线性欧姆接触或材料特性受欧姆接触工艺影响较大的外延材料及其金半接触的监测研究.     

基于双肖特基接触GaN薄膜特性参数测试新方法

提出了一种GaN薄膜电学参量测试新方法.该方法基于双肖特基结二极管结构,利用非对称的电极图形获取整流特性,从而省去了复杂的欧姆接触形成工艺,可方便地导出电子电导迁移率和肖特基接触理想因子等特征参数.对残留载流子浓度为7×1016 cm-3 的非故意掺杂GaN薄膜进行了试验,新方法得到Ni/Au-GaN肖特基接触的理想因子为2.8,GaN薄膜方块电阻为491Ω和电子电导迁移率为606cm2/(V·s).这些典型参数与利用欧姆接触实验和普通Ni/Au-GaN肖特基二极管测试所得结果较为吻合.该方法为半导体薄膜测试提供了新思路,可推广用于难以形成良好线性欧姆接触或材料特性受欧姆接触工艺影响较大的外延材料及其金半接触的监测研究.     

恒磁场对Si、Ge基二极管I-V特性的影响及机理分析

在恒磁场为0～2T的范围内,对Si、Ge基二极管的反向饱和电流和正向电流进行了测试.结果表明,在一定的电学条件下,随着磁感应强度B的增大,磁场对Ge基二极管的反向饱和电流的影响比Si基二极管的更明显.磁场对Si基二极管的正向特性几乎没有影响,但可以观测到Ge基二极管的正向电流随磁场的增强发生了变化.依据半导体理论基础,对实验结果进行了分析并通过建立理论模型对磁场中二极管的I-V特性进行了模拟.     

6H-SiC肖特基二极管的特性研究

采用缓慢氧化-稀释的HF刻蚀-沸水浸泡法(BW法)处理SiC表面,以减少其界面态。首次在100°C以下制备了6H-SiC肖特基二极管,其欧姆接触比接触电阻ρc=5～7×10-3Ω.cm2,理想因子n=1.20～1.25。同时,还制备了P型6H-SiC肖特基二极管,其欧姆接触采用950°C高温合金Al/SiC工艺获得,该样品衬底较大的串联电阻导致其正向压降偏高,理想因子较大。实验表明,BW法不仅能降低合金温度和工艺难度,而且能有效改善器件的电学特性。     

激光二极管正向电特性的精确检测

采用正向交流特性结合I-V特性的方法,检测了激光二极管的串联电阻、理想因子、结电压和结电容与外加电压或电流的关系.首次发现,激光二极管的结电压、串联电阻、理想因子和结电容在阈值附近同时出现了明显的阶跃,之后结电压呈现饱和.此外还观察到,在较低的测试频率和较大的正向电压下,激光二极管的结电容具有负值.     

Sudden Change of Electrical Characteristics at Lasing Threshold of a Semiconductor Laser

Accurate forward electrical characteristics of multiquantum-well (MQW) lasers have been measured using ac admittance measurements together with dc I-V plot. The synchronous step offsets of apparent conductance, apparent capacitance, junction voltage, series resistance, and ideality factor at the onset of lasing were observed for the first time. With this effect, the lasing threshold can be deduced immediately by the LCR Meter. It is also found that the junction voltage jumps abruptly to a saturated value at the onset of lasing, and the starting and end points of jumping exactly correspond to the maximum of the second derivative of lasing power with respect to current and the kink point of the first derivative, respectively. All of the phenomena may help to verify and improve existing semiconductor laser models. In addition, negative capacitance effect in LDs was observed     

Enhancement in electrical properties of Au/n-GaAs Schottky diodes exposed to 60Co gamma rays

The effect of γ-ray exposure on the electrical characteristics of Au/n-GaAs Schottky barrier diodes has been investigated using current–voltage and capacitance–voltage techniques. The results indicate that irradiation with a cumulative dose of 10 Mrad (Si) improves the electrical characteristics of the diode. The parameters like ideality factor, series resistance and reverse leakage current determined from the current–voltage data decreases, whereas the barrier height and rectification ratio increases upon irradiation. The effective barrier height deduced from the capacitance–voltage technique has also increased with irradiation. The irradiated diode shows a higher carrier concentration compared to the virgin diode. The observed overall improvement in the diode quality is attributed to the annealing effect of γ-rays.     

Measurement of series resistance in IMPATT diodes

A new method is given for determining the electrical series resistance of an IMPATT diode. The measurement is based on observation of the oscillation threshold bias current for a diode in a standard circuit. The method is applied to GaAs diodes near 40 GHz. The values obtained are used to quantitatively explain other performance characteristics of the diodes.     

Reliability and micro-structural properties of GaAs Schottky diodes for submillimeter-wave applications

Whisker contacted GaAs Schottky barrier diodes are the standard devices for mixing and multiplier applications in the THz frequency range. This is mainly due to their minimum parasitics and mature technology. But with the decreasing size of the anode contact, which is required for operation at high frequencies (up to approx. 3 THz), the reliability and the micro-structural understanding of the Schottky barrier becomes increasingly important. This contribution presents new results concerning the reliability of Schottky diodes and the physical properties of small-area Schottky junctions, especially at low current densities. For these purposes a number of different Schottky diodes have been fabricated with different epilayer doping concentrations and anode diameters. Measured I/V characteristics show that the diode current deviates considerably from the ideal thermionic current behavior with decreasing diode diameter. This deviation shows an exponential dependence on the diode voltage and is a function of the doping concentration of the active layer. For a given doping concentration in the epi-layer and decreasing anode diameter, this phenomenon shifts the minimum of the ideality factor towards higher current densities. An explanation is given in terms of a difference of the cyrstallinity of the polycrystalline platinum films on the GaAs for decreasing SiO₂ aperture size in connection with a reduced Pt mobility in the electrolyte. The reliability of Schottky barrier diodes under thermal and electrical stress has been investigated on different THz Schottky diode structures. The results show that the barrier height and the ideality factor of the fabricated structures are not affected by thermal stress. Electrical stress induced by large forward currents up to a current density of 10 kA/mm² even leads to a slight increase of the barrier height and a reduction of the series resistance.     

Influence of inhomogeneous contact in electrical properties of 4H–SiC based Schottky diode

Schottky diodes realized on 4H–SiC n-type wafers with an epitaxial layer and a metal-oxide overlap for electric field termination were studied. The oxide was grown by plasma enhanced chemical vapor deposition (PECVD) and the Schottky barriers were formed by thermal evaporation of titanium or nickel. Diodes, with voltage breakdown as high as 700 V and ideality factor as low as 1.05, were obtained and characterized after packaging in standard commercial package (TO220).The electrical properties such as ideality factor, hight barrier, the series resistance R_s were deduced by current/voltage (I–V) analysis using the least mean square (LMS) method. The temperature effect on break voltage, R_s and saturation current was studied. A model based on two parallel Schottky diodes with two barrier heights is presented for some devices having an inhomogeneous contact. It is shown that the excess current at low voltage can be explained by a lowering of the Schottky barrier in localized regions. We use the two series RC components electrical model in order to study the dynamic behaviour of the Schottky diode in low frequency and to improve the effect of barrier inhomogeneities in electrical properties.     

Tunnel injection and power efficiency of InGaN/GaN light-emitting diodes

The results of studying the influence of the finite tunneling transparency of injection barriers in light-emitting diodes with InGaN/GaN quantum wells on the dependences of the current, capacitance, and quantum efficiency on the p-n junction voltage and temperature are presented. It is shown that defectassisted hopping tunneling is the main transport mechanism through the space charge region (SCR) and makes it possible to lower the injection barrier. It is shown that, in the case of high hopping conductivity through the injection barrier, the tunnel-injection current into InGaN band-tail states is limited only by carrier diffusion from neutral regions and is characterized by a close-to-unity ideality factor, which provides the highest quantum and power efficiencies. An increase in the hopping conductivity through the space charge region with increasing frequency, forward bias, or temperature has a decisive effect on the capacitance-voltage characteristics and temperature dependences of the high-frequency capacitance and quantum efficiency. An increase in the density of InGaN/GaN band-tail states and in the hopping conductivity of injection barriers is necessary to provide the high-level tunnel injection and close-to-unity power efficiency of high-power light-emitting diodes.     

Scalable Electrical Properties of Axial GaAs Nanowire <Emphasis Type="Italic">pn</Emphasis>-Diodes

In this letter the scalability of electrical properties of axial GaAs nanowire pn-diodes grown by Au-assisted metalorganic vapor-phase epitaxy is reported. The impact of the nanowire diameter on the forward current, the ideality factor, and the diode series resistance were investigated. Electrical measurements carried out on various single nanowires reveal the existence of a critical diameter for device functionality. Below that diameter the diode series resistance increases infinitely, which can be attributed to surface depletion. Above that diameter the forward current increases linearly with the junction area, while the series resistance demonstrates inverse proportionality. Hereby the ideality factor remains approximately constant at a value of 2. In addition, the analyzed axial GaAs nanowire pn-diodes offer very high rectification ratios ranging from 10⁴ to 10⁶ at ±2 V.     

AlGaN/GaN横向肖特基势垒二极管的仿真与制作

基于GaN横向肖特基势垒二极管(SBD)的频率特性和应用的需要,设计了一种基于AlGaN/GaN异质结的横向SBD.利用Silvaco Atlas软件研究了 AlGaN势垒层的厚度和Al摩尔组分对异质结AlχGaN1-χ/GaN SBD电学性能的影响.仿真结果表明,SBD器件截止频率随Al摩尔组分的增加先增大再减小,当AlχGaN,1-χ层中Al摩尔组分为0.2～0.25,其厚度为20～30nm时,AlGaN/GaN SBD器件的频率特性最好.在仿真的基础上,设计制作出了肖特基接触直径为2 μm的非凹槽和凹槽型AlGaN/GaN横向空气桥SBD.通过直流I-V[测试和射频S参数测试,提取了两种SBD器件的理想因子、串联电阻、结电容、截止频率和品质因子等关键参数,该平面 SBD可应用于片上集成和混合集成的太赫兹电路的设计与制造.