Circuit Techniques Utilizing Independent Gate Control in Double-Gate Technologies

Independent gate control in double-gate (DG) devices enhances circuit performance and robustness while substantially reducing leakage and chip area. In this paper, we describe circuit techniques which take advantage of the independent biasing properties of symmetrical and asymmetrical DG devices in design. DG circuits at the 25-nm node are analyzed via mixed-mode numerical simulations using Taurus MEDICI. In dynamic circuits, we give examples of conditional keepers, charge sharing prevention scheme, and static keepers. A conditional keeper can dynamically achieve the optimal strength ratio between keeper and evaluation devices by utilizing the front- and backchannel currents in DG devices. A charge sharing mitigation scheme utilizing the back-gate of a logic transistor is then described. Static data retention scheme in dynamic circuits is proposed. A case study for analog applications using a voltage controlled oscillator (VCO) illustrates the specific advantages of DG devices.      

A Leakage Current Replica Keeper for Dynamic Circuits

We present a leakage current replica (LCR) keeper for dynamic domino gates that uses an analog current mirror to replicate the leakage current of a dynamic gate pull-down stack and thus tracks process, voltage, and temperature. The proposed keeper has an overhead of one field-effect transistor per gate plus a portion of a shared current mirror. Techniques for properly sizing LCR keepers are presented. Using these sizings, LCR keepers allow design of and-or circuits with 30% more legs than conventional keepers at the same noise margin in a 90-nm, 1.2-V CMOS logic process. Furthermore, 16-24-leg dynamic AO circuits are 25%-40% faster when using the replica keeper. We demonstrated the circuit operation on a 1024 words times 72 bits, 3W/4R embedded SRAM macro using a four-stage LCR-keeper domino structure for a read-out circuit     

A 130-nm 6-GHz 256 × 32 bit leakage-tolerant register file

Describes a 256-word × 32-bit 4-read, 4-write ported register file for 6-GHz operation in 1.2-V 130-nm technology. The local bitline uses a pseudostatic technique for aggressive bitline active leakage reduction/tolerance to enable 16 bitcells/bitline, low-V_t usage, and 50% keeper downsizing. Gate-source underdrive of -V _cc on read-select transistors is established without additional supply/bias voltages or gate-oxide overstress. 8% faster read performance and 36% higher dc noise robustness is achieved compared to dual-V_t bitline scheme optimized for high performance. Device-level measurements in the 130-nm technology show 703× bitline active leakage reduction, enabling continued V_t scaling and robust bitline scalability beyond 130-nm generation. Sustained performance and robustness benefit of the pseudostatic technique against conventional dynamic bitline with keeper-upsizing is also presented     

A 4.5-GHz 130-nm 32-KB L0 cache with a leakage-tolerant self reverse-bias bitline scheme

This paper describes a 32-KB two-read, one-write ported L0 cache for 4.5-GHz operation in 1.2-V 130-nm dual-V/sub TH/ CMOS technology. The local bitline uses a leakage-tolerant self reverse-bias (SRB) scheme with nMOS source-follower pullup access transistors, while preserving robust full-swing operation. Gate-source underdrive of -220 mV on the bitline read-select transistors is established without external bias voltages or gate-oxide overstress. Device-level measurements in the 130-nm technology show 72/spl times/ bitline active leakage reduction, enabling low-V/sub TH/ usage, 40% bitline keeper downsizing, and 16 bitcells/bitline. 11% faster read delay and 2/spl times/ higher dc noise robustness are achieved compared with high-performance dual-V/sub TH/ bitline scheme. Sustained performance and robustness benefits of the SRB technique against conventional dynamic bitline with scaling to 100- and 70-nm technology is also presented.     

High speed wide fan‐in designs using clock controlled dual keeper domino logic circuits

Clock Controlled Dual keeper Domino logic structures (CCDD_1 and CCDD_2) for achieving a high‐speed performance with low power consumption and a good noise margin are proposed in this paper. The keeper control circuit comprises an additional PMOS keeper transistor controlled by the clock and foot node voltage. This control mechanism offers abrupt conditional control of the keeper circuit and reduces the contention current, leading to high‐speed performance. The keeper transistor arrangement also reduces the loop gain associated with the feedback circuitry. Hence, the circuits offer less delay variability. The design and simulation of various wide fan‐in designs using 180 nm CMOS technology validates the proposed CCDD_1 and CCDD_2 designs, offering an increased speed performance of 7.2% and 8.5%, respectively, over a conventional domino logic structure. The noise gain margin analysis proves good robustness of the CCDD structures when compared with a conventional domino logic circuit configuration. A Monte Carlo simulation for 2,000 runs under statistical process variations demonstrates that the proposed CCDD circuits offer a significantly reduced delay variability factor.     

A process variation compensating technique with an on-die leakage current sensor for nanometer scale dynamic circuits

This paper describes a process compensating dynamic (PCD) circuit technique for maintaining the performance benefit of dynamic circuits and reducing the variation in delay and robustness. A variable strength keeper that is optimally programmed based on the die leakage, enables 10% faster performance, 35% reduction in delay variation, and 5/spl times/ reduction in the number of robustness failing dies, compared to conventional designs. A new leakage current sensor design is also presented that can detect leakage variation and generate the keeper control signals for the PCD technique. Results based on measured leakage data show 1.9-10.2/spl times/ higher signal-to-noise ratio (SNR) and reduced sensitivity to supply and p-n skew variations compared to prior leakage sensor designs.     

Forward body bias for microprocessors in 130-nm technology generation and beyond

Device and test chip measurements show that forward body bias (FBB) can be used effectively to improve performance and reduce complexity of a 130-nm dual-V/sub T/ technology, reduce leakage power during burn-in and standby, improve circuit delay and robustness, and reduce active power. FBB allows performance advantages of low-temperature operation to be realized fully without requiring transistor redesign, and also improves V/sub T/ variations, mismatch, and saturation transconductance and output resistance product (g/sub m//spl times/r/sub o/).     

High performance dynamic logic incorporating gate voltagecontrolled keeper structure for wide fan-in gates

A new keeper structure for wide fan-in gates is proposed to optimise performance, noise- and skew-tolerance by controlling the gate voltage of the keeper transistor. Simulation results show that the proposed gate voltage controlled keeper scheme improves performance by 13.8 and 26.6% compared with the conventional keeper scheme for 16 and 32 bit wide fan-in dynamic gates     

Probabilistic Approach for Yield Analysis of Dynamic Logic Circuits

In deep-submicrometer technologies, process variability challenges the design of high yield integrated circuits. While device critical dimensions and threshold voltage shrink, leakage currents drastically increase, threatening the feasibility of reliable dynamic logic gates. Electrical level statistical characterization of this kind of gates is essential for yield analysis of the entire die. This work proposes a yield model for dynamic logic gates based on error propagation using numerical methods. We study delay and contention time in the presence of process variability. The methodology is employed for yield analysis of two typical wide-nor circuits: one with a static keeper and another without the keeper. Since we use a general numerical approach for the calculation of derivatives and error propagation, the proposed yield analysis methodology may be applied to a wide range of dynamic gates (for instance pre-charge dynamic gates using dynamic keeper). The proposed methodology results in errors less than 2% when compared to Monte Carlo simulation, while increasing computational efficiency up to 100$times$.      

Speed enhancement techniques for Clock-Delayed Dual Keeper Domino logic style

ABSTRACT

Domino circuit topology for high-speed operation, robustness and lower power consumption is quintessential in design of digital systems. In this paper, various high speed and robust mechanisms are proposed to enhance the speed of Clock-Delayed Dual Keeper Domino (CDDK) circuit. Delayed enabling of keeper circuit in CDDK domino circuit reduces contention between keeper circuit and Pull-Down network (PDN). The speed of transition at the dynamic node of the CDDK domino circuit is enhanced through imposing techniques namely (i) controlled clock delay time in enabling the keeper transistor, (ii) keeper control signal voltage swing variation, (iii) sizing of keeper transistors and (iv) deploying an additional conditional discharge path. The robustness of CDDK circuit is increased by upsizing the keeper transistor without degrading the speed by stack arrangement of dual keeper transistors. The simulation of enhancement techniques has been performed using Cadence® Virtuoso ADEL and ADEXL environments employing UMC 90nm technology library. The simulation results of wide fan-in 64-input OR gate demonstrate that CDDK technique with additional discharge path offer 38% increase in speed and CDDK technique with keeper transistor upsizing offers 52% increase in noise gain margin without speed degradation while comparing with the conventional domino logic circuit.     

Diode-footed domino: a leakage-tolerant high fan-in dynamic circuit design style

A leakage-tolerant design technique for high fan-in dynamic logic circuits is presented. An NMOS transistor with gate and drain terminals tied together (diode) is added in series with the evaluation network of standard domino circuits. Due to the stacking effect, the leakage of the evaluation path significantly decreases, thereby improving the robustness of the circuit against deep-submicron subthreshold leakage and input noise. To improve the speed of the circuit, a current mirror is also employed in the evaluation network to increase the evaluation current. The proposed technique (diode-footed domino) exhibits considerable improvement in leakage and noise immunity as compared to the standard domino circuits. Simulation results of wide fan-in gates designed using Berkeley Predictive Technology Models of 70-nm technology demonstrate at least 1.9/spl times/ noise-immunity improvement at the same delay compared to the standard domino circuits. Dynamic comparators and multiplexers are designed using the diode-footed domino and conventional techniques to demonstrate the effectiveness of the proposed scheme in improving leakage-tolerance and performance of high fan-in circuits.     

An Ultra-Low-Power Memory With a Subthreshold Power Supply Voltage

A 512$,times,$13 bit ultra-low-power subthreshold memory is fabricated on a 130-nm process technology. The fabricated memory is fully functional for read operation with a 190-mV power supply at 28 kHz, and 216 mV for write operation. Single bits are measured to read and write properly with$V _ DD$as low as 103 mV and 129 mV, respectively. The memory operates at a 1-MHz clock rate with a 310-mV power supply. This operating point has 1.197$muhboxW$power consumption, of which 0.366$muhboxW$is due to leakage and 0.831$muhboxW$is due to dynamic power dissipation. Analysis of the available fan-out or fan-in that can be supported at a given voltage is summarized. A number of circuit techniques are presented to overcome the substantially reduced on-to-off current ratios and the poor drive strength of transistors operating in subthreshold. These include a gated feedback memory cell, and hierarchical read and decode circuits. The memory is dynamic, with pseudo-static operation provided via self-timed control of the keeper transistors to mitigate increased variability manifested in subthreshold operation.     

A transition-encoded dynamic bus technique for high-performance interconnects

This paper describes a transition-encoded dynamic bus technique that enables on-chip interconnect delay reduction while maintaining the robustness and switching energy behavior of a static bus. Efficient circuits, designed for a drop-in replacement, enable significant delay and peak-current reduction even for short-length buses, while obtaining energy savings at aggressive delay targets. On a 180-nm 32-bit microprocessor, 79% of all global buses exhibit 10%-35% performance improvement using this technique.     

Design and analysis of spatial encoding circuits for peak power reduction in on-chip buses

We propose various low-latency spatial encoder circuits based on bus-invert coding for reducing peak energy and current in on-chip buses with minimum penalty on total latency. The encoders are implemented in dual-rail domino logic with interfaces for static inputs and static buses. A spatial and temporally encoded dynamic bus technique is also proposed for higher performance targets. Comparisons to standard on-chip buses of various lengths with optimal repeater configurations at the 130-nm node show the energy-delay and peak current-delay design space in which the different encoder circuits are beneficial. A 9-mm spatially encoded static bus exhibits peak energy gains beyond that achievable through repeater optimization for a single-cycle operation at 1 GHz, with delay and energy overhead of the encoding included. For throughput-constrained buses, the spatially encoded static bus can provide up to 31% reduction in peak energy, while the spatially and temporally encoded dynamic bus yields peak current reductions of more than 50% for all bus lengths. The encoder circuits show good scaling properties since the performance penalty from encoding decreases with scaled interconnects.     

Robust low leakage controlled keeper by current-comparison domino for wide fan-in gates

In this paper, a new design for low leakage and noise immune wide fan-in domino circuits is presented. The proposed technique uses the difference and the comparison between the leakage current of the OFF transistors and the switching current of the ON transistors of the pull down network to control the PMOS keeper transistor, yielding reduction of the contention between keeper transistor and the pull down network from which previously proposed techniques have suffered. Moreover, using the stacking effect, leakage current is reduced and the performance of the current mirror is improved. Results of simulation in high performance 16 nm predictive technology model (PTM) demonstrate that the proposed circuit exhibits about 39% less power consumption, and nearly 2.57 times improvement in noise immunity with a 41% die area overhead for a 64-bit OR gate compared to a standard domino circuit.     

Low standby power state storage for sub-130-nm technologies

Handheld and other battery-powered ICs require process scaling to increase functional integration and reduce active power consumption. Scaling also increases leakage current components to the point where standby power is frequently a limiting design factor. A scheme combining low-leakage thick-gate shadow latches and high-performance transistors is presented that decouples performance from standby power in sub-130-nm technologies. Circuit design and operation, including pulse-clocked latches, use of dynamic circuits, and inclusion of scan is presented. The approach is validated by experimental results on a 90-nm process.     

Domino logic with variable threshold voltage keeper

A variable threshold voltage keeper circuit technique is proposed for simultaneous power reduction and speed enhancement of domino logic circuits. The threshold voltage of a keeper transistor is dynamically modified during circuit operation to reduce contention current without sacrificing noise immunity. The variable threshold voltage keeper circuit technique enhances circuit evaluation speed by up to 60% while reducing power dissipation by 35% as compared to a standard domino (SD) logic circuit. The keeper size can be increased with the proposed technique while preserving the same delay or power characteristics as compared to a SD circuit. The proposed domino logic circuit technique offers 14% higher noise immunity as compared to a SD circuit with the same evaluation delay characteristics. Forward body biasing the keeper transistor is also proposed for improved noise immunity as compared to a SD circuit with the same keeper size. It is shown that by applying forward and reverse body biased keeper circuit techniques, the noise immunity and evaluation speed of domino logic circuits are simultaneously enhanced.     

Efficiency of body biasing in 90-nm CMOS for low-power digital circuits

The efficiency of body biasing for leakage reduction and performance improvement in a 90-nm CMOS low-power technology with triple-well option is evaluated. Static measurements of single devices and dynamic measurements of ring oscillators and 32-b parallel prefix adders are presented. Whereas forward biasing still provides a significant performance improvement of up to 37% for low-leakage devices with 2.2-nm gate oxide thickness, the application of reverse biasing to reduce subthreshold leakage currents is inefficient due to additional leakage currents such as gate leakage and gate-induced drain leakage. Experimental results confirm that, in 90-nm CMOS circuits, the efficiency of body biasing strongly depends on the device type and operating temperature. Moreover, the impact of the zero-temperature coefficient point on static device and dynamic circuit performance is investigated.     

A 4-GHz 130-nm address generation unit with 32-bit sparse-tree adder core

This paper describes a 32-bit address generation unit designed for 4-GHz operation in 1.2-V 130-nm technology. The AGU utilizes a 152-ps sparse-tree adder core to achieve 20% delay reduction, 80% lower interconnect complexity, and a low (1%) active energy leakage component. The dual-V/sub T/ semidynamic implementation of the adder core provides the performance of a dynamic CMOS design with an average energy profile similar to static CMOS, enabling 71% savings in average energy with a good sub-130-nm scaling trend.     

Dual-regulator dual-decoding-trimmer DRAM voltage limiter forburn-in test

The authors present a dynamic RAM (DRAM) voltage limiter with a burn-in test mode. It features a dual-regulator dual-trimmer scheme that provides a precise stress voltage in a burn-in test while maintaining a constant limited voltage under normal operation. A regulator is used to preserve a constant difference between the internal burn-in voltage and the supply voltage. Two sets of trimmers reduce the voltage deviations of both the burn-in and normal-operation voltages within ±0.13 V. The circuits are implemented in a 16-Mb CMOS DRAM. A burn-in voltage regulated to ±50 mV at an ambient temperature up to 120°C is obtained simply by elevating the supply voltage to 8 V as in conventional burn-in procedures