Linearised InGaP/GaAs HBT MMIC power amplifier with active biascircuit for W-CDMA application

A high linearity InGaP/GaAs heterojunction bipolar transistor (HBT) monolithic microwave integrated circuit (MMIC) power amplifier is demonstrated using a new structure for a bias circuit for wideband-code division multiple access (W-CDMA) application. A one shunt capacitor is added to a novel active bias circuit and acts as a lineariser improving input P_{1 dB} of 16 dB and phase distortion of 5.1° for the hybrid phase shift keying (HPSK) modulated signal at the 28 dBm output power; the lineariser showing no significant increase of signal loss and chip area. The two-stage HBT MMIC amplifier exhibits a power-added efficiency (PAE) of 37%, a linear power gain of 24.5 dB, and an output power of 28 dBm with an adjacent channel power ratio (ACPR) of -45 dBc, under a 3 V operation voltage     

Fully-integrated GaAs HBT power amplifier MMIC with high linear output power for 3 GHz-band broadband wireless applications

A high linear output power two-stage GaAs heterojunction bipolar transistor (HBT) power amplifier MMIC is reported. The input, interstage and output matching circuits are designed for wideband and low-voltage operations, and are fully integrated into an MMIC chip. The power amplifier measured with 54 Mbits 64-QAM OFDM signals at a collector supply voltage of 3.3 V showed linear output power of higher than 23.2 dBm at an error vector magnitude of 3.0% in a frequency range 3.3-3.6 GHz     

Linearised HBT MMIC power amplifier with partially RF coupled active bias circuit for W-CDMA portable terminals applications

A highly linear MMIC power amplifier for wideband code-division multiple-access (W-CDMA) portable terminals has been devised and implemented with a new integrated on-chip lineariser. The proposed lineariser, consisting of an InGaP/GaAs heterojunction bipolar transistor (HBT) active bias circuit partially coupled to RF input power together with a feedback capacitor, effectively improves gain compression with little insertion power loss and no additional die area. The optimised lineariser improves maximum output power (P1 dB) by 2 dB and adjacent channel leakage power ratio (ACLR) by 4 dB, and the implemented HBT MMIC power amplifier exhibits a P1 dB of 30 dBm, a power gain of 30 dB, a power added efficiency of 42% at the maximum output power under an operation voltage of 3.4 V, and an ACLR of -34 dBc at 27 dBm of output power.     

0.1-42 GHz InP DHBT distributed amplifiers with 35 dB gain and 15 dBm output

An InP double hetero-junction bipolar transistor (DHBT) distributed power amplifier MMIC with 35 dB gain, 42 GHz bandwidth and 15 dBm output power is reported. This represents the highest power and largest gain reported over this bandwidth from a single chip HBT amplifier. A lumped preamplifier with a novel distributed output is used to obtain high gain and wide bandwidth at these power levels.     

5W ISM波段InGaP/GaAs HBT功率放大器MMIC

通过分析InGaP/GsAsHBT器件的热学和电学特点,结合HBT大功率放大器芯片在技术性能、稳定性、可靠性及尺寸等方面的要求,通过优化设计HBT功率器件单元和匹配电路,开发了一个大功率、高效率、小尺寸的ISM波段功率放大器单片集成电路。该三级放大器的各级器件单元的发射极面积分别为320μm2,1280μm2,5760μm2,芯片内部包括了输入、输出50Ω匹配电路,面积仅为1.9mm×2.1mm。放大器采用5V单电源供电,在2.4～2.5GHz频率范围内线性增益为27dB,2dB增益压缩点输出饱和功率达到37dBm,功率附加效率为46%。     

A 5-10 GHz octave-band AlGaAs/GaAs HBT-Schottky diodedown-converter MMIC

The authors describe an AlGaAs/GaAs heterojunction bipolar transistor (HBT) X-band down-converter monolithic microwave integrated circuit (MMIC) which integrates a double double-balanced Schottky mixer and five stages of HBT amplification to achieve greater than 30 dB conversion gain over an RF bandwidth from 5 to 10 GHz. In addition, an output IP3 as high as +15 dBm has been achieved. The Schottky diodes are constructed from the existing N^$collector and N⁺ subcollector layers of the HBT molecular beam epitaxy (MBE) device structure. A novel HBT amplifier topology employing active feedback which provides wide bandwidth in a compact area is used for the RF, LO, and IF amplifier stages. The complete down-converter MMIC is realized in a 3.6×3.4 mm² area, is self-biased through a 6 V supply, and consumes 530 mW. This MMIC represents the highest complexity X-band down-converter MMIC demonstrated using GaAs HBT-Schottky diode technology     

用于W-LAN的5.8GHz InGaP/GaAs HBT MMIC线性功率放大器

介绍了一种应用于W-LAN系统的5.8 GHz InGaP/GaAs HBT MMIC功率放大器。该功率放大器采用了自适应线性化偏置电路来改善线性度和效率,同时偏置电路中的温度补偿电路可以抑制直流工作点随温度的变化,采用RC稳定网络使放大器在较宽频带内具有绝对稳定性。在单独供电3.6 V电压情况下,功率放大器的增益为26 dB,1 dB压缩点处输出功率为26.4 dBm,功率附加效率(PAE)为25%。三阶交调系数(IMD3)在输出功率为26.4 dBm时为-19 dBc,输出功率为20 dBm时低于-38 dBc,在1 dB压缩点处偏移频率为20 MHz时邻道功率比(ACPR)值为-31 dBc。     

高效率X波段GaN MMIC功率放大器的研制

突破了GaN MMIC功率放大器的设计、制造、测试等关键技术,研制成功X波段GaN MMIC功率放大器。设计及优化了电路拓扑结构及电路参数,放大器芯片采用了国产外延材料及标准芯片制作工艺。单片功率放大器包含两级放大电路,采用了功率分配及合成匹配电路,输入输出阻抗均为50Ω。制作了微波测试载体及夹具,最终实现了X波段GaN MMIC功率放大器微波参数测试。在8.7～10.9 GHz频率范围内,该功率放大器输出功率大于16 W,功率增益大于14 dB,增益波动小于0.4 dB,输入驻波比小于2∶1,功率附加效率大于40%,带内效率最高达52%。     

An X-band high-power amplifier using SiGe/Si HBT and lumped passivecomponents

We report the design and fabrication of a compact microwave monolithic integrated circuit (MMIC) amplifier, which demonstrates high output power at X-Band. A single-stage power amplifier is demonstrated, with a double-mesa type SiGe/Si HBT as the active device and spiral inductors and MIM capacitors as lumped passive components. At 8.4 GHz, a linear gain of 8.7 dB, an output power at peak efficiency of 23 dBm, and a saturated output power P_sat of 25 dBm, are measured. To our knowledge, this is the first MMIC X-Band power amplifier using SiGe/Si HBTs     

W-band InP HEMT MMICs using finite-ground coplanar waveguide(FGCPW) design

In this paper, we report on the development of W-band monolithic microwave integrated circuit (MMIC) power amplifiers using 0.1-μm AlInAs/GaInAs/InP high electron mobility transistor (HEMT) technology and finite-ground coplanar waveguide (FGCPW) designs. In the device modeling, the Angelov nonlinear HEMT model was employed to predict the large signal performance of the device, and the results were validated by using state-of-the-art vector load-pull measurements. A two-stage single-ended W-band FGCPW MMIC using a 150-μm-wide HEMT as the driver and a 250-μm-wide HEMT for the output stage was designed, fabricated, and tested. The MMIC amplifier demonstrates a maximum output power of 18.6 dBm with 18.2% power-added efficiency and 10.6 dB associated gain at 94 GHz. This result is the best output power to date reported from an InP-based MMIC using FGCPW design at this frequency     

A 25-GHz ultra-low phase noise InGaP/GaAs HBT VCO

A 25-GHz monolithic voltage controlled oscillator (VCO) has been designed and fabricated in a commercial InGaP/GaAs heterojunction bipolar transistor (HBT) process. This balanced VCO has a novel topology using a feedback /spl pi/-network and a common-emitter transistor configuration. Ultra-low phase noise is achieved: -106 dBc/Hz and -130 dBc/Hz at 100kHz and 1-MHz offset frequency, respectively. To the authors' knowledge, this is the lowest phase noise achieved in a monolithic microwave integrated circuit (MMIC) VCO at such high frequency. The single-ended output power is -1 dBm. It can be tuned between 25.33GHz and 25.75GHz using the base-collector junction capacitor of the HBT as a varactor. The dc power consumption is 90mW for a 9-V supply. An excellent figure-of-merit of -195 dBc/Hz is obtained.     

5~6GHz自适应线性化偏置的InGaP/GaAs HBT功率放大器

针对高质量无线局域网的传输需求,设计了一款工作在5~6 GHz的宽带磷化镓铟/砷化镓异质结双极型晶体管(InGaP/GaAs HBT)功率放大器芯片。针对HBT晶体管自热效应产生的非线性和电流不稳定现象,采用自适应线性化偏置技术,有效地解决了上述问题。针对射频系统的功耗问题,设计了改进的射频功率检测电路,以实现射频系统的自动增益控制,降低功耗。通过InGaP/GaAs HBT单片微波集成电路(MMIC)技术实现该功率放大器芯片。仿真结果表明,功放芯片的小信号增益达到32 dB;1 dB压缩点功率为28.5 dBm@5.5 GHz,功率附加效率PAE超过32%@5.5 GHz;输出功率为20 dBm时,IMD3低于-32 dBc。     

应用于C-X-Ku波段的宽带功率放大器

采用0.25μm AlGaAs/InGaAs/GaAs PHEMT工艺技术,研制出了6～18GHz三级MMIC全匹配宽带功率放大器单片.在6～18GHz的工作频率下,放大器的平均功率增益为19dB,输出功率大于33.3dBm,在10GHz处有最大输出功率34.7dBm,输入回波损耗S11低于-10dB,输出回波损耗S22低于-6dB.与报道的C-X-Ku频段宽带功率放大器相比,有较好的功率平坦度.     

A 9.1–10.7 GHz 10-W, 40-dB Gain Four-Stage PHEMT MMIC Power Amplifier

This letter presents a compact X-band high gain and high power four-stage AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) high power amplifier (PA). This amplifier is designed to fully match a 50-Omega input and output impedance. Based on 0.35-mum gate-length power PHEMT technology, this PA MMIC is fabricated on a 3-mil thick wafer. While operating under 8 V and 2700-mA dc bias condition, the characteristics of 40-dB small-signal gain, a 10-W continuous-wave saturation output power, and 33% power added efficiency at 9.7GHz can be achieved     

An X-Band High-Power and High-PAE PHEMT MMIC Power Amplifier for Pulse and CW Operation

An X-band high-power and high power added efficiency (PAE), two-stage AlGaAs/InGaAs/GaAs psuedomorphic high electronic mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) power amplifier is presented. The amplifier is designed to fully match a 50 Omega input and output impedance. Based on a 0.35 mum gate-length power PHEMT technology, the MMIC is fabricated on a 3 mil thick wafer. Under an 8 V DC bias condition, the characteristics of 17.5 dB small-signal gain, 10 W continuous wave mode saturation output power of 42% PAE, and 12.6 W pulse saturation output power of 52.6% PAE at 9.4 GHz can be achieved.     

A 44-GHz-high IP3 InP HBT MMIC amplifier for low DC powermillimeter-wave receiver applications

This paper reports on what is believed to be the highest IP3/P_dc power linearity figure of merit achieved from a monolithic microwave integrated circuit (MMIC) amplifier at millimeter-wave frequencies. The 44 GHz amplifier is based on an InP heterojunction bipolar transistor (HBT) technology with f_T's and f_max's of 70 and 200 GHz, respectively. The 44-GHz amplifier design consists of four prematched 1×l0μm² four-finger (40-μm²) heterojunction bipolar transistor (HBT) cells combined in parallel using a compact λ/8 four-way microstrip combiner. Over a 44-50-GHz frequency band, the amplifier obtains a gain of 5.5-6 dB and a peak gain of 6.8-7.6 dB under optimum gain bias. At a low bias current of 48 mA and a total dc power of 120 mW, the amplifier obtains a peak IP3 of 34 dBm, which corresponds to an IP3/P_dc power ratio of 21:1, a factor of two better than previous state-of-the-art MMIC's reported in this frequency range. By employing a thin, lightly doped HBT collector epitaxy design tailored for lower voltage and higher IP3, a record IP3/P_dc, power ratio of 42.4:1 was also obtained and is believed to be the highest reported for an MMIC amplifier of any technology. The new high-linearity HBT's have strong implications for millimeter-wave receiver as well as low-voltage wireless applications     

应用于移动终端的线性功率放大器设计

设计了一种应用于移动终端的InGaP/GaAs HBT功率放大器。该放大器采用了一种新颖的在片偏置电路技术,不仅避免了由于电源和温度变化导致的直流偏置点的不稳定,而且补偿了由于输入信号增大所引起的动态偏置点的偏离。电流镜结构的偏置电路与反馈电路使偏置电压维持在一个稳定的状态,在反馈电路中引入一个非反相电路加强了电路增益。通过在偏置管的基极并联一个反偏二极管改善了功率放大器的线性。芯片采用基板的封装形式进行测试,改善了功率放大器的散热条件。测试结果表明该放大器具有27.6 dBm的输出压缩点,对于W-CDMA应用,放大器的效率为34.1%,ACPR为-40.3 dBc。     

A 77 GHz mHEMT MMIC Chip Set for Automotive Radar Systems

A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 µm gate‐length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4‐inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2 mm × 2 mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1 mm × 2 mm. The frequency doubler achieved an output power of –6 dBm at 76.5 GHz with a conversion gain of ?16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2 mm × 1.2 mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W‐band.     

A low-power highly linear cascoded multiple-gated transistor CMOS RF amplifier with 10 dB IP3 improvement (Revised)

A low-power highly linear CMOS RF amplifier circuit composed of a Multiple-Gated common-source FET TRansistor (MGTR) in cascode configuration is reported. In an MGTR amplifier, linearity is improved by using transconductance linearization which can be achieved by canceling the negative peak value of g/sub m/" of the main transistor with the positive one in the auxiliary transistor having a different size and gate drive combined in parallel. This enhancement, however, is limited by the distortion originated from the combined influence of g/sub m/' and harmonic feedback, which can greatly be reduced by the cascoding MGTR output. IP3 improvement as large as 10 dB has been obtained from an experimental RF amplifier designed at 900 MHz and fabricated using 0.35 /spl mu/m BiCMOS technology using only CMOS at a similar power consumption and gain as those obtainable from conventional cascode single gate transistor amplifiers.     

基于GaAs HBT工艺的高增益宽带Doherty功率放大器设计

在传统Doherty功率放大器的基础上,采用砷化镓(GaAs)异质结双极晶体管(HBT)工艺,设计了一款可应用于5G通信N79频段(4.4~5 GHz)的高回退效率MMIC Doherty功率放大器(DPA)。通过在Doherty电路中采用共射-共基结构,并在共射-共基结构中加入共基极接地电容,大幅提升了DPA的增益和输出功率。使用集总元件参与匹配,减小了芯片的面积。仿真结果表明,在目标频段内,增益大于28 dB,饱和输出功率约为38 dBm,饱和附加效率(PAE)为63%,7 dB回退处的效率达到43%。