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1.
A phase-locked clock and data recovery circuit incorporates a multiphase LC oscillator and a quarter-rate bang-bang phase detector. The oscillator is based on differential excitation of a closed-loop transmission line at evenly spaced points, providing half-quadrature phases. The phase detector employs eight flip-flops to sample the input every 12.5 ps, detecting data transitions while retiming and demultiplexing the data into four 10-Gb/s outputs. Fabricated in 0.18-/spl mu/m CMOS technology, the circuit produces a clock jitter of 0.9 ps/sub rms/ and 9.67 ps/sub pp/ with a PRBS of 2/sup 31/-1 while consuming 144 mW from a 2-V supply.  相似文献   

2.
A variable-gain low-noise amplifier (LNA) suitable for low-voltage and low-power operation is designed and implemented in a standard 0.18 /spl mu/m CMOS technology. With a current-reused topology, the common-source gain stages are stacked for minimum power dissipation while achieving high small-signal gain. The fully integrated 5.7 GHz LNA exhibits 16.4 dB gain, 3.5 dB noise figure and 8 dB gain tuning range with good input and output return losses. The LNA consumes 3.2 mW DC power from a supply voltage of 1 V. A gain/power quotient of 5.12 dB/mW is achieved in this work.  相似文献   

3.
A 24 GHz monolithic low-noise amplifier (LNA) is implemented in a standard 0.18 /spl mu/m CMOS technology. Measurements show a gain of 12.86 dB and a noise figure of 5.6 dB at 23.5 GHz. The input and output return losses are better than 11 dB and 22 dB across the 22-29 GHz span, respectively. The operation frequency of 24 GHz is believed to be the highest reported for LNA in a standard CMOS technology.  相似文献   

4.
A 43-Gb/s full-rate clock transmitter chip for SONET OC-768 transmission systems is reported. The IC is implemented in a 0.18-/spl mu/m SiGe BiCMOS technology featuring 120 GHz f/sub T/ and 100 GHz f/sub max/ HBTs. It consists of a 4:1 multiplexer, a clock multiplier unit, and a frequency lock detector. The IC features clock jitter generation of 260 fs rms and dissipates 2.3 W from a -3.6-V supply voltage. Measurement results are compared to a previously reported half-rate clock transmitter designed using the same technology.  相似文献   

5.
This paper presents a hardware implementation of a sound localization algorithm that localizes a single sound source by using the information gathered by two separated microphones. This is achieved through estimating the time delay of arrival (TDOA) of sound at the two microphones. We have used a TDOA algorithm known as the "phase transform" to minimize the effects of reverberations and noise from the environment. Simplifications to the chosen TDOA algorithm were made in order to replace complex operations, such as the cosine function, with less expensive ones, such as iterative additions. The custom digital signal processor implementing this algorithm was designed in a 0.18-/spl mu/m CMOS process and tested successfully. The test chip is capable of localizing the direction of a sound source within 2.2/spl deg/ of accuracy, utilizing approximately 30 mW of power and 6.25 mm/sup 2/ of silicon area.  相似文献   

6.
A 3-6 GHz CMOS broadband low noise amplifier (LNA) for ultra-wideband (UWB) radio is presented. The LNA is fabricated with the 0.18 /spl mu/m 1P6M standard CMOS process. Measurement of the CMOS LNA is performed using an FR-4 PCB test fixture. From 3 to 6 GHz, the broadband LNA exhibits a noise figure of 4.7-6.7 dB, a gain of 13-16 dB, and an input/output return loss higher than 12/10 dB, respectively. The input P/sub 1 dB/ and input IP3 (IIP3) at 4.5 GHz are about -14 and -5 dBm, respectively. The DC supply is 1.8 V.  相似文献   

7.
A fully integrated 5.8 GHz CMOS L-C tank voltage-controlled oscillator (VCO) using a 0.18-/spl mu/m 1P6M standard CMOS process for 5 GHz U-NII band WLAN application is presented. The VCO core circuit uses only PMOS to pursue a better phase noise performance since it has less 1/f noise than NMOS. The measurement is performed by using a FR-4 PCB test fixture. The output frequency of the VCO is from 5860 to 6026 MHz with a 166 MHz tuning range and the phase noise is -96.9 dBc/Hz at 300 kHz (or -110 dBc/Hz at 1 MHz) with V ctrl = 0 V. The power consumption of the VCO excluding buffer amplifiers is 8.1 mW at V/sub DD/ = 1.8 V and the output power is -4 dBm.  相似文献   

8.
This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.  相似文献   

9.
Two K-Band low-noise amplifiers (LNAs) are designed and implemented in a standard 0.18 /spl mu/m CMOS technology. The 24 GHz LNA has demonstrated a 12.86 dB gain and a 5.6 dB noise figure (NF) at 23.5 GHz. The 26 GHz LNA achieves an 8.9 dB gain at the peak gain frequency of 25.7 GHz and a 6.93 dB NF at 25 GHz. The input referred third-order intercept point (IIP3) is >+2 dBm for both LNAs with a current consumption of 30 mA from a 1.8 V power supply. To our knowledge, the LNAs show the highest operation frequencies ever reported for LNAs in a standard CMOS process.  相似文献   

10.
The paper describes a bioluminescence detection lab-on-chip consisting of a fiber-optic faceplate with immobilized luminescent reporters/probes that is directly coupled to an optical detection and processing CMOS system-on-chip (SoC) fabricated in a 0.18-/spl mu/m process. The lab-on-chip is customized for such applications as determining gene expression using reporter gene assays, determining intracellular ATP, and sequencing DNA. The CMOS detection SoC integrates an 8 /spl times/ 16 pixel array having the same pitch as the assay site array, a 128-channel 13-bit ADC, and column-level DSP, and is fabricated in a 0.18-/spl mu/m image sensor process. The chip is capable of detecting emission rates below 10/sup -6/ lux over 30 s of integration time at room temperature. In addition to directly coupling and matching the assay site array to the photodetector array, this low light detection is achieved by a number of techniques, including the use of very low dark current photodetectors, low-noise differential circuits, high-resolution analog-to-digital conversion, background subtraction, correlated multiple sampling, and multiple digitizations and averaging to reduce read noise. Electrical and optical characterization results as well as preliminary biological testing results are reported.  相似文献   

11.
Scaling of CMOS technologies has a great impact on analog design. The most severe consequence is the reduction of the voltage supply. In this paper, a low voltage, low power, AC-coupled folded-switching mixer with current-reuse is presented. The main advantages of the introduced mixer topology are: high voltage gain, moderate noise figure, moderate linearity, and operation at low supply voltages. Insight into the mixer operation is given by analyzing voltage gain, noise figure (NF), linearity (IIP3), and DC stability. The mixer is designed and implemented in 0.18-/spl mu/m CMOS technology with metal-insulator-metal (MIM) capacitors as an option. The active chip area is 160 /spl mu/m/spl times/200 /spl mu/m. At 2.4 GHz a single side band (SSB) noise figure of 13.9 dB, a voltage gain of 11.9 dB and an IIP3 of -3 dBm are measured at a supply voltage of 1 V and with a power consumption of only 3.2 mW. At a supply voltage of 1.8 V, an SSB noise figure of 12.9 dB, a voltage gain of 16 dB and an IIP3 of 1 dBm are measured at a power consumption of 8.1 mW.  相似文献   

12.
A fully integrated matrix amplifier with two rows and four columns (2-by-4) fabricated in a three-layer metal 0.18-/spl mu/m silicon-on-insulator (SOI) CMOS process is presented. It exhibits an average pass-band gain of 15 dB and a unity-gain bandwidth of 12.5 GHz. The input and output ports are matched to 50 /spl Omega/ using m-derived half sections; the measured S/sub 11/ and S/sub 22/ values exceed -7 and -12 dB, respectively. Integrated in 2.0/spl times/2.9mm/sup 2/, it dissipates 233.4 mW total from 2.4- and 1.8-V power supplies.  相似文献   

13.
Gupta  V. Rincon-Mora  G.A. 《Electronics letters》2007,43(20):1085-1087
A 0.6 mum CMOS sub-bandgap reference circuit, the output voltage of which is, unlike reported in the literature, concurrently low voltage and low output impedance, is presented. Experimental measurements verify that the proposed circuit, which produces a first-order temperature-compensated reference voltage of 890 my sources up to 5 mA of load current and rejects noise by a factor of 30.8-8.1 dB at 500 kHz- 4 MHz, neither of which feature is achieved by state-of-the-art sub-bandgap circuits.  相似文献   

14.
Decision-feedback equalisation (DFE) is explored to reduce intersymbol interference and crosstalks in high-speed backplane applications. In the design of the clock and data recovery circuit, embedding DFE within a phase and frequency detector enhances the recovery of data inherently from distorted input signals and facilitates providing DFE with the recovered clock.  相似文献   

15.
《Electronics letters》2007,43(20):1096-1098
A CMOS dual-band ultra-wideband low noise amplifier (LNA) with interference rejection is presented. The proposed LNA employs a current reuse structure to reduce power consumption and an active notch filter to produce in-band rejection in the 5 GHz WLAN frequency band. The load tank of the current reuse stage is optimised to provide an additional out-band attenuation in the 2.4 GHz WLAN band. Measurement shows a peak gain of 19.7 dB in the low band (3-5 GHz) and 20.3 dB in the high band (6-10 GHz), while the in-band and out-band maximum rejections are 19.6 and 12.8 dB, respectively.  相似文献   

16.
Cao  C. Seok  E. O  K.K. 《Electronics letters》2006,42(4):208-210
A 192 GHz cross-coupled push-push voltage controlled oscillator (VCO) is fabricated using the UMC 0.13 /spl mu/m CMOS logic process. The VCO can be tuned from 191.4 to 192.7 GHz. The VCO provides output power of /spl sim/-20 dBm and phase noise of /spl sim/-100 dBc/Hz at 10 MHz offset, while consuming 11 mA from a 1.5 V supply.  相似文献   

17.
The analysis and design of two novel high-speed CMOS clock dividers is discussed. The realizations of these circuits in a 0.13-/spl mu/m CMOS process show a significant improvement in high-frequency operation compared to a conventional D flip-flop-based divider. Measured sensitivity curves of these dividers give maximum frequency of operation ranging from 20 to 38 GHz with power consumption of 12 mW from a 1.8-V supply voltage.  相似文献   

18.
This paper demonstrates a low-jitter clock multiplier unit that generates a 10-GHz output clock from a 2.5-GHz reference clock. An integrated 10-GHz LC oscillator is locked to the input clock, using a simple and fast phase detector circuit that overcomes the speed limitation of a conventional tri-state phase frequency detector due to the lack of an internal feedback loop. A frequency detector guarantees PLL locking without degenerating jitter performance. The clock multiplier is implemented in a standard 0.18-/spl mu/m CMOS process and achieves a jitter generation of 0.22 ps while consuming 100 mW power from a 1.8-V supply.  相似文献   

19.
A downconversion double-balanced oscillator mixer using 0.18-/spl mu/m CMOS technology is proposed in this paper. This oscillator mixer consists of an individual mixer stacked on a voltage-controlled oscillator (VCO). The stacked structure allows entire mixer current to be reused by the VCO cross-coupled pair to reduce the total current consumption of the individual VCO and mixer. Using individual supply voltages and eliminating the tail current source, the stacked topology requires 1.0-V low supply voltage. The oscillator mixer achieves a voltage conversion gain of 10.9 dB at 4.2-GHz RF frequency. The oscillator mixer exhibits a tuning range of 11.5% and a single-sideband noise figure of 14.5 dB. The dc power consumption is 0.2 mW for the mixer and 2.94 mW for the VCO. This oscillator mixer requires a lower supply voltage and achieves a higher operating frequency among recently reported Si-based self-oscillating mixers and mixer oscillators. The mixer in this oscillator mixer also achieves a low power consumption compared with recently reported low-power mixers.  相似文献   

20.
This paper presents the first fully integrated SONET OC-192 transmitter and receiver fabricated in a standard 0.18-/spl mu/m CMOS process. The transmitter consists of an input data register, 16-b-wide first-in-first-out (FIFO) circuit, clock multiplier unit (CMU), and 16:1 multiplexer to give a 10-Gb/s serial output. The receiver integrates an input amplifier for 10-Gb/s data, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. An on-chip LC-type voltage-controlled oscillator (VCO) is employed by both the transmitter and receiver. The chipset operates at multiple data rates (9.95-10.71 Gb/s) with functionality compatible with the multisource agreement (MSA) for 10-Gb transponders. Both chips demonstrate SONET-compliant jitter characteristics. The transmitter 10.66-GHz output clock jitter is 0.065 UI/sub pp/ (unit interval, peak-to-peak) over a 50-kHz-80-MHz bandwidth. The receiver jitter tolerance is more than 0.4 UI/sub pp/ at high frequencies (4-80 MHz). A high level of integration and low-power consumption is achieved by using a standard CMOS process. The transmitter and receiver dissipate a total power of 1.32 W at 1.8 V and are packaged in a plastic ball grid array with a footprint of 11/spl times/11 mm/sup 2/.  相似文献   

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