高k HfLaO栅介质MoS2晶体管的性能研究

比较研究了HfO₂与HfLaO栅介质多层MoS₂场效应晶体管。实验结果表明,与HfO₂栅介质MoS₂晶体管相比,HfLaO栅介质MoS₂晶体管表现出更优的电性能。电流开关比高达1×10⁸,亚阈斜率低至76 mV/dec,界面态密度低至1.1×10¹² cm-2·eV-1,载流子场效应迁移率高达1×10⁹ cm²·V-1·s-1。性能改善的原因在于镧(La)对HfO₂的掺杂形成HfLaO化合物,减小栅介质薄膜的表面粗糙度,降低缺陷电荷密度,改善了栅介质/沟道界面特性,从而减小了界面态密度,抑制了库仑散射和界面粗糙散射。最终,提高了多层MoS₂晶体管的场效应迁移率,改善了晶体管的亚阈特性。     

兼顾增益与折射率变化的低偏振量子点材料研究

对比分析了InGaAs/InGaAsP柱状量子点材料TE模和TM模增益谱及其折射率变化谱随点区材料组分、垒区材料组分和量子点高宽比的变化特性,并剖析了其中的物理机理。进一步联合考虑点区和垒区组分变化对兼顾增益与折射率变化以及偏振相关性的影响,提出了一种多参数调配方法,并据此设计出在1550nm通信波段(1540~1560nm)内兼顾增益与折射率变化的低偏振量子点材料In0.97Ga0.03As/In0.76Ga0.24As0.52P0.48。最后通过分析,选定合适的工作载流子浓度。当载流子浓度为0.6×10²⁴ m-3时,TE模和TM模的3dB谱宽交叠区面积分别为8.66×10³和7.55×10³nm/cm,增益和折射率变化的偏振相关性分别在3%和10%以内。研究结果有助于未来全光网络中关键器件的优化设计。     

LiYF4:Tm3＋单晶的生长及其光学性能研究

采用坩埚下降法,制备了尺寸为Φ10mm×110mm的高质量Tm³⁺掺杂LiYF₄(YLF :Tm3＋)单晶体。测试了样品的电感耦合等离子(ICP)、X光衍射(XRD)吸收光谱 以及790nm LD激发 下的荧光光谱。应用Judd-Ofelt理论计算了Tm³⁺在YLF∶Tm3＋单晶 材料中的唯象强度参数Ω_t、能级跃迁振子强度Pexp、 自发辐射跃迁几率A、荧光分支比β和辐射寿命τrad 等光谱参数,同时计算了1800nm波段的吸收截 面和受激发射截面分别 为σabs=0.52×10－20 cm²和σem=0.67×10 －20 cm²。在荧光光谱中观察到1470nm与1 800nm的荧光发射,它们分别对应于Tm³⁺的³H₄→³F ₄与³F₄→³H₆的能级跃迁。测定了1800nm波段的荧光寿命 ,并计算得到³F₄→³H₆跃迁的量子效率为79.22%。     

可调谐氮化硅波导微环谐振腔滤波器研究

设计并制备了一种基于热光效应的集成可调谐氮化 硅(Si₃N₄)波导微环谐振腔滤波器,通过采用马赫-曾德干涉仪(MZI)构成的可调谐 耦合器控制耦合区耦合比,以实现滤波器消光比的调谐。设计并优化了微环谐振 腔的波导截面尺寸、弯曲半径和耦合区波导间隔等参数,并通过光刻、反应离子刻蚀(RIE )等工艺制备 了两种不同弯曲半径的Si₃N₄波导微环谐振腔。实验结果表明,本文器件在波长1550nm附近处的自由光谱 范围(FSR)为68pm,3dB带宽约为16pm,品质因子Q达到了9.68×10 4,消光比可调范围约为17dB。     

NH3等离子体处理钝化层致Ge MOS界面特性的改善

制备了以TaYON作为钝化层,以HfTiON作为高k栅介质的Ge MOS电容。研究了NH₃和N₂等离子体处理TaYON对界面特性的影响。结果表明,N₂和NH₃等离子体处理可以有效改善器件的界面及电性能,其中,NH₃等离子体处理的效果更好,可获得更高的k值(25.9)、更低的界面态密度(6.72×10¹¹ eV-1·cm-2)和等效氧化物电荷密度(-9.43×10¹¹ cm-2),以及更小的栅极漏电流(5.18×10-5 A/cm²@V_g=1 V+V_fb)。原因在于NH₃等离子体分解产生的N原子或H原子以及NH基团能有效钝化界面附近的悬挂键和缺陷态,防止GeO_x低k界面层的形成,N原子的结合也增加了介质的热稳定性。     

WO3对Rubrene/C70有机太阳能电池性能的改善

研究了WO₃对Rubrene/C₇₀有机太阳能电池 (OSCs)性能的 改善,制备了结构为ITO/WO₃/Rubrene/C₇₀/BCP/Al的OSCs,其中WO₃插入在I TO和Rubrene中间作为阳极修饰层。通过优化WO₃的厚度,研究了WO₃对OSCs性能的改善及其作用机理。实验发现,器件的短路电流Jsc、开路电压V_oc、 填充因子(FF)、光电转换效率(PCE)和串联电阻Rs等性能参数随WO₃厚度的变化呈规律性变化;当 WO₃厚度小于80 nm时,器件PCE随着厚度的增加不断增大;当W O ₃厚大于80 nm时,器件PCE随着厚度的 增加不断减小;当WO₃厚度为80 nm 时,器件PCE达到最高为1.03%, 相应的J sc、V_oc、FF分别为2.81mA·cm－2、 0.83V、43.85%,Rs为45.3Ω·cm²,对比没有WO₃修饰层, 器件的J_sc、V_oc、FF和PCE分别提高了31%、137%、17%,Rs降低了33%。     

偏振选择可调谐双带太赫兹吸收器

提出并研究了一种偏振选择可调谐双带太赫兹吸收器。吸收器由顶层方形劈裂石墨烯环、中间SiO₂介质层以及底层金反射层组成。基于时域有限差分法的仿真结果显示,该吸收器在不同偏振光入射下均可以实现双带高效率吸收。x偏振光时在7.86和12.63THz处的吸收率分别为97.9%和91.2%;y偏振光时在6.30和10.52THz处的吸收率分别为94.1%和93.2%。通过改变石墨烯费米能级,可以对两个偏振的双带吸收峰波长进行调谐。此外,研究了介质层厚度和石墨烯劈裂环的物理参数对共振吸收峰的影响。因为在两个偏振状态下都能产生双带高吸收,所以此吸收器在太赫兹偏振成像、太赫兹传感、选择性光谱检测和偏振复用等领域有重要的潜在应用价值。     

YPO4:Dy3+,Eu3+荧光粉的水热合成及白光发射

采用水热法,合成了YPO₄:xDy³⁺,0.06Eu³⁺系列荧光粉。通过X射线衍射(XRD )、扫 描电子显微镜(SEM)、电子散射能谱(EDS)、光致发光(PL)谱和长余辉光谱,分别对样品的物 相、结构和PL进行了表征。 XRD检测表明,合成的样品属四方晶系;荧光光谱测试表明,在234nm紫外光激发下, YPO₄:xDy³⁺,0.06Eu³⁺的 发射光谱呈现Eu3+ 的⁵D₀→⁷F₁(592nm,橙光)和 ⁵D₀→ ⁷F₂(618nm,红光) 的发光峰;而在354nm的激发波长下,YPO₄:0.06Dy³⁺,0.06Eu³⁺的发射光谱 呈现Dy³⁺的4F9/2→⁶H15/2(486nm、蓝 光)和⁴F9/2→⁶H13/2(575nm、黄光)的发光 峰,以及Eu³⁺的⁵D₀→⁷F₁(592nm、 橙光)和⁵D₀→⁷F₂(619nm、红光 )的发光峰。对荧光 衰减谱的双参数拟合证实了Dy³⁺→Eu³⁺能量 传递的存在。色坐标图显示,在234nm紫外光激发下,YPO₄:0.05Dy ³⁺,0.06Eu3+ 是很好的近紫外光激发下的白色荧光粉。     

新型红色荧光粉Ca0.5Sr0.5MoO4:Sm3+的制备及光学性能

为了得到发光效率较好的长波长红色荧光粉,采用 高温固相法成功地合成了适合紫外激发的红色荧光粉 Ca0.5－xSr0.5MoO₄:xSm³⁺,研究了其晶体结构和发 光性质。X射线衍射(XRD)测量结果显示,制备的样品为纯相Ca0.5Sr0.5MoO₄晶体。其激发 光谱包括一个宽带峰和一系列尖峰,通过不同波长激发的发射谱和与Ca0. 5－xSr0.5MoO₄:xEu³⁺的发射 谱比较分析得出激 发宽带为最有效激发带,归属于Mo⁶⁺－O2－的电荷迁移跃迁。在275nm的激发 下,发射峰由峰值为564nm(⁴G5/2→⁶H 5/2)、 606nm(4G5/2→⁶H7/2) 、647nm (⁴G5/2→⁶H9/2)、707nm(4G5/2→⁶H11/2)的4个峰组成,最大发射 峰位于647nm处,呈现红光 发射。Sm³⁺掺杂高于6%时Ca0.5－xSr0.5Mo O₄:xSm³⁺出现浓度猝灭,分析表明,其猝灭机 理是最邻近离子间的能量传递。同时,添加电荷补偿剂可增强材料的发射强度,以添加Na +的效果最明显。     

高Q值横向激发体声波谐振器的设计与制备

随着5G移动通信时代的发展,射频前端(RF front-ends)的滤波和信号处理迫切需要高频大带宽的声学谐振器。横向激发体声波谐振器(XBAR)具有超高的工作频率和超大的机电耦合系数(k²),但其品质因数(Q)值不高,阻碍了其在射频前端中的应用。该文提出了一种基于ZY切铌酸锂(LiNbO₃)的XBAR谐振器,通过有限元(FEM)仿真对谐振器进行了优化设计,并在微机电系统(MEMS)工艺下对谐振器进行加工。该文所制备的横向激发体声波谐振器A₁模式的谐振频率为4.72 GHz,k²=26.9%,Q_{3 dB}为384,温度频率漂移系数为-60.5×10^-6/℃。A₃模式的谐振频率为13.5 GHz,k²=4.4%。     

Effects of annealing conditions on the properties of tantalum oxide films on silicon substrates

The formation of a SiO₂ layer at the Ta₂O₅/Si interface is observed by annealing in dry O₂ or N₂ and the thickness of this layer increases with an increase in annealing temperature. Leakage current of thin (less than 40 nm thick) Ta₂O₅ films decreases as the annealing temperature increases when annealed in dry O₂ or N₂. The dielectric constant vs annealing temperature curve shows a maximum peak at 750 or 800° C resulting from the crystallization of Ta₂O₅. The effect is larger in thicker Ta₂O₅ films. But the dielectric constant decreases when annealed at higher temperature due to the formation and growth of a SiO₂ layer at the interface. The flat band voltage and gate voltage instability as a function of annealing temperature can be explained in terms of the growth of interfacial SiO₂. The electrical properties of Ta₂O₅ as a function of annealing conditions do not depend on the fabrication method of Ta₂O₅ but strongly depend on the thickness of Ta₂O₅ layer.     

金刚石 MISFET 器件的研究

Based on the hydrogen-terminated surface channel diamond material,a 1μm gate length diamond metal-insulator-semiconductor field-effect transistor（MISFET） was fabricated.The gate dielectric Al₂O₃ was formed by naturally oxidated thin Al metal layer,and a less than 2 pA gate leakage current was obtained at gate bias between -4 V and 4 V.The DC characteristic of the diamond MISFET showed a drain-current density of 80 mA/mm at drain voltage of -5 V,and a maximum transconductance of 22 mS/mm at gate-source voltage of -3 V.With the small signal measurement,a current gain cutoff frequency of 2.1 GHz was also obtained.     

Liquid phase epitaxial growth of InAsxSbyPl-x-y layers on InAs

High quality InAs_xSb_yP_l-x-y quaternary layers, which are lattice matched to InAs, have been grown successfully on InAs substrates by liquid phase epitaxy. Both Graded and constant composition InAs_xSb_yP_l-x-y layers have been grown. In addition, the graded InAs_xSb_yP_l-x-y layer has been used as a buffer layer for the growth of InAs_l-xSb_x on an InAs substrate. Research supported in part by Commander, U. S. Army Missile Command, Attn: AMSMI-RNS, Redstone Arsenal, AL 35809 and ARPA-Advanced Research Projects Agency, 1400 Wilson Boulevard, Arlington, VA 22209.     

Schottky barrier heights on IV-IV compound semiconductors

The variations of Schottky barrier heights on Si_1-x-y Ge_xC_y films with composition and strain have been investigated and compared to those expected for the band gap energy. The barrier on n-type does not depend on composition and strain. This independence suggests that the Fermi level at the interface between tungsten and Si_1-x-yGe_xC_y alloys (x≠0) is pinned relative to the conduction-band. For Si_1-xGe_x the barrier on p-type follows the same trends as the band gap. For the ternary alloys, the variations of the barrier on p-type seem to be too large to be only due to a variation of the band-gap. In addition, we have investigated the influence of the deposition conditions of the sputtered-W-gate on the barrier to silicon and Si_1-xGe_x. Our results show that the barrier on n-type-Si and p-type-Si_1-xGe_x-films increases when the stress retained in the W-films changes from compressive to tensile as the deposition pressure increases. The absence of change in the barrier height of W to p-type-silicon and n-type-Sij xGex-films suggests that the Fermi level at the interface with Si is pinned relative to the valence-band while it is pinned relative to the conduction when Ge is added.     

CdSeTe分子束外延技术研究

对HgCdTe红外探测器CdSe_xTe_1-x衬底材料的分子束外延生长条件、组分调整等进行了简单介绍。生长条件包括生长结构(主要有CdSe_xTe_1-x/CdTe/ZnTe/Si、CdSe_xTe_1-x/ZnTe/GaAs等)、生长温度(300℃左右)、生长厚度(5μm左右)等。组分调整包括分析Se组分随(J_Se+J_Te)/J_Cd和J_Se/(J_Se+J_Te)的变化。J_Se/(J_Se+J_Te)值较小时,Se组分较难融入外延层;J_Se/(J_Se+J_Te)值较大时,Se组分增长较迅速。同时,若J_Se/(J_Se+J_Te)值较小,则Se组分增长趋势...     

Liquid phase epitaxial growth of InAs1-xSbx on GaSb

Reported here, for the first time, is the lattice matched growth of InAs_1-xSb_x on GaSb. The thermodynamic incompatibility of the system, i.e., the strong tendency for the In-As-Sb liquid to dissolve the GaSb substrate, was solved via a novel liquid phase epitaxial growth technique. Liquid compositions for lattice matching conditions have been determined in the 400-600°C range. Epitaxial growth has been examined for (100), (111)B and (111)A orientations. Dislocation etch pit densities for lattice matched, and near lattice matched conditions are shown to be less than 10⁴-cm⁻² and 10⁵-cm⁻⁴, respectively. The composition of the epitaxial layers are determined by the Gandolfi X-ray diffraction technique and compositional homogeneity has been confirmed by SEM X-ray analysis. Some material related device properties which demonstrate the reproducibility of the growth technique are presented.     

基于InP衬底的晶格失配In0.68Ga0.32As的MOCVD生长及其特性研究

采用MOCVD生长技术在InP衬底上成功实现了晶格失配的3μm In0.68 Ga0.32As薄膜生长.通过As组分的改变,利用张应变和压应变交替补偿的InAsxP1-x应变缓冲层结构来释放由于晶格失配所产生的应力,在InP衬底上得到了与In0.68Ga0.32 As晶格匹配的InAsxP1-x“虚拟”衬底,通过对缓冲层厚度的优化,使应力能够在“虚拟”衬底上完全豫弛.通过原子力显微镜(AFM)、高分辨XRD、透射电镜(TEM)和光致发光(PL)等测试分析表明,这种释放应力的方法能够有效提高In0.68 Ga0.32 As外延层的晶体质量.     

Growth and structure of wide-gap insulator films on SrTiO3

Wide-gap insulator films, CaZrO₃, CaHfO₃, LaGaO₃, and NdGaO₃, were grown on SrTiO₃(1 0 0) substrates with the aim of obtaining a gate insulator for epitaxial oxide devices. We show that CaZrO₃ and CaHfO₃ films were epitaxial and had a multi-domain in-plane structure due to their highly distorted perovskite structure. Most of the LaGaO₃ and NdGaO₃ films were polycrystalline, and therefore showed relatively high leak currents. CaHfO₃ had the best crystallinity among these four materials.     

Effects of Ball-Milling Atmosphere on the Thermoelectric Properties of TAGS-85 Compounds

Inspired by the high ZT value lately attained in Ar-protected ball-milled nanocrystalline p-BiSbTe bulk alloy, we report herein an investigation of the effects of ball-milling atmosphere on the thermoelectric (TE) properties of the traditional TE material (GeTe)₈₅(AgSbTe₂)₁₅ (TAGS-85). TAGS-85 samples were prepared via a melting–quenching–annealing process, and then ball-milled in different atmospheres and subsequently densified using a spark plasma sintering technique. The Seebeck coefficient, electrical conductivity, thermal conductivity, and Hall coefficient were measured as a function of temperature from 10 K to 310 K. It was found that different ball-milling atmospheres, i.e., air, liquid N₂ (LN₂), and Ar, profoundly affected the TE properties. A state-of-the-art figure of merit ZT ≈ 0.30 was attained at 310 K in the Ar-ball milled sample. The results are discussed in terms of the carrier concentration, mobility, crystallinity, and the grain boundary scattering.