大功率激光二极管列阵的硅基微通道热沉研制

为了提高大功率激光二极管列阵的散热效率以便提高其寿命和波长稳定性,研制了一种封装集成度较高的屋脊式硅基微通道热沉.将田口稳健设计方法用于微通道热沉的优化设计,利用正交试验和信噪比分析实现了参数的稳健优化.以(110)单晶硅作为基片,采用KOH各向异性刻蚀和硅-玻璃-硅三层阳极键合方法制作出了通道宽度约为50 μm的微通道热沉,通道壁面粗糙度优于0.1 μm.采用激光二极管芯片对样品进行了封装和测试,利用砷化镓激光波长的温度漂移系数估算出了中间激光二极管的有源区温升,从而计算出了热沉的热阻.测试结果表明,该微通道热沉的单位面积热阻约为0.070 cm2·K/W,与有限元分析结果基本一致.     

纳卫星等效空间热沉的PWM控制及其在地面模拟试验中的应用研究

纳卫星等效空间热沉是一种适用于纳卫星热系统动态特性地面试验研究的空间环境模拟装置,详细阐述纳卫星等效空间热沉的工作原理,并提出其核心部件热电制冷器(Thermoelectric cooler, TEC)及强迫冷却风扇的脉冲宽度调制(Pulse width modulation, PWM)控制策略及其算法与硬件实现,以此为平台对一模拟纳卫星内部的闭环控温策略进行地面试验研究,结果表明采用PWM控制的等效空间热沉可以满足在地球表面进行纳卫星空间控温效果研究的目的,为微小航天器热系统的空间环境模拟试验提供一种新的技术途径.     

微通道热沉设计技术初探

半导体器件越小,单位面积的热生成率越大,温度急剧升高导致器件性能改变,因此必须对器件产生的废热进行有效处理.1981年,Tuckerman和Pease提出了利用强迫对流方法致冷微通道的概念,可用于高速电脑芯片、激光二极管阵列、无线电与微波频率放大器等高功率电子器件的有效散热.介绍了微通道热沉的相关物理概念,讨论了几何参数对歧管式微通道热沉冷却性能的影响.     

激光二极管温度控制系统设计

激光二极管由于具有体积小、效率高、低功耗驱动和易于调制等优点,近年来被广泛应用在医疗、工业加工、精密测量和通信等领域。激光二极管工作温度的稳定性严重影响其性能,因此有必要采取温度控制措施使激光二极管在额定温度下稳定工作。利用半导体制冷片(TEC)作为系统的执行元件,以PID算法为基础设计了激光二极管温度控制系统。通过测试,激光二极管工作温度在1 min内达到设定温度,控温稳定度优于0.2℃,能够有效抑制激光二极管波长的红移。     

用于大功率激光二极管列阵的硅基微通道热沉研制

将田口稳健设计方法用于面向大功率激光二极管列阵的硅基屋脊式微通道热沉的优化设计,利用正交试验和信噪比分析实现了参数的稳健优化。采用激光二极管条对样品进行了封装和测试。利用砷化镓激光波长的温度漂移系数估算出了中间的激光二极管条的有源区温升。测试结果表明,该微通道热沉的单位面积热阻约为0.070 K•cm2/W,与有限元分析结果基本一致。     

弹载电子设备相变热沉装置散热性能研究

文中介绍了一种用于弹载电子设备的相变热沉装置的设计方法及试验研究。通过实验对比了电子模块在采用相变热沉装置、铝块和无热沉3种情况下的工作温度曲线,同时对比分析了相变热沉装置在不同热流密度下的工作特性。结果表明,当热源热流密度较小时,相变热沉装置具有明显的减缓热源升温的作用,对比铝块热沉具有明显的散热功效。而随着热流密度的增加,其散热优势逐渐减弱。同时,填料相变温度点的选取和导热增强体的设计,对相变热沉装置的散热性能有很大的影响。     

热沉扩展表面积对换热性能影响的数值模拟研究

通过数值模拟的方式,研究了在冷却工质通过热沉通道消耗的分别泵功为0.04W和0.4W时,扩展表面热沉的扩展表面面积对热沉加热面的过余温度的影响。结果显示,在加热面面积一定,泵功为0.04W时,扩展表面面积的增大可以明显的降低热沉加热面的过余温度;在泵功为0.4W,扩展表面面积与加热面面积比值小于2.25时,扩展面积的增大可以降低热沉加热面的过余温度,当该面积比值大于2.25时,扩展面积的增大对热沉加热面的最高过余温度和最低温过余温度没有影响。     

水-相变材料复合蓄热装置的充放热特性研究

研究了一种新型的水-相变材料复合蓄热装置,在水箱的上部添加少量相变材料,设置2个均流孔板将水箱分为高温段、低温段和过渡段,并对其蓄热特性进行了试验研究,分析了充热、放热过程中水箱内的温度分布,以及相关因素的影响.试验测试表明:(1) 水-相变材料复合水箱在充热和放热过程中,均存在着明显的温度分层;(2) 对于充热过程,流量越小,充热温度越稿,分层效果越明显;(3) 对于取热过程,相变材料能有效提高较高温度热水的供应量.     

压力管道在役焊接热循环试验研究

利用平板腔室模拟试验装置以及圆管模拟试验装置,对16MnR钢进行了在役焊接热循环研究。结果表明,与水冷条件下相比,空冷时在役焊接热循环曲线峰值温度提高,冷却时间延长;随着焊接热输入的增大,峰值温度和冷却时间明显增加;小于临界板厚时,冷却时间随着板厚的增大而减小,试板的冷却速度增大;而超过临界板厚,板厚对冷却时间的影响可以忽略;压力因素对静试验装置的在役焊接热循环的影响可以忽略。     

基于分流式热沉的锂电池热管理系统研究

锂电池热管理的目标是为了确保电池组的最大温度和电池单体之间的温差在合适的范围内,本文通过数值模拟研究了分流式热沉和矩形直通道热沉对方形锂电池包在1C放电倍率下冷却效果,结果表明:分流式热沉具有更加优良的换热性能和热均匀性,在入口流量为0.03~0.27kg/s范围内,冷却液为进口为300K的水和乙二醇混合物,相较于矩形直通道热沉,分流式热沉可以将电池包的最大温度降低2°,电池单体的最大温差相较于矩形直通道降低最高可达72%。     

Effect of Heat Sink and Cooling Mediums on Ferrite Austenite Ratio and Distortion in Laser Welding of Duplex Stainless Steel 2205

In order to control the ferrite and austenite percentage in duplex stainless steel welding, many researchers try to change the laser welding parameters and cooling medium, but ignore to study the influence of heat sink e ect on weld strength. In this work, the e ect of aluminium heat sink and varying cooling medium on the laser welding of duplex stainless steel(DSS) 2205 is studied. The 2 mm thick DSS sheets welded with pulsed Nd: YAG laser welding machine by varying the cooling medium(air and oil) and an aluminium plate used as a heat sink. The welded specimens tested for tensile strength, micro-hardness, distortion, microstructure and radiography analysis. The faster cooling rate in the oil quenching process enhances the ferrite percentage compared with air-cooled samples. But the faster cooling rate in oil quenching leads to more distortion and using aluminium as a heat sink influenced positively the distortion to a small extent. The lower cooling rate in air quenching leads to a higher tensile strength of the welded specimen. The objective of this work is to analyse experimentally the e ect of cooling medium and heat sink in the mechanical and metallurgical properties of laser welded duplex stainless steel.     

基于光伏充电的高效热电散热系统研究

针对大功率光学器件和设备的热严重影响其稳定性、性能和使用寿命的问题,提出了一种基于能量回馈的智能高效热电散热系统。利用基于改进的增量式比例积分微分（PID）算法快速实现高精度温度控制,通过能量回收机制实现热电制冷器（TEC）制冷效率的提升。采用光伏充电为主、电源充电为辅的电源管理策略,通过上位机监测与控制实现对两组蓄电池的高效充放电切换。同时,利用Python+PyQt5为散热系统搭建可视化图形操作界面。研究表明,设计的实验系统实现了对TEC器件的电路信息监测与温度高效控制,可为解决大功率光学器件和系统的散热问题提供参考。     

基于多孔微热沉的大功率LED冷却技术研究

针对大功率发光二极管(Light-emitting diode,LED)具有的高热流通量、表面温度要求严格控制的特点,提出一种新型高效的基于多孔微热沉系统的散热技术来满足大功率LED散热封装的需求。分析多孔微热沉系统的工作原理以及传热特性,基于局部热力学平衡建立多孔微热沉流动与传热的数学模型,并用SIMPLE算法进行数值求解,得出微热沉的温度分布以及影响微热沉性能的一些因素。数值研究表明:在高热流密度下,微热沉散热表面的温度能维持较低水平,即使在热流达到200W/cm2时,散热表面的最高温度才55.2℃;提高工质入口流速可以降低微热沉内的温度以及散热表面的温度水平。多孔微热沉系统能够有效地解决大功率LED的散热问题,提高LED芯片的可靠性与使用寿命。     

高精度大范围的光学晶体温度控制系统

为解决固体激光器工作时光学晶体产生的热沉积问题,保证其工作性能稳定,提出了一种基于半导体制冷器(TEC)的高控温精度、大控温范围光学晶体温度控制方案。分析了TEC的工作特性和光学晶体的热效应与传热机理,将TEC工作过程中自身温度变化引起的电气特性改变与光学晶体温度的变化同时纳入控制环节,建立了温度-电流双闭环温度控制模型,设计并完成了一套高控温精度、大控温范围的光学晶体温度控制系统。实验结果表明:本系统在-15~120℃的温度控制范围内,可以迅速稳定在任一设定的温度点,其控温精度优于±0.002℃;当设定温度和实际温度之间的偏差在20℃以内时,其收敛稳定时间小于60s,可以满足固体激光器中光学晶体对控温范围与精度的要求。     

Modeling a Heat Source/Heat Sink for Tribological Applications©

The surface temperature of contact elements is one of the most important factors that influences the performance and life of tribological systems. Heat-pipe cooling seems to be a promising means for enhanced heat transfer. The heat input at the surface and the heat pipe as a heat sink represent a system of heat source/heat sink (HSHS). In this paper, the function of the heat pipe is mathematically described and the heat-transfer characteristics of the HSHS system are investigated. A semi-empirical model is developed to shed some light on the surface flash temperature control employing the HSHS system. Both steady-state and transient analyses show that heat pipes can be employed to reduce the flash temperature effectively. The possibility of applying this concept to composite materials is also analyzed.     

Investigation on thermal characteristics of heat sinks for power module using STM

The device that controls dynamic motions in a washing machine is called as MICOM. This device includes an IPM that controls the rotation of a tub. Also, the overheating of IPM gives cause for lowering the service life of an applied chip and is directly linked with its faults. A heat sink that is larger than the volume of the applied chip more than 50 times is installed to prevent such overheating. In the operation of the IPM, the temperature specification of the heat sink can be determined as 80°C under the air temperature of 25°C. However, the heat sink used at the present time cannot satisfy this condition, so it is necessary to redesign such a heat sink to satisfy this condition. This study proposes an STM that is able to precisely calculate the temperature applied to IPM in a system level prior to redesigning the heat sink. The STM can be considered as a model that complements a JEDEC analysis model. This model implements a parameter analysis to perform the optimization of a heat sink and verifies the priority of parameters to reduce material costs. Furthermore, it investigates a counterproposal that replaces the conventional cooling methods in which it seeks a counterproposal that performs heat dissipation in a device according to the SoC of chips and is able to suppress EMI. This paper was recommended for publication in revised form by Associate Editor Jae Dong Chung Chung-Hyo Jung acquired the doctoral degree in the Dept. of Science for Open and Enviromental Systems at Keio University in 2003. The specialty in the doctoral course was GSMAC-FEM and studied on MHD (magnetohydrodynamics). Dr. Jung joined Samsung Electronics Co., Ltd. as a CFD engineer in 2003. Also, he has worked at Samsung Advanced Institute of Technology and has charged in the thermal analysis of semi-conductors (system LSI). One of the Dr. Jung’s major concerning fields is the mechanical application of Lie-Groups.     

某数字T/R组件微通道液冷冷板的热设计

文中针对某大功率数字T/R组件局部热流密度较高的特点,提出了微通道散热模块与蛇形流道相结合的散热方式,设计了带有微通道模块的液冷冷板,通过仿真分析优化了微通道模块的几何参数,并验证了液冷冷板的散热效果。结果表明：微通道模块对散热效果改善明显,可保障电子元件工作在允许的温度范围内。该设计方式值得在局部热流密度过高的液冷冷板设计中推广应用。     

EMBCCD的制冷系统设计

光子探测应用领域的快速发展对探测器灵敏度的要求不断提高,EMCCD（Electron-Multiplying Back illuminat-ed CCD）技术可解决目前的需求。其中降低温度能有效提高EMBCCD信噪比。设计一套制冷系统,使EMBCCD工作在稳定的低温环境。该系统以Atmega8单片为控制器,以TEC为制冷器件,用温度传感器DS18B20完成对温度信号的采集,并把采集的信号送入单片机进行处理,实时显示温度值,运用PID控制算法实现稳定低温控制。     

Wave-number stability of a laser diode mounted in a closed cycle helium refrigerator

The wave-number stability of a laser diode mounted in a closed cycle helium refrigerator was examined using a CO(2) laser heterodyne spectrometer. The set current supplied by a commercial laser diode supply appeared stable enough over the time periods normally used. Temperature control was achieved through both passive and active loop control. A stage of open loop control of the cold tip allowed the closed loop control of diode heat sink to be operated at higher gains than conventionally used. Long-term stability of the center of the line shape function was better than 10 MHz per hour and the 1-min average was better than +/-5 MHz. Vibration of the diode mount determined the instrument line shape in spite of steps taken to eliminate the vibrations. The line shape had a half-width of 10 MHz with broad shoulders out to 50 MHz.     

新型单圆锥体热沉单孔射流散热数值模拟*

射流冷却是高热流密度换热的有效方法之一,其热沉形状是影响换热的关键因素。提出一种新型圆锥体热沉,应用RNG k-ε湍流模型,对新型单圆锥体热沉进行单孔水冷散热数值模拟,并进行试验验证。结果表明：单圆锥体热沉的散热效果明显强于常规平板热沉,前者的射流流体域比后者多一个转折区,转折区内存在二次冲击,使换热得到强化。雷诺数越大,圆锥体热沉散热性能越优异;在不同锥角(15°~60°)的单圆锥体热沉传热模拟中,当锥角在45°左右时,热沉表面的平均努塞尔数数最高;圆锥体底面直径d₁和射流孔直径d比值在1~3范围内,数在比值为2.5左右达到最大值;射流高度H与射流孔直径d比值在5左右时,数趋于最大。