微波功率双异质结高电子迁移率晶体管

研制和测试了K波段频率范围的微波高电子迁移率晶体管(HEMT)。这种HEMT具有选择低掺杂(AlGa)As/GaAs/(AlGa)As双异质结的独特结构,它可同时获得大电流密度和高的栅击穿电压。这种结构在室温下电子迁移率达6800cm~2/V.s,二维(2-D)电子密度高达1.2×10~(12)cm~(-2)。橱长为1μm,总栅宽为1.2mm的器件,在20GHz下输出功率达660mW(550mW/mm),相关增益为3.2dB,功率附加效率为19.3％。栅宽为2.4mm的同样器件得到1W的输出功率,3dB的增益以及15.5％的效率。这些结果表明了双异质结HEMT(DH-HEMT)的微波大功率的能力。     

非掺杂AlGaN/GaN微波功率HEMT

报道了研制的AlGaN/GaN微波功率HEMT,该器件采用以蓝宝石为衬底的非掺杂AlGaN/GaN异质结构,器件工艺采用了Ti/Al/Ni/Au欧姆接触和Ni/Au肖特基势垒接触以及SiN介质进行器件的钝化.研制的200μm栅宽T型布局AlGaN/GaN HEMT在1.8GHz,Vds=30V时输出功率为28.93dBm,输出功率密度达到3.9W/mm,功率增益为15.59dB,功率附加效率(PAE)为48.3%.在6.2GHz,Vds=25V时该器件输出功率为27.06dBm,输出功率密度为2.5W/mm,功率增益为10.24dB,PAE为35.2%.     

增强型AlGaN/GaN/AlGaN双异质结槽栅HEMT研究

为了在获得高击穿电压的同时实现增强型器件,对AlGaN/GaN/AlGaN双异质结HEMT进行了栅槽刻蚀,得到阈值电压为0.6 V的增强型HEMT。对器件特性的变化机理进行了分析,发现刻蚀引入的陷阱态使器件的击穿性能降低。采用变频电导法,定量研究了反应离子刻蚀在AlGaN/GaN/AlGaN双异质结HEMT中引入的陷阱态。研究表明,刻蚀工艺在双异质结HEMT中引入了大量的浅能级陷阱,这些陷阱的能级主要分布在0.36~0.40 eV。     

X波段GaN单片电路低噪声放大器

采用0.25μm GaN HEMT制备工艺在AlGaN/GaN异质结材料上研制了高性能X波段GaN单片电路低噪声放大器.GaN低噪声单片电路采取两级微带线结构,10V偏压下芯片在X波段范围内获得了低于2.2 dB的噪声系数,增益达到18 dB以上,耐受功率达到了27 dBm.在耐受功率测试中发现GaN低噪声HEMT器件...     

AlGaN器件欧姆接触的研究进展

作为制备光电子器件例如紫外光子探测器、异质结场效应晶体管(HFET)、高电子迁移率晶体管(HEMT)异质结场效应管等的一种宽禁带半导体材料, III V 族氮化物AlGaN器件近年来颇受关注.AlGaN与金属之间的低阻欧姆接触的实现问题阻碍了AlGaN(基)器件的发展.通过对相关文献的归纳分析,介绍了近年来AlGaN器件在欧姆接触形成、金属化方案、合金化工艺及表面处理等方面的研究进展.     

AlN阻挡层对AlGaN/GaN HEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

AlN阻挡层对AlGaN/GaNHEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

HEMT及其界面态效应的二维数值模拟

本文提出了一个调制掺杂异质结界面态模型,并首次将界面态效应引入到HEMT的二维数值模型中.本文用基于异质结漂移-扩散模型建立的 HEMT二维数值模型对常规结构的 AlGaAs/GaAs HEMT进行了模拟,讨论了 HEMT的内部工作机制,特别是异质结效应.本文着重模拟分析了HEMT中界面态对器件性能的影响。模拟结果表明界面态对HEMT的特性有显著的影响.     

L波段GaN HEMT器件的研制

基于标准工艺自主研制了L波段0.5μm栅长的GaN HEMT器件。该器件采用了利用MOCVD技术在3英寸(1英寸=2.54 cm)SiC衬底上生长的AlGaN/GaN异质结外延材料,通过欧姆接触工艺的改进将欧姆接触电阻值控制在了0.4Ω·mm以内,采用场板技术提高了器件击穿电压,采用高选择比的刻蚀工艺得到了一定倾角的通孔,提高了器件的散热能力及增益。结果表明,采用该技术研制的两胞内匹配GaN HEMT器件在工作频率1.5~1.6 GHz下,实现了输出功率大于66 W、功率增益大于15.2 dB、功率附加效率大于62.2%。     

Ka波段高电子迁移率晶体管的研制

介绍了35GHz赝配高电子迁移率晶体管的设计、制造与性能。在测试频率为35GHz时,该器件的最小噪声系数为2.46dB,相关增益为6.95dB。这是国内首次设计定型的8mm三端固态有源器件,其性能达到了1990年12月Alpha公司公布的AF040N3-00 HEMT的水平。     

AlGaAs/InGaAs/GaAs quantum-well power MISFET at millimeter-wavefrequencies

An AlGaAs/InGaAs/GaAs quantum-well MISFET developed for power operation at millimeter-wave frequencies is described. The InGaAs channel is heavily doped to increase the sheet carrier density, resulting in a maximum current density of 700 mA/mm with a transconductance of 480 mS/mm. The 0.25-μm×50-μm device delivers a power density of 0.76 W/mm with 3.6-dB gain and 19% power-added efficiency at 60 GHz. At 5.2 dB gain, the power density is 0.55 W/mm. A similar device built on an undoped InGaAs channel had much poorer power performance and no speed advantage     

S波段大功率GaAs PHEMT单片放大器

GaAs单片集成电路具有体积小、质量轻和可靠性高等特性,已经成为微波领域重要的器件。采用MBE技术生长出双面掺杂AlGaAs/InGaAs PHEMT结构的外延材料,研制了高效率的GaAs PHEMT器件,S波段功率附加效率大于55%。建立了基于EEHEMT的大信号模型,利用ADS软件搭建了有耗匹配的二级放大电路拓扑结构,进行最佳效率匹配,得到优化电路。采用4英寸(1英寸=2.54cm)GaAs0.35μm标准工艺研制了AlGaAs/InGaAs/GaAsPHEMT MMIC电路,测试结果表明,在测试频率为2.2~3.4GHz,测试电压VDS为10V时,输出功率大于12W,功率增益大于22dB,功率附加效率大于40%。     

Current-gain cutoff frequency comparison of InGaAs HEMTs

The current-gain cutoff frequency performance of pseudomorphic InGaAs/AlGaAs (20% InAs composition) high-electron-mobility transistors (HEMTs) on GaAs is compared to that of lattice-matched InGaAs/InAlAs HEMTs on InP. The current-gain cutoff frequency (f_t) characteristics as a function of gate length (L_g) indicate that the f_t-L_g product of ~26 GHz-μm in InGaAs/InAlAs HEMTs is 23% higher than that of ~21 GHz-μm in InGaAs/AlGaAs HEMTs. The performance of InGaAs/AlGaAs HEMTs is also 46% higher than that of conventional GaAs/AlGaAs HEMTs (~18 GHz-μm). These data are very useful in improving the device performance of HEMTs for a given gate length     

0.1-µm Gate-length pseudomorphic HEMT's

AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistors (HEMT's) with a gate length of 0.1 µm have been successfully fabricated. The HEMT's exhibit a maximum transconductance of 540 mS/mm with excellent pinch-off characteristics. A maximum stable gain (MSG) as high as 18.2 dB was measured at 18 GHz. At 60 GHz the device has demonstrated a minimum noise figure of 2.4 dB with an associated gain of ∼6 dB. These are the best gain and noise results reported to date for HEMT's.     

RHEED优化MBE异质材料生长工艺

利用高能电子衍射振荡研究MBE异质材料生长工艺。优化了AlGaAs/InGaAs/GaAs材料生长工艺。通过霍耳测量、X射线双晶衍射及二次离子质谱研究了利用该工艺生长的AlGaAs/InGaAs/GaAs双δ掺杂PHEMT结构材料,获得了较好的材料参数。利用该材料研制器件也有较好的结果。     

Ultra low noise characteristics of AlGaAs/InGaAs/GaAs pseudomorphicHEMT's with wide head T-shaped gate

The fully passivated low noise AlGaAs/InGaAs/GaAs pseudomorphic (PM) HEMT with 0.13 μm T-shaped gate was fabricated using dose split electron beam lithography method (DSM). This device exhibited low noise figures of 0.31 and 0.45 dB at 12 and 18 GHz, respectively. These noise figures are the lowest value ever reported for the GaAs based HEMT's. These results are attributed to the extremely low gate resistance which results from wide head T-shaped gate having the higher ratio more than 10 of gate head length to gate footprint     

Uniform, high-gain AlGaAs/In0.05Ga0.95As/GaAsP-n-p heterojunction bipolar transistors by dual selective etch process

AlGaAs/InGaAs/GaAs P-n-p heterojunction bipolar transistors (HBTs) have been fabricated using a dual selective etch process. In this process, a thin AlGaAs surface passivation layer surrounding the emitter is defined by selective etching of the GaAs cap layer. The InGaAs base is then exposed by selective etching of the AlGaAs emitter. The resulting devices were very uniform, with current gain varying by less than ±10% for a given device size. Current gain at a given emitter current density was independent of device size, with gains of over 200 obtained at current densities above 5×10⁴ A/cm ²     

Low-frequency noise performance of self-aligned InAlAs/InGaAs heterojunction bipolar transistors

The first measurement of low-frequency noise performance for self-aligned InAlAs/InGaAs HBTs is reported. The 1/f noise obtained was around 20 dB lower than that for AlGaAs/GaAs HBTs at a fixed frequency, which is considered to be caused by the low surface recombination velocity of InGaAs.<>     

Super-low-noise performance of direct-ion-implanted 0.25-μm-gateGaAs MESFET's

The authors report on advanced ion implantation GaAs MESFET technology using a 0.25-μm `T' gate for super-low-noise microwave and millimeter-wave IC applications. The 0.25×200-μm-gate GaAs MESFETs achieved 0.56-dB noise figure with 13.1-dB associated gain at 50% I_DSS and 0.6 dB noise figure with 16.5-dB associated gain at 100% I_DSS at a measured frequency of 10 GHz. The measured noise figure is comparable to the best noise performance of AlGaAs/GaAs HEMTs and AlGaAs/InGaAs/GaAs pseudomorphic HEMTs     

LP－MOCVD生长InGaAs／GaAs量子阱

用低压ＭＯＣＶＤ（ＬＰ－ＭＯＣＶＤ）生长三种不同的ＩｎＧａＡｓ／ＧａＡｓ应变层量子阱材料，其中两种含ＡｌＧａＡｓ限制层。结果表明，ＡｌＧａＡｓ限制层对量子阱的发光强度影响很大，与没有ＡｌＧａＡｓ限制层的结果相比，带ＡｌＧａＡｓ限制层的结构的发光强度要强一个数量级以上。在低温（１８Ｋ）ＰＬ光谱图中，我们看到，除了存在主峰以外，在主峰两侧还各有一个子峰，这些子峰可能与量子阱的质量有关。