一种高功率LED射灯的散热设计与实验研究

以一款MR16 LED射灯为模型,采用ANSYS有限元软件进行热分析。以散热器翅片保持60℃为标准,通过实验与仿真相结合的方法,分析了LED射灯的热流功率、散热器基座厚度、LED芯片间距、对流面积对整个系统散热性能的影响。结果表明,散热器对流面积是影响灯具散热性能的最重要因素;对一定的散热器,存在一个有效的最大芯片输入功率。现有MR16 LED射灯的散热器最大散热功率只能达到2.5 W左右,要使散热功率增大并且发挥散热器最佳性能,必须增加散热器的对流面积。对该结构散热器散热性能的定量研究对今后高功率LED灯具的生产具有一定的指导意义。     

High power LED package with vertical structure

A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.     

一种基于大功率LED照明灯的可见光通信系统

基于强度调制及直接检测(IM/DD)原理,利用18×1 W大功率白光LED照明灯,以开关键控和二进制非归零码(OOK-NRZ)调制方式实现了可见光通信(VLC)系统的室内单向下行通信.为优化LED光源的布局,对光链路视线(LOS)信道损耗进行了理论分析,对LED光源建模并进行光线追迹仿真.系统采用基于TCP/IP的VL...     

Design of White LED Energy-saving Street Lamp

An energy-saving light-emitting-diode（LED） street lamp was conducted, Based on the simulation by optical software TracePro, a physical street lamp system including 600 white LEDs was achieved. This system was operated under a constant current of 20 mA for each unit, and the electric power consumption of the whole lamp was only 42 W. Experimental results demonstrated that the total average illuminance reached 8.8 lx and the overall uniformity was 0. 370 for a 30-m-long and 10-m-wide test area at a height of 8 m, which is fully acceptable for the current standard for sub-main road.     

大功率LED照明灯有限元热设计与高效系统开发

随着LED亮度要求的不断提高,LED的温度分布和采用的散热手段对LED的可靠性有很大影响。利用ANSYS软件对LED照明的散热问题进行了详细的模拟计算。基于100 WLED实验和模拟结果的一致性,分析比较了不同结构和加载方式对200 WLED温度分布的影响。采用增加散热片个数及其长度、Al锭厚度、灯头的直径等因素,对LED的散热进行了优化设计,结合基于VC++的二次开发系统,较好实现了LED热模拟分析。研究发现LED照明灯的传热方向主要是轴向,轴向散热设计可提高LED开发效率;点阵排列LED灯的温度分布呈现一定的温度梯度;在基于实验验证的模拟可以较好实现不同功率的LED灯散热设计。模拟分析为LED的散热方案优化设计提供了有效的参考依据和手段。     

A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs

In this paper, a microjet-based cooling system is proposed for the thermal management of high-power light-emitting diodes (LEDs). Preliminary experimental investigation and numerical simulation on such an active cooling system are conducted. In the experiment investigation, thermocouples are packaged with LED chips to measure the temperature and evaluate the cooling performance of the proposed system. The experimental results demonstrate that the microjet-based cooling system works well. For a 2 times 2 LED chip array, when the input power is 5.6 W and the environment temperature is 28degC, without any active cooling techniques, the temperature of 2 times 2 LED chip array substrate reaches 72degC within 2 min and will continue to increase sharply. However, by using the proposed cooling system, when the flow rate of micropump is 9.7 mL/s, the maximum LED substrate temperature measured by the thermocouples will remain stable at about 36.7degC. As for the numerical optimization, the comparison between the simulation and experimental results is presented to confirm the feasibility of the simulation model. By using the simulation model, the effects of microjet diameter, top cavity height, micropump flow rate, and jet device material on system performance are numerically studied. According to the preliminary test and numerical optimization, an optimized microjet cooling system is fabricated and applied in thermal management of a 220-W LED lamp. The temperature test demonstrates that the cooling system has good performance.     

基于PL3536的18W LED驱动电源设计

LED光源是一种新型绿色光源,也是取代传统白炽灯和荧光灯的最佳选择。针对LED照明设计了一款高效简便的18 W LED驱动电路。与传统的LED恒流驱动相比,该电路在没有反馈光耦及次级控制电路的情况下就能实现精准的恒流控制,从而减少了电子元器件的数量和电路生产成本。主要内容包括主要元器件的选型、PCB绘制要点、最终的效果及分析。经测试,该设计输出电流值可达300 mA ±5％,效率可达82％左右。     

Thermal design for the high-power LED lamp

This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.     

Thermal design for the high-power LED lamp

This paper summarizes different kinds of heat sinks on the market for high power LED lamps.Analysis is made on the thermal model of LED,PCB and heat sink separately with a simplified mode provided.Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.     

Modelling LED lamps in SPICE with thermal phenomena taken into account

In this paper the improved version of the electrothermal model of LED lamps dedicated for SPICE software is proposed. The electrothermal models of components of such lamps: the LED module and the power supply are described. The elaborated model of the lamp makes it possible to calculate optical and electrical quantities characterising properties of the lamp and additionally, the internal temperatures of components of such lamps. The procedure of model parameters estimation is worked out, too. The correctness of the elaborated model was verified experimentally for the selected types of LED lamps. A good agreement between the results of calculations and measurements was obtained.     

多芯片集成大功率白光LED照明光源

通过对自行设计的集成功率型1W白光LED进行测试，发现当持续点亮900h时，其光通量衰减只有12％，比传统支架型封装的白光LED明显慢，而色温飘移也不明显。1W白光LED的色温可以覆盖2700～13000K，并且显色指数均可做到80以上，完全能够满足普通照明对光性能指标的要求。通过对多颗小功率芯片(60mW)进行不同的串并联组合，可以实现不同的额定电压与电流，可以更好地匹配驱动器的设计，提高整体发光效能，降低成本，并满足不同场合的需求。最后给出了3个典型LED驱动设计实例。     

100W风光互补LED路灯驱动电路设计

随着节能环保产品的推广,风光互补LED路灯以其独特的优势走入了人们的视野。风光互补系统和LED路灯的结合对LED驱动电路的设计产生了很大的挑战。目前采用单开关管DC/DC LED驱动控制器进行供电虽然能满足要求,但是功率不能达到很高,并且不能实现输出短路保护功能。为了输出短路保护功能并且达到较高的功率,设计了一种基于LT3791的4开关Buck-Boost DC/DC LED驱动控制器。此电路可由12/24 V蓄电池供电,输出功率可达100 W,恒流精度可达到±6%,效率可高达98.5%。输出能够达到70 V/2 A。该设计经测试能够达到设计要求,在实际生活中应用来满足夜晚照明需求。     

基于分布光度计测试实验的LED二次光学仿真

以LED为研究对象,利用TracePro光学仿真软件和LED分布光度计对其进行光学仿真和光学实验研究,并通过对比验证仿真结果的正确性和仿真方法的可行性。研究结果表明,实验结果和仿真结果吻合,将仿真方法用于LED的光学研究切实可行。利用TracePro对大功率LED的二次光学设计结构进行了仿真,仿真结果表明该LED的二次光学设计结构使LED的光学性能得到了极大的改善,配光效果更理想,光照均匀性更好。     

基于Fresnel透镜的激光车灯的设计与加工

激光车灯对比于LED车灯,具有能耗小、体积小、亮度高等优点,是汽车车灯发展的新方向。提出了一种激光车灯的完整的设计思路。光源采用激光二极管激发荧光片得到白光。通过搭建光学检测平台研究激光驱动白光光源的光学特性,通过机器视觉的方法研究荧光片前后光斑的形状和尺寸的变化,从而精确地建立光源的仿真模型,为后续的光学设计提供理论依据。通过非成像光学设计方法,设计了Fresnel透镜实现了对激光的整形,并利用超精密车削实现透镜的加工。完成了车灯的设计和组装,并通过光学仿真和光学实验验证了设计的正确性。     

LED信号灯二次光学设计

随着科学技术的发展,LED在很多领域中被应用得越来越广泛,如在信号灯中的应用,因此就需要对LED发出的光线进行二次光学设计。文中介绍了一种LED信号灯的二次光学设计思路和方法,通过对光通量的估算,设计出合理的LED分布、光学面罩和菲涅耳透镜。     

基于自重式热管的LED工矿灯散热研究

设计制作了一种带有自重式热管的散热器,并应用于100 W LED工矿灯。测试了LED工矿灯的光源模组引脚温度以及工作状态下散热器温度的分布。结果表明:自重式热管散热的光源引脚温度要比传统散热方式低4℃,光源表面温度要比传统散热方式的光源表面温度低约6℃;散热鳍片温度分布更为均匀,提高了鳍片散热的效率。     

集成式大功率LED散热的二次优化方法

研究了集成式大功率LED散热的二次优化设计方法。分析了集成式大功率LED的发热特性和LED路灯的散热要求,建立了散热分析模型。通过对散热器翅片的形状和布局的优化分析,得到一次优化结果。在此基础上,结合实际生产要求,提取凸台半径、凸台高度和拔模角度这三个参数进行了二次优化,得到了有效的优化组合。然后用优化分析结果来指导LED路灯和散热器的设计,并制作样品进行温度实验,结果表明散热器设计满足要求。     

大功率LED灯合成双射流主动散热费用模型研究

针对合成双射流激励器大功率LED灯主动散热方案,利用Ansys软件对LED灯模型在表面射流不同流速下的散热进行仿真,并结合试验结果验证,得到气体流速和pn结温度的散点图,利用Matlab进行Gauss曲线拟合,得到pn结温度与射流速度的关系;利用阿伦尼乌斯(Arrhenius)加速模型对pn结温度与LED灯寿命的关系进行预测,得到LED灯寿命与pn结温度的一般数学关系,进而得到LED灯寿命与合成双射流流速的数学关系,结合LED灯的经济性要求,建立了基于合成双射流的LED灯散热的费用模型;通过费用模型寻找最优解,可以确定LED灯单位时间最小费用及相应合成双射流最佳速度和LED灯寿命。     

基于双BP神经网络的室内可见光定位算法

为提高室内可见光定位的精度,提出了一种基于双反向传播(BP)神经网络的单发光二极管(LED)灯室内定位算法.首先在定位区域内使用BP神经网络确定待测目标粗略的位置范围,然后以该位置范围为限制条件,再次使用BP神经网络实现更精确的定位.室内定位系统采用单个LED灯作为发射器,3个水平光电探测器作为接收器接收光功率,避免了...     

Computer Modeling and Simulation Evaluation of High Power LED Sources for Secondary Optical Design

Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes（LEDs）. It contains geometrical structure and optical property of high power LED as well as LED dies definition with its spatial and angular distribution. Merits and non-merits of traditional modeling methods when applied to high power LEDs based on secondary optical design are discussed. Two commercial high power LEDs are simulated using the proposed computer modeling method. Correlation coefficient is proposed to compare and analyze the simulation results and manufacturing specifications. The source model is precisely demonstrated by obtaining above 99% in correlation coefficient with different surface incident angle intervals.