共查询到20条相似文献,搜索用时 421 毫秒
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采用无转子发泡流变仪系统研究了不同填胶量对顺丁橡胶(BR)/丁苯橡胶(SBR)/天然橡胶(NR)发泡体系的硫化及发泡特性的影响,并采用两步模压法制备了预交联度为30%不同填胶量的发泡材料,通过扫描电镜(SEM)观察并计算出填胶量对相结构(泡孔直径、泡孔壁厚度、单位体积内的泡孔数)的影响。结果表明,体积分数为70%~120%的填胶范围时可呈现典型的硫化历程;填胶体积分数为60%~80%时可清晰地呈现典型的发泡历程;填胶体积分数在70%~90%范围内,随着填胶量增加,泡孔直径显著减小,泡孔壁显著变薄,单位体积内的泡孔数显著增加;填料体积分数在100%~120%范围内对相结构的影响较小。 相似文献
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聚酯短纤维用量对工程胎胎面用天然橡胶性能的影响 总被引:1,自引:0,他引:1
采用预处理的聚酯短纤维(PESF)增强天然橡胶作为工程胎胎面胶,研究了PESF用量对胎面胶加工性能、硫化特性和物理机械性能的影响.结果表明,随着PESF用量的增加,胎面胶胶料的混炼难度增加,功率、能耗和排胶温度增加,分散度降低;PESF的加入可降低胎面胶胶料的硫化温度,提高硫化速率,克服工程胎难于硫化的缺点;加入适量的PESF能提高胎面胶胶料的物理机械性能,尤其是抗撕裂性能. 相似文献
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为理解和正确执行丁苯橡胶(SBR)1500系列硫化胶性能评价的国家标准及为修订标准做必要准备,在现有实验室条件下,做了4个方面的工作:一是混炼温度对硫化胶性能的影响。试验表明:混炼温度在50℃±5℃对硫化速度无明显影响,但随着混炼温度的升高,硫化25min的300%定伸应力有升高趋势;二是硫化室温对硫化胶性能的影响。试验表明,室温对硫化胶影响不明显,但恢复时间T_R的长短会直接影响硫化胶的物性,尤其对硫化25min的300%定伸应力的影响是敏锐的,应引起足够重视;三是硫化时间对硫化胶性能的影响。试验推断T_B的长短对硫化25min的300%定伸应力的影响是举足轻重的,硫化时间(35±2)min对硫化胶性能影响不大;四是硫化温度对硫化胶性能的影响。试验指出,在145℃±1℃下,硫化25min的300℃定伸应力相差3.3MPa,在145℃±0.5℃下,相差1.7MPa,由于差异会直接影响产品等级的判定,因此,国际标准规定硫化温度控制在145℃±0.5℃是十分必要的。 相似文献
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聚苯乙烯增强室温硫化硅橡胶的制备及表征 总被引:1,自引:0,他引:1
以过氧化苯甲酰为引发剂,使苯乙烯在α,ω-羟基聚(二甲基-甲基乙烯基)硅氧烷(PDM-MVS)中进行自由基聚合,制备了PDM-MVS/聚苯乙烯(PS)共混物。将该共混物在室温下进行硫化,获得了PS增强的室温硫化硅橡胶,并对硅橡胶的力学性能和微观形态进行了表征。结果表明,目标硅橡胶的拉伸强度和扯断伸长率均随PDM-MVS中乙烯基质量分数的增加而增大,当乙烯基质量分数为1.50%时,其拉伸强度达3.9 MPa,扯断伸长率达416%,PS的增强效果明显;目标硅橡胶具有微相分离结构,PS作为分散相均匀分布于PDM-MVS连续相中,两相的相容性随着PDM-MVS中乙烯基质量分数的增加而增强。 相似文献
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酸性气流脱除物是净化天然气、合成气、煤气时脱除的物质,STW-3#是由该物质制成的样品之一。就STW-3#对NR硫化性能的影响进行了研究。结果表明,STW-3#对NR有较好的硫化促进特性和一定的软化增塑作用;其用量3.0份以下时,硫化特性较差,3.0份以上时硫化特性较好,但超过4.0份时有粘辊和喷霜现象。它与促进剂M并用时,硫化特性与促进剂D相似。 相似文献
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Dynamic vulcanized thermoplastic polyurethane (TPU)/methyl vinyl silicone rubber (MVQ) thermoplastic vulcanizates (TPVs) were prepared in torque rheometer. The influence of the type and amount of peroxide crosslinking agent on the mechanical properties, thermal stability, micromorphology and melt flowability was systematically investigated. The results showed that the mechanical properties of the TPVs vulcanized by 2,5-dimethyl-2,5-di (tert-butyl peroxy) hexane (DBPH) first increased and then decreased with increasing the peroxide amount, while for dicumyl peroxide (DCP) vulcanizing system the mechanical properties slowly increased. Besides, the comprehensive mechanical properties vulcanized by DBPH were better than those of DCP group. The results of the thermogravimetric analysis showed that the TPVs vulcanized by DBPH had better heat stability, corresponding to the excellent thermo-oxidative aging performance and the 38% increase in tensile strength after aging. In addition, the MVQ rubber particles showed better dispersing performance for DBPH vulcanizing system. The melt flow rate of the TPVs showed a linear relationship with increasing DBPH dosage and became worse after the amount of crosslinking agent exceeded 1.5 phr. By comprehensive comparison, the TPVs have better performance when use peroxide DBPH as the crosslinking agent and the dosage is 1.5 phr. 相似文献
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The effect of the cure temperature of rubber compound on the adhesion with brass-plated steel cord was investigated in conjunction with the formation, growth and degradation of the adhesion interphase formed between the rubber compound and brass-plated steel cord. With increasing cure temperature from 130°C to 190°C, the pull-out force after cure decreased linearly. This decrease in adhesion force at higher temperature may be explained by the limitation of the mass transfer of vulcanizing agents into the adhesion interphase and/or rubber compound near the adhesion interphase, resulting in a deficiency of sulfur due to the fast cure of the rubber compound which significantly retards the diffusion of vulcanizing chemicals. Also, at a high temperature, an adhesion interphase with a ZnS-rich layer, which may act as a barrier to copper diffusion for the formation of the adhesion interphase of copper sulfide, was formed. After thermal aging of the adhesion samples, the pull-out force decreased in comparison with that of the unaged. The decrease of pull-out force after thermal aging stemmed mainly from the decline of the tensile properties after thermal aging. The adhesion property after humidity aging was completely different from that after thermal aging. With increase in the cure temperature to 160°C, the pull-out force increased. But further increase in the cure temperature caused a decline in pull-out force. This phenomenon can be explained by the degradation of the adhesion interphase. At lower cure temperatures, a severe growth of copper sulfide and a large extent of dezincification were observed in the adhesion interphase. At higher cure temperatures, a significant growth of copper sulfide in the adhesion interphase appeared. The proper formation of the adhesion interphase and good physical properties of the rubber compound at a moderate cure temperature can result in high retention of adhesion properties. 相似文献
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The effect of the cure temperature of rubber compound on the adhesion with brass-plated steel cord was investigated in conjunction with the formation, growth and degradation of the adhesion interphase formed between the rubber compound and brass-plated steel cord. With increasing cure temperature from 130°C to 190°C, the pull-out force after cure decreased linearly. This decrease in adhesion force at higher temperature may be explained by the limitation of the mass transfer of vulcanizing agents into the adhesion interphase and/or rubber compound near the adhesion interphase, resulting in a deficiency of sulfur due to the fast cure of the rubber compound which significantly retards the diffusion of vulcanizing chemicals. Also, at a high temperature, an adhesion interphase with a ZnS-rich layer, which may act as a barrier to copper diffusion for the formation of the adhesion interphase of copper sulfide, was formed. After thermal aging of the adhesion samples, the pull-out force decreased in comparison with that of the unaged. The decrease of pull-out force after thermal aging stemmed mainly from the decline of the tensile properties after thermal aging. The adhesion property after humidity aging was completely different from that after thermal aging. With increase in the cure temperature to 160°C, the pull-out force increased. But further increase in the cure temperature caused a decline in pull-out force. This phenomenon can be explained by the degradation of the adhesion interphase. At lower cure temperatures, a severe growth of copper sulfide and a large extent of dezincification were observed in the adhesion interphase. At higher cure temperatures, a significant growth of copper sulfide in the adhesion interphase appeared. The proper formation of the adhesion interphase and good physical properties of the rubber compound at a moderate cure temperature can result in high retention of adhesion properties. 相似文献