UHV/CVD法生长硅基低位错密度厚锗外延层

采用超高真空化学气相淀积系统,以高纯Si2 H6和GeH4作为生长气源,用低温缓冲层技术在Si(001)衬底上成功生长出厚的纯Ge外延层.对Si衬底上外延的纯Ge层用反射式高能电子衍射仪、原子力显微镜、X射线双晶衍射曲线和Ra-man谱进行了表征.结果表明在Si基上生长的约550nm厚的Ge外延层,表面粗糙度小于1nm,XRD双晶衍射曲线和Ra-man谱Ge-Ge模半高宽分别为530'和5.5cm-1,具有良好的结晶质量.位错腐蚀结果显示线位错密度小于5×105cm-2可用于制备Si基长波长集成光电探测器和Si基高速电子器件.     

Defect Characterization in Ge/(001)Si Epitaxial Films Grown by Reduced-Pressure Chemical Vapor Deposition

We studied the microstructural characteristics and electrical properties of epitaxial Ge films grown on Si(001) substrates by x-ray diffraction, atomic force microscopy, and transmission electron microscopy. The films were grown using a two-step technique by reduced-pressure chemical vapor deposition, where the first step promotes two-dimensional growth at a lower substrate temperature. We observed a decrease in defect density with increasing film thickness. Ge films with thickness of 3.5 μm exhibited threading dislocation densities of 5 × 10⁶ cm^?2, which yielded devices with dark current density of 5 mA cm^?2 (1 V reverse bias). We also noted the presence of stacking faults in the form of lines in the films and establish that this is an important defect for Ge films grown by this deposition technique.     

Comparative Studies of the Growth and Characterization of Germanium Epitaxial Film on Silicon (001) with 0° and 6° Offcut

The quality of germanium (Ge) epitaxial films grown directly on silicon (Si) (001) with 0° and 6° offcut orientation using a reduced-pressure chemical vapor deposition system is studied and compared. Ge film grown on Si (001) with 6° offcut presents ～65% higher threading dislocation density and higher root-mean-square (RMS) surface roughness (1.92 nm versus 0.98 nm) than Ge film grown on Si (001) with 0° offcut. Plan-view transmission electron microscopy also reveals that threading dislocations are more severe (in terms of contrast and density) for the 6° offcut. In addition, both high-resolution x-ray diffraction and Raman spectroscopy analyses show that the Ge epilayer on 6° offcut wafer presents higher tensile strain. The poorer quality of the Ge film on Si (001) with 6° offcut is a result of an imbalance in Burgers vectors that favors dislocation nucleation over annihilation.     

Research progress of Si-based germanium materials and devices

Si-based germanium is considered to be a promising platform for the integration of electronic and photonic devices due to its high carrier mobility, good optical properties, and compatibility with Si CMOS technology. However, some great challenges have to be confronted, such as: (1) the nature of indirect band gap of Ge; (2) the epitaxy of dislocation-free Ge layers on Si substrate; and (3) the immature technology for Ge devices. The aim of this paper is to give a review of the recent progress made in the field of epitaxy and optical properties of Ge heterostructures on Si substrate, as well as some key technologies on Ge devices. High crystal quality Ge epilayers, as well as Ge/SiGe multiple quantum wells with high Ge content, were successfully grown on Si substrate with a low-temperature Ge buffer layer. A local Ge condensation technique was proposed to prepare germanium-on-insulator (GOI) materials with high tensile strain for enhanced Ge direct band photoluminescence. The advances in formation of Ge n⁺p shallow junctions and the modulation of Schottky barrier height of metal/Ge contacts were a significant progress in Ge technology. Finally, the progress of Si-based Ge light emitters, photodetectors, and MOSFETs was briefly introduced. These results show that Si-based Ge heterostructure materials are promising for use in the next-generation of integrated circuits and optoelectronic circuits.     

Technology of the production of laser diodes based on GaAs/InGaAs/AlGaAs structures grown on a Ge/Si substrate

InGaAs/GaAs/AlGaAs laser diodes with quantum wells are grown by the metal-organic chemical vapor deposition (MOCVD) method on an exact Si (001) substrate with a Ge buffer layer. The diodes generate stimulated emission in the pulsed mode at room temperature in the spectral range from 1.09 to 1.11 μm.     

Structural characterization of thick, high-quality epitaxial Ge on Si substrates grown by low-energy plasma-enhanced chemical vapor deposition

In this paper, we report on the growth of epitaxial Ge on a Si substrate by means of low-energy plasma-enhanced chemical vapor deposition (LEPECVD). A Si_1?xGe_x graded buffer layer is used between the silicon substrate and the epitaxial Ge layer to reduce the threading dislocation density resulting from the lattice mismatch between Si and Ge. An advantage of the LEPECVD technique is the high growth rate achievable (on the order of 40 Å/sec), allowing thick SiGe graded buffer layers to be grown faster than by other epitaxial techniques and thereby increasing throughput in order to make such structures more manufacturable. We have achieved relaxed Ge on a silicon substrate with a threading dislocation density of 1 × 10⁵ cm^?2, which is 4?10x lower than previously reported results.     

Growth of a Ge layer on 8 in. Si (100) substrates by rapid thermal chemical vapor deposition

We have made the successful growth of Ge layer on 8 in. Si (100) substrates by rapid thermal chemical vapor deposition (RTCVD). In order to overcome the large lattice mismatch between Ge and Si, we used a two-step growth method. Our method shows the uniformity of the thickness and good quality Ge layer with a homogeneous distribution of tensile strain and a lower etch pit density (EPD) in order of 10⁵ cm⁻². The surface morphology is very smooth and the root mean square (RMS) of the surface roughness was 0.27 nm. The photocurrent spectra were dominated by the Ge layer related transition that corresponding to the transitions of the Si and Ge. The roll-off in photocurrent spectra beyond 1600 nm is expected due to the decreased absorption of Ge.     

Low threading dislocation density Ge deposited on Si (1 0 0) using RPCVD

Epitaxial Ge layer growth of low threading dislocation density (TDD) and low surface roughness on Si (1 0 0) surface is investigated using a single wafer reduced pressure chemical vapor deposition (RPCVD) system. Thin seed Ge layer is deposited at 300 °C at first to form two-dimensional Ge surface followed by thick Ge growth at 550 °C. Root mean square of roughness (RMS) of ∼0.45 nm is achieved. As-deposited Ge layers show high TDD of e.g. ∼4 × 10⁸ cm⁻² for a 4.7 μm thick Ge layer thickness. The TDD is decreasing with increasing Ge thickness. By applying a postannealing process at 800 °C, the TDD is decreased by one order of magnitude. By introducing several cycle of annealing during the Ge growth interrupting the Ge deposition, TDD as low as ∼7 × 10⁵ cm⁻² is achieved for 4.7 μm Ge thick layer. Surface roughness of the Ge sample with the cyclic annealing process is in the same level as without annealing process (RMS of ∼0.44 nm). The Ge layers are tensile strained as a result of a higher thermal expansion coefficient of Ge compared to Si in the cooling process down to room temperature. Enhanced Si diffusion was observed for annealed Ge samples. Direct band-to-band luminescence of the Ge layer grown on Si is demonstrated.     

超高真空化学气相生长用于应变硅的高质量SiGe缓冲层

采用UHV/CVD技术,以多层SiGe/Si结构作为缓冲层来生长应变弛豫SiGe虚衬底,并在此基础上生长出了具有张应力的Si层.利用高分辨X射线、二次离子质谱仪和原子力显微镜分别对薄膜的晶体质量、厚度以及平整度进行了分析.结果表明,通过这种方法制备的SiGe虚衬底,不仅可以有效提高外延层中Ge含量,以达到器件设计需要,而且保证很好的晶体质量和平整的表面.Schimmel液腐蚀后观察到的位错密度只有1×106cm-2.     

Interaction of self-assembled Ge islands and adjacent Si layers grown on unpatterned and patterned Si(001) substrates

For use in electronic devices, self-assembled Ge islands formed on Si(001) must be covered with an additional Si layer. Chemically vapor deposited Si layers initially grow very rapidly over Ge islands because of the catalytic effect of Ge on the reaction of the Si-containing gas. The edges of the Si features covering Ge “pyramids” are rotated by 45° with respect to the edges of the Ge pyramids because of the different mechanisms orienting the Ge islands and the Si features. When multiple layers of islands are formed, the in-plane ordering of the Ge islands depends on the thickness of the Si interlayer separating the island layers. When selective Si is grown on a patterned Si wafer to form the underlying structure for the Ge islands, the position of the islands is influenced by the detailed shape of the Si near the edges, which in turn depends on the thickness of the selectively deposited Si, the pattern size, and the amount of surrounding oxide.     

Si基外延Ge薄膜及退火对其特性的影响研究

采用超高真空化学气相沉积(UHV-CVD)系统,用低温Ge缓冲层技术在Si衬底上外延了张应变Ge薄膜.扫描电镜(TEM)图表明Si基外延Ge薄膜拥有低的位错密度,原子力显微镜(AFM)测试Ge层表面粗糙度仅为1.2 nm.对Si基外延Ge薄膜进行了不同温度下的退火,并用双晶X射线衍射(DCXRD)曲线和Raman谱进行...     

Resonant cavity enhanced photoluminescence of tensile strained Ge/SiGe quantum wells on silicon-on-insulator substrate

The tensile strained Ge/SiGe multiple quantum wells （MQWs） grown on a silicon-on-insulator （SOI） substrate were fabricated successfully by ultra-high chemical vapor deposition. Room temperature direct band photoluminescence from Ge quantum wells on SOI substrate is strongly modulated by Fabry-Perot cavity formed between the surface of Ge and the interface of buried SiO2. The photoluminescence peak intensity at 1.58 μm is enhanced by about 21 times compared with that from the Ge/SiGe quantum wells on Si substrate, and the full width at half maximum （FWHM） is significantly reduced. It is suggested that tensile strained Ge/SiGe multiple quantum wells are one of the promising materials for Si-based microcavity lijzht emitting devices.     

采用SiGe虚拟衬底高迁移率应变硅材料的制备和表征

研究了生长在弛豫Si0.79Ge0.21/梯度Si1-xGex/Si虚拟衬底上的应变硅材料的制备和表征,这一结构是由减压外延气相沉积系统制作的.根据双晶X射线衍射计算出固定组分SiGe层的Ge浓度和梯度组分SiGe层的梯度,并由二次离子质谱仪测量验证.由原子力显微术和喇曼光谱测试结果得到应变硅帽层的表面粗糙度均方根和应变度分别为2.36nm和0.83%;穿透位错密度约为4×104cm-2.此外,发现即使经受了高热开销过程,应变硅层的应变仍保持不变.分别在应变硅和无应变的体硅沟道上制作了nMOSFET器件,并对它们进行了测量.相对于同一流程的体硅MOSFET,室温下观测到应变硅器件中电子的低场迁移率显著增强,约为85%.     

The influence of As and Ga prelayers on the metal-organic chemical vapor deposition of GaAs/Ge

GaAs epilayers were grown on Ge by metal-organic chemical vapor deposition (MOCVD) with As or Ga prelayers. The grown epilayers were examined for surface morphology, antiphase domain (APD) presence, and optical quality using optical interference contrast microscopy, molten potassium hydroxide (KOH) etching, and photoluminescence (PL) spectroscopy. The As prelayer results in smooth, shiny, and APD-free epilayers with good optical quality. In contrast, the Ga prelayer results in a rough surface with APDs and higher carbon incorporation.     

SiGe MOSFET structures on silicon-on-sapphire substrates grown by ultra-high vacuum chemical vapor deposition

SiGe heterostructures on silicon-on-sapphire (SOS) substrates were investigated to determine the advantages of combining these two technologies. Devicequality epitaxial layer structures were grown by ultra-high vacuum chemical vapor deposition (UHV/CVD) on silicon-on-sapphire substrates having a very low density of microtwin defects. Enhancements in device performance comparable to similar SiGe devices on bulk Si substrates were achieved, even though significant interdiffusion of Si and Ge had occurred during device fabrication processes at T>850°C. These results emphasize the need for low temperature fabrication processes to fully exploit SiGe heterostructures for device applications.     

Deposition,post-deposition annealing,and characterization of epitaxial Ge films grown on Si(100) by pyrolysis of GeH4

As a first step towards developing heterostructures such as GaAs/Ge/Si entirely by chemical vapor deposition, Ge films have been deposited on (100) Si by the pyrolysis of GeH₄. The best films are grown at 700° C and are planar and specular, with RBS minimum channeling yields of ≈4.0% (near the theoretical value) and defect densities of 1.3 x 10⁸ cm⁻². Variations of in-situ cleaning conditions, which affect the nature of the Si substrate surface, greatly affect the ability to get good epitaxial growth at 700° C. The majority of the defects found in the Ge films are extrinsic stacking faults, formed by dissociation of misfit and thermal expansion accommodation dislocations. The stacking fault density is not significantly reduced by post-deposition annealing, as is the case for the dislocations observed in MBE Ge films. It is suggested that lowering the CVD growth temperature through the use of high vacuum deposition equipment would result in dislocation defects like those of MBE films which could then be annealed more effectively than stacking faults. Films with defect densities equivalent to MBE Ge films (~2 x 10⁷ cm⁻²) could then probably be produced.     

Dislocation-free undoped semi-insulating GaAs epilayers prepared by chloride chemical vapor deposition and successive wafer annealing

Dislocation-free (DF) undoped semi-insulating GaAs epilayers have been realized by chloride chemical vapor deposition and successive wafer annealing. It was found that undoped conductive DF GaAs epilayers grown on Si-doped n-type DF GaAs substrates can be converted to semi-insulating by wafer annealing at temperatures higher than 950°C. The resistivity of these semi-insulating epilayers was higher than 10⁷ Ωcm. The outdiffusion of Si from the substrate to the epilayer was analyzed by secondary ion mass spectrometry and it was found that the thickness of the outdiffusion region was only 1μm.     

采用SiGe虚拟衬底高迁移率应变硅材料的制备和表征

研究了生长在弛豫Si0.79Ge0.21/梯度Si1-xGex/Si虚拟衬底上的应变硅材料的制备和表征,这一结构是由减压外延气相沉积系统制作的.根据双晶X射线衍射计算出固定组分SiGe层的Ge浓度和梯度组分SiGe层的梯度,并由二次离子质谱仪测量验证.由原子力显微术和喇曼光谱测试结果得到应变硅帽层的表面粗糙度均方根和应变度分别为2.36nm和0.83%;穿透位错密度约为4×104cm-2.此外,发现即使经受了高热开销过程,应变硅层的应变仍保持不变.分别在应变硅和无应变的体硅沟道上制作了nMOSFET器件,并对它们进行了测量.相对于同一流程的体硅MOSFET,室温下观测到应变硅器件中电子的低场迁移率显著增强,约为85%.     

Transition from the two- to three-dimensional growth of Ge films upon deposition onto relaxed SiGe/Si(001) buffer layers

The critical thickness of the two-dimensional growth of Ge on relaxed SiGe/Si(001) buffer layers different in Ge content is studied in relation to the parameters of the layers. It is shown that the critical thickness of the two-dimensional growth of Ge on SiGe buffer layers depends on the lattice mismatch between the film and the substrate and, in addition, is heavily influenced by Ge segregation during SiGe-layer growth and by variations in the growth-surface roughness upon the deposition of strained (stretched) Si layers. It is found that the critical thickness of the two-dimensional growth of Ge directly onto SiGe buffer layers with a Ge content of x = 11–36% is smaller than that in the case of deposition onto a Si (001) substrate. The experimentally detected increase in the critical thickness of the two-dimensional growth of Ge with increasing thickness of the strained (stretched) Si layer predeposited onto the buffer layer is attributed to a decrease in the growth-surface roughness and in the amount of Ge located on the surface as a result of segregation.     

Characterization of reduced pressure chemical vapor deposited Si0.8Ge0.2/Si multi-layers

We have investigated the Si_0.8Ge_0.2/Si multi-layer grown directly onto the Si (001) substrates using reduced pressure chemical vapor deposition. The thicknesses of the Si_0.8Ge_0.2/Si multi-layer were determined using transmission electron microscopy. From the results of energy-dispersive X-ray spectroscopy and X-ray diffraction analyses on the Si_0.8Ge_0.2/Si multi-layer, Ge composition in the Si_1?xGe_x layers was determined as ～20% and the value of residual strain ε of the Si_0.8Ge_0.2 layer is calculated to be 0.012. Three peaks are observed in Raman spectrum, which are located at approximately 514, 404, and 303 cm^?1, corresponding to the vibration of Si–Si, Si–Ge, and Ge–Ge phonons, respectively. The photoluminescence spectrum originates from the radiative recombinations both from the Si substrate and the Si_0.8Ge_0.2/Si multi-layer. For the Si_0.8Ge_0.2/Si multi-layer, the transition peaks related to the quantum well region observed in the photocurrent spectrum were preliminarily assigned to e–hh and e–lh fundamental excitonic transitions.