退火处理对Y2O3薄膜结构和光学性能的影响

采用射频磁控溅射法以Y2O3陶瓷为靶材在单晶si(Ⅲ)和石英表面制备了Y2O3薄膜.利用X射线衍射(XRD)仪、扫描电子显微镜(SEM)、紫外-可见(UV-VIS)光谱仪和傅立叶变换红外(FTIR)光谱仪对真空退火前后Y2O3薄膜的结构和光学性质进行了分析研究.结构研究表明,在200℃条件下制备的Y2O3薄膜为非晶态,经600℃退火后出现单斜相,经800℃退火后薄膜完全转化为立方多晶,同时得到了不同晶面的晶粒尺寸;沉积态的Y2O3薄膜由球状颗粒排列组成,经800℃真空退火后薄膜为柱状晶.光学性质研究发现,真空退火后Y2O3薄膜的红外透过率显著下降;使用Tauc作图法得到不同结晶条件下的光学带隙,发现薄膜的光学带隙与结晶条件有关,并且退火后薄膜的光学带隙明显减小.     

正交相Y2Mo3O12薄膜的制备及光吸收性能研究

采用磁控溅射法在Si(100)和石英衬底上沉积Y2Mo3O12,并经退火处理获得正交相Y2Mo3O12薄膜.采用扫描电镜、X射线衍射仪、变温拉曼光谱仪和紫外-可见光谱计研究了薄膜的表面形貌、结晶特性、吸湿性和光吸收性能.结果表明,磁控溅射沉积Y2Mo3O12薄膜为非晶态,退火后结晶为正交相结构.正交相Y2Mo3O12薄膜表面平整、晶粒细小,具有可逆的脱水吸水性能,其光学带隙宽度为4.58eV,对近紫外光(波长286～270nm)具有很好的吸收性能,可应用于日盲探测器中.     

退火对Y2O3薄膜结构和电学性能的影响

采用射频磁控反应溅射法,成功地在n-Si衬底上制备了高k栅介质Y2O3薄膜.对薄膜在不同温度退火后的结构、成分和电学性能进行了分析研究.结果表明,沉积态薄膜为非晶态,退火后薄膜开始晶化;沉积态薄膜中Y和O元素的原子浓度比基本符合化学计量比;薄膜具有较低的漏电流,退火后薄膜的漏电流降低.高频C-V曲线表明,退火后由于界面层的生长导致积聚电容减小.     

N掺杂Cu2O薄膜的低温沉积及快速热退火研究

采用氧化亚铜(Cu_2O)陶瓷靶,利用射频磁控溅射沉积法在氮气和氩气的混合气氛下制备了N掺杂Cu_2O(Cu_2O∶N)薄膜,并在N_2气氛下对薄膜进行了快速热退火处理,研究了N_2流量和退火温度对Cu_2O∶N薄膜的生长行为、物相结构、表面形貌及光电性能的影响。结果显示,在衬底温度300℃、N_2流量12sccm条件下生长的薄膜为纯相Cu_2O薄膜;在N_2气氛下对预沉积薄膜进行快速热退火处理不影响薄膜的物相结构,薄膜的结晶质量随退火温度(450℃)的升高而显著改善;快速热退火处理能改善薄膜的结晶质量和缺陷,降低光生载流子的散射,增强载流子的传输,预沉积Cu_2O∶N薄膜经400℃退火处理后展示出较好的电性能,薄膜的霍尔迁移率(μ)为27.8cm~2·V~(-1)·s~(-1)、电阻率(ρ)为2.47×10~3Ω·cm。研究表明低温溅射沉积和快速热退火处理能有效改善Cu_2O∶N薄膜的光电性能。     

O_2/Ar比例对直流脉冲磁控溅射制备TiO_2薄膜光催化性能的影响

利用直流脉冲磁控溅射方法在不同O2/Ar比例条件下制备具有不同结构、性能的TiO2薄膜,利用台阶仪、X射线衍射仪及紫外-可见分光光度计等仪器,对薄膜的结构、透光性能、光催化性能等进行表征。研究结果表明:TiO2薄膜的结构、光催化性能等强烈依赖于沉积过程中的O2/Ar比例。在低O2/Ar比例条件下制备的TiO2薄膜,薄膜处于O控制生长阶段,相应薄膜处于高速生长状态,薄膜经退火处理后形成锐钛矿(101)相择优取向结构,同时薄膜对甲基橙溶液降解率较低。随着O2/Ar比例的增加,薄膜生长速率逐渐降低,薄膜逐渐呈现多相混合生长,经退火处理后薄膜呈现锐钛矿(101)相与(004)相的混合相结构,相应薄膜对甲基橙溶液降解率增加,在O2/Ar比为6/14时,其对甲基橙溶液降解率达到最大值,为86.45%。继续增加O2/Ar比例,在高O2/Ar比例条件下,薄膜沉积速率较低,沉积离子有充足的驰豫时间释放自身能量以寻找低能位置,因此在薄膜沉积过程中主要形成能量最低的锐钛矿(101)相结构,经退火处理后薄膜呈现锐钛矿(101)相择优取向结构,在O2/Ar比为20/0时,薄膜对甲基橙溶液降解率下降至52.15%。     

原子层沉积Al2O3薄膜钝化n型单晶硅表面的研究

以三甲基铝(TMA)和水为反应源,采用原子层沉积(ALD)技术在n型单晶硅表面沉积15nm、30nm和100nm的Al2O3薄膜,并对样品进行快速退火(RTA)处理。采用少子寿命测试仪测试样品的有效少子寿命,获得了表面复合速率(SRV),通过X射线光电子能谱(XPS)分析了薄膜的化学成分,在此基础上研究了薄膜厚度及退火条件对钝化效果的影响,并分析了钝化机理。结果表明:ALD技术制备的Al2O3薄膜经退火后可使n型单晶硅SRV值降低到7cm/s,表面钝化效果显著。     

Zn0.9Mg0.1O:Ga宽带隙导电膜的 PLD制备及性能研究

利用脉冲激光沉积法(PLD)制备了Ga掺杂的Zn0.9Mg0.1O(ZMOGa)宽带隙透明导电薄膜.采用各种分析手段研究了沉积温度和真空退火处理对薄膜结构、表面形貌及光电性能的影响.结果表明,制备的薄膜具有ZnO(002)择优取向;200℃下沉积的薄膜通过3×10-3Pa的真空400℃退火2h后,其电阻率由8.12×10-4Ω·cm减小到4.74×10-4Ω·cm,禁带宽度则由原来的3.83eV增加到3.90eV.退火处理增强了薄膜的择优取向和结晶度、增加了禁带宽度、提高了载流子浓度并使其透射谱线的光学吸收边发生蓝移现象.     

溶胶-凝胶法制备0.1BiFeO3-0.9SrBi2Nb2O9铁电薄膜的结构和光学性质研究

采用硝酸铋[Bi(NO3)3·5H2O]、硝酸锶[Sr(NO3)2]、硝酸铁[Fe(NO3)3·9H2O]和乙醇铌[Nb(OC2H5)5]作为起始原料,乙二醇甲醚[C3H8O2]作为溶剂配制掺Fe的SrBi2Nb2O9前驱体溶液,利用溶胶-凝胶法在石英衬底上制备出0.1BiFeO3-0.9SrBi2Nb2O9铁电薄膜.研究了该薄膜的表面形貌、组分、晶体结构和光学性质.结果表明,经400℃退火后薄膜为非晶结构,而在空气中经600℃退火1h后,沉积的薄膜晶化成钙钛矿结构.制备的薄膜表面平整,颗粒分布均匀,表现出良好的光透过性,该薄膜的光学能隙大约为2.5eV.     

脉冲激光蒸发熔融织构靶制备的YBa2Cu3O7-δ超导薄膜

用脉冲激光蒸发熔融织构靶材在SrTiO3(001)单晶基片上制备了YBa2Cu3O7-δ超导薄膜。用X射线衍射仪、透射电镜和原子力显微镜分别对薄膜的微观结构和表面形貌进行了分析。结果表明，薄膜呈c轴取向，薄膜中有一定数量的颗粒状Y2O3杂相，且具有择优取向，而靶材中所含的Y2BaCuO8相却没有在薄膜中形成。沉积温度升高，有利于[001]取向，但不利于[111]取向的Y2O3形成。与传统的粉末烧结靶相比，用熔融织构靶制备YBa2Cu3O7-δ薄膜可以明显抑制薄膜表面颗粒的形成。     

ZrO_2-12wt% Y_2O_3沉积薄膜退火后处理前后的相结构研究

在不同温度衬底上射频磁控溅射沉积ZrO2－12wt％Y2O3薄膜进行了不同方式的退火后处理。其一为1000℃大气气氛下的热退火处理，其二为高真空渗氧条件下的电子束退火处理。退火前后的相结构和显微形貌的研究表明，退火前的沉积膜相组成与沉积过程中衬底温度有关，退火后的沉积膜相组成与退火方式有关，其形貌特征经不同形式退火显示出明显的差别。     

Y_2O_3-SnO_2常温气敏薄膜的Sol-Gel制备及性能研究

以无机盐ＳｎＣｌ２·２Ｈ２Ｏ,Ｙ（ＮＯ３）３·６Ｈ２Ｏ为原料,无水乙醇为溶剂,采用溶胶－凝胶工艺制备了Ｙ２Ｏ３掺杂的ＳｎＯ２薄膜．采用差热－失重分析研究了Ｙ２Ｏ３掺杂的ＳｎＯ２干凝胶粉末的热分解、晶化过程．研究了Ｙ２Ｏ３－ＳｎＯ２薄膜的电学和气敏性能．从实验中得到了Ｙ２Ｏ３掺杂份量对ＳｎＯ２薄膜电学及气敏性能的影响．实验表明Ｙ２Ｏ３掺杂的ＳｎＯ２薄膜在常温下对ＮＯｘ具有较好的灵敏度和选择性,并具有较好的响应恢复性能;在常温下对Ｈ２Ｓ气体也具有一定的灵敏度．     

Comparative Study of LiMn2O4 Thin Films Heat-treated by Conventional and Rapid Thermal Annealing

Cathode material LiMn2O4 thin films were prepared by solution deposition followed by conventional thermal annealing (CTA) and rapid thermal annealing (RTA) using lithium acetate and manganese acetate as starting materials. The phase and surface morphology identification was done by X-ray diffraction and scanning electron microscopy. The electrochemical properties of the thin films were carried out by cyclic voltammetry, charge-discharge experiments, electrochemical impedance spectroscopy and potential step technique. The results show that both thin films are homogeneous and crack-free. Compared with the CTA derived thin films, the RTA derived ones with smaller grain size are more smooth and dense. The CTA and RTA derived LiMn2O4 thin films deliver the capacity of 34.5 μAh/(cm2 ·μm) and 38 μAh/(cm2 ·μm) and show the capacity loss of 0.050% and 0.037% per cycle after being cycled 100 times, respectively. The diffusion coefficient of lithium ion in the CTA derived LiMn2O4 thin-film electrode is 4.59×10-11 cm2/s, and that of lithium ion in the RTA derived one is 3.86×10-11 cm2/s.     

Crystallization and electrical characteristics of 0.95 (Na0.5Bi0.5)TiO3-0.05 BaTiO3 thin films under different annealing temperature and atmosphere

0.95 (Na0.5Bi0.5)TiO3-0.05 BaTiO3 +1 wt% Bi2O3 (NBT-BT3) ceramic is used as target to deposit the NBT-BT3 thin films. The excess 1wt% Bi2O3 is used to compensate the vaporization of Bi2O3 during the sintering and annealing processes. NBT-BT3 thin films are successfully deposited using radio frequency (RF) magnetron sputter method and crystallized subsequently using a conventional furnace annealing (CFA) process. The annealed process is conducted in air and in oxygen atmosphere at temperatures ranging from 600-800 degrees C for 60 min. As compared with the as-deposited NBT-BT3 thin films, the CFA-treated process has improved the grain growth and crystallization. We will show that the annealing atmosphere is the more important parameter to influence the grain growth and crystallization of NBT-BT3 thin films than the annealing temperature. The influences of CFA-treated temperature and atmosphere on the electrical characteristics of NBT-BT3 thin films, including the polarization characteristics (Pr, Ps, and Ec values), the capacitance-voltage (C-V) curves, and the leakage current density-electric field (J-E) curves, are also investigated in this study.     

Sequential electron beam evaporation of YBCO thin films through the barium fluoride route

Superconducting YBCO thin films have been fabricated by sequential electron beam evaporation of metallic constituents for yttrium and copper while barium is replaced with BaF2. The conversion of BaF2 BaO has been attained through wet oxygen annealing. Correlations of stoichiometry with microstructural, as well as superconducting, properties of the films have been examined. Results are given for YBa2Cu3O7– thin films on SrTiO3 (1 0 0) and YSZ (1 0 0) single crystal substrates. The usefulness of the BaF2 preparation route for the fabrication of mixed phase (Y123 + Y124) and pure Y124 is also demonstrated. Microstructural properties of Y123 thin films indicate different growth processes for the two substrates.     

自组装单层膜表面的Bi2Ti2O7薄膜制备与表征

以硝酸铋和钛酸四丁酯为原料,以三氯十八烷基硅烷(OTS)为模板,采用自组装单层膜(self-as-sembled monolayers,SAMs)技术,在玻璃基板上成功制备了Bi2Ti2O7晶态薄膜。借助X射线衍射(XRD)、场发射扫描电子显微镜(FE-SEM)、X射线能谱(EDS)及原子力显微镜(AFM)等测试手段对Bi2Ti2O7薄膜进行了表征。结果表明,以OTS为模板利用自组装技术,经540℃煅烧2h可成功制得立方相Bi2Ti2O7晶态薄膜,且薄膜表面平整光滑,均匀致密。     

Opto-electronic properties of sputter-deposited Cu2O films treated with rapid thermal annealing

Cu₂O thin films were first deposited using magnetron sputtering at 200 °C. The samples produced were then annealed by a rapid thermal annealing (RTA) system at 550 °C in a protective atmosphere with or without the addition of oxygen. After annealing, various Cu₂O and CuO films were formed. These films were characterized, as a function of oxygen concentration in RTA, using UV-VIS photometer, four-point probe, and Hall measurement system. The results show that these Cu₂O thin films annealed at 550 °C with more than 1.2% oxygen added in the protective argon atmosphere would transform into the CuO phase. Apparently, the results of RTA are sensitive to the amount of oxygen added in the protective atmosphere. The resistivity of these Cu₂O thin films decreases with the increase in the oxygen amount in the annealing atmosphere, most likely due to the increase in carrier mobility. In addition, Cu₂O/ZnO (doped with AlSc) junctions were produced at 200 °C and annealed. The rectifying effect of P-N junction disappeared after annealing, probably due to the damage of p-n interface, which directly causes current leakage at the junction.     

Temperature dependence of oriented growth of Pb[Yb(1/2)Nb(1/2)]O(3)-PbTiO(3) thin films deposited on LNO/Si substrates

(1-x)Pb[Yb(1/2)Nb(1/2)]O(3)-xPbTiO(3) (PYbN-PT, x=0.5)(001) oriented thin films were deposited onto LaNiO3 (LNO)/Si(001) substrates by sol-gel processing. The crystallographic texture of the films was controlled by the annealing temperature and heating rate. Highly (001) oriented LNO thin films were prepared by a simple metal organic decomposition technique, and the samples were annealed at 700 °C and 750 °C using a rapid thermal annealing process and furnace, respectively. X-ray diffraction analysis revealed that the films of PYbN-PT were highly (001) oriented along LNO/Si substrates. The degree of PYbN-PT orientation is dependent on the heating rate and annealing temperature. Annealing heating rate of 10 °C/s and high annealing temperature near 750 °C produce the greatest degree of (001) orientation, which gives rise to improved dielectric properties.     

Effect of Annealing Temperature on Transformation Behaviors of Ti-50.2 at. pct Ni Thin Film

The effect of the annealing treatment on the transformation behaviors of the Ti-50.2 at. pct Ni thin films prepared,by d.c magnetron sputtering system was investigated, The results show that two different kinds of precipitates, both Ni3Ti and Ti4Ni2O, co-existed in the annealed thin films. The transformation temperatures of thin film increased with increasing annealing temperature from 500 to 650 degreesC, but they dropped at 750 degreesC. The complicated changes of the transformation temperatures were related to the existence of both Ni3Ti and Ti4Ni2O precipitates.     

退火时间对BNT-BT6薄膜微结构及压电性能的影响

采用溶胶-凝胶法(Sol-Gel)在Pt/Ti/SiO2/Si(100)衬底上制备了0.94(Na0.5Bi0.5)TiO3-0.06BaTiO3(BNT-BT6)薄膜,研究了不同退火时间对其微结构和压电性能的影响。X射线衍射(XRD)结果表明,制备的BNTBT6薄膜为钙钛矿型铁电薄膜,随着退火时间的延长,晶粒尺寸略有增加。原子力显微镜(AFM)结果表明,制备的薄膜表面比较平整、无裂缝。随着退火时间的延长,薄膜的粗糙度有所增加。在退火时长为60min时薄膜表面具有最佳的均一性,在退火时间为90min时薄膜均一性最差;优化退火时间,可提高薄膜结晶程度,避免焦绿石相的生成,进而提高BNT-BT6薄膜压电性能。压电力显微镜(PFM)结果表明,BNT-BT6薄膜的电畴为多畴结构。在不同退火时间下均有明显的压电响应,特别是在退火时间为60min时,BNT-BT6原始电畴有着最高的振幅强度。在30min、40min、60min和90min退火时间时,其平均压电系数d33分别为48pm/V、157pm/V、186pm/V和142pm/V。