IEEE 1450集成电路测试接口语言标准

讨论了集成电路测试技术中传统测试图形转换存在的问题及标准测试接口语言STIL解决方案,并重点介绍和分析了STIL标准IEEE 1450及其应用现状.提出应该在我国集成电路测试行业内大力推行IEEE 1450标准,以实现高效率低成本测试目标.     

IEEE1149.4模拟和混合信号测试总线标准

模拟和混合信号边界扫描标准(IEEE1149.4)是针对电路板级外部分立元件的测试而发展起来的,该标准与IEEE1149.1兼容,另外,在此基础上,IEEE1149.4又增加了两根线,用来控制模拟信号.目前1149.4的标准,不但应用在传统的电路板上,在混合信号集成电路甚至包含混合信号的SoC系统芯片上,都有应用.本文...     

VXI边界扫描模块接口电路的设计

根据IEEE1149.X标准和VXI总线规范,采用EDA技术对VXI边界扫描模块的接口电路进行了研究和设计,通过仿真和实际测试验证了设计的正确性,很好地将VXI总线技术和边界扫描技术融合在一起,成功研制了一种符合IEEE1149.X标准的C尺寸VXI边界扫描模块。在VXI总线测试领域拓展了边界扫描测试功能,不增加测试系统的成本和复杂性,解决了VXI总线应用领域集成电路的测试问题。     

专用测量及设备

Y99-61621 99139501998年 IEEE 第16届超大规模集成电路测试会议录=1998 IEEE 16th VLSI test symposium[会,英]/IEEEComputer Society Test Technology Technical Committee& IEEE Philadelphia Section.—IEEE Computer SocietyPress,1998.—468P.(G)报道了1998年4月26日至30日在美国加州的Monterey 市举行的 IEEE 第16届 VLSI 测试会议上的     

基于边界扫描技术和Tcl语言的DualSRAM测试设计

集成电路（IC）的迅猛发展促进了测试技术的研究和发展,支持IEEE1149.1标准的边界扫描芯片的广泛应用,使得边界扫描测试技术日益被重视。Tcl语言是一种简明、高效、移植性强的语言,它与边界扫描技术的结合,扩展了芯片测试技术的应用,使得IC的测试更加灵活。本文以DualSRAM的测试设计为例,介绍了以边界扫描技术为基础的Tcl语言的应用,同时根据测试开发中遇到的问题,提出了一些可测性设计（DFT）的建议。     

半导体器件

Y2002-63011 0212673IEEE GaAs 集成电路会议录=IEEE GaAs IC sympo-sium[会,英]/IEEE Electron Devices Society.—266P.(E)本会议录收集了在华盛顿州 Seattle 召开的 GaAs集成电路会议上发表的56篇论文,内容涉及     

支持边界扫描测试的电路设计

基于IEEE 1149.1标准制定的边界扫描技术能够对复杂电路进行测试,并诊断出硬件问题。首先介绍了边界扫描测试电路的基本结构,针对基于边界扫描的大规模集成电路的特点,论述了为提高电路板的可测试性而采用边界扫描技术进行设计时应注意的一些基本要点,另外,还给出了能够获得良好测试性设计效果的边界扫描电路的设计方案。     

2008年IEEE功率半导体器件及集成电路国际会议评述

综述和评论了在第20届IEEE功率半导体器件及集成电路国际会议会议上发表的一些主要成果和进展,其中对一些重点成果还补充了往年的研发情况和发展经历,希望能帮助读者大致上了解当前功率器件和功率集成电路研发的典型状况和最新信息。     

膜混合集成电路、MOS集成电路

0102051片上系统集成(SoC)时代的到来[刊]/张宝元//微电子技术.—2000.28(5).—13～17(E)本文从信息市场需求和技术发展的角度分析了片上系统集成(SOC)是集成电路发展的必然趋势,它是设计技术的一场革命.将成为信息领域 IC 的主流。本文还简要地叙述了 SOC 所涉及到的如 IP、设计方法学、软、硬件协调设计、验证等主要技术。参2Y2000-62185-147 01020520.8μm CMOS 工艺的器件设计,制造及特性=Devicedesign.fabrication and characterization of 0.8gm CMOStechnology[会,英]//1998 IEEE International Confer-ence on Semiconductor Electronics.—147～151(E)Y2000-62185-162 0102053用于 CMOS 集成电路逻辑和 IDDQ 测试集成化的电流传感器及测试处理器设计=Current sensor and testprocessor design for integration of logic and IDDQ testingof CMOS ICs[会,英]/Ahaf-U1-Amin.M.＆ Darus,Z.M.//1998 IEEE International Conference on Semicon-     

IEEE802.11g协议中一些问题的分析与研究

本文简要介绍了IEEE80 2 .11协议族标准的发展过程 ,重点分析了IEEE80 2 .11g协议标准。对IEEE80 2 .11g协议中可能出现的一些问题进行分析和研究 ,并针对这些问题给出了相应的解决方法     

基于IEEE 1149.X标准的测试技术研究

IEEE1149标准及其子标准是基于边界扫描的测试技术，它们针对不同的应用环境采用相应的技术标准。它们所提供的解决方案极大地方便了芯片级、板级、系统级及数字网络的测试。本文讨论了IEEE1149．X中各标准的原理、结构，分析了各项技术的发展及应用，并举例说明了在实际中的测试应用。     

JTAG技术的发展和应用综述

JTAG作为测试标准已为芯片设计与制造厂商接受和应用.文章概述了JTAG技术在测试领域的典型应用.同时,随着深亚微米工艺的采用,以及千兆时钟时代的来临和SOC的发展,JTAG已出现很多新的应用和实现方法.着重探讨了JTAG的发展,及其在信号完整性测试、嵌入式调试、差分信号测试等技术中的应用.     

集成电路测试相关标准研究与探讨

重点研究了纯数字信号、混合信号和片上系统测试的一些问题及相关标准，阐述了各标准的作用，分析了这些标准在实际应用中存在的一些问题及其局限性。     

Do ESD fails in systems correlate with IC ESD robustness?

Integrated circuits (ICs) are qualified for their electrostatic discharge (ESD) robustness according to the well-known IC ESD standards Human Body Model, Machine Model, and Charged Device Model in order to guarantee safe handling in ESD protected areas. For electronic systems like mobile phones which are in direct use by consumers, certain robustness against system level ESD is demanded, too. As the ESD test methods of device and system level stress are completely different (waveforms, stress application, operating condition of the DUT, etc.), correlations between models of both worlds are difficult to establish. Therefore, the system vendors more and more demand a specified ESD robustness for devices (ICs) according to an ESD system level standard. Testing ICs to a system level ESD standard requires careful considerations; first ideas are summarized in the new Standard Practice “Human Metal Model” of the ESDA/ANSI. However, the approach of deriving system ESD robustness from IC robustness is currently too much simplified and bears severe potential risks. Nevertheless, there are methodologies and approaches to use IC ESD characterization for defining ESD protection concepts for systems. Appropriate high-current characterization of ICs can be the cornerstone for a successfully optimized system ESD protection.     

GaAs、InP集成电路技术的发展——1992年IEEE GaAs IC讨论会评述

本文介绍了1992年IEEE GaAs IC讨论会的概况,并依据这次国际会议所发表的论文,以GaAs、InP集成电路的技术路线为主线,介绍和评述了GaAs基PHEMT,HBT,MESFET以及InP基HEMT、HBT等集成电路的现状与发展。     

世界GaAs集成电路的发展及我们的对策——1990 IEEE GaAs IC讨论会评述

1990 IEEE GaAs IC讨论会是一次历史性会议。它提供了交流和宣传GaAs IC研究和发展的机会。会议特别关注GaAs IC的全球性进步。本文评述美国、日本和欧洲GaAs IC的进展,并提出发展我国GaAs IC的想法。     

Test Planning for Core-based Integrated Circuits under Power Constraints

This paper addresses reduction of test cost for core-based non-stacked integrated circuits (ICs) and stacked integrated circuits (SICs) by test planning, under power constraint. Test planning involves co-optimization of cost associated with test time and test hardware. Test architecture is considered compliant with IEEE 1149.1 standard. A cost model is presented for calculating the cost of any test plan for a given non-stacked IC and a SIC. An algorithm is proposed for minimizing the cost. Experiments are performed with several ITC’02 benchmark circuits to compare the efficiency of the proposed power constrained test planning algorithm against near optimal results obtained with Simulated Annealing. Results validate test cost obtained by the proposed algorithm are very close to those obtained with Simulated Annealing, at significantly lower computation time.     

Low-Power Analog Integrated Circuits for Wireless ECG Acquisition Systems

This paper presents low-power analog ICs for wireless ECG acquisition systems. Considering the power-efficient communication in the body sensor network, the required low-power analog ICs are developed for a healthcare system through miniaturization and system integration. To acquire the ECG signal, a low-power analog front-end system, including an ECG signal acquisition board, an on-chip low-pass filter, and an on-chip successive-approximation analog-to-digital converter for portable ECG detection devices is presented. A quadrature CMOS voltage-controlled oscillator and a 2.4 GHz direct-conversion transmitter with a power amplifier and upconversion mixer are also developed to transmit the ECG signal through wireless communication. In the receiver, a 2.4 GHz fully integrated CMOS RF front end with a low-noise amplifier, differential power splitter, and quadrature mixer based on current-reused folded architecture is proposed. The circuits have been implemented to meet the specifications of the IEEE 802.15.4 2.4 GHz standard. The low-power ICs of the wireless ECG acquisition systems have been fabricated using a 0.18 μm Taiwan Semiconductor Manufacturing Company (TSMC) CMOS standard process. The measured results on the human body reveal that ECG signals can be acquired effectively by the proposed low-power analog front-end ICs.     

Applications '90: instrumentation

Important developments in instrumentation during 1989 are described. A proposed design-for-testability standard embracing the boundary-scan technique was approved by voters in an IEEE letter ballot last August. The advent of smart sensors has led to the notion of universal instruments, standard boxes that can measure a variety of parameters when the appropriate sensors are plugged in. More than 40 of these instruments can be interconnected in a network to share data at rates up to 1 Mb/s. New international standards for the volt and ohm were to have gone into effect on New Year's Day this year. Standards for the ampere and watt derive from those for the volt and ohm and, therefore, would also change. The need for standards to test microwave and millimeter-wave integrated circuits (MIMICs) manifested itself in the formation last year of the NIST (National Institute for Standards and Technology) Consortium for MIMIC Metrology. Composed of industry and government laboratories and spearheaded by NIST, the group is charged with producing standards for measuring the radio frequency and thermal characteristics of microwave monolithic ICs     

集成电路油墨打印标记牢度探讨

随着电子产品对可靠性的要求越来越高,军品集成电路的打印标记要经受越来越苛刻的筛选试验和考核。目前,国内在金属外壳或盖板上的标记大多采用油墨打印。油墨打印技术实际上是一种胶粘剂粘接技术,胶粘剂的粘接过程是一个复杂的物理化学过程。胶粘剂与被粘物间形成良好的浸润性是提高粘接强度的先决条件,也就是说保证标记牢度的关键除了选择高表面能的金属材料外,还要对金属外壳或盖板进行恰当的处理使油墨对它有优良的浸润性。通过反复试验,总结出一套能保证标记牢度的打印工艺。