共查询到20条相似文献,搜索用时 78 毫秒
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多晶硅TFT及其在AMLCD中的应用 总被引:3,自引:0,他引:3
多晶硅薄膜晶体管目前是大面积微电子学领域中最热门的研究课题之一,它以其独特的优点,在液晶显示领域中失常着重要角色,简要介绍了多晶硅薄膜晶体管的结构、器件特性以及在有源矩阵液晶显示器中的应用。 相似文献
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多晶硅有源矩阵液晶显示技术,特别是一体化多晶硅有源矩阵液晶显示技术以它独特的优点,越来越受到重视,并将在液晶显示领域中占有重要地位,但是,多晶硅有源矩阵液晶显示技术还存在一些问题,这也正是目前研究的主要内容,本文对低温下淀积高质量多晶硅薄膜技术;通过退火使非晶硅结晶为多晶硅技术;器件层转移技术;钝化技术;一体化技术以及多晶硅有源矩阵液晶显示的前景等进行了分析和讨论。 相似文献
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引言近来,平板显示有源矩阵液晶显示(LCD)得到广泛的开发。各种类型的有源矩阵液晶显示已有报导。我们已报导过可用激光再结晶的多晶硅来获得重复性和一致性好的薄膜晶体管(TFT)。然而,由于激光再结晶TFT是用某些高温过程的大规模集成工艺制作的,而且,在大规模集成工艺设备中存在某些尺寸限制,使得激光再结晶多晶硅TFT阵列不适用于大面积显示。另一方面,非晶硅TFT目前普遍用作有源矩阵LCD中的开关管。最近,我们已经制成由非晶硅TFT组成的,对角线尺寸为5英寸和10英寸的有源矩阵LCD。 相似文献
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一门引人注目的新学科——大面积电子学 总被引:1,自引:0,他引:1
概述了大面积电子学的发展现状与趋势,介绍了太阳能电池、薄膜晶体管,有源矩阵液晶显示和场发射阵列等大面积电子器件的目前研制水平及其应用前景。 相似文献
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概述了大面积电子学的发展现状与趋势,介绍了太阳能电池、薄膜晶体管、有源矩阵液晶显示和场发射阵列等大面积电子器件的目前研制水平及其应用前景。 相似文献
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Cheol-Min Park Byung-Hyuk Min Jae-Hong Jun Juhn-Suk Yoo Min-Koo Han 《Electron Device Letters, IEEE》1997,18(1):16-18
We have fabricated a self-aligned offset-gated poly-Si thin film transistor (TFT) by employing a novel photoresist reflow process. The gate structure of the new device is consisted of two unique patterns: A main-gate and a sub-gate. The new fabrication method extends the gate-oxide over the offset region. With the assistance of the sub-gate and reflowed photoresist a self-aligned offset region is successfully obtained due to the offset oxide acting as an implantation mask. The poly-Si TFT with symmetrical offsets is easily fabricated and the new method does not require any additional offset mask step. Compared with the misaligned offset gated poly-Si TFTs, excellent symmetric electrical characteristics are obtained 相似文献
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Byung-Hyuk Min Cheol-Min Park Min-Koo Han 《Electron Device Letters, IEEE》1996,17(12):560-562
We propose and fabricate a novel polycrystalline silicon thin-film transistor (poly-Si TFT) which exhibits the properties of an offset gated structure in the OFF state, while acting as a nonoffset structure in the ON state. The fabrication process is compatible with the conventional nonoffset poly-Si TFT's process and does not require any additional mask. Experimental results show that the leakage current of the new device is two orders of magnitude lower than that of the nonoffset gated device, while the ON current of the new device is almost identical to the nonoffset gated device. It is observed that the ON/OFF current ratio of the proposed poly-Si TFT is improved remarkably 相似文献
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Polycrystalline silicon-germanium thin-film transistors 总被引:3,自引:0,他引:3
The fabrication of p- and n-channel MOS thin-film transistors (TFT's) in polycrystalline silicon-germanium (poly-Si1-xGe x) films is described, and their electrical characteristics are presented. Various technological issues are then addressed in order to provide direction for further work in optimizing the fabrication process. The initial devices fabricated in this work exhibit well behaved electrical characteristics; enhanced performance is expected to accompany improvements in the crystallization and defect-passivation processes. Compared to a poly-Si TFT technology, an optimized poly-Si 1-xGex TFT technology may ultimately be able to provide a lower-temperature, shorter-time processing capability at little expense to device performance and it is therefore promising for large-area electronics applications 相似文献
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低温多晶硅(LTPS:Low-temperature poly-Si)技术已经成为薄膜晶体管(TFT:thin film transistor)制作中最具吸引力的技术,并应用在AMOLED显示器中.P-type 技术能够简化 TFT 的制作过程.本文提出了一种应用 p-type 多晶硅 TFT的 AMOLED 驱动电路结构,包括栅极驱动器、数据驱动器以及像素阵列.数据驱动器采用分块方法,使得显示屏的输出线数大大减少.作者采用一种改进的 p-type 移位寄存器实现逐行选通的功能,并采用由 4 个 p-type 反相器级联构成的缓冲器来提高电路的驱动能力.为了验证上述电路结构的正确性,作者采用 HSPICE 软件进行仿真分析.结果表明,电路工作正常.利用韩国汉城国立大学及 Neo Poly 公司在多晶硅制作方面的优势,我们已经合作完成了应用上述电路结构的分辨率为96×3×128的有源 OLED 的制作. 相似文献
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Won-Kyu Lee Joong-Hyun Park Joonhoo Choi Min-Koo Han 《Electron Device Letters, IEEE》2008,29(2):174-176
We fabricated a new top-gate n-type depletion-mode polycrystalline silicon (poly-Si) thin-film transistor (TFT) employing alternating magnetic-field-enhanced rapid thermal annealing. An n+ amorphous silicon (n+ a-Si) layer was deposited to improve the contact resistance between the active Si and source/drain (S/D) metal. The proposed process was almost compatible with the widely used hydrogenated amorphous silicon (a-Si:H) TFT fabrication process. This new process offers better uniformity when compared to the conventional laser-crystallized poly-Si TFT process, because it involves nonlaser crystallization. The poly-Si TFT exhibited a threshold voltage (VTH) of -7.99 V at a drain bias of 0.1 V, a field-effect mobility of 7.14 cm2/V ldr s, a subthreshold swing (S) of 0.68 V/dec, and an ON/OFF current ratio of 107. The diffused phosphorous ions (P+ ions) in the channel reduced the VTH and increased the S value. 相似文献
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Kow Ming Chang Yuan Hung Chung Chi-Gun Deng Yuan Fu Chung Jian-Hong Lin 《Electron Devices, IEEE Transactions on》2002,49(4):564-567
Proposed and fabricated a novel polysilicon thin film transistor (poly-Si TFT) with a subgate coupling structure that behaves as an offset gated structure in the OFF state while acting as a conventional nonoffset structure in the ON state. The OFF state leakage current of the new TFT is two orders of magnitude lower than that of the conventional nonoffset TFT, while the ON current of the new TFT is one order of magnitude higher than that of the offset TFT and is almost identical to that of the conventional non-offset TFT. The ON/OFF current ratio of the new TFT is greatly improved by two orders of magnitude. No additional photo-masking steps are required to fabricate the subgate of the new TFT and its fabrication process is fully the same as the conventional nonoffset TFTs 相似文献
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A planar type polysilicon thin-film transistor (poly-Si TFT) EEPROM cell with electron cyclotron resonance (ECR) N2O-plasma oxide has been developed with a low temperature (⩽400°C) process. The poly-Si TFT EEPROM cell has an initial threshold voltage shift of 4 V for programming and erasing voltages of 11 V and -11 V, respectively. Furthermore, the poly-Si TFT EEPROM cell maintains the threshold voltage shift of 4 V after 100 000 program/erase cycles. The excellent high endurance of the fabricated poly-Si TFT EEPROM cell is attributed to the ECR N2O-plasma oxide with good charge-to-breakdown (Qbd) characteristics 相似文献
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Jyi-Tsong Lin Yi-Chuen Eng 《Electron Devices, IEEE Transactions on》2007,54(12):3238-3244
An original blocking technology is proposed for improving the short-channel characteristics of polycrystalline silicon thin-film transistors (poly-Si TFTs). In particular, two types of modified devices called poly-Si TFT with block oxide and poly-Si on partial insulator (POPI)-TFT are designed for the first time in this field to enhance device performance. The proposed TFT structures can significantly reduce short-channel effects when compared with a thick source/drain (S/D) poly-Si TFT (i.e., the fully depleted TFT). In addition, an ultrathin (UT) S/D structure (UT-TFT) is designed to verify that the block oxide TFT devices do achieve improved performance without needing the thin active layers and ultrashallow junction depth. Also, the POPI-TFT is found to reduce the thermal instability through its natural body-tied scheme. 相似文献
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Jung Chul Kim Jong Hyun Choi Seung Soo Kim Jin Jang 《Electron Device Letters, IEEE》2004,25(4):182-184
We studied the bias-induced changes in the performance of the poly-Si thin-film transistor (TFT) by metal-induced crystallization of amorphous silicon through a cap layer (MICC) poly-Si. The p-channel poly-Si TFT exhibited a field-effect mobility of 101 cm/sup 2//V/spl middot/s and a minimum leakage current of <1.0/spl times/10/sup -12/ A//spl mu/m at V/sub ds/=-10 V. The MICC poly-Si TFT performance changes little by either gate or hot-carrier bias stress. The better stability appears to be due to the smooth surface of MICC poly-Si, which is /spl sim/2 nm that is much smaller than that (13 nm) of a laser-annealed poly-Si. 相似文献
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RAO Rui XU Chong-yang SUN Guo-cai ZHOU Xue-mei ZENG Xiang-bin ZHAO Bo-fang 《半导体光子学与技术》2001,7(1):17-19,23
Using a new low-temperature process (<600 ℃), the poly-Si TFT was fabricated by metal-induced lateral crystallization (MILC). An ultrathin aluminum layer was deposited on a-Si film and selectively formed by photolithography. The films were then annealed at 560 ℃ to obtain laterally crystallized poly-Si film, which is used as the channel area of a TFT. The poly-Si TFT showed an on/off current ratio of higher than 1×10 6 at a drain voltage of 5 V. The electrical properties are much better than TFT fabricated by conventional crystallization at 600 ℃. 相似文献