时效对Cu-0.33Cr-0.06Zr合金导电率与硬度的影响

采用固溶+冷变形（80%变形量）+不同温度和时间时效工艺制备了Cu-0.33Cr-0.06Zr合金试样,研究了时效温度以及时效时间对Cu-0.33Cr-0.06Zr合金导电率和显微硬度的影响。结果表明,固溶后冷变形加时效可以显著提高合金的导电率和显微硬度。固溶和冷变形后Cu-0.33Cr-0.06Zr合金的合理时效工艺为450 ℃下时效2 h,经此工艺处理后合金的导电率可以达到83 %IACS,硬度达到195 HV0.1。     

Cu-Ag-Zr-Ce合金时效性能和电磨损性能的研究

本文对Cu-0.1Ag-0.18Zr-0.068Ce合金时效后的导电率和显微硬度以及电滑动磨损性能进行了研究.结果表明合金940℃固溶1 h后,在560℃时效可获得较高的导电率;在480℃时效可获得较高的显微硬度.时效前冷变形能大大加快第二相的析出过程,使合金综合性能得到显著提高.固溶合金经60%变形后在480℃时效1 h其导电率和显微硬度分别可达83%IACS和135 HV.在载流条件下,Cu-0.1Ag-0.18Zr-0.068Ce合金的耐磨性能较Cu-0.1Ag-0.18Zr合金大幅度提高.     

时效对列车接触网导线用Cu-Ag-Zr合金性能的影响

研究了时效参数对Cu-0.1Ag-0.051Zr合金性能的影响。结果表明:合金经870℃×1h固溶后,在560℃时效可获得较高的导电率;而在480℃时效可获得较高的显微硬度;时效前加以冷变形可以加速时效初期第二相的析出,使合金的导电性显著增加,合金经50%变形后480℃时效0.25h时,导电率可达90.2%IACS,而固溶后直接时效为83.2%IACS;经适当加工工艺成形的合金导线的综合性能优于Cu-0.1Ag合金导线。     

稀土Y掺杂对Cu-Cr-Zr合金时效性能的影响

研究了时效参数和变形量对Cu-Cr-Zr-Y合金时效性能的影响.结果表明:Cu-0.41Cr-0.10 Zr合金在950℃×1h固溶后,在520℃时效2 h能获得较高的显微硬度和导电率;固溶后合金经60%变形后在520℃时效30 min时,硬度可达147.9 HV,导电率可达83.97%IACS,比固溶后直接时效分别高出约41HV和14%IACS.而加入稀土元素Y后,使Cu-Cr-Zr合金的显微硬度提高了约9HV,而导电率降低了约3%IACS.     

时效时间对Cu-0.2Be-0.5Co合金组织及性能的影响

研究了时效时间对Cu-0.2Be-0.5Co合金显微硬度和导电率的影响,采用透射电子显微镜(TEM)观察分析了微观组织随时效时间的变化。结果表明:Cu-0.2Be-0.5Co合金在460℃时效条件下显微硬度和导电率随时效时间的变化规律基本一致:时效初期(0~2 h)急剧升高,时效中期(2~4 h)缓慢增加,时效后期(4~8 h)趋于稳定。析出相结构为Be12Co化合物相,与Cu基体的位向关系为[112]α∥[011]Be12Co。析出相的大量析出和弥散分布导致合金硬度的显著增加,由固溶态的97 HV0.1增加至时效2 h后的243 HV0.1;铜基体晶格畸变程度的恢复导致合金导电率显著增加,由固溶态的32.3%IACS增加至时效2 h后的57.1%IACS。在试验范围内,Cu-0.2Be-0.5Co合金经950℃×1 h固溶+460℃×2 h时效处理后综合性能优良。     

Cu-Ag-Cr合金时效析出行为研究

研究了时效参数和变形量对Cu-0.1Ag-0.61Cr合金性能的影响。结果表明:合金经980℃×20 min固溶后,在480℃时效1 h可获得较高的导电率和硬度。时效前对合金加以冷变形可以显著提高其显微硬度,合金经60%变形后在480℃时效30 min时,峰值硬度可达165.13 HV,导电率可达83%IACS,而固溶后直接时效分别仅为153.46 HV和77.63%IACS。与Cu-0.1Ag-0.46Cr合金相比其显微硬度有较大提高而导电率降低很少。     

时效和形变对Cu-Cr-Zr合金性能的影响

采用非真空熔炼工艺制备Cu-Cr-Zr合金,研究了不同温度下时效时间对合金显微硬度和导电率的影响,并分析了在500℃时效时变形量和合金显微硬度与导电率的关系,用扫描电子显微镜(SEM)观察分析了材料的显微组织。结果表明:非真空熔铸的Cu-0.90Cr-0.18Zr合金950℃×1 h固溶后,经过适当的形变和固溶时效处理,显微硬度和导电率都显著增加,分别达到179 HV和79%IACS。时效后固溶在基体中的合金元素大量析出,析出相弥散分布。     

时效工艺对Cu-1.4Cr-0.2Zr-0.04Mg合金硬度和导电率的影响

研究了时效工艺对Cu-1.4Cr-0.2Zr-0.04Mg合金硬度和导电率的影响,并对强化机理和导电率提高的原因做了分析.结果表明:合金经过980℃固溶1 h,450℃时效3 h后其硬度和导电率达到最大值,分别为11 1.5 HBS和77.15%IACS.     

固溶时效对Cu-4Ni-2Sn-Si合金组织及其性能的影响

采用OM、XRD、导电率和硬度测试等分析方法研究了固溶时效工艺对Cu-4Ni-2Sn-Si合金的显微组织及性能的影响。结果表明,热轧态Cu-4Ni-2Sn-Si合金中未溶解的第二相Ni2Si颗粒随着固溶温度的升高逐渐回溶,且发生再结晶,再结晶晶粒逐渐长大。当温度升高至900℃时,第二相粒子基本回溶到合金基体中。经时效处理后,合金的硬度受到析出相与再结晶的交互作用的影响。当时效温度低于450℃时,硬度值随时效时间的延长呈现先增大后减小的趋势;而时效温度升高至500℃时,合金硬度值随时效时间的延长而逐渐下降。而导电率则随时效时间的延长一直保持增大的趋势。热轧态Cu-4Ni-2Sn-Si合金经900℃×1 h固溶处理+68%冷轧变形+450℃×6 h时效处理后获得较优的综合性能,其硬度值为225 HB,导电率为24.5%IACS。     

形变热处理对上引拉铸Cu-0.45Cr-0.15Zr-0.05Mg组织性能的影响

对上引连铸的Cu-0.45Cr-0.15Zr-0.05Mg合金进行固溶处理、冷拉拔以及时效处理工艺,研究拉冷拔形变及时效对材料力学性能、导电性能及组织结构的影响规律。结果表明:时效前的冷拉拔变形能提高Cu-0.45Cr-0.15Zr-0.05Mg合金的力学性能而保持较高的导电率;合金在950℃固溶1h后经70%冷拉拔变形和500℃时效4h,合金显微硬度和导电率分别达到了170HV,85%IACS;时效合金组织转变过程为:固溶体→G.P.区→Cr+Cu4Zr,析出相对位错的运动的阻碍是合金强化的重要机制。     

Cu-0.8Cr-0.2Zr合金固溶时效后的组织与性能研究

通过检测Cu-Cr-Zr合金在固溶时效过程中硬度、电导率的变化及显微组织的观察,研究不同热处理条件对该合金组织和性能的影响。试验结果表明：固溶时效后在合金基体中能得到大量的孪晶组织及细小的析出粒子,在两者综合作用下,合金的组织和性能得到极大的改善。合金在980℃固溶、450℃时效3 h后性能最佳。合金的硬度为111.5 HBS,相对电导率为78.42%IACS。     

固溶处理对Cu-Cr-Zr合金组织与性能的影响

对热轧态Cu-1.0Cr-0.1Zr合金在电阻炉中进行了不同温度不同保温时间的固溶处理,并对固溶后合金的组织与性能进行了检测,分析了固溶温度与时间对该合金组织性能的影响。结果表明:固溶后合金组织性能由回复、再结晶、未溶粒子回溶与晶粒长大综合影响;随固溶温度升高,合金的硬度先大幅下降,后不断上升,而导电率不断下降;随固溶时间的延长,合金的硬度呈抛物线升高并趋于平缓的趋势,导电率的变化则与之相反。在固溶温度为950 ℃,固溶时间为120 min时,固溶基本完成,此时硬度为58.9 HBS,导电率为50%IACS。     

时效参数和变形量对Cu-Cr-Zr-B-RE合金组织与性能的影响

研究了时效参数和变形量对Cu-1．15Cr-0．05Zr-0．04B-0．02RE合金组织与性能的影响。结果表明：该合金经950℃固溶1．5h、50％冷变形后，在470℃时效1．5h可获得较高的硬度和电导率，分别为104．2HB和48．76％IACS；并通过扫描电镜、能谱及X射线衍射仪等检测手段，发现时效过程中析出物为单质Cr和Cu5Zr化合物。     

Aging characteristic of Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy containing trace rare earth yttrium

The aging characteristic of Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy containing trace rare earth yttrium was investigated. The results showed that Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy obtained good comprehensive performance after 80% rolling and then aging at 480℃ for 1 h; the hardness and electrical conductivity reached HV 150 and 85.5% IACS, respectively. Increasing aging temperature accelerated aging precipitation. The time for attaining peak hardness was postponed, the precipitates were finer (2-4 nm), and the interparticle spacing was shorter due to yttrium addition. The hardness and electrical conductivity of the Y-containing alloy after 80% deformation and then aging at 480℃ for 45 min reached HV 174 and 82.1% IACS, respectively.     

Aging Behavior of Cu-Cr-Zr-Ce Alloy

The aging properties of Cu-0.35Cr-0.038Zr-0.055Ce alloy are studied. The results show that can obtain higher electrical conductivity and microhardness after solutioned at 920℃ for lh, and aged at 500℃. The process of precipitation of the secondary phase can be accelerated with cold deformation before aging, so properties of the alloy are improved.Upon aging at 500℃ for 30 minutes after 60% cold deformation, the values of electrical conductivity and microhardness are 69.0%IACS and 152HV respectively, but they are only 66.2%IACS and 136HV upon directly aging after solution. With the addition of a trace of rare earth element Ce, the value of microhardness of Cu-0.35Cr-0.038Zr alloy increases 18～25HV,while the value of electrical conductivity drops a little.     

Aging Precipitation Characterics of Lead Frame Cu-Cr-Zr-Mg Alloy

This paper presents the effects of aging processes on the properties and microstructure of Cu-0.3Cr-0.15Zr-0.05Mg lead frame alloy. Optimal conditions for good hardening and electrical conductivity can be obtained by solution treating at 920℃ for lh and aging at 470℃ for 4h and at 550℃ for lh. The hardness and electrical conductivity can reach 108HV, 73%IACS and 106HV, 76%IACS, respectively. Aging precipitation was dealt with by transmission electronic microscope (TEM). At 470℃ aging for 4h the fine precipitation of an ordered compound CrCu2(Zr, Mg) is found in matrix as well as fine Cr and Cu4Zr. Aging at 550℃ for lh some precipitates are still coherent with matrix. The CrCu2(Zr, Mg) completely dissolves into Cr and Cu4Zr.     

Cu-Cr-Fe-Ni合金形变热处理过程中的组织与性能

采用非真空熔炼并经热轧—固溶—冷轧—时效热处理工艺制备Cu-0.59Cr-0.078Fe-0.081Ni合金板,探究热处理和冷变形对合金显微组织、电导率和硬度的影响。结果表明:Cu-Cr-Fe-Ni合金大气熔铸后呈明显的枝状晶组织,经固溶处理后合金发生再结晶,硬度和电导率都相应的降低,分别为65.9 HV0.2、41.7%IACS;经过冷变形处理后合金的硬度显著提高,变形量达90%时,合金的硬度高达144.7 HV0.2;合金变形后在450 ℃时效的过程中硬度先增加后减少,变形量为60%时,时效30 min达到峰时效,此时硬度、电导率分别为155.5 HV0.2、71.4 %IACS。     

Cu-Cr合金强化机制研究及其对导电性能的影响

采用真空铸造-固溶处理-冷轧-时效处理工艺制备了Cu-0．8％Cr合金。利用金相显微镜、透射电镜、选取电子衍射、硬度和电导率测试等手段考察了合金在不同处理状态下的组织和性能，定量分析了不同强化方式对合金硬度及导电性能的影响。结果表明：与固溶强化相比，析出强化方法更能有效强化合金，对导电性能影响也更小；形变强化能显著提高合金硬度，但对导电性能几乎无影响；大预变形、短时时效是合金获得较高综合性能的有效手段。     

形变热处理对Cu-Ti-Fe-Sn合金组织与性能的影响

利用真空熔炼法制备了Cu-3Ti-0.2Fe-1Sn合金,通过均匀化退火、固溶+冷轧(变形量分别为40%、60%、80%)+450 ℃时效处理,研究了形变热处理对Cu-3Ti-0.2Fe-1Sn合金显微组织、导电率及硬度的影响。结果表明:真空熔炼制得的 Cu-3Ti-0.2Fe-1Sn合金铸态组织中含有大量的枝状晶组织,经固溶处理后组织中出现了晶粒长大;铸态合金的硬度和导电率分别为178.1 HV和10.85%IACS,固溶处理后硬度和导电率都相应降低,分别为102.7 HV和4.58%IACS。经过冷变形和时效处理后Cu-3Ti-0.2Fe-1Sn合金硬度明显提高,变形量为60%时,时效480 min时硬度达到峰值,合金硬度为310.2 HV,此时合金的导电率为18.59%IACS。     

Effect of V addition on hardness and electrical conductivity in Cu-Ni-Si alloys

The effect of vanadium (V) addition on the microstructure, the hardness and the electrical conductivity of Cu-2.8Ni-0.7Si alloys was investigated. The V-free, the 0.1 wt% V-added, the 0.2 wt% V-added Cu base alloys were exposed to the same experimental conditions. After the cold rolling of the studied alloys, the matrix was recrystallized during the solution heat treatment at 950 °C for 2 h. However, small amounts of vanadium substantially suppressed the recrystallization and retarded the grain growth of the Cu base alloys. The added vanadium accelerated the precipitation of Ni₂Si intermetallic compounds during aging and therefore it contributed positively to the resultant hardness and electrical conductivity. It was found that the hardness and the electrical conductivity increased simultaneously with increasing aging temperature and time with accelerated precipitation kinetics by the addition of vanadium. In the present study, the Cu-2.8Ni-0.7Si alloy with 0.1 wt%V was found to have an excellent combination of the hardness and the electrical conductivity when it was aged at 500 °C.