共查询到17条相似文献,搜索用时 171 毫秒
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根据多层瓷介电容器的结构特征,全面概括了“独石”结构广泛应用于片式元件设计与制造的新趋势,重点了多层压敏电阻器,多层电感元件,多层复合元件等片式无源元件,引入独交传统结构在性能上的显著改进和技术上的重大突破,总结了片式多层元件技术与应用的新进展。 相似文献
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片式多层元件新技术概论 总被引:27,自引:8,他引:19
根据多层瓷介电容器的结构特征,全面概括了“独石”结构广泛应用于片式元件设计与制造的新趋势,重点论述了多层压敏电阻器,多层热敏电阻器,多层电感元件,多层复合元件等片式无源元件,引入独石结构较传统结构在性能上的显著改进和技术上的重大突破,总结了片式多层元件技术与应用的新进展。 相似文献
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矩形片式元件在众多表面贴装元件(SMC)门类中,开发应用最早,产销量最大,始终保持领先地位。其中包括两大类代表品种:其一,以厚薄膜工艺制造的具有基片、电阻体、玻璃和导电体单层组合结构的片式电阻器;其二,以多层厚膜共烧工艺制造的具有交叠电介质与电极层独石一体化(Monolithic)结构的片式多层瓷介电容器(MLCC),或称片式独石电容器。MLCC源于有 相似文献
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对制定、修定多层片式瓷介电容器有关标准过程中和使用过程中发现的一些问题,诸如:片式元件的尺寸、性能参数和性能试验等10个问题进行讨论。 相似文献
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发展片式元件是我国电子元件的必然趋势。目前较适用的是电调谐高频头用片式元件。当片式元件大发展之际,80年代初陶瓷圆片电容器和碳膜电阻器出现供大于需的局面值得借鉴。 相似文献
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3 台湾菱庆股份有限公司台湾菱庆股份有限公司 MMC(以前为 KCK)及两个工厂(台中县加工出口区 ) 由日本 MMC (KCK)在台投资。 1970年成立 ,注册资金 16 82 45 40 0元 (新台币 )。主要产品是圆片形瓷介电容器、半导体瓷介电容器 (包括表面型和晶界层型 )、多层陶瓷电容器、安全规格的交流瓷介电容器。生产能力为月产 1.5亿只陶瓷电容器。有两个工厂 ,一厂是前、中工序 ,制造瓷基体和被银电极瓷片 ;二厂是后工序 ,电容器的装配。员工有 34 7名 :一厂 16 1人 ,二厂 174人 ,其余 12人是台北分公司业务人员 ,日本专家驻台湾工作人员有 7人… 相似文献
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采用一次性烧成技术研制了晶界层半导体陶瓷电容器,在瓷料配制过程中先后加入施主杂质和含有受主杂质的晶界助烧剂,两者在还原烧成时促使晶粒生长并半导化,助烧剂在氧化时有利于晶界绝缘层形成。在一台联体烧成设备中,采用大梯度温度和气氛变化,连续完成还原烧成和氧化处理。还原烧成时,升温速度大于400℃/h。在还原烧成温度下保温后,立即在几分钟内,从还原气氛转到氧化气氛,同时降温300℃以上。整个烧成过程中,瓷体全部是堆烧(叠烧10~20层),生产效率比二次烧成提高10倍以上。 相似文献
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随着片式多层陶瓷电容器(Multilayer Ceramic Capacitor,MLCC)向着微型化、高容量方向的发展,片式多层陶瓷电容器的生产工艺,对设备提出了更高的要求。对目前MLCC生产工艺的主要特点进行了研究,简单阐述了常见的片式多层陶瓷电容器薄膜流延技术,提出了一种实用型的唇式流延技术。同时,对薄膜流延设备的工作原理、总体构成、系统控制,以及关键技术进行了分析和探讨。 相似文献
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《Solid-State Circuits, IEEE Journal of》1978,13(3):303-307
An experimental single-chip silicon integrated-circuit filter is described for use in color television receivers. It comprises five gyrator resonators operating in the range 4-6 MHz. This chip provides all the selectivity required to separate the sound, luminance, and chrominance components from the composite video signal, and is tuned by a single bias potential applied to the p-n junction capacitors on the chip. The chip replaces an equivalent LC filter of about 20 discrete components (coils, capacitors, and resistors) which are bulky, are relatively expensive, and suffer from the need for individual screening and alignment. The theory of gyrators related to providing fully integrated selectivity at high frequency is outlined. Performance boundaries in terms of Q-factor, frequency setting accuracy, noise, distortion, and temperature are considered. Design aspects are discussed, first for a gyrator and then for the complete experimental filter chip. 相似文献
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D Kasperkovitz 《Microelectronics Reliability》1981,21(2):183-189
A complete FM receiver is integrated on a chip of 3.5 mm2. External components are one tunable resonant circuit and fourteen low-cost ceramic capacitors. Current consumption is 9 mA at 6 V. supply voltage range is 3 to 18 V. 相似文献
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在材料组成、烧结工艺不变的情况下,系统研究了还原气氛对Y5V、Y5u、Y5P型表面层半导体陶瓷电容器瓷片半导化电阻率、瓷片介电性能的影响。研究结果表明,半导体陶瓷电容器的容量变化率强烈依赖其还原气氛,无论是Y5V、Y5u还是Y5P瓷片均有类似的变化规律。氧分压降低,电容器的电容量温度变化率△C/C变小,当H2:N2比例大于20:100时,瓷片的△C/C不再变化,大约为空气烧结瓷片△C/C的88%。在不改变瓷料组成、烧结温度的情况下,通过还原气氛的适当控制,可改善Y5V、Y5u、Y5P型表面层半导体陶瓷电容器的电容温度特性,而其他介电性能基本不变。 相似文献
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Temperature cycling of a test board with different electronic components was carried out at two different temperature profiles in a single-chamber climate cabinet. The first temperature profile ranged between −55 and 100 °C and the second between 0 and 100 °C. Hole mounted components and secondary side SMD components were wave soldered with an Sn–3.5Ag alloy. Joints of both dual in line (DIL) packages and ceramic chip capacitors were investigated. Crack initiation and propagation was analysed after every 500 cycles. In total, 6500 cycles were run at both temperature profiles and the observations from each profile were compared.For both kinds of components analysed, cracks were first visible for the temperature profile ranging between −55 and 100 °C. For this temperature profile, and for DIL packages, cracks were visible already after 500 cycles, whereas for the other temperature profile, cracks initiated between 1000 and 1500 cycles. The cracks observed after 1500 cycles were visibly smaller for the temperature profile ranging between 0 and 100 °C, concluding that crack initiation and propagation was slightly slower for this temperature profile. For the chip capacitors, cracks were first visible after 2000 cycles. 相似文献