Kinetics of 4,4′-diaminodiphenylmethane curing of bisphenol-S epoxy resin

The kinetics of the cure reaction for a system of bisphenol-S epoxy resin (BPSER), with 4,4′-diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. Rate constants k₁ and k₂ were observed to be greater when curing temperature increased. The over-all reaction order, m + n, is in the range of 2.5 ∼ 3. The activation energies for k₁ and k₂ were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999     

Epoxy resins based on aromatic glycidylamines. VI. Toughening of N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane by reactive additives

Mechanical properties of N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane and its mixtures with liquid bisphenol A-type epoxy resins, bisphenol A and ε-caprolactone have been studied. 4,4′-Diaminodiphenylsulfone was used as hardener. Materials with improved fracture toughness and good mechanical strength in the temperature range 20–200°C have been formulated.     

Exploration of the difference of reaction rates for polyester and polyether urethane prepolymers with 3,3′-dichloro-4,4′-diaminodiphenylmethane

Polyester (PEPA) and polyether (PTMO) prepolymers with NCO end groups were synthesized. The chain extension reaction of these prepolymers with MOCA diamine was studied by FTIR spectrometry and found to be a second-order reaction. Data on chain extension reaction rate constants and activation energy showed that the chain extension reaction rate of the PEPA prepolyme with MOCA was faster than that of PTMO prepolymer with MOCA. Such a difference of chain extension reaction rate for PEPA and PTMO prepolymers with MOCA can be explained by hydrogen bonding interaction and miscibility between hard and soft segments in the cast polyurethane elastomer. The hydrogen bonding interactions of MOCA with PEPA prepolymer and PTMO prepolymer without chain extension reaction convincingly demonstrated the difference of chain extension reaction in the polyurethane-urea systems. © 1995 John Wiley & Sons, Inc.     

Epoxy resins based on aromatic glycidylamines. IV. Preparation of N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane from aniline and analysis of the product by GPC and HPLC

Epoxy resins containing N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM) were prepared from aniline and epichlorohydrin and analyzed by GPC and HPLC. The product composition was compared with that of resins prepared from 4,4′-diaminodiphenylmethane (DDM) and epichlorohydrin, which had been analyzed in our previous work. A new byproduct designated Y4 was isolated by semipreparative HPLC and identified by NMR and mass spectroscopy. The course of formaldehyde condensation with N,N-dichlorohydrin of aniline (DCHA) was followed by GPC and HPLC and the mechanism of formation of Y4 was proposed on the basis of obtained results. Attention was also paid to the differences in reactivity of DCHA diastereoisomers.     

Isothermal Cure of an Epoxy System Containing Tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM), a Multifunctional Novolac Glycidyl Ether and 4,4′-Diaminodiphenylsulphone (DDS): Vitrification and Gelation

Times to gelation and vitrification have been determined at different isothermal curing temperatures between 200 and 240°C for an epoxy/amine system containing both tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM) and a multifunctional Novolac glycidyl ether with 4,4′-diaminodiphenylsulphone (DDS). The mixture was rich in epoxy, with an amine/epoxide ratio of 0·64. Gelation occurred around 44% conversion. Vitrification was determined from data curves of glass transition temperature, T_g, versus curing time obtained from differential scanning calorimetry experiments. The minimum and maximum values T_g determined for this epoxy system were T_g0=12°C and T_gmax=242°C. Values of activation energy for the cure reaction were obtained from T_g versus time shift factors, a_T, and gel time measurements. These values were, respectively, 76·2kJmol^-1 and 61·0kJmol^-1. The isothermal time–temperature–transformation (TTT) diagram for this system has been established. Vitrification and gelation curves cross at a cure temperature of 102°C, which corresponds to glass transition temperature of the gel. © of SCI.     

Development of green and dark blue colors in epoxy resins cured with 4,4′-diaminodiphenylmethane

From a study of the oxidation of bisphenol-A epoxy resin cured with DDM (4,4′-diaminodiphenylmethane), it has been shown that the development of greenish-blue colors is due to an initial reaction between molecular oxygen and secondary amine groups. A full reaction scheme is suggested and supporting evidence, in the form of UV/visible, infrared, and ESR spectra, is presented.     

Torsional braid analysis of the cure of some tetra-N-glycidyl-4,4′-diaminodiphenylmethane systems

Torsional braid analysis has been used to study the curing reaction of some resin systems based upon tetraglycidyldiaminodiphenylmethane. TBA gives isothermal times to gelation and vitrification and hence the processing window for the particular systems studied at any intermediate isothermal temperature. The activation energies for the processes involved were also derived allowing extrapolation outside the range of the experiments.     

Curing kinetics,thermal property,and stability of tetrabromo-bisphenol-A epoxy resin with 4,4′-diaminodiphenyl ether

The curing reaction of tetrabromo-bisphenol-A epoxy resin (TBBPAER) with 4,4′-diaminodiphenyl ether (DDE) was studied by isothermal differential scanning calorimetry (DSC) in the temperature range of 110–140°C. The results show that the isothermal cure reaction of TBBPAER–DDE in the kinetic control stage is autocatalytic in nature and does not follow simple nth-order kinetics. The autocatalytic behavior was well described by the Kamal equation. Kinetic parameters, including 2 rate constants, k₁ and k₂, and 2 reaction orders, m and n, were derived. The activation energies for these rate constants were 83.32 and 37.07 kJ/mol, respectively. The sum of the reaction orders is around 3. The glass transition temperatures (T_gs) were measured for the TBBPAER–DDE samples cured partially in isothermal temperature. With the degree of cure varies, different glass transition behaviors were observed. By monitoring the variation in these T_gs, it is illustrated that the network of the system is formed via different stages according to the sequence reactions of primary and second amines with epoxides. It is due to the presence of the 4 bromine atoms in the structure of TBBPAER that this curing process can be clearly observed in DSC curves. The thermal stability of this system studied by differential thermal analysis–thermogravimetric analysis illustrates that the TBBPAER–DDE material can automatically debrominate and takes the effect of flame retarding when the temperature reaches 238.5°C. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1991–2000, 1998     

4,4′-carbo(4,4′-bismaleimido phenoxy)diphenyl silane: Synthesis and characterization

The paper describes the successful synthesis of silicon containing bismaleimide resin 4,4′-carbo(4,4′-bismaleimido phenoxy)diphenyl silane. The char yield of the bismaleimide resin in N₂ atmosphere was found to be 55% at 800°C. Chain extension of bismaleimide with 4,4′-diamino diphenyl sulfone reduced the char yield and thermal stability.     

Synthesis and characterization of 4,4′-diacryloyloxybenzophenone

A copolymerizable type II photoinitiator 4,4′-diacryloyloxybenzophenone (DABP) based on 4,4′-dihydroxybenzophenone (DHBP) and acryloyl chloride was synthesized, and its structure was confirmed by ¹H NMR and real-time infrared spectroscopy. UV–vis absorption spectroscopy of DABP exhibited red-shifted maximal absorption as compared with benzophenone (BP). The kinetics of photopolymerization was studied by real-time infrared spectroscopy. It showed that DABP was a more effective photoinitiator than benzophenone. When this photointiator and amine was used to efficiently initiate polymerization of acrylates and methacrylates, both rate of polymerization and final conversion increased and the induction period was shortened with increase of amine concentration, DABP concentration and light intensity.     

Studies on the Synthesis of 2,2′,4,4′,6,6′-Hexanitrostilbene

The synthesis of 2,2′,4,4′,6,6′-hexanitrostilbene by oxidative coupling of 2,4,6-trinitrotoluene in the presence of metal catalysts has been studied. The effects of reaction parameters on product yields have been evaluated and mechanisms for the reaction are proposed.     

Synthesis and characterization of high‐performance epoxy resin based on disiloxane and 4,4′‐oxybis(benzoic acid) ester

Epoxy‐terminated siloxane‐contained resin (BCDS/OBBA‐ETS) with high tensile strength and lap shear strength as well as good thermal stability was synthesized and characterized by ¹H‐NMR and Fourier transform infrared spectroscopy. Carboxy‐capped disiloxane‐4,4′‐oxybis (benzoic acid) ester oligomer (BCDS/OBBA) was firstly prepared from the reaction between 1,3‐bis(chloromethyl)‐1,1,3,3‐tetramethyl‐disiloxane and 4,4′‐oxybis(benzoic acid) (OBBA) in N,N‐dimethylformamide in the presence of triethylamine. Then, the BCDS/OBBA oligomer was reacted with epichlorohydrin to obtain the title BCDS/OBBA‐ETS resin. Cured with liquid polyamide L‐651, or diethylenetriamine, the mechanical and thermal properties as well as the lap shear strength of the BCDS/OBBA‐ETS resin were evaluated. The results indicated that the BCDS/OBBA‐ETS resin exhibited good thermal stability below 200°C, and the glass transition temperature (T_g) was about 64°C after cured with L‐651. The tensile strength of same cured BCDS/OBBA‐ETS resin was 27.46 MPa with a stain at break of 42.11%, and the lap shear strength for bonding stainless steel was 18.59 MPa. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Synthesis of 3,3′-Bis(2,2′,4,4′,6,6′-Hexanitortilbene)

This paper describes the synthesis of 3,3′bis(2,2′,4,4′,6,6′-hexanitrostilbene) (5). Based on the Ullmann reaction we prepared the title compound in nitrobenzene by using 3-chloro 2,2′,4,4′,6,6′-hexanitroztilbene (4) as the starting material and copper powder as the catalyst. (4) was reacted with hydrazine, not to yield a desired product, azo-3,3′bist(2,2′,4,4′,6,6′-hexanitrostilbene.) but to form a well-known explosive, 2,2′,4,4′,6,6′-hexanitrostibene (6). Differential scanning calorimetrical analysis has shown that (5) begins to decompose at the temperature of 298°C.     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

Synthesis and properties of new aromatic polyimides based on 2,2′‐dibromo‐4,4′,5,5′‐benzophenone tetracarboxylic dianhydride

New polyimides with enhanced thermal stability and high solubility were synthesized in common organic solvents from a new dianhydride, 2,2′‐dibromo‐4,4′,5,5′‐benzophenone tetracarboxylic dianhydride (DBBTDA). DBBTDA was used as monomer to synthesize polyimides by using various aromatic diamines. The polymers were characterized by IR and NMR spectroscopy and elemental analysis. These polyimides had good inherent viscosities in N‐methyl‐2‐pyrrolidinone (NMP) and also high solubility and excellent thermo‐oxidative stability, with 5 % weight loss in the range 433 to 597 °C. Copyright © 2004 Society of Chemical Industry     

Cure kinetics of multifunctional epoxies with 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane as hardener

The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000     

Synthesis and properties of novel 4,4′‐biphenylene‐bridged flame‐retardant cyanate ester resin

The bisphenol‐containing 4,4′‐biphenylene moiety was prepared by the reaction of 4,4′‐bis(methoxymethyl) biphenyl with phenol in the presence of p‐toluenesulfonic acid. The bisphenol was end‐capped with the cyanate moiety by reacting with cyanogen chloride and triethylamine in dichloromethane. Their structures were confirmed by Fourier transform infrared spectroscopy, ¹H‐NMR, and elemental analysis. Thermal behaviors of cured resin were studied by differential scanning calorimetry, dynamic mechanical analysis, and TGA. The flame retardancy of cured resin was evaluated by limiting oxygen index (LOI) and vertical burning test (UL‐94 test). Because of the incorporation of rigid 4,4′‐biphenylene moiety, the cyanate ester (CE) resin shows good thermal stability (T_g is 256°C, the 5% degradation temperature is 442°C, and char yield at 800°C is 64.4%). The LOI value of the CE resin is 42.5, and the UL‐94 rating reaches V‐0. Moreover, the CE resin shows excellent dielectric property (dielectric constant, 2.94 at 1 GHz and loss dissipation factor, 0.0037 at 1 GHz) and water resistance (1.08% immersed at boiling water for 100 h). © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

耐高温环氧胶粘剂及其固化动力学研究

基于TGDDM环氧树脂和DDRS多官能环氧树脂,制得了3种耐高温环氧胶粘剂(J-1,J-2,J-3),并对其不同温度下的粘接强度进行了研究。研究结果表明,其200℃的拉伸剪切强度为15.6~18.6 MPa,耐热性能良好。采用J-3耐高温环氧胶粘剂为样品,利用DSC对其进行了固化动力学研究,采用Kissinger法计算出该环氧胶粘剂的表观活化能第1个峰Ea=69.8kJ/mol,第2个峰Ea=73.2kJ/mol;结合Crane公式求出该体系第1个峰的反应级数n=0.82,第2个峰的反应级数n=1.07。     

Soluble aromatic polyimides and polyamides based on 4,4′-diaminotriphenylmethane

Aromatic polyamides and polyimides were synthesized from 4,4′-diaminotriphenylmethane (DA-TPM) for studying their solubility, thermal, and mechanical properties. The polymers were found to be soluble in amide solvents and pyridine, and this could be attributed to the practically free rotation of the polymer chain segments around the bridging group within the DA-TPM and the effect of its pendant phenyl ring. The polyimides and polyamides exhibited well-distinguished glass transition in the range of temperatures, which is typical for flexible-chain polymers. For the polyimides, significant differences in solubility and mechanical properties were observed between the samples prepared by chemical and thermal imidization of poly(amic acids). Thermal imidization brought about remarkably less soluble brittle films. © 1995 John Wiley & Sons, Inc.     

Synthesis and characterization of 4,4′‐diaminodiphenyl methane‐based benzoxazines and their polymers

A series of diamine‐based benzoxazine precursors have been prepared using 4,4′‐diaminodiphenyl methane, formaldehyde, and different phenol derivatives including phenol, p‐cresol, and 2‐naphthol. Their chemical structures were identified by FTIR, ¹H NMR, and elemental analysis. The curing reactions of those precursors were monitored by FTIR and DSC. The obtained materials exhibited higher glass transition temperature and char yields than the corresponding bisphenol‐A based polybenzoxazines. The polybenzoxazine prepared from phenol showed the highest char yields of 65% and thermal stability with 5 and 10% weight‐loss temperatures at 346 and 432°C, respectively. The polybenzoxazine prepared from 2‐naphthol exhibited the highest glass transition temperature at 244°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007