大功率670nm半导体激光器的研制

采用低压金属有机化学气相沉积生长了670nm激光器外延片,有源区采用单量子阱结构,阱区、垒区分别为InGaAsP和AlGaInP.利用该外延片制作了带无电流注入区的氧化物条形激光器.激光器腔长为900μm,电流注入区条宽为100μm,两端的无注入区宽度均为25μm.镀膜后器件的阈值电流为0.4A,输出波长670士2nm,最大输出功率为1100mW,水平、垂直发散角分别为8°,40°.表明该种结构可以提高器件的腔面光灾变功率.     

大功率670nm半导体激光器的研制

采用低压金属有机化学气相沉积生长了670nm激光器外延片,有源区采用单量子阱结构,阱区、垒区分别为InGaAsP和AlGaInP.利用该外延片制作了带无电流注入区的氧化物条形激光器.激光器腔长为900μm,电流注入区条宽为100μm,两端的无注入区宽度均为25μm.镀膜后器件的阈值电流为0.4A,输出波长670士2nm,最大输出功率为1100mW,水平、垂直发散角分别为8°,40°.表明该种结构可以提高器件的腔面光灾变功率.     

实用化1730nm波段掩埋结构半导体激光器的研制

报道了应用于医疗器械的InP基1730nm波段半导体激光器.外延片采用低压金属有机物化学气相沉积法(MOCVD)生长,有源区为5个周期的InGaAs量子阱层和InGaAsP垒层.器件采用pnpn结限制掩埋结构,有源区脊宽2μm、腔长300μm.室温下腔面镀膜后激光器管芯的阈值电流为18±5mA,8mW输出功率时的工作电流为60±5mA.采用TO封装后,100mA工作电流下激光器的输出功率大于5mW,输出波长为1732±10nm,高温恒流加速老化筛选实验表明,器件具有长期工作的可靠性,满足实用化要求.     

实用化1730nm波段掩埋结构半导体激光器的研制

报道了应用于医疗器械的InP基1730nm波段半导体激光器.外延片采用低压金属有机物化学气相沉积法(MOCVD)生长,有源区为5个周期的InGaAs量子阱层和InGaAsP垒层.器件采用pnpn结限制掩埋结构,有源区脊宽2μm、腔长300μm.室温下腔面镀膜后激光器管芯的阈值电流为18±5mA,8mW输出功率时的工作电流为60±5mA.采用TO封装后,100mA工作电流下激光器的输出功率大于5mW,输出波长为1732±10nm,高温恒流加速老化筛选实验表明,器件具有长期工作的可靠性,满足实用化要求.     

940 nm高功率半导体激光器研究

报道了一种采用大光学腔结构的InGaAs/GaAs/AlGaAs应变量子阱高功率半导体激光器。在量子阱能级本征值方程的数值求解基础上 ,优化了InGaAs阱层材料的In组份含量 ;采用大光学腔结构以有效降低垂直于结平面方向的光束发散角及腔面的光功率密度 ,实现器件的高功率、低发散角光。设计的激光器外延结构采用分子束外延 (MBE)方法生长 ,成功获得具有较低激射阈值的 94 0nm波长激光器外延片。对 10 0 μm条形 ,10 0 0 μm腔长的制备器件测试表明 ,器件的最大连续输出功率达到 2W ,峰值波长为 939.4nm ,远场水平发散角为 10° ,垂直发散角为 30°。器件的阈值电流为 30 0mA。     

高功率14xx nm锥形增益区脊形波导结构量子阱激光器的研制

初步设计14xx nm锥形增益区脊形波导量子阱激光器材料和器件结构,利用MOCVD生长14xx nm InGaAsP/InP量子阱激光器外延片,引入腔破坏凹槽(cavity-spoiling grooves)将有源层刻蚀断以隔离从锥形区反向传输回的高阶模,进一步改善远场光束质量.保持总腔长1900μm不变,改变脊形区的长度,其长度分别为450,700和950μm.对比三种情况的最高输出功率和远场特性,发现LRW＝700μm时,器件特性参数和远场光束质量最优,斜率效率为0.32W/A,饱和输出功率为1.21W,其远场为近衍射极限的高斯分布,发散角为29°×9.6°.当固定脊形区长度为700μm,改变锥形区长度,发现当锥形区长度为1000μm时,器件特性参数进一步提高,斜率效率达0.328W/A,饱和输出功率为1.27W,远场仍为近似高斯分布.     

高功率14xx nm锥形增益区脊形波导结构量子阱激光器的研制

初步设计14xx nm锥形增益区脊形波导量子阱激光器材料和器件结构,利用MOCVD生长14xx nm InGaAsP/InP量子阱激光器外延片,引入腔破坏凹槽(cavity-spoiling grooves)将有源层刻蚀断以隔离从锥形区反向传输回的高阶模,进一步改善远场光束质量.保持总腔长1900μm不变,改变脊形区的长度,其长度分别为450,700和950μm.对比三种情况的最高输出功率和远场特性,发现LRW＝700μm时,器件特性参数和远场光束质量最优,斜率效率为0.32W/A,饱和输出功率为1.21W,其远场为近衍射极限的高斯分布,发散角为29°×9.6°.当固定脊形区长度为700μm,改变锥形区长度,发现当锥形区长度为1000μm时,器件特性参数进一步提高,斜率效率达0.328W/A,饱和输出功率为1.27W,远场仍为近似高斯分布.     

高功率980nm锥形增益区脊形波导量子阱激光器的优化

利用MOCVD生长980nm InGaAs-AlGaAs渐变折射率分别限制异质结单量子阱激光器外延片,采用锥形增益区脊形波导结构制备器件.保持总腔长1850μm不变,改变脊形区的长度分别为450,700和950μm,对比三种情况的P-I特性和光束质量.发现LRW＝450μm时,器件特性参数和远场光束质量最优,斜率效率达0.83W/A,饱和功率为4.28W.输出功率为1W时,远场发散角为7.5°×30.6°,M2因子为3.79.     

高功率980nm锥形增益区脊形波导量子阱激光器的优化

利用MOCVD生长980nm InGaAs-AlGaAs渐变折射率分别限制异质结单量子阱激光器外延片,采用锥形增益区脊形波导结构制备器件.保持总腔长1850μm不变,改变脊形区的长度分别为450,700和950μm,对比三种情况的P-I特性和光束质量.发现LRW＝450μm时,器件特性参数和远场光束质量最优,斜率效率达0.83W/A,饱和功率为4.28W.输出功率为1W时,远场发散角为7.5°×30.6°,M2因子为3.79.     

提高超大光腔波导结构半导体激光器功率效率的设计考虑

对976 nm波段超大光学腔结构半导体激光器的外延和谐振腔设计进行了数值研究。在量子阱层的下方和上方设计了模式控制层,以抑制快轴高阶模的激射。通过能带结构的调控抑制了电子泄漏,调控使得电子势垒从p波导层到p包层增加。优化后的外延结构内部损耗为0.66 cm^-1,内部量子效率为0.954,远场发散角半高全宽为17.4°。对于谐振腔设计,提出了沿谐振腔线性电流分布结构,以减少空间烧孔效应,这使激光器在20 A时功率提高了1.0 W。采用超大光学腔外延结构的4 mm腔长、100 μm发光区宽度的单管芯片,在25°C连续电流注入下,21 W输出功率时达到约71%的高功率效率。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.