Structure and physical properties of undoped ZnO and vanadium doped ZnO films deposited by pulsed laser deposition

Undoped ZnO films were deposited using pulsed laser deposition technique on Si and glass substrates in different O2 partial pressures (ranging from 10(-5) mbar to 3 mbar) and substrate temperatures. When the substrate temperature is 500 degrees C and O2 partial pressure (pp) approximately 3 mbar, randomly oriented ZnO hexagons were observed on glass substrate, whereas, dense ZnO hexagonal rod like structures (diameter ranging from 200-500 nm) were observed on Si substrate. The photoluminescence (PL) characterization of ZnO film grown on Si exhibited an intense defect free narrow excitonic emission in the UV region (Full width half maximum (FWHM) approximately 11.26 nm) as compared to broad emission (FWHM approximately 57.06 nm) from that grown on glass. The parent film emission was found to shift from UV to blue region on doping ZnO with Vanadium.     

Fabrication and optical properties of Pb(Mg(1/3)Nb(2/3))O(3)-PbTiO(3) thin films on Si substrates using the PLD method.

Epitaxial 0.67Pb(Mg(1/3)Nb(2/3))O(3)-PbTiO(3)-0.33PbTiO(3) (PMN-PT) thin films with electro-optic effects were fabricated on (PMN-PT) thin films with electro-optic effects were fabricated on (La0(0.5)Sr0(0.5))CoO(3) (LSCO)/CeO(2)/YSZ-buffered Si(001) substrates using double-pulse excitation pulsed laser deposition (PLD) method with a mask placed between the target and the substrate. Epitaxial growth of PMN-PT thin films was undertaken using the two-step growth method of PMN-PT film. The PMN-PT seed layer was deposited at 500 degrees C on the LSCO/CeO(2)/YSZ/Si, which temperature was the same as that used for LSCO deposition. The PMN-PT thin films were deposited on the PMN-PT seed layer at 600 degrees C, which enables growth of high-crystallinity PMN-PT films with smooth surfaces. We obtained optimum fabrication conditions of PMNPT film with micrometer-order thickness. Resultant films showed high crystallinity with full width at half maximum (FWHM) = 0.73 deg and 1.6 mum thickness. Electro-optic properties and the refractive index value were measured at 633 nm wavelength using the prism coupling method. The obtained refractive index was 2.59. The electro-optic coefficients r(13) and r(33) were determined by applying the electrical field between a semitransparent, thin top electrode of Pt and a bottom LSCO electrode. The electro-optic coefficient was r(13) = 17 pm/V at transverse electric field (TE) mode and r(33) = 55 pm/V at transverse magnetic field (TM) mode.     

Current conduction mechanisms in HfO2 and SrHfON thin films prepared by magnetron sputtering

Metal–oxide–semiconductor (MOS) capacitors incorporating HfO₂ and SrHfON gate dielectrics were fabricated by magnetron sputtering. The interface quality, thermal stability, and electrical properties of the MOS capacitors have been investigated. Compared to HfO₂ dielectric film, SrHfON dielectric film has thin interface layer with Si substrate, good thermal stability, and low leakage current densities. The dominant current conduction mechanisms (CCMs) of HfO₂ film are Schottky emission or Poole–Frenkel emission at low and high electric fields. The main CCMs of SrHfON film are Schottky emission or Poole–Frenkel emission at low electric field, whereas, the CCMs are replaced by space charge limited current at high electric field.     

Fabrication and characterization of ZnO nanoneedle array using metal organic chemical vapor deposition

High density and vertically well-aligned ZnO nanoneedle arrays were fabricated on the ZnO thin film deposited on silicon substrates. The ZnO buffer layer and nanoneedles were synthesized by metal organic chemical vapor deposition using diethylzinc and oxygen gas. The ZnO buffer film was grown at 250 degrees C and the growth temperature of nanoneedles was in the range of 480-500 degrees C. As-grown ZnO nanoneedles showed single crystalline structure of ZnO (002). The crystalline properties of three samples (A: as-deposited ZnO buffer layer, B: annealed buffer film, C: ZnO nanoneedles) were compared using XRD and Raman spectroscopy. The synthesized ZnO nanoneedles (sample C) showed highest crystalline quality among three samples. The field emission properties of ZnO nanoneedles were investigated, which showed low turn on field of 4.8 Vmicrom(-1) and high field enhancement factor of 3.2 x 103.     

The effects of substrate and annealing on structural and electrochemical properties in LiCoO2 thin films prepared by DC magnetron sputtering

LiCoO2 thin films were fabricated by direct current magnetron sputtering method on STS304 and Ti substrates. The effects of substrate and annealing on their structural and electrochemical properties of LiCoO2 thin film cathode were studied. Crystal structures and surface morphologies of the deposited films were investigated by X-ray diffraction and field emission scanning electron microscopy. The as-deposited films on both substrates have amorphous structure. The (104) oriented perfect crystallization was obtained by annealing over 600 degrees C in STS304 substrate. The LiCoO2 thin film deposited on Ti substrate shows the (003) texture after annealing at 700 degrees C. The electrochemical properties were investigated by the cyclic voltammetry and charge-discharge measurement. The 600 degrees C-annealed LiCoO2 film deposited on STS304 substrate exhibits the inithial discharge capacity of 22 uAh/cm2 and the 96% capacity retention rate at 50th cycles. The electrochemical measurement on annealed films over 600 degrees C was impossible due to the formed TiO2 insulator layer using Ti substrate. As a result, it was found that the STS304 substrate seems to be more suitable material than the Ti substrate in fabricating LiCoO2 thin film cathode.     

Effects of growth atmosphere and homo-buffer layer on properties of ZnO films prepared on Si(1 1 1) by PLD

ZnO films were synthesized on Si(1 1 1) substrates by pulsed laser deposition (PLD) under four different growth conditions. The structural and optical properties of the samples were characterized by reflection high-energy electron diffraction (RHEED), X-ray diffraction (XRD), and photoluminescence (PL) measurement. It is found that when ZnO film is directly prepared on Si, oxygen atmosphere can significantly enhance the near-band-edge (NBE) emission and decrease the deep-level (DL) emission, but cause a polycrystalline film. By introducing a homo-buffer layer fabricated at 500 °C in vacuum, epitaxial ZnO film with three-dimensional (3D) growth mode is achieved instead of the polycrystalline film. In particular, the epitaxial film with the buffer layer shows more intensive NBE emission and narrower full-width at half maximum (FWHM) of 98 meV than the film without the buffer layer. The experimental results suggest that both oxygen atmosphere and buffer layer are quite efficient during PLD to grow high-quality ZnO/Si heteroepitaxial films suitable for applications in optoelectronic devices.     

Fabrication of dye-sensitized solar cells using Nb2O5 blocking layer made by sol-gel method

In this study, nanocrystalline Nb2O5 thin film has been prepared via sol-gel process using niobium ethoxide as a precursor. Sol-gel films using various ratios of H2O/Nb have been prepared on fluorinated tin oxide (FTO) glass substrate, and used as electron-blocking layer of dye-sensitized solar cell (DSSC). The Nb2O5 film as deposited was amorphous, but became crystalline with hexagonal phase after heat treatment at 600 degrees C. With higher H2O/Nb molar ratio, denser and more uniform Nb2O5 film surface was obtained. DSSCs with the structure of FTO/Nb2O5/TiO2/Dye/EL/Pt/FTO have been prepared, and their solar-cell performance was evaluated. By introduction of Nb2O5 sol-gel film between FTO and TiO2 layer in DSSCs, energy conversion efficiency could be improved.     

Thermal stability of metal-silicide nanocrystal nonvolatile memory with barrier engineered tunnel layers

WSi2 nanocrystal nonvolatile memory devices were fabricated with a silicon oxide-nitride-oxide (SiO2: 2 nm/Si3N4:2 nm/SiO2:3 nm) tunnel layer. WSi2 nanocrystals of 2.5 nm diameters and a density of 3.6 x 10(12) cm(-2) were formed using radio frequency magnetron sputtering and annealing processes. The WSi2 nanocrystal nonvolatile memory device exhibited strong thermal stability during writing/erasing operations at temperatures up to 125 degrees C. When the writing/erasing voltages were applied at +10 V/-10 V for 500 ms, the memory window of the initial approximately 2.6 V decreased by approximately 1.1 V at 25 degrees C and 0.4 V at 125 degrees C after 10(4) sec, respectively. These results show that WSi2 nanocrystals with barrier-engineered tunnel layers are possible for application in nonvolatile memory devices.     

Influences of Ti film thickness on electrochemical properties of Si/Ti/Cu film electrodes

Si and Si/Ti films were fabricated on a Cu current collector (substrate) using the DC sputtering system. The Ti film as a buffer layer was inserted between the Si film and the Cu current collector. Their structural and electrochemical properties were investigated with various Ti film thicknesses of 20-90 nm. The Si and Ti films deposited on a polycrystalline Cu substrate were amorphous. The Si/Ti/Cu film electrode exhibited better electrochemical properties than the Si/Cu electrode in terms of capacity, charge-discharge efficiency, and cycleability. In the Si/Ti/Cu electrode, the film electrode with a 55 nm Ti film thickness showed the best electrochemical properties: 367 microA h/cm2 initial capacity, 91% efficiency, and 50% capacity retention after 100 cycles. These good electrochemical properties are attributed to the enhanced adhesion between the Si and Ti films. Additionally, the modified surface morphology of Si film with a cluster structure could withstand the lateral volume change during the charge-discharge process.     

Deposition of GaN films on (1 1 1) Si substrates by alternate supply of TMG and NH3

GaN films were grown on (1 1 1) Si substrates at 1000 °C by separate admittances of trimethylgallium (TMG) and ammonia (NH₃). To achieve high quality GaN films, the optimization in growth temperature and layer thickness of AlN buffer layer between GaN film and Si substrate is required. Cross-sectional transmission electron microscopic observations of the GaN/(1 1 1)Si samples show a nearly parallel orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. Room temperature photoluminescence spectra of high quality GaN films show a strong near band edge emission and a weak yellow luminescence. The achievement of high quality GaN films on (1 1 1) Si substrates is believed to be attributed to enhancement in surface mobilities of the adsorbed surface species and adequate accommodation of lattice mismatch between high temperature AlN buffer layer and Si substrate.     

Thermal stability of atomic layer deposited Ru layer on Si and TaN/Si for barrier application of Cu interconnection

The thermal stability of thin Ru single layer and Ru/TaN bilayers grown on bare Si by plasma enhanced atomic layer deposition (PEALD) have been studied with Cu/Ru, Cu/Ru/TaN structures as a function of annealing temperature. To investigate the characteristics as a copper diffusion barrier, a 50 nm thick Cu film was sputtered on Ru and Ru/TaN layers and each samples subjected to thermal annealing under N2 ambient with varied temperature 300, 400, and 500 degrees C, respectively. It was found that the single 5 nm thick ALD Ru layer acted as an effective Cu diffusion barrier up to 400 degrees C. On the other hand ALD Ru (5 nm)/TaN (3.2 nm) showed the improved diffusion barrier characteristics even though the annealing temperature increased up to 500 degrees C. Based on the experimental results, the failure mechanism of diffusion barrier would be related to the crystallization of amorphous Ru thin film as temperature raised which implies the crystallized Ru grain boundary served as the diffusion path of Cu atoms. The combination of ALD Ru incorporated with TaN layer would be a promising barrier structure in Cu metallization.     

Atomic layer deposition of SiO2 thin films using tetrakis(ethylamino)silane and ozone

We examined the atomic layer deposition (ALD) of silicon dioxide thin films on a silicon wafer by alternating exposures to tetrakis(ethylamino)silane [Si(NHC2H5)4] and O3. The growth kinetics of silicon oxide films was examined at substrate temperatures ranging from 325 to 514 degrees C. The deposition was governed by a self-limiting surface reaction, and the growth rate at 478 degrees C was saturated at 0.17 nm/cycle for Si(NHC2H5)4 exposures of 2 x 10(6) L (1 L = 10(-6) Torr x s). The films deposited at 365-404 degrees C exhibited a higher deposition rate of 0.20-0.21 nm/cycle. However, they contained impurities, such as carbon and nitrogen, and showed poor film qualities. The concentration of impurities decreased with increasing substrate temperature. It was found that the films deposited in the high-temperature regime (478-514 degrees C) showed excellent physical and electrical properties equivalent to those of LPCVD films.     

Tantalum and niobium as a diffusion barrier between copper and silicon

The efficiency of Ta and Nb films as diffusion barriers between thin Cu film and Si substrate has been studied using Auger electron spectroscopy, X-ray diffraction, optical microscopy, scanning electron microscopy and sheet resistance measurements. Two kinds of system were prepared by electron-beam evaporation: Cu/Ta (or Nb)/Si and Cu/Ta (or Mb) SiO₂/Si. The samples were annealed at temperatures from 400 to 800C in a vacuum of 1 × 10^–7 torr (13 Pa) for 30 min. In the Cu/Ta (or Nb)/Si system, the thermal stability was determined by interdiffusion at local sites, forming suicides, whereas the Cu/Ta (or Nb)/SiO₂/Si system degraded by interdiffusion at the interface between Ta (or Nb) and Cu. It appears that Ta is a more effective diffusion barrier than Nb for both kinds of system. This difference in the barrier effect of the transition metals is attributed to differences between oxygen segregation at grain boundaries of barrier layers and differences between diffusion coefficients through barrier layers. It is suggested that the driving force for interdiffusion may play a major role in the reaction that determines the thermal stability of a given contact system; this suggestion is based on the fact that the interdiffusion in Cu/barrier/Si systems is suppressed by interposing an SiO₂ layer in the Si substrate.     

Fabrication of carbon nanotubes field emission cathode by composite plating

Carbon nanotubes (CNTs) have high aspect ratio and have great potential to be applied as the field emission cathode because of its large field enhancement factor. In this work, a high performance carbon nanotube field emission cathode (CNTFC) was fabricated by using a composite plating method. The CNTs were purified by acid solutions and then dispersed in electrobath with nickel ions at temperatures of 60, 70, or 80 degrees C for the electroless plating process on glass substrate. The resulting CNT-Ni composite film has strong adhesion on the glass substrate. The degree of graphitization and the microstructure of the CNTFCs were studied by Raman spectroscopy and scanning electron microscopy. The field emission properties of the CNTFCs show a low turn-on electric field E(on) of about 1.2 V/microm, and a low threshold electric field E(th) of about 1.9 V/microm. Such a composite plating method could be applied to the fabrication of large area CNT field-emission displays.     

Vertically aligned carbon-nanotube arrays showing Schottky behavior at room temperature

Vertically aligned carbon-nanotube (CNT) arrays were fabricated in the thin-film anodic aluminum oxide (AAO) templates on silicon wafers utilizing a niobium (Nb) thin film as the source electrode. The average diameter of the CNTs was 25 nm, and the number density was 3 x 10(10) cm(-2). The CNT arrays synthesized at 700 degrees C and above exhibited Schottky behavior even at 300 K, with energy gaps between 0.2 eV and 0.3 eV. However, individual CNTs obtained by removal of the template behaved as resistors at 300 K. The CNT/Nb oxide/Nb junction is thought to be responsible for the Schottky behavior. This structure can be a useful cornerstone in the fabrication of nanotransistors operating at room temperature.     

Stable, low-loss optical waveguides and micromirrors fabricated in acrylate polymers

Acrylate-based optical waveguides have been fabricated with optical loss of 0.5 dB/cm at 1300 nm by means of a new material system that ensures stable optical and mechanical properties over a wide temperature range. No increase in loss was measured after 500 h at temperatures up to 150 degrees C, and there was no significant increase in loss during short (<5 min) temperature excursions to 300 degrees C for bonding. Single-mode waveguides were fabricated with refractive indices for core and clad of 1.505 and 1.500, respectively, so that the mode field is very similar to that of single-mode silica fiber. Guides were fabricated on both planar and structured substrates of Si and GaAs as well as on substrates coated with metals and dielectrics. Fabrication involved spin coating and UV exposure to cross-link the polymer, but the substrate temperature did not exceed 180 degrees C. With this method guides could be fabricated on a range of substrates up to 125 cm in diameter, including those with multilayer metallization for multichip modules, providing optical interconnect capability. Microprism reflecting surfaces were fabricated in the waveguides to couple light out normal to the substrate. All the processing was compatible with normal semiconductor fabrication.     

Effect of substrate temperature on the in-situ formation of crystalline SiC nanostructured film using ultra-high-vacuum ion beam sputtering

In this paper, we have investigated the effect of substrate temperature on the in-situ formation of crystalline SiC (c-SiC) nanostructured film using ultra-high-vacuum ion beam sputtering (UHV IBS). The phase transformation, bonding behavior, morphology, composition and interdiffusion of the SiC nanostructured film were examined by X-ray diffraction, Raman spectra, high resolution scanning electron microscopy (SEM) with the attached energy dispersive X-ray detector and Auger electron spectroscopy (AES) depth profile, respectively. The in-situ formation of c-SiC was through interdiffusion and reaction between the sputtered carbon (C) and the crystalline Si (c-Si) substrate at high temperature. The amorphous-like C microstructure is stable up to 500 degrees C and transformed into a new phase of c-SiC together with the remained C at 600 degrees C. Complete C and Si reaction was found at 700 degrees C from Raman spectra without any C peaks. The main diving force for the c-SiC formation is the thermal energy to activate the large interdiffusion between C and c-Si which was detected from AES depth profile. Also, a nanoweb-like morphology of the c-SiC was observed on the surface of film from the SEM image. Therefore, the c-SiC nanostructured film can be obtained at 700 degrees C using in-situ UHV IBS process, which is much lower than conventional CVD c-SiC.     

Structure and electrical properties of (111)-oriented Pb(Mg1/3Nb2/3)O3-PbZrO3-PbTiO3 thin film for ultra-high-frequency transducer applications

Ternary lead magnesium niobate-lead zirconate titanate system 0.4Pb(Mg(1/3)Nb(2/3))O(3)-0.25PbZrO(3)-0.35PbTiO(3) (40PMN-25PZ-35PT) thin film with a thickness of 1.5 μm was grown on Pt(111)/Ti/SiO(2)/Si substrate via chemical solution deposition. X-ray diffraction and transmission electron microscopy results suggested the film obtained was highly (111)-oriented. The remanent polarization and coercive electric field of the film were found to be 25.5 μC/cm(2) and 51 kV/cm, respectively. In addition, at 1 kHz, the dielectric constant was measured to be 1960 and the dielectric loss 0.036. The film was observed to undergo a diffuse ferroelectric-to-paraelectric phase transition at around 209°C. The leakage current appeared to depend on the voltage polarity. If the Au electrode was biased positively, the leakage current was dominated by the Schottky emission mechanism. When the Pt electrode was biased positively, the conduction current curve showed an ohmic behavior at a low electric field and space-charge-limited current characteristics at a high electric field.     

Repetitive growth stages in the solid phase epitaxy of silicon

We have studied the solid phase epitaxial growth of Si in the thin film system with a layer structure of Si(〈100〉 substrate)/Pd silicide/Si(amorphous). At approximately 500°C the 〈100〉Si single-crystal substrate grows with a corresponding consumption of the Si(amorphous) layer. Growth starts with nucleation of islands on the substrate. These islands then grow laterally to form a uniform layer. A second stage of island growth then develops and the process goes on repetitively. However, differences between the first and subsequent stages are observed.     

Temperature dependence of the stress in PSG/AlSi structures

The temperature dependence of the stress in each layer of a film system comprising chemically vapour-deposited phosphosilicate glass (PSG) on an AlSi alloy film on a silicon substrate was investigated in the range 20–500°C. During a heating process in which the temperature exceeded 150°C, the deformation of the AlSi film was found to be caused by diffusional creep, and the stresses in both the AlSi film and the PSG film increased with increasing silicon concentration in the AlSi film. Deformation of AlSi film during a cooling process in which temperatures were higher than 150°C was found to be caused by the generation of dislocation loops or by grain boundary sliding. These phenomena are interpreted as representing relaxation of the total elastic energy of the system which results from the deformation of the AlSi film.