Current and future technology of low‐temperature poly‐Si TFT‐LCDs

Abstract— The state of the art of large‐area low‐temperature TFT‐LCDs will be reported in this paper. High‐performance poly‐Si TFTs are expected to realize various applications such as system display where various signal‐processing functions are added to the display. In the past few years, low‐temperature poly‐Si thin‐film‐transistor (LTPS TFT) technology has made great progress, especially in the areas of excimer laser annealing (ELA) of high‐quality poly‐Si film, ion doping for large‐area doping, and high‐quality gate SiO₂ film formation by using the low‐temperature PE‐CVD method. Also, technology trends and possible applications, such as a system displays, will be discussed.     

A new current‐mirror pixel circuit employing poly‐Si TFTs for active‐matrix organic light‐emitting‐diode displays

Abstract— A novel active‐matrix organic light‐emitting‐diode (AMOLED) display employing a new current‐mirror pixel circuit, which requires four‐poly‐Si TFTs and one‐capacitor and no additional signal lines, has been proposed and sucessfully fabricated. The experimental results show that a new current mirror can considerably compensate luminance non‐uniformity and scale down a data current more than a conventional current‐mirror circuit in order to reduce the pixel charging time and increase the minimum data current. Compared with a conventional two‐TFT pixel, the luminance non‐uniformity induced by the grain boundaries of poly‐Si TFTs can be decreased considerably from 41% to 9.1%.     

Low‐temperature poly‐Si TFT data drivers for an SVGA a‐Si TFT‐LCD panel

Low‐temperature poly‐Si TFT data drivers for an SVGA a‐Si TFT‐LCD panel have been developed. The data drivers include shift registers, sample‐and‐hold circuits, and operational amplifiers, and drive LCD panels using a line‐at‐a‐time addressing method. To reduce the power consumption of the shift register, a dot‐clock control circuit has been developed. Using this circuit, the power consumption of the shift register has been reduced to 36% of that of conventional circuits. To cancel the offset voltage generated by the operational amplifier, an offset cancellation circuit for low‐temperature poly‐Si TFTs has been developed. This circuit is also able to avoid any unstable operation of the operational amplifier. Using this circuit, the offset voltage has been reduced to one‐third of the value without using the offset cancellation circuit. These data drivers have been connected to an LCD panel and have realized an SVGA display on a 12.1‐in. a‐Si TFT‐LCD panel.     

A new threshold‐voltage compensation technique of poly‐Si TFTs for AMOLED display pixel circuits

Abstract— A new threshold‐voltage compensation technique for polycrystal line‐silicon thin‐film transistors (poly‐Si TFTs) used in active‐matrix organic light‐emitting‐diode (AMOLED) display pixel circuits is presented. The new technique was applied to a conventional 2‐transistor—1‐capacitor (2T1C) pixel circuit, and a new voltage‐programmed pixel circuit (VPPC) is proposed. Theoretically, the proposed pixel is the fastest pixel with threshold‐voltage compensation reported in the literature because of the new compression technique implemented with a static circuit block, which does not affect the response time of the conventional 2T1C pixel circuit. Furthermore, the new pixel exhibits all the other advantages of the 2T1C pixel, such as the simplicity of the peripheral drivers and improves other characteristics, such as its behavior in the temperature variations. The verification of the proposed pixel is made through simulations with HSpice. In order to obtain realistic simulations, device parameters were extracted from fabricated low‐temperature poly‐Si (LTPS) TFTs.     

Low‐power‐consumption TFT‐LCD with dynamic memory embedded in the pixels

A low‐power‐consumption thin‐film‐transistor liquid‐crystal display (TFT‐LCD) with dynamic memory cells embedded in each pixel using low‐temperature poly‐Si technology has been developed. By holding data in the memory, the operating rate of the data driver can be dramatically reduced to 4 Hz. Eight levels of gray scale with low power consumption can be achieved by using the area‐ratio gray‐scale method. This TFT‐LCD can be used for displaying fine still images, with low power consumption.     

Electro‐optic properties of an intrinsic half‐V‐mode FLCD and its application to field‐sequential full‐color LCDs using a poly‐Si TFT matrix array

Abstract— An intrinsic half‐V‐mode ferroelectric liquid‐crystal display (FLCD) exhibiting a high contrast ratio (300:1), owing to defect‐free gray‐scale capability, with a high response speed (τ ? 400 μsec) and good switchability with TFTs, has been developed. Furthermore, this FLCD features high‐temperature reliability owing to the use of a special hybrid alignment technique. We successfully fabricated an active‐matrix poly‐Si TFT field‐sequential full‐color (FS FC) LCD with XGA specifications and a 0.9‐in. diagonal using a half‐V‐mode FLCD and an RGB light‐emitting‐diode (LED) array microdisplay. It is shown that the fabricated active‐matrix FS FCLCD exhibits good moving‐image performance with high full‐color display capability.     

PECVD films for low‐temperature poly‐Si TFT‐LCD applications

Low‐temperature polycrystalline‐silicon (poly‐Si) thin‐film‐transistor (TFT) processes, based on PECVD amorphous‐silicon (a‐Si:H) precursor films and excimer‐laser crystallization, have been developed for application in the fabrication of active‐matrix liquid‐crystal‐displays (AMLCDs). The optimum process for depositing the precursor films has been identified. The relationship between excimer‐laser crystallization and poly‐Si film morphology has also been studied. Using these techniques, poly‐Si TFTs with a mobility of 275 cm²/V‐sec and on/off ratios of 1 × 10⁷ have been fabricated.     

Active‐matrix organic light‐emitting diode using inverse‐staggered poly‐Si TFTs with a center‐offset gated structure

Abstract— A low‐cost active‐matrix backplane using non‐laser polycrystalline silicon (poly‐Si) having inverse‐staggered TFTs with amorphous‐silicon (a‐Si) n⁺ contacts has been developed. The thin‐film transistors (TFTs) have a center‐offset gated structure to reduce the leakage current without scarifying the ON‐currents. The leakage current of the center‐offset TFTs at Vg = ?10 V is two orders of magnitude lower than those of the non‐offset TFTs. The center‐offset length of the TFTs was 3 μm for both the switching and driving TFTs. A 2.2‐in. QQVGA (1 60 × 1 20) active‐matrix organic light‐emitting‐diode (AMOLED) display was demonstrated using conventional 2T + 1C pixel circuits.     

Latest developments for “system‐on‐glass” displays using low‐temperature poly‐Si TFTs

Abstract— A 2.3‐in.‐diagonal QVGA‐formatted “System‐On‐Glass” display has been developed by using low‐temperature poly‐Si TFT‐LCD technology. This display fully integrates 6‐bit RGB digital interface drivers as well as all the power supply circuitry to drive the LCD, which requires neither external driver ICs nor power‐supply ICs. This paper discusses the newly developed TFT circuit technologies used in this LCD. The development trend of the “System‐On‐Glass” display is also reviewed.     

Digital‐to‐analog converter with gamma correction on glass substrate for TFT‐panel applications

Abstract— Low‐temperature polysilicon (LTPS) technology has a tendency towards integrating all circuits on glass substrate. However, the poly‐Si TFTs suffered poor uniformity with large variations in the device characteristics due to a narrow laser process window for producing large‐grained poly‐Si TFTs. The device variation is a serious problem for circuit realization on the LCD panel, so how to design reliable on‐panel circuits is a challenge for system‐on‐panel (SOP) applications. In this work, a 6‐bit R‐string digital‐to‐analog converter (DAC) with gamma correction on glass substrate for TFT‐panel applications is proposed. The proposed circuit, which is composed of a folded R‐string circuit, a segmented digital decoder, and reordering of the decoding circuit, has been designed and fabricated in a 3‐μm LTPS technology. The area of the new proposed DAC circuit is effectively reduced to about one‐sixth compared to that of the conventional circuit for the same LTPS process.     

Clamped‐inverter circuit architecture for luminescent‐period‐control driving of active‐matrix OLED displays

Abstract— An innovative pixel‐driving technology for high‐performance active‐matrix OLED flat‐panel displays is described. Called “clamped‐inverter circuit architecture,” it uses luminescent‐period‐control driving to reduce the inter‐pixel non‐uniformity caused by the device‐to‐device variability of low‐temperature poly‐Si TFTs. A prototype full‐color display shows a luminous deviation of less than 1.6%, which corresponds to only the LSB‐error in 6‐bit gray‐scale.     

Characteristics and stability of improved re‐crystallized metal‐induced laterally crystallized polycrystalline‐silicon thin‐film transistors for display applications

Abstract— The performance of high‐temperature re‐crystallized (RC) metal‐induced laterally crystallized (MILC) polycrystalline‐silicon (poly‐Si) thin‐film transistors (TFT) have been improved by (1) patterning the active islands before MILC, (2) removing nickel‐containing residues using acid cleaning, (3) using heavily boron‐doped poly‐Si gates to achieve threshold voltage symmetry, and (4) double‐implanting n‐type source/drain junctions. A 30‐MHz driver circuit based on this improved technology was demonstrated. The reliability of optimized RC‐MILC poly‐Si TFTs has not been adversely affected by residual nickel‐containing contaminants in the TFT channel regions.     

Low‐temperature poly‐Si TFT‐LCD with an integrated analog circuit

We have developed a 6‐bit D/A converter and amplifier integrated low‐temperature poly‐Si TFT‐LCD in which an integrated signal‐line driver is driven by a 5‐V power supply. We have employed a D/A converter including a new capacitor array and an original amplifier comprised of serially connected comparators to achieve high accuracy. The D/A converter performs gamma correction using upper significant bits of input data. Control signals for these circuits were generated by the integrated timing circuit. These advances in integration have been achieved for the first time using 3‐μm design rule and improved LTPS TFT technologies and provide an advanced display system with lower power consumption, smaller module size, and higher durability.     

Current programming pixel circuit and data‐driver design for active‐matrix organic light‐emitting diodes

Abstract— We propose a new pixel design for active‐matrix organic light‐emitting diodes (AMOLEDs) employing five polycrystalline thin‐film transistors (poly‐Si TFTs) and one capacitor, which decreases the data current considerably in order to reduce the charging time compared with that of conventional current‐mirror structures. Also, the new pixel design compensates the threshold‐voltage degradation of OLEDs caused by continuous operation and the non‐uniformity of poly‐Si TFTs due to excimer‐laser annealing. The proposed pixel circuit was verified by SPICE simulation, based on measured TFT and OLED characteristics. We also propose current‐data‐driver circuitry that reduces the number of shift‐register signals for addressing the current data driver by one‐half.     

An integrated poly‐Si TFT current data driver with a data‐line pre‐charge function

Abstract— We have developed an integrated poly‐Si TFT current data driver with a data‐line pre‐charge function for active‐matrix organic light‐emitting diode (AMOLED) displays. The current data driver is capable of outputting highly accurate (±0.8%) current determined by 6‐bit digital input data. A novel current‐programming approach employing a data‐line pre‐charge function helps achieve accurate current programming at low brightness. A 1.9‐in. 120 × 136‐pixel AMOLED display using these circuits was demonstrated.     

LTPS circuit integration for system‐on‐glass LCDs

Abstract— A 3.5‐in. QVGA‐formatted driving‐circuit fully integrated LCD has been developed using low‐temperature poly‐Si (LTPS) technology. This display module, in which no external ICs are required, integrates all the driving circuits for a six‐bit RGB digital interface with an LTPS device called a “FASt LDD TFT” and achieves a high‐quality image, narrow frame width, and low power consumption. The LTPS process, device, and circuit technologies developed for system‐on‐glass LCD discussed. The development phase of LTPS circuit integration for system‐on‐glass LCDs is also reviewed.     

High‐performance thin‐film transistor using silicide‐mediated crystallization

Abstract— We studied the silicide‐mediated crystallization of a‐Si for low‐temperature polycrystalline‐silicon (LTPS) on glass. By controling the heating method and Ni density on the a‐Si, the grain size could be increased to 40 μm. Radial grain growth from a NiSi₂ crystalline nucleus gives rise to a large‐grain poly‐Si without amorphous phase inside. A field‐effect mobility of over 200 cm²/V‐sec was achieved by using LTPS.     

New applications for LTPS array technology including lab‐on‐chip and MEMS actuators

Abstract— The use of low‐temperature poly‐Si technology for new applications beyond displays is presented. These applications include lab‐on‐chip, MEMS actuators, and sensors. As a key example, the use of high‐voltage poly‐Si TFTs for rapid heating and temperature control, as is required for DNA amplification within lab‐on‐chip, is described in detail. Other examples given include MEMS ink‐jet printer heads and the formation of photosensors and impedance sensors for optical and electronic input, which can be used not only in displays and lab‐on‐chip, but also for new applications such as fingerprint sensing and particle counting.     

A touch‐sensitive display with embedded hydrogenated amorphous‐silicon photodetector arrays

Abstract— A new touch‐sensitive hydrogenated amorphous‐silicon (a‐Si:H) display with embedded optical sensor arrays is presented. The touch‐panel operation was successfully demonstrated by fabricating a prototype of a 16‐in. active‐matrix liquid‐crystal display (AMLCD). The proposed system, obviating the need for the extraction of information from the captured images in real time, provides the location of the finger touch. Due to the simple architecture of the system, the touch‐panel operation can be readily integrated within large‐area displays.     

Full‐color active‐matrix OLED based on a‐Si TFT technology

Abstract— We have successfully demonstrated a 4‐in. full‐color active‐matrix OLED display based on amorphous‐Si (a‐Si) TFT technology. With improvements in the TFT manufacturing process and structure, a‐Si TFTs provide abundant capability to drive OLEDs. This demonstration clearly shows the possibility of using a‐Si TFTs as driving backplanes in the manufacture of full‐color AMOLEDs.