The real DSP chip market

The biggest market for integrated circuits based on DSP is one most people do not recognize as such. These are chips that employ DSP functionality, but they are almost never programmable by the purchaser and are never sold under the DSP name. They are MPEG codecs, MP3 decoders, Wi-Fi or Bluetooth baseband chips, DVD decoders, digital camera JPEG encoders, DSL modems, cable modems, AC-3 audio codecs, disk read channels, gigabit LAN chips, and a laundry fist of others.     

全球工业芯片产业现状及对我国工业芯片发展的建议

工业芯片已经成为新工业革命和新基础设施建设的关键支撑,工业芯片的研发和制造水平是衡量一个国家整体制造业竞争力的真正试金石。但是,目前我国工业芯片产业在发展模式、产业链上下游协同合作,共性技术研发、配套服务体系建设以及前沿技术布局等方面均面临着很多不足与问题。本文将通过分析全球工业芯片发展特点、现状及基本格局、我国工业芯片市场规模和需求,以及其存在的主要问题,提出我国工业芯片发展的建议,为我国工业芯片产业发展及其能力提升提供一定参考。     

Gigabit local area networks: a systems perspective

A broad overview of gigabit local area networks (LANs) is presented from a systems perspective. Motivations and technical goals of gigabit LANs and challenges of coping with highly bursty traffic and large bandwidth mismatches between network links are described. The focus is on concerns unique to gigabit LANs, especially issues that differentiate them from gigabit wide area networks (WANs), metropolitan area networks (MANs), and lower-speed LANs. Major systems issues are discussed, and possible solutions, such as the virtual-connection architecture, are presented. The hardware technology required by gigabit LANs is illustrated by SONET components     

OCDMA over WDM PON-solution path to gigabit-symmetric FTTH

It will be revealed that a myth of deploying low bit-rate uplink fiber-to-the-home (FTTH) services while providing a high bit-rate downlink is wrong. Therefore, for the future broadband FTTH services, the focus should be on the capability to provide gigabit- or even multigigabits-per-second both in up- and downlinks, namely gigabit symmetric systems. Optical code-division multiple access (OCDMA) now deserves a revisit as a powerful alternative to time-division multiple access and wavelength-division multiple (WDM) access in FTTH systems. In this paper, the authors will first highlight the OCDMA systems. The system architecture and its operation principle, code design, optical en/decoding, using a long superstructured fiber Bragg grating (SSFBG) en/decoder, and its system performance will be described. Next, an OCDMA over WDM passive optical network (PON) as a solution for the gigabit-symmetric FTTH systems will be proposed. The system architecture and the WDM interchannel crosstalk will be studied. It will be shown that by taking advantage of reflection spectrum notches of the SSFBG en/decoder, the WDM interchannel crosstalk can be suppressed and can enable OCDMA over WDM PON to simultaneously provide multigigabit-per-second up- and downlinks to a large number of users.     

Very-high-speed optical signal processing

Challenges of next-generation transmission technologies are summarized in the context of creating future terabit-per-second networks. The technologies will be realized through both the separate and combined evolution of inherent lightwave capabilities along with time-, wavelength-, and space-domain optical processing techniques. Optical signal processing techniques in the tens of gigabit per second range for future high-speed transmission systems and broadband networks are reviewed     

宇航用千兆LVDS传输线等长试验研究

LVDS(低压差分信号)技术广泛地应用于对低抖动、信号完整性和共模特性要求较高的系统中。为了确保LVDS信号传输的完整性,对宇航用千兆LVDS传输线(差分线对两绝缘线)等长与否对所传输信号的衰减以及对内延时差的影响进行了试验研究。研究结果发现:两差分传输线非等长是宇航用千兆LVDS传输线中差分信号传输质量下降的主要原因之一,而控制等长的重要工序为对绞,控制手段为张力一致;在传输2Gb/s LVDS信号时,宇航用千兆LVDS传输线中两差分传输线的长度偏差应小于1.6mm。     

Defining, designing, and evaluating digital communication systems

The fundamental relationships in defining, designing, and evaluating digital communication system performance are reviewed. The concept of bandwidth-limited and power-limited systems and how such conditions influence the design when the choices are confined to M -ary phase-shift keying (MPSK) and M-ary frequency-shift keying (MFSK) modulation are examined. The definitions and computations involved in transforming from data bits to channel bits to symbols to chips are discussed. It is suggested that since most digital communication systems share these concepts, understanding them should enable one to evaluate other such systems in a similar way     

Ultra-high efficiency solar cells: the path for mass penetration of solar electricity

For achieving a photovoltaic penetration above one-third of the world demand for electricity in the first half of this century, the importance of a fast manufacturing learning curve that is linked to the capacity of developing cells of increasing efficiency is stressed. Progress in multijunction cells is described as well as three novel concepts promising very high efficiency. It is explained why these concepts will probably be used in concentrator systems.     

基于同轴与光纤结合的2km数据传输的设计

若采用没有信号调节功能的LVDS芯片与设有驱动器预加重功能和接收器均衡功能的LVDS集成电路构成系统传输数据,电缆的长度便可最多到数百米。但这些系统想要进行数十公里长距离的数据传送,便应将LVDS信号经过光模块转成光信号来传输,并将之与LVDS系统一起搭配使用。采用DS92LV1023和DS92LV1224型号的LVDS芯片与驱动芯片CLC006和CLC014相互配合构成LVDS系统,再与光模块构成一个大系统便能够传输数十公里的距离。该系统已投入使用,其性能可靠、稳定、支持。     

Regulation of Photovoltaic Voltage

Manufacturing systems changed towards higher degrees of automation in the 1980s. Today's manufacturing systems again face a fundamental change. One of the key matters of this change is going to be the modularity of tomorrow's manufacturing systems. This article analyzes the industrial and technological background of this change from the perspective of a large manufacturing company in the automotive, consumer goods and automation industry. A seminal definition of modularity for manufacturing systems is given. A new categorization of manufacturing systems based on the granularity of their modules is presented. Within this categorization manufacturing systems are divided into standard-machine-based production systems, cell-based production systems, workstation-based production systems, and unit-based production systems. Advantages and disadvantages of the different concepts are discussed with respect to future requirements. Finally, challenges and trends of the future manufacturing technology are outlined.     

Optical Digital High-Speed Transmission: General Considerations and Experimental Results

Laboratory experiments on digital optical transmission systems at bit rates of 1 and 2 Gbits/s are described. Systems with graded-index and single-mode fibers in the optical short and long wavelength region were investigated. All systems include complete circuits for clock and signal regeneration. Special emphasis was laid on the development of electronic circuits for gigabit signal processing and on the investigations of the noise sources of the optical channel, which appear especially pronounced in broad-band systems. The experimental results confirm the possibility to set up reliable high-speed optical transmission systems under laboratory conditions with available components. The remaining problems are of optical and not of electronic nature, despite the fact that monolithic integrated circuits for gigabit applications are hardly commercially available today.     

35–65-GHz CMOS Broadband Modulator and Demodulator With Sub-Harmonic Pumping for MMW Wireless Gigabit Applications

Sub-harmonic modulator and demodulator are presented in this paper using 0.13-mum standard CMOS technology for millimeter-wave (MMW) wireless gigabit direct-conversion systems. To overcome the main problem of local oscillator (LO) leakage in direct-conversion systems, the sub-harmonically pumped scheme is selected in this mixer design. An embedded four-way quadrature divider is utilized in the sub-harmonic Gilbert-cell design to generate quadrature-phases LO signals at MMW frequency. For broadband applications, a broadband matching design formula is provided in this paper to extend the operational frequency range from 35 to 65 GHz. To improve the flatness of conversion loss at high frequency, high-impedance compensation lines are incorporated between the transconductance stage and LO switching quad of the Gilbert-cell mixer to compensate the parasitic capacitance. The sub-harmonic modulator and demodulator exhibit 6 plusmn1.5 dB and 7.5 plusmn1.5 dB measured conversion loss, respectively, from 35 to 65 GHz. For MMW wireless gigabit applications, the gigabit modulation signal test is successfully performed through the direct-conversion system in this paper. To our knowledge, this is the first demonstration of the MMW CMOS sub-harmonic modulator and demodulator that feature broadband and gigabit applications.     

Virtual engineering: an integrated approach to agile manufacturing machinery design and control

A virtual manufacturing approach for designing, programming, testing, verifying and deploying control systems for agile modular manufacturing machinery are proposed in this paper. It introduces the concepts, operations, mechanisms and implementation techniques for integrating simulation environments and distributed control system environments so that the control logic programs that have been programmed and verified in the virtual environment can be seamlessly transferred to the distributed control system environment for controlling the real devices. The approach looks to exploit simulation in a much wider range of applications with great advantages in the design and development of manufacturing machine systems. In particular, it facilitates the verification of the runtime support applications using the simulation model before they are applied to the real system. Mechanisms that allow runtime data to be collected during operation of the real machinery to calibrate the simulation models are also proposed. The system implemented delivers a powerful set of software tools for realising agile modular manufacturing systems.     

Gallium arsenide joins the giants

Gallium arsenide has enjoyed a unique position in the electronics industry for more than 25 years. GaAs is emerging as the starting material for integrated circuits with one million or more transistors per chip. The technology today is firmly in the domain of high-performance, very large-scale integration (VLSI), with chip clock rates hitting 100 MHz and up, whilst maintaining a reasonable manufacturing cost. Here, the author describes how present forms of GaAs VLSI are higher-performing versions of silicon VLSI. The GaAs transistors just speed up the same old IC concepts. Still in the future are truly novel chips, incorporating devices like optical emitters or microwave amplifiers that can be built only in GaAs III-V compounds     

VISTAnet deployment and system integration experiences

VISTAnet is a three-year research effort that involves the deployment of prototype broadband switching systems interconnecting specialized supercomputers. The project partners include BellSouth, GTE, MCNC, North Carolina State University (NCSU), and the University of North Carolina at Chapel Hill (UNC-CH). In addition to the deployment and evaluation of experimental network facilities, the project supports research activities in several areas: gigabit communications, metacomputing, advanced visualization techniques, and medical treatment planning techniques, specifically dynamic radiation therapy planning. VISTAnet is organized as a testbed. It is an environment that has been established to experiment with and evaluate techniques associated with gigabit networking. These experiments include methods for moving data into and out of host computers from the application to the network at gigabit rates, demonstrations and evaluations of an application that requires gigabit networking, and interactive three-dimensional graphics techniques. The overall goal of the testbed is to advance the state-of-the-art in gigabit networking and its application. VISTAnet is one of five gigabit test beds coordinated by the Corporation for National Research Initiatives in cooperation with DARPA and NSF     

The latency/bandwidth tradeoff in gigabit networks

It is argued that delays through gigabit networks are dominated by propagation delay, so communications techniques and protocols for megabit networks would be inefficient or ineffective for gigabit networks. The latency-bandwidth tradeoff for gigabit networks is discussed, and an example of it is presented. It is concluded that gigabit networks have forced network designers to deal with propagation delays due to the finite speed of light     

The art of building LSIs

Today solid-state technology has improved to such a degree that very large IC chips are being made with yields up to 30 percent. This article highlights some of the main elements that determine whether LSIs can be manufactured in large quantities. The author claims that obtaining reasonable yields is readily achievable once the factors that stand out as deterrents to success are recognized. Previously developed manufacturing techniques are used for LSI production. In the future, however, lasers and the computer will be applied to enable engineers to produce components faster with greater reliability.     

生坯研磨工艺在MLCC制作过程中的应用

采用新开发出的一种多层片式陶瓷电容器（MLCC）生坯研磨工艺,对现有MLCC加工流程再造,解决现有烧成后芯片研磨工艺对芯片造成内部损伤,导致MLCC芯片内部分层,保护层开裂及芯片棱角崩瓷等影响产品质量的问题,同时对MLCC的加工过程进行简化,缩短加工周期。     

High Gain Equalizing Amplifier Integrated Circuits for a Gigabit Optical Repeater

Equalizing amplifier circuits for a gigabit optical-fiber transmission system are integrated on two monolithic chips implementing an advanced silicon bipolar process. Several new circuit techniques such as a broad-band 50-/spl Omega/ matching amplifier and an electrically controlled and adjusted peaking technique are employed. It is clarified that the main degradation factors of circuit stability are parasitic capacitance between the input and output terminals, and the crosstalk occuring through the wire bonding inductance. The maximum gain and 3-dB down bandwidth of the equalizing amplifier IC's are 64 dB and 1.2 GHz, respectively. The noise figure obtained is 4.5 dB within the dc to 2-GHz range.     

IEEE standard 488 and microprocessor synergism

The assembly and use of more new and versatile instrumentation systems is now enhanced dramatically with the widespread application of IEEE Standard 488-1975, "Digital Interface for Programmable Instrumentation." This Standard interface provides an easy-touse high performance concept that links instruments, calculators or computers, and peripheral devices to function as automated instrumentation systems. Microprocessor technology applied to both smart instrumentation and the implementation of IEEE Standard 488's interface functions provides still further benefits to system designers and users. This article describes both the interface function concepts important to instrumentation systems and the roles played by IEEE Standard 488 and microprocessor techniques in support of these functional concepts. Microprocessor and IEEE Standard 488 interface techniques combine to provide designers and users with significant new tools for improved product performance, something neither technology alone could provide. In the near future, special LSI chips optimized to integrate the two technologies should further enhance the benefits for all concerned.