Interface characteristics of Ge3N4-(n-type) GaAs MIS devices

Passivation of GaAs surfaces was achieved by the deposition of Ge₃N₄ dielectric films at low temperatures. Electrical characteristics of MIS devices were measured to determine the interface parameters. From C-V-f and G-V-f measurements, density of interface states has been obtained as (4–6)×10¹¹ cm⁻² eV⁻¹ at the semiconductor mid-gap. Some inversion charge buildup was seen in the C-V plot although the strong inversion regime is absent. Thermally stimulated current measurements indicate a trap density of 5×10¹⁸−10¹⁹ cm⁻³ in the dielectric film, with their energy level at 0.59 eV.     

High performance Schottky contacts on Se-doped AlxGa1−xAs by cryogenic processing

Al_xGa_1−xAs samples were grown on Se-doped Al_xGa_1−xAs layer above GaAs substrate by metalorganic chemical vapor deposition (MOCVD). It was reported that the crystal quality of the re-growth Al_xGa_1−xAs layer can be improved significantly when an Se-doped Al_xGa_{1 − x}As layer was used. The surface carrier concentration, however, was increased as a result of the Se-doping. Therefore, it could be difficult to obtain a high performance Schottky contacts on such a structure for practical devices application. In this work, Schottky contacts to Al_xGa_1−xAs/Se-doped Al_xGa_1−xAs were formed by cryogenic processing. In such a processing, the Schottky metal deposition was carried out with the sample cooled to a low temperature (LT) of 77 K. The Schottky barrier height was increased significantly in a Au/Al_xGa_1−xAs/Se-doped Al_xGa_1−xAs contact. The leakage current, for the LT contact, was nearly 4 orders lower than that of contact made at room temperature. A current transport mechanism dominated by thermionic emission for the LT contacts was found from current-voltage-temperature (I-V-T) measurement.     

Measurement of low densities of surface states at the Si---SiO2-interface

By a careful process Si---SiO₂-interfaces can be made with a low oxide charge Q_ox and with a low surface states density N_ss. For dry oxides on (100) N_ss-values as low as a few 10⁹ cm⁻² eV⁻¹ are found on samples with an oxide charge density of 3·0 × 10¹⁰ cm⁻². Only the Nicollian-Goetzberger conductance method is proved to give reasonable results on these structures. The quasi-static low frequency C-V-technique is in good agreement with the conductance technique for samples with N_ss-values higher than 1·0 × 10¹⁰ cm⁻² eV⁻¹. The spatial fluctuation of surface potential, mainly caused by oxide charge fluctuations, is an important parameter when studying the high or low frequency C-V-characteristics. Some irregularities in the experimental N_ss-φ_s-curves are explained.     

The use of generalised models to explain the behaviour of ohmic contacts to n-type GaAs

The use of two generalised carrier transport models to account for the N_D⁻¹ dependence of the specific contact resistance (ρ_c) of metal-semiconductor Ohmic contacts to n-type GaAs is proposed. Both models include the effects of thermionic emission and diffusion across the high-low barrier junction a priori. Calculations of ρ_c, and comparison with experimental data, show conclusively that thermionic emission is the dominant transport mechanism across the barrier. It is stressed that these models do not rely on prior choices of either of the transport processes. These conclusions are arrived at a posteriori.     

Analysis of I–V measurements on PtSi-Si Schottky structures in a wide temperature range

I–V Measurements on PtSi-Si Schottky structures in a wide temperature range from 90 to 350 K were carried out. The contributions of thermionic-emission current and various other current-transport mechanisms were assumed when evaluating the Schottky barrier height Φ₀. Thus the generation-recombination, tunneling and leak currents caused by inhomogeneities and defects at the metal-semiconductor interface were taken into account.

Taking the above-mentioned mechanisms and their temperature dependence into consideration in the Schottky diode model, an outstanding agreement between theory and experiment was achieved in a wide temperature range.

Excluding the secondary current-transport mechanisms from the total current, a more exact value of the thermionic-emission saturation current I_te and thus a more accurate value ofΦ_b was reached.

The barrier height Φ_b and the modified Richardson constant A^** were calculated from the plot of thermionic-emission saturation current I_te as a function of temperature too. The proposed method of finding Φ_b is independent of the exact values of the metal-semiconductor contact area A and of the modified Richardson constant A^**. This fact can be used for determination of Φ_b in new Schottky structures based on multicomponent semiconductor materials.

Using the experimentally evaluated value A^** = 1.796 × 10⁶ Am⁻²K⁻² for the barrier height determination from I–V characteristics the value of Φ_b = 0.881 ± 0.002 eV was reached independent of temperature.

The more exact value of barrier height Φ_b is a relevant input parameter for Schottky diode computer-aided modeling and simulation, which provided a closer correlation between the experimental and theoretical characteristics.     

Characteristics of polycrystalline films grown by ultrahigh vacuum chemical vapor deposition system

In situ boron-doped polycrystalline Si_1−xGe_x (poly-Si_1−xGe_x) films deposited by ultrahigh vacuum chemical vapor deposition (UHV/CVD) system were characterized. Optimum fitted values of grain boundary trap state densities, 4.0 × 10¹² cm⁻² and 4.9 × 10¹² cm⁻² were obtained for poly-Si and poly-Si_0.79Ge_0.21, respectively. The extracted average carrier concentration in the grain agrees with secondary ion mass spectroscopy (SIMS) analysis. In turn, we found that these films are suitable Hall elements to sense magnetic field. Experimental results show that the sensitivity decreased with the increasing input current, which can be well explained using the thermionic emission theory. Finally, we use these films to fabricate thin film transistors.     

Schottky barrier height of a new ohmic contact NiSi2 to n-type 6H-SiC

We present a new ohmic contact material NiSi₂ to n-type 6H-SiC with a low specific contact resistance. NiSi₂ films are prepared by annealing the Ni and Si films separately deposited on (0 0 0 1)-oriented 6H-SiC substrates with carrier concentrations (n) ranging from 5.8×10¹⁶ to 2.5×10¹⁹ cm⁻³. The deposited films are annealed at 900 °C for 10 min in a flow of Ar gas containing 5 vol.% H₂ gas. The specific contact resistance of NiSi₂ contact exponentially decreases with increasing carrier concentrations of substrates. NiSi₂ contacts formed on the substrates with n=2.5×10¹⁹ cm⁻³ show a relatively low specific contact resistance with 3.6×10⁻⁶ Ω cm². Schottky barrier height of NiSi₂ to n-type 6H-SiC is estimated to be 0.40±0.02 eV using a theoretical relationship for the carrier concentration dependence of the specific contact resistance.     

Metal/n-GaP Schottky barrier heights

A systematic study, which aims to extend the existing metal/n-Gap Schottky barrier height data, is made. Schottky diodes of various barriers, which included Pt/n-GaP, Au/n-GaP, Ni/n-GaP, Mo/n-Gap, Al/n-GaP, Cr/n-GaP, Ag/n-GaP and Cu/n-GaP, were fabricated and their I-V and C-V characteristics were measured. The derived barrier height values for Au, Cr, and Cu agree with the existing data. The derived I-V and C-V barrier height data on Ni, Mo and Ag extend the present barrier height data for n-type GaP. The C-V barrier height values are plotted vs work function of metals and a straight line relationship is obtained.     

An investigation of LixNi1−x,O as a mixed-valence thermoelectric material

The mixed valence material, Li_xNi_1−xO, has been investigated as a potential thermoelectric material. Measurements of the Seebeck coefficient, (μ V/°C), electrical resistivity, ρ(Ω-cm), and thermal conductivity, k(W/cm°C) have been made as a function of temperature and lithium concentration. The thermoelectric figure of merit, Z(²/ρk), reaches a value of approximately 1·4×10⁻⁴ at 1100°C for the composition Li_0.04Ni_0.96O.     

Electrical characteristics of GaAsP Schottky barrier diodes

Schottky barrier diodes of chromium on n-type epitaxial gallium arsenide phosphide (GaAsP) were studied from 25°C to 440°C. The diodes showed significant rectification properties up to a temperature of 440°C. At high temperature the reverse leakage current was 1.15 mA at 25 V with a diode area of 1.14×10⁻³ cm² as compared with 0.25-μA current at room temperature. The n factor derived from the slope of the ln I vs. V curves was 1.1. The barrier height for chromium was found to be 1.25 eV from the capacitance measurements and 1.12 eV from the saturation current vs. temperature measurements. The slope of the C-V curves yielded a carrier concentration of 6.0×10¹⁵ carriers per cm³.     

Electrical characterization of interface states in Ni/n-Si(111) Schottky diodes from (C-V) characteristics

Experiments have been performed on Ni/n-Si(111) Schottky diodes fabricated by the vacuum vapor deposition of Ni at 10⁻⁵ Torr pressure on an n-type «111å oriented silicon wafer. Measured current-voltage and capacitance-voltage characteristics in range frequency range 10 kHz-1 MHz have been analysed. Interface states parameters have been extracted from (C-V) characteristics using a metal-thin interfacial layer-semiconduct (MIS) structure model. The interface states density has been found to be in the range of 10¹¹ cm⁻² eV⁻¹ with a peak in the band gap of Si at about 0·51 eV below the conduction band edge.     

Thermal noise of a silicon double-injection plasma diode

Measurements of the thermal noise of a silicon p⁺−π−n⁺ diode operating in the Lampert-insulating regime agree within 6 per cent with the prediction S_i = 4kT Re(Y). The noise measurements were performed in the cube-law regime with d.c.-currents from 100 μA to 4mA at room temperature.     

Density of States-Based DC $I$– $V$ Model of Amorphous Gallium–Indium–Zinc-Oxide Thin-Film Transistors

The density of states (DOS)-based DC I-V model of an amorphous gallium-indium-zinc oxide (a-GIZO) thin-film transistor (TFT) is proposed and demonstrated with self-consistent methodologies for extracting parameters. By combining the optical charge-pumping technique and the nonlinear relation between the surface potential (phiS) and gate voltage (V _GS), it is verified that the proposed DC model reproduces well both the measured V _GS-dependent mobility and the I _DS-V _GS characteristics. Finally, the extracted DOS parameters are N _TA = 4.4 times 10¹⁷ cm^-3 middot eV^-1, N _DA = 3 times 10¹⁵ cm^-3 middot eV^-1, kT _TA = 0.023 eV, kT _DGA = 1.5 eV, and EO = 1.8 eV, with the formulas of exponential tail states and Gaussian deep states.     

GaAs surface plasma treatments for Schottky contacts

The properties of different rectifying metallizations (Al, Ti/Pt, WN_x) on GaAs have been investigated for various surface preparation procedures. In particular, in situ hydrogen plasma treatments were used to remove residual surface contamination (mainly O and C) and a nitrogen plasma to grow a thin mixed nitride layer. Al and Ti/Pt Schottky diodes with an ideality factor very close to 1, but with reduced barrier height, were found after the H₂ plasma as a consequence of H diffusion into GaAs. The Schottky barrier height was further reduced if a H₂ + N₂ plasma was performed. The N content in the sputtering environment during the WN_x deposition affects the diode properties of plasma-treated WN_x contacts. By increasing the N₂ partial pressure, the diode barrier height is reduced, probably due to nitridization of the GaAs surface. Such differences disappear after annealing the diodes in arsine overpressure at 800°C. WN_x contacts deposited under different conditions on H₂ plasma treated substrates also show a similar Schottky barrier height after such annealing.     

Process and device characterization of high voltage gallium arsenide P-i-N layers grown by an improved liquid phase epitaxy method

GaAs P-i-N layers with an i-region net doping of less than 10¹² cm⁻³ were grown on P⁺ and N⁺ substrates by a modified liquid phase epitaxy (LPE) method. Doping profiles and structural data obtained by varius characterization techniques are presented and discussed. A P⁺-P-i-N-N⁺ diode with a 25 μm-wide i-region exhibits a breakdown voltage of 1000 V, a t_rr of 50 ns, and reverse current densities (at V_R = 800 V) of − 3 × 10⁻⁶ A/cm² at 25°C and 10⁻² A/cm² at 260° C.     

Estimation for the capture cross-sections of surface state on p-Si surface by photovoltaic method

A new method which can nondestructively measure the surface-state density (SSD) D_s and estimate the capture cross-sections (CCS) of surface state σ⁰_n and σ⁻_p on surface of p-type semiconductor crystals is proposed. This method is based on the photovoltage measurements at various temperatures. The photovoltage experiment was carried out with a (1 1 1) p-type Si single crystal (N_A=4.8×10¹⁴ cm ⁻³). Owing to that the surface barrier height φ_BP=0.6421 V and the surface-recombination velocity s_n=9.6×10³ cm s⁻¹ of this sample can be determined, the SSD D_s=1.2×10¹¹ cm⁻² eV⁻¹ can therefore be obtained, furthermore CCS σ⁰_n≈5×10⁻¹⁴ cm² and σ⁻_p≈2×10⁻¹⁰ cm² can also be estimated. These results are consistent with that of related reports obtained by other methods.     

Carrier cooling in nonpolar semiconductors studied with subpicosecond time-resolution

A carrier plasma in the nonpolar semiconductor germanium is photoexcited by light pulses of a photon energy of hv = 1.0 eV. Cooling of the carriers is monitored via the rise of the transmission at the probe energy hv = 1.0 eV close to the direct band gap energy which directly reflects the population of the corresponding hole states. Approximately 90 % of the excess carrier energy is found to be transfered to the lattice within 7 ps. There is no evidence for a density dependence of the cooling rate for n ≤ 10¹⁸ cm⁻³ at T_L = 30 K. Experiments performed with a hihger excitation frequency of hv = 1.77 eV show a very similar increase of the transmission on account of carrier cooling.     

Theoretical calculation and experimental evidence of the real and apparent bandgap narrowing due to heavy doping in p-type Si and strained Si1−xGex layers

Based on an analytical approach developed by Jain and Roulston, the different contributions to the bandgap narrowing at T = 0 K due to heavy doping in highly p-type doped Si and strained Si_1-xGe_x-layers are calculated for x < 0.3. The valence band in Si and in strained Si_1-xGe_x layers is not parabolic, it is highly distorted. To take the non-parabolicity into account a dopant concentration-dependent density of states effective mass is defined. within the framework of this formalism we find that the bandgap narrowing (BGN) in Si is not appreciably affected due to the band distortion. The situation for strained Si_1-xGe_x layers is quite different, in that the BGN increases significantly at doping levels exceeding 10¹⁹ cm⁻³. In the earlier published work, BGN of the Si_1−xGe_x layers was either slightly smaller or about the same as in Si. Now at high doping levels, BGN becomes considerably higher than in Si. We will show that the effect of the strain on the Fermi energy is much larger than on the BGN, which will cause a large change in the effective valence band offset. Comparison will be made then between our theoretical calculations and experimental results obtained on two different device structures. The modified effective valence band offset that we have calculated is in very good agreement with the experimental value derived from the published work on long-wavelength optical detectors. The apparent bandgap narrowing in strained p-type Si_1-xGe_x-layers is also calculated and compared with the experimental results on Heterojunction Bipolar Transistors fabricated in our laboratory.     

Improved Electrical Properties of Ge p-MOSFET With $ hbox{HfO}_{2}$ Gate Dielectric by Using $hbox{TaO}_{x} hbox{N}_{y}$ Interlayer

The electrical characteristics of germanium p-metal-oxide-semiconductor (p-MOS) capacitor and p-MOS field-effect transistor (FET) with a stack gate dielectric of HfO₂/TaOxNy are investigated. Experimental results show that MOS devices exhibit much lower gate leakage current than MOS devices with only HfO₂ as gate dielectric, good interface properties, good transistor characteristics, and about 1.7-fold hole-mobility enhancement as compared with conventional Si p-MOSFETs. These demonstrate that forming an ultrathin passivation layer of TaOxNy on germanium surface prior to deposition of high-k dielectrics can effectively suppress the growth of unstable GeOx, thus reducing interface states and increasing carrier mobility in the inversion channel of Ge-based transistors.     

Nickel-based contact metallization for SiGe MOSFETs: progress and challenges

The Ni-based self-aligned silicide process has attracted a rapidly growing interest for contact metallization in Si technology, as the device dimensions are scaled down into the sub-100 nm regime. Incorporation of Ge in the electrodes of a MOSFET, i.e. gate and source/drain, in order to further enhance device performance, has made the study of Ni–Si_1−xGe_x interactions a scientifically and technologically important issue. Among the different germanosilicides of Ni, NiSi_1−uGe_u (i.e. mono-germanosilicide, with u possibly different from x in the Si_1−xGe_x) is the most desirable phase due to its low specific resistivity of 12–25 μΩcm. The focus of the present work is placed on issues concerning the phase and morphology stability of NiSi_1−uGe_u on single-crystal and polycrystalline Si_1−xGe_x substrates. The related experimental data from our recent work are analysed with reference to two classics on the formation of silicides by d’Heurle [J. Mater. Res. 3 (1988) 167] and by d’Heurle and Gas [J. Mater. Res. 1 (1986) 205]. Influences of C and Pt on the stability of NiSi_1−uGe_u are also covered. The electrical properties of the NiSi_1−uGe_u–Si_1−xGe_x contact are discussed referring to our latest experimental results.