基于数字图像处理的印刷电路板缺陷检测

针对传统PCB检测方法高成本、低效率问题,提出一种基于数字图像处理的PCB板自动光学检测方法,建立了将标准图像和待测图像进行对比的检测系统。针对PCB板生产过程中遇到的短路、断路、空洞、凸起、凹陷等缺陷,采用了求连通区域数、计算欧拉数、求缺陷区域面积等方法,来检测上述缺陷问题,并给出算法的全过程。经实验结果分析,该方法能准确地检测出待检测电路板上存在的缺陷,达到了自动实时检测的目的。     

基于轮廓提取的电路板缺陷检测

针对目前工业领域对多层电路板缺陷检测高效高精度的要求,在工业计算机分层成像的基础上,设计了一种基于轮廓提取技术的多层电路板缺陷自动检测系统。通过随机Hough变换检测出电路板定位圆的圆心坐标,再对目标图与标准图进行几何配准。同时对电路板裸板中常见的缺陷类型进行分析和研究,采用轮廓提取算法进行缺陷分类,并对缺陷类型进行了相应的标记,解决了传统DR和自动光学检测技术AOI对多层电路板无法进行内部电路分析的问题。     

一种基于混沌优化算法的PCB板元件检测方法

先进电子制造生产中经常要对PCB板元件进行检测与识别,介绍了一种基于图像模板匹配算法的PCB板元件自动快速检测方法.从检测速度和准确度出发,首先提出了一种图像相似性度量参数指标,并提出一种利用并行混沌算法融合单纯形的算法,来优化搜索图像相似性,给出了算法实现的全过程.用实际拍摄的PCB板元件进行性能测试,验证了该优化算法能提高检测速度.     

基于无损检测的高分辨率PCB板焊点缺陷检测系统

为了能快速、准确地对BGA封装器件的PCB板上的焊点进行缺陷检测,设计了高分辨率X-射线无损检测的缺陷检测系统.给出了系统的基本工作原理和硬件结构,采用等比例成像的方法求解了获得最高分辨率的距离信息.分析了系统可能存在的噪声源,并设计了去噪算法用于提高图像信噪比.试验采用HAWK-180XI型X-射线源、高速图像采集卡和UNIQ-2000型CCD相机等对BGA封装的PCB板缺陷进行检测,结果显示:系统可以快速有效地获得被测PCB板的图像信息,并给出缺陷的位置、尺寸等特征信息,满足设计要求.     

基于加权SSIM算法的PCB元件缺陷检测

提出了一种自动光学检测方法,通过将传统的SSIM算法与元件的权重相结合的方法来检测PCB元件缺陷。该方法基于图像内容生成权重图,与SSIM矩阵相乘,它可以有效地增强平滑区域信息并消除高频区域的干扰。该系统不需要严格照明条件,对相机性能要求不高。实验结果表明,该方法在PCB缺陷检测精度方面,特别是对位置变化较大的插件元件的检测优于传统的SSIM方法。将有助于开发低成本和自动化的缺陷检测系统。     

基于机器视觉的 PCB 缺陷检测算法研究现状及展望

印刷电路板(PCB)是电子零件的基板,需求量极大,承载着电路元件和导线的布局,其优良与否对电子产品的质量有着 重要影响。 由于电子产品的制作逐渐趋于轻薄、精小,基于机器视觉的 PCB 缺陷检测已成为一个具有挑战性的问题。 为了加 深研究人员对 PCB 缺陷检测的理解,本文从传统图像处理方式、传统机器学习及深度学习 3 大维度全面回顾了近 10 年基于机 器视觉的 PCB 缺陷检测算法,并分析其优缺点;介绍了 9 个 PCB 数据集,给出了评价 PCB 缺陷检测算法的性能指标,且在 PCB 数据集及流行的小目标数据集上分别对典型的算法进行了对比分析;最后指出了 PCB 缺陷检测算法目前存在的问题,展望了 未来可能的研究趋势。     

PCB设计/制造数据交换技术及标准化

为了弥补传统印刷电路板数据标准Gerber不能进行双向数据交换的缺陷，介绍了新PCB数据标准的三个候选格式：IPC的GenCAM、Valor的ODB 以及EIA的EDIF400；分析了PCB设计／制造数据交换技术的研究进程；讨论了实施PCB数据交换的关键技术和标准化前景。指出必须将目前PCB设计和制造的点对点交换模式改变成单一的理想交换模式。     

基于FPGA的工业PCB板元器件检测系统设计

针对PCB元器件在贴装过程中贴装错误的问题,设计了基于FPGA的元器件检测系统。采用FPGA作为硬件平台,采集PCB电路板图像,首先对图像进行预处理,读取预先制作的PCB元器件信息,然后通过SURF算法计算元器件与模板的匹配度,通过匹配度判断元器件贴装的正误,最后剔除贴装错误的PCB板,实现元器件贴装正误的自动检测。完成了系统硬件和软件的设计。实验表明系统检测的平均正确率为89.82%,速度为969 ms/次。     

基于模式匹配及其参数自适应的PCB焊点检测算法

为了提高在线自动光学检测(AOI)系统检测印刷电路板(PCB)焊点的准确率和速度,对PCB焊点进行了研究。通过研究由特定结构光源和3CCD彩色相机获取的PCB焊点图像,基于常见的良品、多锡、少锡、假焊等焊点类型,提取焊点图像关键子区域的面积特征,在此基础上,建立了五种焊点类型的特征矩阵模型,并根据同类焊点相似程度最大为原则设计了检测焊点的模式匹配算法。此外,本文还给出了一种参数自适应方法对各检查项所用到的阀值参数进行学习与校正。在实验研究中,对含有1040个Chip焊点的PCB进行了检测,结果显示本文所提算法对焊点检测的准确率可达96.5%,检测所用时间为9秒。研究结果表明,本文算法具有较高检测准确率和检测速度。     

基于FPGA的工业PCB板元器件检测系统设计北大核心CSCD

针对PCB元器件在贴装过程中贴装错误的问题,设计了基于FPGA的元器件检测系统。采用FPGA作为硬件平台,采集PCB电路板图像,首先对图像进行预处理,读取预先制作的PCB元器件信息,然后通过SURF算法计算元器件与模板的匹配度,通过匹配度判断元器件贴装的正误,最后剔除贴装错误的PCB板,实现元器件贴装正误的自动检测。完成了系统硬件和软件的设计。实验表明系统检测的平均正确率为89.82%,速度为969 ms/次。     

Minimal Realization of Linear Graph Models for Multi-physics Systems

An engineering system may consist of several different types of components,belonging to such physical"domains"as mechanical,electrical,fluid,and thermal.It is t...     

INTEGRAL EQUATION METHOD＇S APPLICATION IN HOLE-EDGE STRESS OF COMPOSITE MATERIAL PLATE WITH DIFFERENT SHAPED HOLES

The strength of composite plate with different hole-shapes is always one of the most important but complicated issues in the application of the composite material. The holes will lead to mutations and discontinuity to the structure. So the hole-edge stress concentration is always a serious phenomenon. And the phenomenon makes the structure strength decrease very quickly to form dangerous weak points. Most partial damage begins from these weak points. According to the complex variable functions theory, the accurate boundary condition of composite plate with different hole-shapes is founded by conformal mapping method to settle the boundary condition problem of complex hole-shapes. Composite plate with commonly hole-shapes in engineering is studied by several complex variable stress fimction. The boundary integral equations are founded based on exact boundary conditions. Then the exact hole-edge stress analytic solution of composite plate with rectangle holes and wing manholes is resolved. Both of offset axis loadings and its influences on the stress concentration coefficient of the hole-edge are discussed. And comparisons of different loads along various offset axis on the hole-edge stress distribution of orthotropic plate with rectangle hole or wing manhole are made. It can be concluded that hole-edge with continuous variable curvatures might help to decrease the stress concentration coefficient; and smaller angle of outer load and fiber can decrease the stress peak value.     

Non-monotonic material contrast in scanning ion and scanning electron images

30 keV Ga⁺ focused ion beam induced secondary electron (iSE) imaging was used to determine the relative contrast between several materials. The iSE signal compared from C, Si, Al, Ti, Cr, Ni, Cu, Mo, Ag, and W metal layers does not decrease with an increase in target atomic number Z₂, and shows a non-monotonic relationship between contrast and Z₂. The non-monotonic relationship is attributed to periodic fluctuations of the stopping power and sputter yield inherent to the ion–solid interactions. In addition, material contrast from electron-induced secondary electron (eSE) and backscattered electron (BSE) images using scanning electron microscopy (SEM) also shows non-monotonic contrast as a function of Z₂, following the periodic behavior of the stopping power for electron–solid interactions. A comparison of the iSE and eSE results shows similar relative contrast between the metal layers, and not complementary contrast as conventionally understood. These similarities in the contrast behavior can be attributed to similarities in the periodic and non-monotonic function defined by incident particle–solid interaction theory.     

Application of Feature Extraction through Convolution Neural Networks and SVM Classifier for Robust Grading of Apples

This paper proposes a novel grading method of apples,in an automated grading device that uses convolutional neural networks to extract the size,color,texture,an...     

分布动态载荷识别的抗噪处理

针对正交多项式频域法在用多种响应对矩形薄板进行载荷识别中抗噪性较差的问题,综合运用平均法、矩阵预处理和奇异值截断法等方法对之进行改善,并引入空间映射的思想,将该方法的应用范围拓展为复杂的模型.利用仿真算例,证实了该方法具有较好的抗噪性.     

基于MELTAC-N平台的核电厂安全级DCS环网研究与测试

针对工程实践中环网通讯相关问题的处理缺乏理论基础及国产化安全级DCS平台的开发缺乏成熟经验借鉴问题,对基于MELTAC-N平台核电厂安全级DCS环网的软硬件实现进行了研究。提出了安全级DCS环网双环网冗余设计、光切换开关设计等硬件设计方法,以及以RPR协议为基础,采用全数据收发策略的软件设计方法。在CPR1000安全级DCS平台上对安全级DCS环网的可靠性及实时性进行了评价,并进行了容错能力、响应时间及响应时间稳定性测试验证实验。结果表明,基于MELTAC-N平台安全级DCS环网软硬件设计具有较好的容错能力及响应时间稳定性。     

The laboratory simulation of abrasive wear

Abrasive wear has long been recognised as one of the most potentially serious tribological problems facing the operators of many types of plant and machinery; several industrial surveys have indicated that wear by abrasion can be responsible for more than 50% of unscheduled machine and plant stoppages. Locating the operating point of a tribological contact in an appropriate operational ‚map’︁ can provide a useful guide to the likely nature and origins of the surface degradation experienced in use, though care must be exercised in choosing the most suitable parameters for the axes of the plot. Laboratory testing of materials and simulations of machine contacts are carried out for a number of purposes; at one level for the very practical aims of ranking candidate materials or surface hardening treatments in order of their wear resistance, or in an attempt to predict wear lives under field conditions. More fundamentally, tests may be aimed at elucidating the essential physical mechanisms of surface damage and loss, with the longer term aim of building an analytical and predictive model of the wear process itself. In many cases, component surface damage is brought about by the ingress of hard, particulate matter into machine bearing or sealing clearances. These may be running dry although, more usually, a lubricant or service fluid is present at the interface. A number of standardised wear test geometries and procedures have been established for both two- and three-body wear situations, and these are briefly described. Although abrasive wear is often modelled as following an ‚Archard’︁ equation (i.e. a linear increase in material loss with both load and time, and an inverse dependence on specimen hardness) both industrial experience and laboratory tests of particularly lubricated contacts show that this is not always the case: increasing the hardness differential in an abrasively contaminated lubricated pair may not always reduce the rate of damage to the harder surface.     

Short-Term Relay Quality Prediction Algorithm Based on Long and Short-Term Memory

The fraction defective of semi-finished products is predicted to optimize the process of relay production lines, by which production quality and productivity ar...     

End-to-End Multiview Gesture Recognition for Autonomous Car Parking System

The use of hand gestures can be the most intuitive human-machine interaction medium.The early approaches for hand gesture recognition used device-based methods....     

Limits of topographic measurement by the scanning tunnelling and atomic force microscopes

Parameters describing the topographic character of a surface (height, surface wavelength, slope and curvature) can be derived from equivalent sinusoidal profiles. The response of a surface-measuring instrument may be modelled in terms of instrument parameters such as stylus radius, and scanning range and resolution. The performance of the instrument may then be mapped as a zone in amplitude-wavelength (AW) space to show the sinusoidal profiles it is capable of measuring. In a first-order analysis the STM and AFM are considered as equivalent to contact-stylus instruments with a notional stylus radius equal to the tip radius plus the gap. Comparisons between different instruments and types of instrument are readily made by mapping in AW space. The error arising from convolution of the sinusoidal profile with that of the finite tip may be quantified and plotted as contours in AW space.