钎焊接头的蠕变损伤与寿命预测

钎焊连接技术被广泛应用于航空航天、核电等领域的高效紧凑换热器制造中.高温高压工作条件下,蠕变及蠕变损伤引起的裂纹扩展是换热器中钎焊接头的主要失效方式之一.以高效紧凑换热器中常用的Incone1625/BNi-2及C276/BNi-2钎焊接头为研究对象,对其蠕变及蠕变裂纹扩展扩展行为进行了研究,获得钎焊接头的蠕变变形及裂纹扩展规律,澄清其蠕变及蠕变裂纹扩展失效机理.同时结合蠕变损伤本构模型和试验,对钎焊接头的蠕变损伤与寿命预测进行研究与综述,讨论钎焊工艺、扩散区性能及尺寸对钎焊接头蠕变裂纹扩展行为的影响规律,建立钎焊接头蠕变拘束参数,实现钎焊接头蠕变裂纹扩展行为尺寸效应的统一拘束表征,进而为基于材料-组件-装备一体化的寿命预测方法提供理论基础.     

微互连接头的蠕变数值模拟及失效寿命预测

电子封装中的微互连接头失效是电子设备的主要失效原因之一.文中根据实际封装期间建立了一个1/8的板级封装组件有限元模型.对微互连接头的蠕变变形进行了数值模拟,并依据疲劳寿命模型进行了失效预测.模拟中的互连接头分别采用了两种钎料（Sn-3.8Ag-0.7Cu和63Sn-37Pb）进行定义,对比了两种钎料的变形及寿命.     

2A50铝合金钎焊钎料与钎剂的选择

针对2A50铝合金的特点,根据铺展性、填缝性试验,对适合其钎焊的钎料与钎剂作了选择,进行了接头强度试验。结果表明：中温CsF-AlF3钎剂具有较高的活性及较好的去膜效果,适合含镁热处理强化型铝合金的钎焊;用CsF-AlF3钎剂分别与Al-Cu-Ag-Zn钎料及Zn-Al-Be钎料匹配钎焊,均可获得较理想的钎焊效果;当搭接间隙为0．2mm、搭接长度为2．3mm时,Zn-Al-Be钎料与CsF-AlF3钎剂匹配钎焊,所得焊接接头的抗剪强度可达143．2MPa。     

急冷Al基活性钎料钎焊Si3N4陶瓷高温性能研究

用急冷Ａｌ基活性钎料钎焊Ｓｉ３Ｎ４陶瓷接头高温剪切强度的研究表明，对用不同成分钎料钎焊的接头均存在一较合适的钎焊工艺，５００℃时的高温剪切强度最高可达１１０ＭＰａ，经Ｎｉ粉复合的接头强度最高为１７０ＭＰａ。加Ｎｉ粉复合的接头在一定的钎焊。艺条件下能明显提高接头的高温剪切强度。高温断裂多发生于陶瓷界面处。界面处所富集的富Ｉｎ相是接头高温断裂的薄弱环节。随着富Ｉｎ相尺寸的增大，接头强度明显下降。     

薄板电弧钎焊钎缝形成及界面现象

以不同的钎料及MIG/TIG电弧加热方式对几种母材进行了电弧钎焊初步试验 ,结果表明 ,CuSi3和CuMnZn钎料在电弧加热下能润湿铺展形成钎缝 ;在电弧钎焊条件下 ,钎料中的Si和Mn元素易在钎缝—基体金属界面偏析和富集 ,经XRD分析Si是以Fe2 Si相形式存在 ,而Mn是以固溶体形式存在。     

Cu基钎料电弧钎焊接头强度及断口分析

研究用钨极氩弧焊作为热源,用Cu3Si1Mn钎料、56Cu8Mn26Zn钎料分别钎焊A3钢板及1Cr18Ni9Ti不锈钢板。试验结果表明,在钎料/母材界面分别存在Si、Mn富集带,经XRD分析表明,Si是以Fe2Si相形式存在,而Mn是以固溶体形式存在;用Cu3Si1Mn、56Cu8Mn26Zn钎料钎焊A3钢板接头抗拉强度试样均断在母材,抗拉强度为308.2～308.7MPa,钎焊1Cr18Ni9Ti不锈钢板,拉伸均断在钎缝,其抗拉强度分别是331.5 MPa、382.9 MPa;拉伸断口分析发现,断裂起裂点在搭接钎缝的根部,主要是母材成分与少量的钎料成分混合、溶解而成,是脆性断口;止裂点在钎缝金属中（Cu3Si1Mn钎料）或在近界面上（Cu3Si1Mn钎料）,是塑性断口。     

薄板电弧钎焊钎缝形成及界面现象

以不同的钎料及ＭＩＧ／ＴＩＧ电弧加热方式对几种母材进行电弧钎焊初步试验，结果表明，ＣＵＳＩ３和ＣＵＭＮＺＮ钎料电弧中热下能润湿铺展形成纤链，在电反钎焊条件下，钎料中的Ｓｉ、Ｍｎ元素易地钎疑一基体金属界面偏析和富集，经ＸＲＤ分析Ｓｉ是以Ｆｅ２Ｓｉ相式存在，而Ｍｎ是以固溶体形式存在。     

铝基复合钎料钎焊机理

采用Cu/Al-Si/Cu式复合钎料,在不同温度下钎焊铝及其合金,通过钎焊接头金相图片和电子探针对焊缝线扫描,分析接头反应结合情况,研究钎焊接头在此条件下共晶反应特征以及铜和硅的扩散特点。研究表明,铜的加入能够显著降低钎焊温度,从而有效保护钎焊母材。不同的钎焊温度,钎焊接头表现出不同的共晶反应,且共晶液相的产生极大地促进了铜和硅的扩散能力。首先内侧发生Al-Si-Cu三元共晶反应,随着钎焊温度超过548℃,铝和铜之间发生二元共晶反应,接头反应能够充分进行,得到较为理想的接触反应区。     

两种铜磷钎料对紫铜钎焊的焊接性能和焊缝组织对比

对国产BCu80PAg钎料和德国进口L-Agl5P钎科进行了化学成分、熔化性能、润湿性试验,并比较了这两种铜磷钎料对紫铜钎焊焊接接头的力学性能和焊缝组织.结果表明:L-Ag15P钎料的成分均匀性和润湿性要好于BCu80PAg的,其熔化区间较窄;两种钎料焊接接头的力学性能相当;两种钎料所形成焊缝的显微组织主要都是亚共晶,初生相为富银和磷的α-Cu固溶体,共晶体组分为α-Cu固溶体和Cu3P化合物.     

PDC复合片的真空钎焊及钎缝重新合金化

通过对ＰＤＣ复合片真钎焊的研究，提出了钎缝重新合金化概念，在实验中采用复合钎料真空钎焊ＰＤＣ复合片，取得了钎缝完全重新合金化的效果，钎缝接头的剪切强度均在３００ＭＰａ以上。同时，对复合钎料强化钎缝的机理进行了探讨。     

SnAgCu/SnAgCuCe焊点的显微组织与性能

针对SnAgCu和SnAgCuCe两种无铅焊点,研究焊点内部组织、力学性能及热疲劳特性。研究结果表明,稀土元素Ce的加入可以提高焊点的力学性能,稀土元素的添加可以使SnAgCu焊点拉伸力提高近12.7%。稀土元素的添加细化SnAgCu基体组织,同时减小金属间化合物颗粒(Cu6Sn5和Ag3Sn)的尺寸,这是SnAgCuCe焊点力学性能提高的主要原因。拉伸断裂后的扫描电镜分析表明,两种焊点的断裂呈现明显的韧性断裂特征。另外在温度循环载荷下,稀土元素可以显著提高SnAgCu焊点的疲劳寿命。基于有限元模拟发现SnAgCuCe的抗蠕变性能显著高于SnAgCu焊点。     

Al2O3-SiO2／AZ91D复合材料蠕变行为的研究

研究了Al2O3-SiO2短纤维增强AZ91D复合材料在不同温度下的蠕变性能。结果表明,Al2O3-SiO2／AZ91D复合材料具有良好的抗高温蠕变性能。显微分析发现,复合材料在蠕变过程中部分纤维发生断裂。纤维／基体界面处的缺陷和微裂纹在加载应力的作用下逐渐扩展,最终导致复合材料的蠕变断裂。     

Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package

The wafer level chip scale assembly (WLCSP) has increasingly become popular due to its compact, wafer scale assembly. In a WLCSP assembly, the under bump metallurgy (UBM) connecting the solder joints and the chip is crucial for the assembly reliability. This study focuses on a WLCSP with 96.5Sn3.5Ag/95.5Sn3.8Ag0.7Cu solder joints and Ti/Cu/Ni UBM on a 2–layer microvia build-up electric board. Furthermore, the Garofalo-Arrhenius creep model in finite element analysis ANSYS 6.0 is used for simulations on the WLCSP assembly under thermal cycling to investigate the deformations of the assembly with different thickness of nickel layer, the maximum equivalent strain and maximum equivalent stress of microvias/joints. Finally, the Coffin-Manson equation is applied to predict the fatigue lives of four combinations of solder joints with different eutectic alloy and thickness of nickel layer.     

倒装芯片封装结构中SnAgCu焊点热疲劳寿命预测方法研究

由于焊点区非协调变形导致的热疲劳失效是倒装芯片封装（包括无铅封装）结构的主要失效形式.到目前为止,仍无公认的焊点寿命和可靠性的评价方法.文中分别采用双指数和双曲正弦本构模型描述SnAgCu焊点的变形行为,通过有限元方法计算焊点累积蠕变应变和累积蠕变应变能密度,进而据此预测倒装芯片封装焊点的热疲劳寿命.通过实验验证,评价上述预测方法的可行性.结果表明,倒装芯片的寿命可由芯片角焊点的寿命表征;根据累积蠕变应变能密度预测的焊点热疲劳寿命比根据累积蠕变应变预测的焊点热疲劳寿命更接近实测数据;根据累积蠕变应变预测的热疲劳寿命比根据累积蠕变应变能密度预测的热疲劳寿命长;采用双指数本构模型时,预测的焊点热疲劳寿命也较长.     

Mechanical Properties of QFP Joints Soldered with SnAgCu and SnPb Solders

With the development of lead-free solder alloys, the investiagtion focusing on the relibility of lead-free solders are essential. Since the reliability database of lead-free solder joints needs to be further supplied, the creep behavior of SnAgCu soldered joints on Quad Flat Package (QFP) devices under thermo cycling load are studied in this paper, compared to conventional SnPb solder, by finite element simulation based on Garofalo-Arrhenius creep model. Meanwhile, the mechanical properties of SnAgCu and SnPb soldered joints in the pitches of QFP devices are also carried out by means of tensile test. The results indicate that the values of strain and stress of SnAgCu soldered joints were all smaller than those of SnPb under thermal cycling, and the tensile strength of the joints soldered with SnAgCu solder was higher than that of SnPb, which means the reliability of the joints soldered with SnAgCu solder is better than SnPb soldered joints. As the fracture surface morphology of the soldered joints compared, SnAgCu soldered joint presented ductile fracture, while the fracture mechanism of SnPb solder joints displayed both brittle and ductile fracture. Above all, the experimental results is in accord with that of simulation, which will provide guidance for reliability study and application of lead-free solders.     

The application of an approximate analysis of the diffusion process for a description of creep and creep rupture

An analysis of the environmental effect on creep and creep rupture of metals is presented. It is pointed that the investigation of the diffusion processes leads to significant computational difficulties. These difficulties arise on representing the solution of the diffusion equation with variable boundaries in the form convenient for analysis.The process of damage accumulation is modelled for a material, which is subjected to the combined action of mechanical loads and the aggressive environment. The Rabotnov kinetic theory is applied in which two parameters are taken into account: the damage of the material and the concentration of chemical elements reducing the resistance of the material to mechanical loads. An approximate solution of the diffusion equation is suggested for rod or shell subjected to axial tension. This solution is based on dividing the cross-section of rod or shell into the disturbed and undisturbed parts and determining the motion of the boundary between these parts. The system of constitutive equations which describe the interaction between the diffusion and rupture fronts during the creep process until failure is obtained. A good quantitative agreement between experimental and theoretical results has been received.     

A lower bound to the creep rupture time of pressurised thick cylinders

A lower bound to the creep rupture time of internally pressurised thick cylinders is derived. Material behaviour is described by a phenomenological creep rupture theory that accounts for all phases of creep, and for the full coupling between the deformation and damage processes. To obtain the desirable lower bound, the effective stress and the equivalent rupture stress, which represent the effects of multiaxial stress states on the creep strain and damage rates, respectively, were approximated by the maximum shear stress in the constitutive equations. By comparing the lower bound estimations for a wide range of cylinder dimensions and different engineering materials with the rupture times determined from accurate finite element calculations, it is shown that the lower bound estimations provide quite conservative lifetime predictions.     

稀土元素对SnAgCu焊点内部组织的影响机制

随着人们环保意识的逐渐增强,新型无铅钎料的研究成为电子工业中的研究热点,而稀土元素的添加可以显著改善钎料的性能,基于含稀土Ce无铅钎料的钎焊试验,采用扫描电镜和能谱仪研究稀土元素Ce对SnAgCu焊点内部组织的影响机制。结果表明,稀土元素在SnAgCu焊点内部以CeSn3的形式存在,且稀土相形态各异。采用化学亲和力来表征稀土元素Ce与Sn、Ag、Cu之间的内在联系,从理论上证明Ce的“亲Sn性”。采用乌尔夫原理研究稀土元素的吸附现象,解释稀土元素Ce对SnAgCu焊点内部金属间化合物的细化作用。由SnAgCuCe焊点组织分析,发现基体组织中颗粒尺寸大小排序为CeSn3>Cu6Sn5>Ag3Sn,从理论上证明纳米Ag3Sn颗粒在SnAgCuCe焊点强化中发挥着主要的作用。研究结果可以为新型无铅钎料的研究提供理论支撑。     

蠕变持久寿命幂函数预测方法

通过对大量试验数据的分析研究发现．蠕变持久寿命试验数据经加权累加变换后，能够很好地呈现出幂函数变化规律。由此建立蠕变持久寿命幂函数预测模型，并采用导数最小二乘法确定模型中的待定参数。该方法不但拟合蠕变持久曲线本身，而且还同时拟合蠕变持久曲线上各点的导数，能够很好地描述蠕变持久曲线及其变化趋势，从而实现长期蠕变持久寿命的高精度预测。大量对比试验结果表明，与传统方法相比，蠕变持久寿命幂函数预测方法可以获得更高的预测精度。文中给出两个应用实例。     

采用镍基和奥氏体焊材焊接Cr5Mo钢焊接接头的高温性能

通过热处理实验、持久实验以及焊缝附近微区变形的测量 ,对采用镍基焊材和奥氏体不锈钢焊材焊接的Cr5Mo钢焊接接头的高温性能进行研究。试验表明在高温条件下 ,奥氏体A30 2 /Cr5Mo焊接接头很快就发生碳迁移 ,且碳迁移的程度随着时间的延长而加剧 ;而镍基Inconel 1 82 /Cr5Mo焊接接头很难发生碳迁移。由于碳迁移的影响 ,在低应力的条件下 ,A30 2 /Cr5Mo焊接接头持久寿命大约只有Inconel 1 82 /Cr5Mo焊接接头的 5 0 % ,且镍基焊接接头的断裂位置大多位于远离焊缝的母材上 ,而A30 2 /Cr5Mo焊接接头的断裂位置大都在脱碳层附近。通过对焊缝附近微小区域变形的测量 ,发生断裂的脱碳层区域较其他位置具有较大的蠕变变形以及较高的蠕变变形速率