Low-frequency noise in gallium nitride epitaxial layers with different degrees of order of mosaic structure

The correlation between the noise level 1/f and the degree of mosaic-structure order in gallium nitride epitaxial layers was studied for the first time. Samples with a doping level of N _d ?N _a ≈8×10¹⁶ cm^?3 and a relatively high degree of order were characterized by the Hooge parameter α≈1.5×10^?3. This value is unprecedently low for thin GaN epitaxial films. The Hooge parameter was significantly higher for samples with N _d ?N _a ≈1.1×10¹⁸ cm^?3 and a low degree of order despite the fact that α generally decreases with increasing doping level at the same degree of order. Thus, the degree of mosaic-structure order affects not only the optical and electrical characteristics but also the fluctuation parameters of GaN epitaxial layers.     

Raman and infrared spectroscopy of GaN nanocrystals grown by chloride-hydride vapor-phase epitaxy on oxidized silicon

Raman and infrared spectroscopy were applied to study nanocrystalline GaN films grown by chloride-hydride vapor-phase epitaxy on SiO₂/Si(111) substrates at T=520°C. It was ascertained that GaN nanocrystals are formed on the oxidized silicon surface at a rate of 10^?2 nm/s. It was shown that the peaks in the Raman spectra E₂(high)=566 cm^?1 and A₁(LO)=730 cm^?1 correspond to the elastically strained GaN wurtzite structure. It was detected that a peak related to E₁(TO)=558 cm^?1 arises in the infrared spectra, which shows that elastic stresses in the nanocrystals are insignificant.     

Photoluminescence of electron-hole plasma in semi-insulating undoped GaAs

The dependence of the photoluminescence spectrum of electron-hole plasma in semi-insulating undoped GaAs on the concentration of the background carbon impurity N_C(3×10¹⁵ cm^?3≤N_C≤4×10¹⁶ cm^?3) is studied at 77 K. It is established that the density of the electron-hole plasma, which is equal to n _e?h ≈1.1×10¹⁶ cm^?3 in crystals with the lowest impurity concentration at an excitation intensity of 6×10²² photons/(cm² s), decreases considerably as the value of N_C increases in the range mentioned above. A decrease in the density of the electron-hole plasma with increasing N_C is attributed to the effect of fluctuations in the carbon concentration N_C, which give rise to a nonuniform distribution of interacting charge carriers and to localization of holes in the tails of the density of states of the valence band.     

MOCVD growth and Mg-doping of InAs layers

Epitaxial layers of Mg-doped InAs were grown by MOCVD, and electrical properties of these layers were studied. The doping with magnesium in the course of MOCVD growth allows one to obtain strongly compensated p-InAs with a high hole density (p≈2×10¹⁸ cm^?3) and a low carrier mobility (μ≈50 cm²/(V s)) at T=300 K. When the samples are lightly doped with Mg, neutral impurities are bound with Mg, and n-type InAs layers with a carrier mobility exceeding that in undoped samples are formed.     

Dielectric waveguide for middle and far infrared radiation

The possibility of using the normal skin effect in dielectric waveguides for long-wavelength radiation is analyzed. A design of a waveguide integrated with a heterolaser is suggested, in which an undoped layer of GaAs is clad between heavily-doped n- and p-Al _x Ga_{1 ? x} As alloy layers, reflecting radiation because of the normal skin effect. It is shown that an efficient waveguide can be formed using n-Al _x Ga_{1 ? x} As layers with x < 0.45 and the electron concentration N > 5 × 10¹⁸ cm^?3 and p-Al _x Ga_{1 ? x} As layers of any composition with the hole concentration P ≥ 3 × 1019 cm^?3.     

Electrical properties of Si:H/<Emphasis Type="Italic">p</Emphasis>-Si structures fabricated by hydrogen implantation

Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3–24 keV) high-dose (5×10¹⁶–3×10¹⁷ cm^?2) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E _c ?0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2×10¹⁷ cm^?2 of hydrogen and annealed in the temperature range of 250–300°C. The band gap of the Si:H layer E _g ≈2.4 eV, and the dielectric constant ?≈3.2. The density of states near the Fermi level is (1–2)×10¹⁷ cm^?3 eV^?1.     

A 4<Emphasis Type="Italic">H</Emphasis>-SiC<Emphasis Type="Italic">p-i-n</Emphasis> diode fabricated by a combination of sublimation epitaxy and CVD

The possibility of fabricating heavily doped (N _a ?N _d ≥ 1 × 10¹⁹ cm_?3) p⁺-4H-SiC layers on CVD-grown lightly doped n-4H-SiC layers by sublimation epitaxy has been demonstrated. It is shown that a Au/Pd/Ti/Pd contact, which combines a low specific contact resistance (～2 × 10^?5 Ω cm²) with high thermal stability (up to 700°C), is the optimal contact to p-4H-SiC. The p-n structures obtained are used to fabricate packaged diodes with a breakdown voltage of up to 1400 V.     

Effect of Dislocation-related Deep Levels in Heteroepitaxial InGaAs/GaAs and GaAsSb/GaAs <Emphasis Type="Italic">p</Emphasis>–<Emphasis Type="Italic">i</Emphasis>–<Emphasis Type="Italic">n</Emphasis> Structures on the Relaxation time of Nonequilibrium Carriers

The results of an experimental study of the capacitance–voltage (C–V) characteristics and deep-level transient spectroscopy (DLTS) spectra of p⁺–p⁰–i–n⁰ homostructures based on undoped dislocationfree GaAs layers and InGaAs/GaAs and GaAsSb/GaAs heterostructures with homogeneous networks of misfit dislocations, all grown by liquid-phase epitaxy (LPE), are presented. Deep-level acceptor defects identified as HL2 and HL5 are found in the epitaxial p⁰ and n⁰ layers of the GaAs-based structure. The electron and hole dislocation-related deep levels, designated as, respectively, ED1 and HD3, are detected in InGaAs/GaAs and GaAsSb/GaAs heterostructures. The following hole trap parameters: thermal activation energies (E _t ), capture cross sections (σ _p ), and concentrations (N _t ) are calculated from the Arrhenius dependences to be E _t = 845 meV, σ _p = 1.33 × 10^–12 cm², N _t = 3.80 × 10¹⁴ cm^–3 for InGaAs/GaAs and E _t = 848 meV, σ _p = 2.73 × 10^–12 cm², N _t = 2.40 × 10¹⁴ cm^–3 for GaAsSb/GaAs heterostructures. The concentration relaxation times of nonequilibrium carriers are estimated for the case in which dislocation-related deep acceptor traps are involved in this process. These are 2 × 10^–10 s and 1.5 × 10^–10 s for, respectively, the InGaAs/GaAs and GaAsSb/GaAs heterostructures and 1.6 × 10^–6 s for the GaAs homostructures.     

Specific features of electron spin resonance in 4<Emphasis Type="Italic">H</Emphasis>-SiC in the vicinity of the insulator-metal phase transition: II. Analysis of the width and shape of lines

The variation in the width and shape of the ESR line of nitrogen in 4H-SiC in the concentration range corresponding to the insulator-metal phase transition was investigated. It is shown that the spin relaxation in the region of hopping and metal conduction occurs at electrical multipoles (clusters) whose sizes decrease from rather large to small (characteristic of interimpurity distances) as the concentration of impurity centers increases. Analysis of the temperature dependences of the resistance made it possible to estimate the critical concentration for the insulator-metal phase transition (N _D -N _A )_c≈1.5×10¹⁹ cm^?3. The values of other characteristic concentrations that determine the effects of electron-electron interaction in the system under study were also found.     

Low-temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

The impact ionization of acceptors in aluminum-doped 4H-SiC epitaxial films (Al concentration 2 × 10¹⁵ cm^?3) at a temperature of 77 K is studied. It is found that the impact-ionization coefficient exponentially depends on the reverse electric field: α _p = α*_pexp(?F*/F). The largest ionization coefficient is α* _p = 7.1 × 10⁶ cm^?3 s^?1, and the threshold field is F* = 2.9 × 10⁴ V/cm.     

Carrier Lifetimes in Lightly-Doped <Emphasis Type="Italic">p</Emphasis>-Type 4H-SiC Epitaxial Layers Enhanced by Post-growth Processes and Surface Passivation

We investigated limiting factors of carrier lifetimes and their enhancement by post-growth processes in lightly-doped p-type 4H-SiC epitaxial layers (N _A ～ 2 × 10¹⁴ cm^?3). We focused on bulk recombination, surface recombination, and interface recombination at the epilayer/substrate, respectively. The carrier lifetime of 2.8 μs in an as-grown epilayer was improved to 10 μs by the combination of V_C-elimination processes and hydrogen annealing. By employing surface passivation with deposited SiO₂ followed by POCl₃ annealing, a long carrier lifetime of 16 μs was obtained in an oxidized epilayer. By investigating carrier lifetimes in a self-standing p-type epilayer, it was revealed that the interface recombination at the epilayer/substrate was smaller than the surface recombination on a bare surface. We found that the V_C-elimination process, hydrogen annealing, and surface passivation are all important for improving carrier lifetimes in lightly-doped p-type epilayers.     

Investigation of the ZnS-CdHgTe interface

The ZnS-Cd_xHg_1?xTe interface was investigated using the capacitance-voltage characteristics of MIS structures in experimental samples. During fabrication of the n⁺-p junctions based on p-Cd_xHg_1?xTe, the density of states within the range N _ss =(1–6)×10¹¹ cm^?2 eV^?1 at T=78 K was obtained. The experiments showed that the conditions in which n⁺-p junctions are fabricated only slightly affect the state of the ZnS-CdHgTe interface. The negative voltages of the at bands V _FB , even if immediately after deposition of the ZnS films V _FB >0, point to the enrichment of the ZnS-p-CdHgTe near-surface layer with majority carriers, specifically, holes. This led to a decrease in the leakage current over the surface. During long-term storage (as long as ～15 years) in air at room temperature, no degradation of differential resistance R _d , current sensitivity S _i , and detectivity D* of such n⁺-p junctions with a ZnS protection film was observed.     

Modification of the properties of porous silicon on adsorption of iodine molecules

Infrared spectroscopy and electron spin resonance measurements are used to study the properties of porous silicon layers on adsorption of the I₂ iodine molecules. The layers are formed on the p-an n-Si single-crystal wafers. It is established that, in the atmosphere of I₂ molecules, the charge-carrier concentration in the layers produced on the p-type wafers can be noticeably increased: the concentration of holes can attain values on the order of ～10¹⁸?10¹⁹ cm^?3. In porous silicon layers formed on the n-type wafers, the adsorption-induced inversion of the type of charge carriers and the partial substitution of silicon-hydrogen bonds by silicon-iodine bonds are observed. A decrease in the concentration of surface paramagnetic defects, P _b centers, is observed in the samples with adsorbed iodine. The experimental data are interpreted in the context of the model in which it is assumed that both deep and shallow acceptor states are formed at the surface of silicon nanocrystals upon the adsorption of I₂ molecules.     

Special features of radiation-defect annealing in silicon <Emphasis Type="Italic">p-n</Emphasis> structures: The role of Fe impurity atoms

Deep-level transient spectroscopy is used to study the formation of complexes that consist of a radiation defect and a residual impurity atom in silicon. It is established that heat treatment of the diffused Si p⁺-n junctions irradiated with fast electrons lead to the activation of a residual Fe impurity and the formation of the FeVO (E_0.36 trap) and FeV₂ (H_0.18 trap) complexes. The formation of these traps is accompanied by the early (100–175°C) stage of annealing of the main vacancy-related radiation defects: the A centers (VO) and divacancies (V₂). The observed complexes are electrically active and introduce new electron (E_0.36: E _t ^e =E _c -0.365 eV, σ _n =6.8×10^?15 cm²) and hole (H_0.18: E _t ^h =E _v +0.184 eV, σ _p =3.0×10^?15 cm²) levels into the silicon band gap and have a high thermal stability. It is believed that the complex FeVO corresponds to the previously observed and unidentified defects that have an ionization energy of E _t ^e =E _c ?(0.34–0.37) eV and appear as a result of heat treatment of irradiated diffused Si p⁺-n junctions.     

The electronic and emissive properties of Au-doped porous silicon

The temperature dependences of photovoltage induced by intense pulses of red and white light, along with the time-resolved spectral dependences of photoluminescence, are studied for porous silicon structures por-Si/p-Si). These structures have been obtained by anode etching of p-Si with subsequent Au doping from an aqueous solution with Au ion concentrations of 10^?4 and 10^?3 M. The current-voltage characteristics and electroluminescence of the resulting por-Si/p-Si and por-Si:Au/p-Si structures are also studied after a deposition of semitransparent Au electrodes on por-Si. It is shown that the Au doping changes the sign of the boundary potential of p-Si from positive to negative, alters the magnitude and sign of the photovoltage in the por-Si films, and eliminates photomemory phenomena, which are associated with the capture of nonequilibrium electrons at grain-boundary traps and por-Si traps. The formation of Au nanocrystals in por-Si substantially affects the current-voltage and photoluminescence characteristics. Electroluminescence is observed for the Au/por-Si:(Au, 10^?3 M)/p-Si/Al structures and is attributed to emission from the nanocrystals.     

Electrical properties of Zinc-Tin diarsenide (ZnSnAs<Subscript>2</Subscript>) irradiated with H<Superscript>+</Superscript> ions

The results of studying the electrical properties and isochronous annealing of p-ZnSnAs₂ irradiated with H⁺ ions (energy E = 5 MeV, dose D = 2 × 10¹⁶ cm^?2) are reported. The limiting electrical characteristics of irradiated material (the Hall coefficient R _H (D)_lim ≈ ?4 × 10³ cm³ C^?1, conductivity σ (D)_lim ≈ 2.9 × 10^?2 Ω^?1 cm^?1, and the Fermi level position F _lim ≈ 0.58 eV above the valence-band top at 300 K) are determined. The energy position of the “neutral” point for the ZnSnAs₂ compound is calculated.     

High-temperature nuclear-detector arrays based on 4 <Emphasis Type="Italic">H</Emphasis>-SiC ion-implantation-doped <Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-<Emphasis Type="Italic">n</Emphasis> junctions

Results obtained in a study of spectrometric characteristics of arrays of four detectors based on 4H-SiC ion-implantation-doped p ⁺-n junctions in the temperature range 25–140 °C are reported for the first time. The junctions were fabricated by ion implantation of aluminum into epitaxial 4H-SiC layers of thickness ≤45 μm, grown by chemical vapor deposition with uncompensated donor concentration N _d ? N _a = (4–6) × 10¹⁴ cm^?3. The structural features of the ion-implantation-doped p ⁺-layers were studied by secondary-ion mass spectrometry, transmission electron microscopy, and Rutherford backscattering spectroscopy in the channeling mode. Parameters of the diode arrays were determined by testing in air with natural-decay alpha particles with an energy of 3.76 MeV. The previously obtained data for similar single detectors were experimentally confirmed: the basic characteristics of the detector arrays, the charge collection efficiency and energy resolution, are improved as the working temperature increases.     

Electrical properties and luminescence spectra of light-emitting diodes based on InGaN/GaN heterostructures with modulation-doped quantum wells

The distribution of charged centers N(w), quantum efficiency, and electroluminescence spectra of blue and green light-emitting diodes (LED) based on InGaN/AlGaN/GaN p-n heterostructures were investigated. Multiple InGaN/GaN quantum wells (QW) were modulation-doped with Si donors in GaN barriers. Acceptor and donor concentrations near the p-n junction were determined by the heterodyne method of dynamic capacitance to be about N _A ≥ 1 × 10¹⁹ cm^?3 ? N _D ≥ 1 × 10¹⁸ cm^?3. The N(w) functions exhibited maxima and minima with a period of 11–18 (±2–3 nm) nm. The energy diagram of the structures has been constructed. The shifts of spectral peaks with variation of current (J=10^?6–3×10^?2 A) are smaller (13–12 meV for blue and 20–50 meV for green LEDs) than the corresponding values for the diodes with undoped barriers (up to 150 meV). This effect is due to the screening of piezoelectric fields in QWs by electrons. The dependence of quantum efficiency on current correlates with the charge distribution and specific features in the current-voltage characteristics.     

Method for optimizing the parameters of heterojunction photovoltaic cells based on crystalline silicon

An approach is proposed to calculate the optimal parameters of silicon-based heterojunction solar cells whose key feature is a low rate of recombination processes in comparison with direct-gap semiconductors. It is shown that at relatively low majority-carrier concentrations (N_d ～ 10¹⁵ cm^–3), the excess carrier concentration can be comparable to or higher than N_d. In this case, the efficiency η is independent of N_d. At higher N_d, the dependence η(N_d) is defined by two opposite trends. One of them promotes an increase in η with N_d, and the other associated with Auger recombination leads to a decrease in η. The optimum value N_d ≈ 2 × 10¹⁶ cm^–3 at which η of such a cell is maximum is determined. It is shown that maximum η is 1.5–2% higher than η at 10¹⁵ cm^–3.     

Special features of annealing of radiation defects in irradiated <Emphasis Type="Italic">p</Emphasis>-Si crystals

p-Si single crystals grown by the Czochralski method were studied; the hole concentration in these crystals was p = 6 × 10¹³ cm^?3. The samples were irradiated with 8-MeV electrons at 300 K and were then annealed isochronously in the temperature range T _ann = 100–500°C. The studies were carried out using the Hall method in the temperature range of 77–300 K. It is shown that annealing of divacancies occurs via their transformation into the B _s V ₂ complexes. This complex introduces the energy level located at E _v + 0.22 eV into the band gap and is annealed out in the temperature range of 360–440°C. It is assumed that defects with the level E _v + 0.2 eV that anneal out in the temperature range T _ann = 340–450°C are multicomponent complexes and contain the atoms of the doping and background impurities.