Asymmetric dual-k spacer trigate FinFET for enhanced analog/RF performance

In this paper, we aim to explore the potential benefits of using source side only dual-k spacer (Dual-kS) trigate FinFET structure to improve the analog/RF figure of merit (FOM) for low power operation at 20 nm gate length. It has been observed from the results that Dual-kS (inner spacer high-k) FinFET structure improves the coupling of the gate fringe field to the underlap region towards the source side and results into improvement in transconductance \((g_{m})\) and output conductance \((g_{ds})\). It was also found that drain side only dual-k spacer (Dual-kD) improves the coupling of the gate fringe field to the underlap region towards the drain side which helps to shift away the drain field from gate edge and results into improvement in output conductance \((g_{ds})\) only at the cost of increase in Miller capacitance. A comparative simulation study has been performed on four different device structures namely both side low-k spacers (conventional), both side dual-k spacer (Dual-kB), Dual-kD and Dual-kS structures. From the simulation study, it was found that that Dual-kS structure has potential to improve \(g_{m}\) by \(\sim \)8.7 %, \(g_{ds}\) by \(\sim \)32.24 %, intrinsic gain \((A_{V0})\) by \(\sim \)11.44 %, early voltage \((V_{EA})\) by \(\sim \)47.59 %, maximum oscillation frequency (\(f_{MAX}\)) by \(\sim \)1.7 % and the ratio of gate-source capacitance and gate-drain capacitance \((C_{gs}/C_{gd})\) by \(\sim \)15.27 % with a slight reduction in the value of unity gain cut-off frequency (\(f_{T}\)) by \(\sim \)0.58 % in comparison to the conventional structure at drain current \((I_{ds})\) of \(10\,\upmu \)A/\(\upmu \)m. Furthermore, to reduce the drain field influence on the channel region, we also studied the effect of asymmetric drain extension length on Dual-kS FinFET structure.     

Investigation of trigate JLT with dual-<Emphasis Type="Italic">k</Emphasis> sidewall spacers for enhanced analog/RF FOMs

This paper shows the potential benefits of using the trigate junctionless transistor (JLT) with dual-k sidewall spacers to enhance analog/radio-frequency (RF) performance at 20-nm gate length. Simulation study shows that the source-side-only dual-k spacer (dual-kS) JLT can improve all analog/RF figures of merit (FOMs) compared with the conventional JLT structure. The dual-kS JLT shows improvement in intrinsic voltage gain (\(A_{V0}\)) by \(\sim \)44.58 %, unity-gain cutoff frequency (\(f_\mathrm{T}\)) by \(\sim \)7.67 %, and maximum oscillation frequency (\(f_\mathrm{MAX}\)) by \(\sim \)6.4 % at drain current \((I_\mathrm{ds}) = 10\,\upmu \hbox {A}/\upmu \hbox {m}\) compared with the conventional JLT structure. To justify the improvement in all analog/RF FOMs, it is also found that the dual-kS structure shows high electron velocity near the source region because of the presence of an additional electric field peak near the source region, resulting in increased electron transport efficiency and hence improved transconductance (\(g_\mathrm{m}\)). Furthermore, the dual-kS JLT shows a reduction in the electric field value near the drain end, thereby improving short-channel effects.     

20-nm T-gate composite channel enhancement-mode metamorphic HEMT on GaAs substrates for future THz applications

In this paper, the RF and DC behaviours of a SiN-passivated 20-nm gate length metamorphic high electron mobility transistor (MHEMT) on GaAs substrate with \({\updelta }\)-doped sheets on either side of the composite channel are studied using the Synopsys TCAD tool. The 20-nm enhancement-mode MHEMT with \({\updelta }\)-doped sheets on either side of the \(\hbox {In}_{0.75}\hbox {Ga}_{0.25}\hbox {As}\)/InAs/ \(\hbox {In}_{0.75}\hbox {Ga}_{0.25}\hbox {As}\) multilayer channel shows a transconductance of 3000 mS/mm, cut-off frequency (\({f}_{\mathrm{T}}\)) of 760 GHz and a maximum-oscillation frequency (\({f}_{\mathrm{max}}\)) of 1270 GHz. The threshold voltage of the device is found to be 0.07 V. The room-temperature Hall mobilities of the two-dimensional sheet charge density (2DEG) are measured to be over \(12800\,\hbox {cm}^{2}\)/Vs with a sheet charge density larger than 4 \(\times \) \(10^{12}\,\hbox {cm}^{-2}\). These high-performance enhancement-mode MHEMTs are attractive candidates for future terahertz applications such as high-resolution radars for space research and also for low-noise wide-bandwidth amplifier for future communication systems.     

Simulation-based performance analysis of an ultra-low specific on-resistance trench SOI LDMOS with a floating vertical field plate

An ultra-low specific on-resistance \((R_\mathrm{{on,sp}})\) trench SOI LDMOS with a floating vertical field plate structure (FVFPT SOI) is proposed in this paper. A floating vertical plate (FVFP) is introduced into the filled oxide trench of a conventional trench SOI LDMOS (CT SOI) to improve its electrical performance. We conduct related performance analysis to this device by simulation and investigate the effects of different parameters on its performance. The FVFP causes an assisted depletion effect especially for the trench surface regions. An ultra-low \(R_\mathrm{{on,sp}}\) is therefore obtained in the FVFP device due to higher drift region doping concentration \((N_\mathrm{{d}})\). A breakdown voltage (BV) of 188V and a \(R_\mathrm{{on,sp}}\) of \(0.9 \hbox { m}\Omega \, \hbox { cm}^{2}\) are realized on a 4.8-\({\upmu }\hbox {m}\)-long drift region, a 7.5-\({\upmu }\hbox {m}\)-thick top-silicon layer and a 0.5-\({\upmu }\hbox {m}\)-thick buried oxide (BOX) layer by our simulation. Eventually, the \(R_\mathrm{{on,sp}}\) for the FVFPT SOI can be reduced by more than 60%, while its BV is maintained the same class as the CT SOI, and the figure of merit (FOM) is enhanced by 155%. And a set of optimal parameters, including the structure parameters of plate and the property parameters of device, are obtained.     

Ambipolar leakage suppression in electron–hole bilayer TFET: investigation and analysis

In this paper, we propose and simulate two new structures of electron–hole bilayer tunnel field-effect transistors (EHBTFET). The proposed devices are n-heterogate with \(\hbox {M}_{1}\) as overlap gate, \(\hbox {M}_{2}\) as underlap gate and employs a high-k dielectric pocket in the drain underlap. Proposed structure 1 employs symmetric underlaps (Lgs = Lgd = Lu). The leakage analysis of this structure shows that the lateral ambipolar leakage between channel and drain is reduced by approximately three orders, the OFF-state leakage is reduced by one order, and the \(I_{\mathrm{ON}}/I_{\mathrm{OFF}}\) ratio is increased by more than one order at \(V_\mathrm{{GS}}=V_{\mathrm{DS}} =1.0\) V as compared to the conventional Si EHBTFET. The performance is improved further by employing asymmetric underlaps (\(\hbox {Lgs}\ne \hbox {Lgd}\)) with double dielectric pockets at source and drain, called as proposed structure 2. The pocket dimensions have been optimized, and an average subthreshold swing of 17.7 mV/dec (25.5% improved) over five decades of current is achieved with an ON current of \(0.23~\upmu \hbox {A}/\upmu \hbox {m}\) (11% improved) in proposed structure 2 in comparison with the conventional EHBTFET. Further, the parasitic leakage paths between overlap/underlap interfaces are blocked and the OFF-state leakage is reduced by more than two orders. A high \(I_{\mathrm{ON}}/I_{\mathrm{OFF}}\,\hbox {ratio}~>10^{9}\) (two orders higher) is achieved at \(V_{\mathrm{DS}} =V_{\mathrm{GS}} =1.0~\hbox {V}\) in the proposed structure 2 in comparison with the conventional one.     

Analog and RF performance of doping-less tunnel FETs with $$\hbox {Si}_{0.55} \hbox {Ge}_{0.45}$$ source

This paper reports studies of a doping-less tunnel field-effect transistor (TFET) with a \(\hbox {Si}_{0.55} \hbox {Ge}_{0.45}\) source structure aimed at improving the performance of charge-plasma-based doping-less TFETs. The proposed device achieves an improved ON-state current (\(I_{{\mathrm{ON}}} \sim {4.88} \times {10}^{-5}\,{\mathrm{A}}/\upmu {\mathrm{m}}\)), an \(I_\mathrm{ON}/I_\mathrm{OFF}\) ratio of \({6.91} \times {10}^{12}\), an average subthreshold slope (\(\hbox {AV-SS}\)) of \(\sim \) \({64.79}\,{\mathrm{mV/dec}}\), and a point subthreshold slope (SS) of 14.95 mV/dec. This paper compares the analog and radio of frequency (RF) parameters of this device with those of a conventional doping-less TFET (DLTFET), including the transconductance (\(g_{{\mathrm{m}}}\)), transconductance-to-drain-current ratio \((g_\mathrm{m}/I_\mathrm{D})\), output conductance \((g_\mathrm{d})\), intrinsic gain (\(A_{{\mathrm{V}}}\)), early voltage (\(V_{{\mathrm{EA}}}\)), total gate capacitance (\( C_{{\mathrm{gg}}}\)), and unity-gain frequency (\(f_{{\mathrm{T}}}\)). Based on the simulated results, the \(\hbox {Si}_{0.55}\hbox {Ge}_{0.45}\)-source DLTFET is found to offer superior analog as well as RF performance.     

Delta-doped tunnel FET (D-TFET) to improve current ratio ($$I_\mathrm{ON}/I_\mathrm{OFF}$$) and ON-current performance

A two dimensional (2D) analytical drain current model has been developed for a delta-doped tunnel field-effect transistor (D-TFET) that can address the ON-current issues of the conventional TFET. Insertion of a highly doped delta layer in the source region paves the way for improved tunneling volume and thus provides high drain current as compared with TFETs. The present model takes into account the effects of the distance between the delta-doping region and the source–channel interface on the subthreshold swing (SS), current ratio, and ON-current performance. The D-TFET is predicted to have a higher current ratio \(\left( {\frac{I_\mathrm{ON} }{I_\mathrm{OFF} }\cong 10^{11}} \right) \) compared with TFETs \(\left( {\frac{I_\mathrm{ON} }{I_\mathrm{OFF} }\cong 10^{10}} \right) \) with a reasonable SS \(\left( {{\sim }52\,\mathrm{mV/dec}} \right) \) and \(V_\mathrm{th}\) performance at an optimal position of 2 nm from the channel. The surface potential, electric field, and minimum tunneling distance have been derived using the solution of the 2D Poisson equation. The accuracy of the D-TFET model is validated using the technology computer aided design (TCAD) device simulator from Synopsys.     

Optimal design of the multiple-apertures-GaN-based vertical HEMTs with $$\hbox {SiO}_{2}$$ current blocking layer

Gallium nitride (GaN) based vertical high electron mobility transistor (HEMT) is very crucial for high power applications. Combination of advantageous material properties of GaN for high speed applications and novel vertical structure makes this device very beneficial for high power application. To improve the device performance especially in high drain bias condition, a novel GaN based vertical HEMT with silicon dioxide \((\hbox {SiO}_{2})\) current blocking layer (CBL) was reported recently. In this paper, effects of the thickness of CBL layer and the aperture length on the electrical and breakdown characteristics of GaN vertical HEMTs with \(\hbox {SiO}_{2}\) CBL are simulated by using two-dimensional quantum-mechanically corrected device simulation. Intensive numerical study on the device enables us to optimize and conclude that devices with \(0.5\hbox {-}\upmu \hbox {m}\)-thick \(\hbox {SiO}_{2}\) layer and \(1\hbox {-}\upmu \hbox {m}\)-long aperture will be beneficial considerations to improve the device performance. Notably, using the multiple apertures can effectively reduce the on-state conducting resistance of the device. On increasing the number of apertures, the drain current is increased but the breakdown voltage is decreased. Therefore, device with four apertures is taken as an optimized result. The maximum drain current of 84 mA at \(\hbox {V}_\mathrm{G}= 1\,\hbox {V}\) and \(\hbox {V}_\mathrm{D}= 30\,\hbox {V}\), and the breakdown voltage of 480 V have been achieved for the optimized device.     

Systematic study of elastic,electronic, and magnetic properties of lanthanum cobaltite oxide

The electronic structure, elastic constants, and magnetic properties of lanthanum cobaltite oxide \(\hbox {La}_{4}\hbox {Co}_{3}\hbox {O}_{9}\) compound, which crystallizes in orthorhombic space group Pnma, are investigated theoretically for the first time using the full potential linearized augmented plane wave (FP-LAPW) method based on the density functional theory plus Hubbard correction term (DFT \(+\) U). The calculated equilibrium lattice constants and fractional atomic coordinates are in a good agreement with available experimental data. Our result for the formation energy and elastic constants confirms that the predicted \(\hbox {La}_{4}\hbox {Co}_{3}\hbox {O}_{9}\) is mechanically stable. This compound is found to be ductile in nature in accordance with Pugh’s criteria. The anisotropy factors (\({A}_{1})\), (\({A}_{2})\), and (\({A}_{3})\) of \(\hbox {La}_{4}\hbox {Co}_{3}\hbox {O}_{9}\) material are also predicted through the elastic constants. The electronic band structures show metallic behavior; the conductivity is mostly governed by Co-3d and O-2p states. The total magnetic moments of the tetrahedral (\(\hbox {CoO}_{4})\) and octahedral (\(\hbox {CoO}_{6})\) environments are, respectively, 2.502 \(\mu _{B}\) and 2.874 \(\mu _{B}\), which are consistent with the experimental measurements.     

Structural,electrical and optical properties of $$\hbox {InGaZnO}_{4}$$ and $$\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}$$In29Sn3O48: a first-principles study

First-principles calculations were performed to investigate the electrical and optical properties of \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) with Sn-doped \(\hbox {In}_{2}\hbox {O}_{3}\) and \(\hbox {InGaZnO}_{4}\) (IGZO). The band structure, density of states, optical properties including dielectric function, loss function, reflectivity and absorption coefficient are calculated. The calculated total energy shows that the most stable crystal structures are type III for \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) and type II for \(\hbox {InGaZnO}_{4}\). The band structure indicates the both \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) and \(\hbox {InGaZnO}_{4}\) are direct gap semiconductors. The intrinsic band gap of \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) is much narrower than that of \(\hbox {InGaZnO}_{4}\), and results in a better electrical conductivity for \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\). The density of states shows the main hybridization occurring between In-4d and O-2p states for \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) while between In-4d In-5p, Zn-4s and O-2p states for \(\hbox {InGaZnO}_{4}\) near the valence band maximum. The reflectivity index \(R({\omega })\) shows that the peak value of \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) and \(\hbox {InGaZnO}_{4}\) appears only in the ultraviolet range, indicating that these two materials have all excellent transparency. In addition, the absorption coefficient \({\alpha }({\omega })\) of both \(\hbox {In}_{29}\hbox {Sn}_{3}\hbox {O}_{48}\) and \(\hbox {InGaZnO}_{4}\) is high in the ultraviolet frequency range, and therefore they show, a high UV absorption rate.     

Filament-to-dielectric band alignments in $$\hbox {TiO}_{2}$$ and $$\hbox {HfO}_{2}$$HfO2 resistive RAMs

The next-generation nonvolatile memory storage may well be based on resistive random access memories (RRAMs). \(\hbox {TiO}_{2}\) and \(\hbox {HfO}_{2}\) have been widely used as the resistive switching layer for RRAM devices. However, the electronic properties of the filament-to-dielectric interfaces are still not well understood yet, compared to those of the electrodes and the dielectric. In this work, we study the electronic structures of three typical filament and dielectric structures, \(\hbox {Ti}_{4}\hbox {O}_{7}/\hbox {TiO}_{2}\), \(\hbox {Hf}_{2}\hbox {O}_{3}/\hbox {HfO}_{2}\) and \(\hbox {Hf}/\hbox {HfO}_{2}\), using ab initio calculations. We implement the GGA-1/2 method, which rectifies the band gaps of GGA through self-energy correction. Our calculation predicts an ohmic contact for the \(\hbox {Ti}_{4}\hbox {O}_{7}/\hbox {TiO}_{2}\) interface, where the defective \(\hbox {Ti}_{4}\hbox {O}_{7}\) phase was experimentally identified as the filament composition in \(\hbox {TiO}_{2}\). However, there is a finite Schottky barrier existing in either \(\hbox {Hf}_{2}\hbox {O}_{3}/\hbox {HfO}_{2}\) interface (1.96 eV) or \(\hbox {Hf}/\hbox {HfO}_{2}\) interface (0.61 eV), the two probable filament–dielectric configurations in hafnia-based RRAM. Our results suggest that the distinct filament-to-dielectric band alignments in \(\hbox {TiO}_{x}\) and \(\hbox {HfO}_{x}\) systems account for the much larger resistance window for the latter.     

Dual-material double-gate tunnel FET: gate threshold voltage modeling and extraction

A new analytical model for the gate threshold voltage (\(V_\mathrm{TG}\)) of a dual-material double-gate (DMDG) tunnel field-effect transistor (TFET) is reported. The model is derived by solving the quasi-two-dimensional Poisson’s equation in the lightly doped Si film and employing the physical definition of \(V_\mathrm{TG}\). A numerical simulation study of the transfer characteristics and \(V_\mathrm{TG}\) of a DMDG TFET has been carried out to verify the proposed analytical model. In the numerical calculations, extraction of \(V_\mathrm{TG}\) is performed based on the transconductance change method as already used for conventional metal–oxide–semiconductor FETs (MOSFETs). The effects of gate length scaling, Si film thickness scaling, and modification of the gate dielectric on \(V_\mathrm{TG}\) are reported. The dependence of \(V_\mathrm{TG}\) on the applied drain bias is investigated using the proposed model. The proposed model can predict the effect of variation of all these parameters with reasonable accuracy.     

Accelerating multi-echo water-fat MRI with a joint locally low-rank and spatial sparsity-promoting reconstruction

Objectives

Our aim was to demonstrate the benefits of using locally low-rank (LLR) regularization for the compressed sensing reconstruction of highly-accelerated quantitative water-fat MRI, and to validate fat fraction (FF) and \({R_2^*}\) relaxation against reference parallel imaging in the abdomen.

Materials and methods

Reconstructions using spatial sparsity regularization (SSR) were compared to reconstructions with LLR and the combination of both (LLR+SSR) for up to seven fold accelerated 3-D bipolar multi-echo GRE imaging. For ten volunteers, the agreement with the reference was assessed in FF and \({R_2^*}\) maps.

Results

LLR regularization showed superior noise and artifact suppression compared to reconstructions using SSR. Remaining residual artifacts were further reduced in combination with SSR. Correlation with the reference was excellent for FF with \(R^2\) = 0.99 (all methods) and good for \({R_2^*}\) with \(R^2\) = [0.93, 0.96, 0.95] for SSR, LLR and LLR+SSR. The linear regression gave slope and bias (%) of (0.99, 0.50), (1.01, 0.19) and (1.01, 0.10), and the hepatic FF/\({R_2^*}\) standard deviation was 3.5%/12.1 s\(^{-1}\), 1.9%/6.4 s\(^{-1}\) and 1.8%/6.3 s\(^{-1}\) for SSR, LLR and LLR+SSR, indicating the least bias and highest SNR for LLR+SSR.

Conclusion

A novel reconstruction using both spatial and spectral regularization allows obtaining accurate FF and \({R_2^*}\) maps for prospectively highly accelerated acquisitions.

     

Computational study of a new resonant tunneling diode based on an $$\hbox {MoS}_{2}$$ nanoribbon with sulfur line vacancies

Recent experimental studies have shown that sulfur vacancies in monolayer \(\hbox {MoS}_{2}\) are mobile under exposure to an electron beam and tend to accumulate as sulfur line vacancies (Komsa in Phys Rev B 88: 035301, 2013). In this work, we designed a new resonant tunneling diode (RTD) based on this natural property. Two rows of sulfur vacancies are introduced into armchair \(\hbox {MoS}_{2}\) nanoribbons (\(\hbox {A-MoS}_{2}\) NRs) to tune the nanoribbons’ bandgap to obtain the double-barrier quantum well structure of the resonant tunneling diode. This arrangement has a unique benefit that will result in very little physical distortion. A tight-binding (TB) model, with five 4d-orbitals of the Mo atom and three 3p-orbitals of the S atom, is employed for calculations. In the TB model, which is described in terms of Slater–Koster parameters, we also incorporate the changes of edge bonds. Density functional theory is used to determine all the necessary parameters of the TB model. They are obtained by an optimization procedure which achieves very fine parameter values, which can regenerate the most important energy bands of \(\hbox {A-MoS}_{2}\) NRs of different widths, with highly satisfactory precision. The introduction of these new parameters is another contribution of this work. Lastly, the nonequilibrium Green’s function formalism based on the TB approximation is used to explore the properties of the new RTD structures based on \(\hbox {A-MoS}_{2}\) NRs. Negative differential resistance with peak to valley ratio (PVR) of about 78 at room temperature is achieved for one RTD, having peak current \(I_\mathrm{p}=90\) nA. We show that the PVR can exceed 120 when increasing the barrier length of the RTD at the expense of lower \(I_\mathrm{p}\).     

GaN-based double-gate (DG) sub-10-nm MOSFETs: effects of gate work function

Double-gate (DG) metal–oxide–semiconductor field-effect transistors (MOSFETs) with GaN channel material are very promising for use in future high-performance low-power nanoscale device applications. In this work, GaN-based sub-10-nm DG-MOSFETs with different gate work function, \(\varPhi \), were designed and their performance evaluated. Short-channel effects (SCEs) were significantly reduced by introduction of gates made of dual metals. Use of gold at the source side, having higher \(\varPhi \) (\(\varPhi _{\mathrm{Au}}=5.11\,\hbox {eV}\)) compared with aluminum (\(\varPhi _{\mathrm{Al}}=4.53\,\hbox {eV}\)), at the drain side enhanced the gate control over the channel and screened the effect of the drain on the channel. Dual-metal (DM) DG-MOSFETs showed better results in the nanoscale regime and were more robust to SCEs. Therefore, GaN-based sub-10-nm DM DG-MOSFETs are suitable candidates for use in future complementary metal–oxide–semiconductor (CMOS) technology.     

Thermoelectric,electronic and structural properties of CuNMn3 cubic antiperovskite

Using first-principles calculations, in this work we report the structural, electronic and, for the first time, thermoelectric properties of CuNMn3 cubic antiperovskite. The structural properties are explored using GGA and \(\hbox {GGA}{+}\hbox {U}\) approximations. Structural optimization shows that the compound is stable in the ferrimagnetic phase, and the electronic properties confirm the metallicity of this compound. At room temperature, high values of the Seebeck coefficient are obtained between \(-\) 0.8 and 0.5 \(\upmu (\hbox {eV})\) chemical potential, whereas outside this region the Seebeck coefficient diminishes. Also, thermal conductivities are minimal in this region of chemical potential; therefore, the material can be used to achieve thermocouples. Thermal conductivity is high for 900 K. The maximum electrical conductivity is obtained at 0.38 \(\upmu (\hbox {eV})\) chemical potential, with a value of \(4.15\times 10^{20}(\Omega ~\hbox {ms})^{-1}\). The figure of merit ZT values obtained are still low, so for thermoelectric applications of the material, it is necessary to improve the figure of merit coefficient by doping the material with a suitable element.     

First-principles investigation on transport properties of $$\hbox {Zn}_{2}\hbox {SnO}_{4}$$ molecular device and response toward $$\hbox {NO}_{2}$$NO2 gas molecules

The transport properties of a \(\hbox {Zn}_{2}\hbox {SnO}_{4}\) device along with adsorption properties of \(\hbox {NO}_{2}\) gas molecules on \(\hbox {Zn}_{2}\hbox {SnO}_{4}\) (ZTO) molecular devices are investigated with density functional theory using the non-equilibrium Green’s function technique. The transmission spectrum and device density of states spectrum confirm the changes in HOMO–LUMO energy level due to transfer of electrons between the ZTO-based material and the \(\hbox {NO}_{2}\) molecules. I–V characteristics demonstrate the variation in the current upon adsorption of \(\hbox {NO}_{2}\) gas molecules on the ZTO device. The findings of the present study clearly suggest that ZTO molecular devices can be used to detect \(\hbox {NO}_{2}\) gas molecules in the trace level.     

Numerical analysis of transmission coefficient,LDOS, and DOS in superlattice nanostructures of cubic $$\hbox {Al}_{x}\hbox {Ga}_{1-x}\hbox {N/GaN}$$ resonant tunneling MODFETs

Numerical analysis of the transmission coefficient, local density of states, and density of states in superlattice nanostructures of cubic \(\hbox {Al}_{x}\hbox {Ga}_{1-x}\hbox {N/GaN}\) resonant tunneling modulation-doped field-effect transistors (MODFETs) using \(\hbox {next}{} \mathbf{nano}^{3}\) software and the contact block reduction method is presented. This method is a variant of non-equilibrium Green’s function formalism, which has been integrated into the \(\hbox {next}\mathbf{nano}^{3}\) software package. Using this formalism in order to model any quantum devices and estimate their charge profiles by computing transmission coefficient, local density of states (LDOS) and density of states (DOS). This formalism can also be used to describe the quantum transport limit in ballistic devices very efficiently. In particular, we investigated the influences of the aluminum mole fraction and the thickness and width of the cubic \(\hbox {Al}_{x}\hbox {Ga}_{1-x}\hbox {N}\) on the transmission coefficient. The results of this work show that, for narrow width of 5 nm and low Al mole fraction of \(x = 20\,\%\) of barrier layers, cubic \(\hbox {Al}_{x}\hbox {Ga}_{1-x}\hbox {N/GaN}\) superlattice nanostructures with very high density of states of 407 \(\hbox {eV}^{-1}\) at the resonance energy are preferred to achieve the maximum transmission coefficient. We also calculated the local density of states of superlattice nanostructures of cubic \(\hbox {Al}_{x}\hbox {Ga}_{1-x}\hbox {N/GaN}\) to resolve the apparent contradiction between the structure and manufacturability of new-generation resonant tunneling MODFET devices for terahertz and high-power applications.     

Analysis and modeling of unipolar junction transistor with excellent performance: a novel DG MOSFET with $${N}^{+}{-}{P}^{-}$$ junction

We propose herein a new dual-gate metal–oxide–semiconductor field-effect transistor (MOSFET) with just a unipolar junction (UJ-DG MOSFET) on the source side. The UJ-DG MOSFET structure is constructed from an \({N}^{+}\) region on the source side with the rest consisting of a \({P}^{-}\) region over the gate and drain, forming an auxiliary gate over the drain region with appropriate length and work function (named A-gate), converting the drain to an \({N}^{+}\) region. The new structure behaves as a MOSFET, exhibiting better efficiency than the conventional double-gate MOSFET (C-DG MOSFET) thanks to the modified electric field. The amended electric field offers advantages including improved electrical characteristics, reliability, leakage current, \({I}_{\mathrm{ON}}/I_{\mathrm{OFF}}\) ratio, gate-induced drain leakage, and electron temperature. Two-dimensional analytical models of the surface potential and electric field over the channel and drain are applied to investigate the drain current in the UJ-DG MOSFET. To confirm their accuracy, the MOSFET characteristics obtained using the 2D Atlas simulator for the UJ-DG and C-DG are analyzed and compared.     

Comparative study on interfacial properties of Mo,Nb, and W contacts with monolayer $$\hbox {MoS}_{2}$$

In this work, we make a comparative study on the interfacial properties of top contact for Mo, Nb, and W metals with monolayer \(\hbox {MoS}_{2 }\,(\hbox {mMoS}_{2})\) by employing first-principles based on density functional theory (DFT) calculations. We evaluate the heights of Schottky barrier (SBH) and orbital overlap of the three models by carefully observing band structure and the density of the states relative to the Fermi level. Also, the tunnel barriers and electron densities of the three systems are analyzed. In accordance with the DFT simulations, \(\hbox {mMoS}_{2}\) forms an n-type Schottky contact with Mo, Nb, and W electrodes with electron SBH of 0.28, 0, and 0.6 eV, respectively. Besides, \(\hbox {Nb-mMoS}_{2}\) contact exhibits higher average electron density and lower tunneling barriers, demonstrating that Nb can form a better top contact with \(\hbox {mMoS}_{2}\) and should have prior electron injection efficiency and backgated regulation of current compared to the \(\hbox {mMoS}_{2}\) contacts with Mo and W.