High performance pseudomorphic InGaP/InGaAs power HEMTs

Power transistors with a low d.c. supply voltage were demonstrated with pseudomorphic InGaP/In_0.2Ga_0.8As/GaAs heterostructure field effect transistors on GaAs substrates and 1 μm gate length technology. A current density of 200 mA mm⁻¹ and an extrinsic transconductance of 300 mS mm⁻¹ were exhibited on a 400 μm gate width process control monitor device. For a 1 cm gate width device measured at 850 MHz and V_ds = 1.3 V, state-of-the-art results, 57.4% for the PAE, 12.7 dB for the linear gain and 21.5 dBm for the output power, were obtained.     

基于InP基HEMTs的W波段高增益低噪声放大MMIC

本文基于自主研发的InP基高电子迁移率晶体管工艺设计并制作了一款W波段单级低噪声放大单片毫米波集成电路。共源共栅拓扑结构和共面波导工艺保证了该低噪声放大器紧凑的面积和高的增益,其芯片面积为900 μm×975 μm,84 GHz-100 GHz频率范围内增益大于10 dB,95 GHz处小信号增益达到最大值为15.2 dB。根据调查对比,该单级放大电路芯片具有最高的单级增益和相对高的增益面积比。另外,该放大电路芯片在87.5 GHz处噪声系数为4.3 dB,88.8 GHz处饱和输出功率为8.03 dBm。该低噪声放大器芯片的成功研制对于构建一个W波段信号接收前端具有重要的借鉴意义。     

一种高分辨率W波段SAR系统

该文介绍了中国科学院电子学研究所研制的一套高分辨率W波段SAR系统,对系统的指标、组成、实现方案以及数据处理方法进行了描述,提出了非线性系统误差校正、高精度运动补偿、高隔离度收发系统设计等关键问题的解决方案。通过机载飞行实验,验证了W波段SAR系统的有效性。     

W 波段宽带高灵敏度功率检波器

在对肖特基二极管等效电路模型精确建模的基础上,设计并制作了W 波段宽带高灵敏度功率检波器。根据GaAs 低势垒肖特基二极管的物理结构,建立了二极管等效电路模型,并通过对W 波段检波器试验模块的研制和测试提取了准确的电路模型参数。最后,针对宽带工作要求,根据二极管等效电路模型,优化了射频阻抗匹配网络,使检波器工作频率能够覆盖78～98 GHz。测试结果表明,当输入功率为-30 dBm 时,82 GHz 处检波灵敏度达到了7000 mV/ mW,78～98 GHz 范围内检波灵敏度高于1500 mV/ mW,实测正切灵敏度优于-36 dBm。实测和仿真结果一致,验证了二极管等效电路模型的准确性。     

Compact W-band E-plane Waveguide Filter with High Selectivity

Journal of Infrared, Millimeter, and Terahertz Waves - In this letter, an E-plane substrate is inserted into the W-band standard waveguide to construct a bandpass filter (BPF) with high...     

W-band direct detection circuit performance with Sb-heterostructure diodes

W-band direct detection circuits have been designed and fabricated for use in a passive millimeter wave camera. The circuits are based on the recently developed Sb-heterostructure diode. We measure record voltage responsivities in test circuits, up to 8,000 mV/mW from 75 to 93 GHz, with input power from -50 to -30 dBm. Performance was similar in an actual camera frequency processor board with 128 tuned channels. 72% of detectors showed responsivity at or above 6,000 mV/mW and 3% of channels were above 10,000 mV/mW. Since tens of thousands of Sb-heterostructure diodes can be reproducibly and inexpensively fabricated, this demonstrates for the first time the feasibility of large-scale detector arrays utilizing zero bias direct detection circuitry.     

采用AlN/SiNx钝化的高性能AlGaN/GaN HEMTs

两种不同的钝化层结构被应用到势垒层厚度为12 nm的AlGa/GaN 高电子迁移率场效应晶体管中。首先采用等离子增强原子层沉积(PEALD)技术生长5 nm的AlN薄膜,然后再覆盖50 nm的等离子增强化学气相淀积(PECVD)生长的SiNx。相比于传统的SiNx钝化,AlN钝化层的插入更有效地抑制了电流崩塌效应,同时获得了小的亚阈值斜率(SS)。AlN钝化层的插入增大了器件的射频跨导从而获得了较高的截止频率。另外,通过变温直流特性测试发现,AlN/SiNx钝化的器件在高温时饱和电流和最大跨导的衰退相对于仅采用SiNx钝化的器件都要小,表明AlN钝化层的插入改善了器件的高温稳定性。     

High performance 0.14 /spl mu/m gate-length AlGaN/GaN power HEMTs on SiC

High electron mobility transistors (HEMTs) were fabricated from AlGaN/GaN on semi-insulating SiC substrates with excellent performance and high yield. The devices had 0.14 /spl mu/m T-gates with a total width of 300 /spl mu/m. Extrinsic, unpassivated peak performance values for these HEMTs include transconductance of 338 mS/mm, maximum drain current of 1481 mA/mm, unity current gain cutoff frequency of 91 GHz, and maximum frequency of oscillation of 122 GHz. Saturated CW power measurements of these devices at 10 GHz result in 4.6 W/mm with PAE at 46% when optimized for power and 3.0 W/mm with PAE at 65% when optimized for efficiency.     

Nonlinear electronic transport and device performance of HEMTs

We assess the impact of nonlinear electronic transport and, in particular, of real space transfer (RST) on device performance for advanced III/V high electron mobility transistors (HEMTs) using the device simulator MINIMOS-NT. In this context, we discuss DC and RF performance issues for pseudomorphic AlGaAs-InGaAs-GaAs HEMTs that are especially relevant for gate-lengths of about 150 nm. All results are compared to and found to be consistent with experimental data for devices processed in two different foundries     

S波段大功率、高效率GaN HEMT器件研究

基于国产的SiC衬底GaN外延材料,研制出大栅宽GaN HEMT单胞管芯。通过使用源牵引和负载牵引技术仿真出所设计模型器件的输入输出阻抗,推导出本器件所用管芯的输入输出阻抗。使用多节λ/4阻抗变换线设计了宽带Wilkinson功率分配/合成器,对原理图进行仿真,优化匹配网络的S参数,对生成版图进行电磁场仿真,通过LC T型网络提升管芯输入输出阻抗。采用内匹配技术,成功研制出铜-钼-铜结构热沉封装的四胞内匹配GaN HEMT。在频率为2.7～3.5 GHz、脉宽为3 ms、占空比为50%、栅源电压Vgs为-3 V和漏源电压Vds为28 V下测试器件,得到最大输出功率Pout大于100 W(50 dBm),PAE大于47%,功率增益大于13 dB。     

一款W波段GaN HEMT高谐波抑制八次倍频器MMIC

报道了一款采用0.1μm GaN HEMT工艺制作的W波段八次倍频器芯片。该芯片集成了3个二次倍频器和1个驱动放大器。二次倍频器采用有源平衡电路结构以实现较好的功率输出和有效的基波和奇次谐波抑制;驱动放大器采用单级负反馈电路结构,在实现良好输入输出匹配的同时兼顾增益平坦度。最终实现的八次倍频器芯片3 dB工作带宽为16 GHz(84～100 GHz),输出功率大于13 dBm,谐波抑制度大于40 dBc,带内谐波抑制度大于60 dBc。芯片面积3.6 mm×1.7 mm。     

GaN高电子迁移率晶体管高频噪声特性的研究

基于FUKUI噪声模型,分析了GaN高电子迁移率晶体管(HEMT)器件的高频噪声特性,结果表明,由于GaN HEMT具有更高的临界电场和更大的电子饱和速度,与第2代半导体器件(GaAs HEMT等)相比具有更优越的噪声性能.对近10多年来国内外在GaN HEMT低噪声器件及其低噪声功率放大器单片集成电路(MMIC)方面的研究进行了综述,并分析了GaN HEMT在低噪声应用领域目前存在的主要问题及其发展趋势.     

High microwave and noise performance of 0.17-/spl mu/m AlGaN-GaN HEMTs on high-resistivity silicon substrates

AlGaN-GaN high-electron mobility transistors (HEMTs) based on high-resistivity silicon substrate with a 0.17-/spl mu/m T-shape gate length are fabricated. The device exhibits a high drain current density of 550 mA/mm at V/sub GS/=1 V and V/sub DS/=10 V with an intrinsic transconductance (g/sub m/) of 215 mS/mm. A unity current gain cutoff frequency (f/sub t/) of 46 GHz and a maximum oscillation frequency (f/sub max/) of 92 GHz are measured at V/sub DS/=10 V and I/sub DS/=171 mA/mm. The radio-frequency microwave noise performance of the device is obtained at 10 GHz for different drain currents. At V/sub DS/=10 V and I/sub DS/=92 mA/mm, the device exhibits a minimum-noise figure (NF/sub min/) of 1.1 dB and an associated gain (G/sub ass/) of 12 dB. To our knowledge, these results are the best f/sub t/, f/sub max/ and microwave noise performance ever reported on GaN HEMT grown on Silicon substrate.     

High breakdown voltage AlGaN-GaN HEMTs achieved by multiple field plates

High-voltage Al/sub 0.22/Ga/sub 0.78/N-GaN high-electron mobility transistors have been fabricated using multiple field plates over dielectric passivation layers. The device breakdown voltage was found to increase with the addition of the field plates. With two field plates, the device showed a breakdown voltage as high as 900 V. This technique is easy to apply, based on the standard planar transistor fabrication, and especially attractive for the power switching applications.     

A Novel W-band Microstrip Integrated Avalanche Diode High Order Frequency Multiplier

A W band microstrip integrated high order frequency multiplier based on avalanche diode is proposed. The property of avalanche high order multiplication mode is analyzed based on physical operation mechanism of avalanche diode. According to the harmonics impedance model of avalanche diode, the microstrip integrated multiplier is designed, fabricated and measured. Output power of 5.78 mW has been obtained at output frequency of 94.5 GHz with 15th multiplication order and the phase noise is -90 dBc/Hz and -95 dBc/Hz at 10 KHz and 100 KHz offset. Good results at 13th and 17th multiplication order are also obtained.     

High switching performance 0.1-/spl mu/m metamorphic HEMTs for low conversion loss 94-GHz resistive mixers

We report high switching performance of 0.1-/spl mu/m metamorphic high-electron mobility transistors (HEMTs) for microwave/millimeter-wave monolithic integrated circuit (MMIC) resistive mixer applications. Very low source/drain resistances and gate capacitances, which are 56 and 31% lower than those of conventional pseudomorphic HEMTs, are due to the optimized epitaxial and device structure. Based on these high-performance metamorphic HEMTs, a 94-GHz MMIC resistive mixer was designed and fabricated, and a very low conversion loss of 8.2 dB at a local oscillator power of 7 dBm was obtained. This is the best performing W-band resistive field-effect transistor mixer in terms of conversion loss utilizing GaAs-based HEMTs reported to date.     

高漏偏压下AlGaN/GaN HEMT噪声性能的研究

The advent of fully integrated GaN PA-LNA circuits makes it meaningful to investigate the noise performance under high drain bias. However, noise performance of AlGaN/GaN HEMTs under high bias has not received worldwide attention in theoretical studies due to its complicated mechanisms. The noise value is moderately higher and its rate of increase is fast with increasing high voltage. In this paper, several possible mechanisms are proposed to be responsible for it. Impact ionization under high electric field incurs great fluctuation of carrier density, which increases the drain diffusion noise. Besides, higher gate leakage current related shot noise and a more severe self-heating effect are also contributors to the noise increase at high bias. Analysis from macroscopic and microscopic perspectives can help us to design new device structures to improve noise performance of AlGaN/GaN HEMTs under high bias.     

W波段行波管切断位置性能分析与实验

为分析折叠波导行波管互作用电路切断位置的功率和频谱特性,提出并研制出一只四端口W波段脉冲行波管。对该行波管频带内互作用电路的S参数、切断处功率和对应频谱特性进行测试,分析表明：端口2(输入段的切断)的功率幅值主要取决于饱和状态下行波管的输入功率,与输入段增益不成正比关系分布;端口3(输出段切断)功率主要取决于端口匹配性能,其数值计算功率和测试数据吻合良好。本文研究为毫米波及太赫兹行波管切断设计提供了一种有效方法。     

Power performance of AlGaN-GaN HEMTs grown on SiC by plasma-assisted MBE

We report AlGaN-GaN high electron mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE) on SiC substrates with excellent microwave power and efficiency performance. The GaN buffers in these samples were doped with carbon to make them insulating. To reduce gate leakage, a thin silicon nitride film was deposited on the AlGaN surface by chemical vapor deposition. At 4 GHz, an output power density of 6.6 W/mm was obtained with 57% power-added efficiency (PAE) and a gain of 10 dB at a drain bias of 35 V. This is the highest PAE reported until now at 4 GHz in AlGaN-GaN HEMTs grown by MBE. At 10 GHz, we measured an output power density of 7.3 W/mm with a PAE of 36% and gain of 7.6 dB at 40-V drain bias.     

Trapping effects and microwave power performance in AlGaN/GaN HEMTs

The dc small-signal, and microwave power output characteristics of AlGaN/GaN HEMTs are presented. A maximum drain current greater than 1 A/mm and a gate-drain breakdown voltage over 80 V have been attained. For a 0.4 μm gate length, an f_T of 30 GHz and an f_max of 70 GHz have been demonstrated. Trapping effects, attributed to surface and buffer layers, and their relationship to microwave power performance are discussed. It is demonstrated that gate lag is related to surface trapping and drain current collapse is associated with the properties of the GaN buffer layer. Through a reduction of these trapping effects, a CW power density of 3.3 W/mm and a pulsed power density of 6.7 W/mm have been achieved at 3.8 GHz