Al/Cu/Al接触反应液相行为及其连接

采用模拟的方法,系统研究了Al/Cu接触反应及其液相行为的特点,并运用金属学中表面扩散和晶界扩散等理论进行了理论探讨。研究结果表明,在接触反应中Al/Cu共晶液相的行为包括：一方面液相沿Al基体表面优先反应铺展;另一方面在基体深度方向上也有明显的晶间渗透作用。其中前者可以促进接头间隙内产生均匀的液相填充层;后者则是接头牢固接合的保障。同时为确定Al/Cu/Al接触反应钎焊工艺参数,研究了工艺参数对接触反应中共晶液相铺展行为的影响,结果表明570－580℃的反应温度和15min的保温时间是Al/Cu接解反应钎焊比较适合的工艺参数。在此基础丰,本文采用Cu箔作中间层进行Al的接触反应钎焊,得到良好Al钎焊接头。     

Al共晶接触反应钎焊热力学分析

用扫描电镜和电子探针研究了Al共晶接触反应钎焊液的润湿行为,以分步法观察Cu在Al表面的润湿铺展过程,并运用热力学参数分析Al共晶接触反应钎焊机理,结果表明,Cu原子可以沿Al的晶界优先扩散,达到共晶成分后形成液相,实现Al 的共晶接触反应钎焊。     

Al／Cu接触反应钎焊中反应铺展现象和氧化膜行为

本文比较详细地讨论了和Al有共晶反应的金属颗粒在Al表面的反应铺展的过程和实质,在此基础上对Al/Cu接触反应钎焊中的Al表面氧化膜行为和接头形成机制进行了研究和探讨。     

接触反应钎焊中间层材料的选择原则--接触反应共晶液相产生的方向性

以Al/Cu ,Al/Si接触反应偶为例 ,研究了不同基体与反应材料组合下 ,共晶液相的产生及其铺展行为。结果表明 :Al/Cu ,Al/Si接触反应偶中共晶液相的产生具有明显的方向性—优先在Al侧产生 ,这是扩散偶之间的互扩散系数不等所造成的必然结果。而在接触反应钎焊的中间层材料选择过程中 ,考虑接触反应液相产生的方向性是发挥接触反应钎焊优越性的保障     

保温时间对Cu/Al钎焊接头界面组织和性能的影响

采用Zn -40Sn钎料通过感应钎焊实现了Cu/Al的可靠连接.研究了钎焊时间对接头界面组织和性能的影响规律.研究结果表明:随着钎焊时间的延长,母材侧反应层厚度增加,Cu,Al元素扩散加剧,金属间化合物增多.当感应电流I=12 A,钎焊时间t=15 s时,接头抗剪强度最高为45.5 MPa.接头断裂于铜侧金属间化合物层处,随着钎焊时间的延长,该处Al4.2 Cu3.2Zn0.7相增多,Cu - Zn相减少,断裂发生在二者混合区.通过合理的优化钎焊时间,在保证充分焊合的情况下尽量减少金属间化合物的含量可以获得强度较高的钎焊接头.     

Zn-Al钎料成分对Cu/Zn-Al/Al钎焊接头界面结构及性能的影响

分别采用Zn-15Al,Zn-22Al,Zn-28Al,Zn-37Al和Zn-45Al钎料钎焊获得Cu/Al接头.利用SEM,EDS和XRD研究了Zn-Al钎料成分对Cu/Al接头中Cu母材/钎缝界面结构的影响,并系统阐述了Zn-Al钎料成分-接头界面结构-接头抗剪切强度之间的关系.研究发现,Cu/Zn-15Al/Al接头中Cu母材/钎缝界面结构为Cu/Al4.2Cu3.2Zn0.7,且Al4.2Cu3.2Zn0.7界面层较薄,其厚度为2~3μm,接头具有较高的抗剪切强度,达66.3 MPa.随着钎料中Al含量的提高,在Cu/Zn-22Al/Al接头界面处Al4.2Cu3.2Zn0.7界面层的厚度逐渐增大,甚至在Cu/Zn-28Al/Al接头的Al4.2Cu3.2Zn0.7界面层附近出现少量的Cu Al2,接头的抗剪切强度逐渐降低.当采用Al含量较高的Zn-37Al钎料钎焊Cu/Al接头时,Cu母材/钎缝界面结构转变为Cu/Al4.2Cu3.2Zn0.7/Cu Al2;脆性Cu Al2层的出现,使接头抗剪切强度大幅下降,为34.5 MPa.当采用Al含量最高的Zn-45Al钎料钎焊Cu/Al接头时,Cu母材/钎缝界面结构转变为Cu/Cu Al2,接头抗剪切强度最低,为31.6 MPa.     

微机控制钎焊Cu/Al焊接接头的组织与性能

采用微机控制固定间隙超声波辅助汽车零部件焊接中Cu/Al异质金属的钎焊工艺,在钎焊温度为380、420和460℃时制备Cu/Zn-3Al/Al钎焊接头,观察了不同温度超声钎焊时接头的显微组织与力学性能变化。结果表明,当钎焊温度为380℃时,钎缝层由Zn-Al共晶、α-Al树枝状晶和CuZn5相组成;当钎焊温度为420和460℃时,发现钎缝层由α-Al树枝晶、CuZn5相和Al4.2Cu3.2Zn0.7相组成;在钎焊温度为420℃时,金属间化合物层厚度为1.9μm,扩散层厚度为1.3μm,整个界面层厚度为3种钎焊温度下的最低值,此时钎焊接头的抗拉强度最大。     

Ni-P镀层对Cu/Al钎焊界面结构及性能的影响机制

为了研究Ni-P镀层对Cu/Al异种金属钎焊界面反应的影响,首次采用Zn98Al和BAl67Cu Si两种钎料对含/不含Ni-P镀层的T2紫铜与3003铝合金进行了高频钎焊,获得4种不同的钎焊接头,分别对接头Cu侧界面结构、抗剪强度、断口形貌、显微硬度及弯曲形貌进行了系统研究,并与无镀层接头进行对比.结果表明,T2表面镀覆Ni-P后,Cu/Zn98Al/Al接头中Cu基体/钎缝界面结构由扩散层+8.8μm厚的Cu_3.2Zn_4.2Al_0.7化合物转变为1.5μm厚的Al₃Ni化合物,而Cu/BAl67CuSi/Al接头中Cu基体/钎缝界面结构由扩散层+15μm厚CuAl₂转变为1.8μm厚Cu₃NiAl₆;与无镀层接头相比,镀覆Ni-P后,Cu/Zn98Al/Al接头强度略有上升,Cu/BAl67CuSi/Al接头强度略有下降,但两种接头的韧性均明显增强,力学性能试验结果与接头Cu侧界面微观组织转变规律相符.最后建立了Cu/Al接头的界...     

超声波作用下Al/Zn-14Al/Cu钎焊接头的显微组织及力学性能

采用Zn-14Al过共晶焊料并借助超声波振动对Al/Cu异质金属进行了无钎剂钎焊连接,研究了在420℃超声钎焊不同时间时接头显微结构及力学性能的影响。研究结果表明,随着超声振动时间的延长,钎缝层中的α-Al相减小,Zn-Al共晶相和CuZn_5相增多,Cu界面反应层由以CuZn_5相为主逐步转变为Al_(4.2)Cu_(3.2)Zn_(0.7)相。接头的剪切强度随钎焊时间的延长呈现先增加后减小趋势,钎焊时间为8 s时接头获得了最佳的剪切强度82.6 MPa。     

LD30铝合金接触反应钎焊的试验研究

试验研究了钢层厚度对LD30/Cu接触反应钎缝组织和性能的影响。结果表明：钢层过薄，共晶反应生成的液相量太少，未能填满缝隙，接头有空洞出现：钢层过厚，共晶反应生成的液相量太多，在钎缝区形成较多的Al-Cu化合物脆性相。这两者都会削弱钎缝的强度。因此，要得到理想的钎焊接头，必须合理调整钢层及钎焊工艺参数。     

Brazing of Coated Al Foil Filler to AIN CeramicEI北大核心CSCD

The wettabilities of molten metals on ceramics are poor normally. In order to improve the wettability, all existing ceramic brazing methods introduce a compound transition layer formed by the reaction of active metal and ceramic. The transition layer between brazing seam and ceramic however creates negative effect on the properties of brazing joints. Although Al is the scarce metal which can wet some ceramics such as AIN and Al2O without reaction, the difficulty of removing oxide layer on surface prevents it being ceramic brazing filler. This work proposed a kind of coated Al foil filler able to remove its own Al2O3 film and an elevating temperature brazing process to enhance Al/AIN joint strength. Removing Al2O3. film effect of vapor deposited Ni/Al double layer film on Al foil and the effect of brazing temperature on improving joint strength were studied. The results showed that due to buried by Ni/Al double layer film, Al2O3 film on Al foil original surface broken and was swept in Al-1%Ni (atomic fraction) alloy liquid during heating and melting process. As a result, the direct brazing of Al to AIN without interface reaction transition layer was realized. The joint strength was significantly enhanced by elevating brazing temperature. When brazing at 680 degrees C, the joint fractured along the interface between Al seam and AIN and the sheer strength was 79 MPa because of Al liquid not wetting AIN. With the elevating of brazing temperature, the wettability and interface strength of Al/AIN improved. The fracture gradually transferred to brazing seam from interface. The joint strength increased and reached to the maximum value of 146 MPa at 840 degrees C.     

Microstructure and Property of Cu/Al Joint Brazed with Al-Si-Ge Filler MetalEI北大核心CSCD

Cu/Al brazing has good prospect for applications in the air conditioning and refrigeration industry. A suitable filler metal is the key of Cu/Al brazing. The chemical and physical properties of the filler metal have great influence on the brazing process and parameters. And the strength of the brazing joint is closely related to the properties of the filler metal and the brazing process. While the previous studies have not developed a kind of Cu/Al brazing filler metal which can achieve a tough joint at a low brazing temperature. In this work, the Al-5.6Si-25.2Ge filler metal was first used to braze Cu/Al dissimilar metals, and the melting characteristics of the filler metal, spreading wettability, Cu interfacial structure and strength of brazed joint were investigated systematically. Additionally, the common Zn-22Al filler metal was also used for comparison. The results show that the Al-5.6Si-25.2Ge filler metal possesses low melting temperature (about 541 degrees C) and excellent spreading wettability on Cu and Al base metals. The interfacial structure of Al-5.6Si-25.2Ge/Cu was CuAl2/CuAl/Cu3Al2. The thickness of planar CuAl and Cu3Al2 phases was only 1 similar to 2 mu m, and the thickness of cellular CuAl2 phase was about 3 mu m. The interfacial structure of Zn-22Al/Cu was CuAl2/CuAl/Cu9Al4, but the average thickness of the CuAl2 layer was up to 15 mm. The test results of the shearing strength show that the shearing strength of the Cu/Al joint brazed with Zn-22Al filler metal was only 42.7 MPa, but the shearing strength brazed with Al-5.6Si-25.2Ge filler metal was higher (53.4 MPa).     

Infrared brazing of Ti–6Al–4V using two silver-based braze alloys

Infrared brazing of Ti–6Al–4V using two silver-based alloys is evaluated in the study. For the 72Ag–28Cu brazed specimen, Ag-rich matrix, eutectic Ag–Cu and Cu–Ti interfacial reaction layer(s) are observed in the experiment. In contrast, both Ag-rich matrix and interfacial titanium aluminides, TiAl or Ti₃Al, are found in the 95Ag–5Al brazed joint. In general, the shear strength of 72Ag–28Cu brazed joint is much higher than that of 95Ag–5Al brazed specimen. Additionally, the use of infrared brazing with lower brazing temperature and/or less time can significantly decrease both dissolution of the substrate into molten braze as well as excessive growth of the interfacial reaction layer(s) in the joint. Therefore, infrared brazing has the potential to be applied in industry.     

Penetrating behavior of eutectic liquid during Al/Cu contact reactive brazing

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Al2O3 陶瓷与Al低温连接工艺研究

采用共晶烧结工艺对Ａｌ２Ｏ３陶瓷进行表面Ｃｕ金属化,并采用乔探钎焊的办法实现了陶瓷与Ａｌ的低熳连接。实验结果表明,钎料与Ａｌ基体和金属化层之间均有良好的冶金作用,能够保证接头的强度,而且钎焊过程不会对金属化层／陶瓷界面造成不良影响。     

Al-Mg-Zn钎料钎焊镁合金AZ31B接头的显微组织和性能

以Al-Mg-Zn钎料对变形镁合金AZ31B进行了高频感应钎焊,分析了变形镁合金AZ31B钎焊接头的显微组织、钎缝物相和力学性能.采用扫描电镜(SEM)、X射线衍射仪(XRD)、X射线能谱分析仪(EDS)等仪器分析了钎焊接头的界面组织及钎缝生成相,测试了接头的强度及形成相的显微硬度.结果表明,在钎焊接头的钎缝中钎料与母材Az31B发生反应生成离异共晶组织α-Mg+β-Mg_(17)(Al,Zn)_(12),母材AZ31B的显微硬度最低,钎缝中的β-Mg_(17)(Al,Zn)_(12)相显微硬度最高.对接和搭接接头断口的断裂形式为沿晶脆性断裂,断裂产生在离异共晶组织α-Mg+β-Mg_(17)(Al,Zn)_(12)中的β-Mg_(17)(Al,Zn)_(12)硬脆相处.

Abstract：

High-frequency induction brazing of wrought magnesium alloy AZ31B with Al-Mg-Zn fdler metal was investigated. Microscopic structure, the phases and the mechanical properties of brazed joint were studied. The microstructure and formation phases at the interface in the brazed joint were investigated by scanning electron microscopy(SEM), X-ray diffraction instrument(XRD) and energy dispersive spectrometer (EDS). The strength of the brazed joint and the microhardness of the formation phases were also tested. The results show that, Al-Mg-Zn filler metal reacting with the base metal AZ31B, and a-Mg+β-Mg_(17) (Al,Zn)_(12) divorced eutectic structure is formed in the brazed joint. Microhardness of the base metal AZ31B is the smallest and β-Mg_(17) (Al, Zn)_(12) phase of the brazed joint is the hardest. Both the butt joint and the overlap joint exhibit intergranular fracture mode, the fracture comes from hard brittle phase β-Mg_(17) (Al,Zn)_(12) of α-Mg+β-Mg_(17)(Al,Zn)_(12) divorced eutectic structure.     

SiC陶瓷与TiAI合金的真空钎焊

采用Ag-Cu-Ti钎料对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空钎焊,并对接头的微观组织和室温强度进行了研究。结果表明,利用Ag-Cu-Ti钎料可以实现SiC与TiAl的连接;接头界面具有明显的层状结构,即由Ti-Cu-Si合金层、富Cu相与富Ag相的双相层和Ti-Al-Cu合金层组成;在1173K和10min的钎焊条件下,接头室温剪切强度达到173MPa。