X波段低损耗高隔离开关应用的GaAs PIN二极管

报道了一种适用于X波段的低损耗高隔离度开关的GaAs PIN二极管.讨论了GaAs PIN二极管的物理特性和主要电学参数对开关性能的影响,并且介绍了工艺制备过程.测试结果表明在100MHz～12.1GHz范围内,正向电流为10mA时的开关电阻小于2.2Ω,而反向电压为-10V时开关电容小于20fF.     

1~26.5GHz GaAs PIN单刀单掷开关单片

采用GaAs PIN二极管,完成1~26.5 GHz的单刀单掷开关单片的设计、制作。SPST开关单片带内插损小于0.5 dB,驻波优于1.1,隔离度大于27 dB,在10~26.5 GHz,隔离度大于37 dB。开关单片采用MOCVD生长的GaAs纵向PIN二极管材料结构,76 mm GaAs圆片工艺加工制作。     

C波段GaAs PIN二极管单片单刀单掷开关

基于中国科学院微电子研究所的GaAs PIN二极管工艺,研究了一种单片单刀单掷开关.为了仿真该单片单刀单掷开关,研制开发了GaAs PIN二极管的小信号模型.在5.5～7.5GHz的频段内,开关正向导通时的插入损耗低于1.6dB,回波损耗大于10dB,开关关断状态的隔离度大于23dB.     

C波段GaAs PIN二极管单片单刀单掷开关

基于中国科学院微电子研究所的GaAs PIN二极管工艺,研究了一种单片单刀单掷开关.为了仿真该单片单刀单掷开关,研制开发了GaAs PIN二极管的小信号模型.在5.5～7.5GHz的频段内,开关正向导通时的插入损耗低于1.6dB,回波损耗大于10dB,开关关断状态的隔离度大于23dB.     

基于GaAs PIN二极管的宽带大功率单片单刀双掷开关

GaAs PIN二极管具有开态电阻小、截止频率高以及功率容量大的特点,采用GaAs PIN二极管制作的开关插入损耗较小、隔离度较高、并且功率的线性较好。基于河北半导体研究所GaAs PIN工艺制造了一款单刀双掷开关芯片。该开关采用单级并联结构。通过微波在片测试,在小信号条件下,6～18 GHz范围内插入损耗小于1.45 dB、隔离度大于28 dB,输入输出反射损耗小于7.5 dB。把开关装入夹具中进行功率特性测试,在连续波输入功率37 dBm,12 GHz条件下测试输出功率仅压缩0.5 dB,具有非常好的功率特性。在4英寸(100 mm)晶圆上开关的成品率较高,具有非常好的工程应用前景。     

GaAs垂直结构PIN二极管限幅器

基于垂直结构GaAs PIN二极管的工艺技术开发,在GaAs PHEMT生产线上开发研制了GaAs PIN二极管限幅器单片集成电路.针对不同频段的单片电路采用了不同的材料结构参数设计.工艺中采用先进的深挖槽技术,严格控制横向钻蚀问题,制作出了限幅水平40 mW、最大承受功率5 W的多个频段GaAs限幅器单片电路,成品率达到95%以上.GaAs垂直结构PIN二极管工艺对GaAs PIN二极管大功率开关、限幅器等GaAs MMIC的发展具有重大意义.     

基于滤波器综合分析法的118 GHz单刀二掷开关（英文）

采用滤波器综合分析方法,基于分立式AlGaAs/GaAs异质结PIN二极管,根据其等效寄生参数,综合出单刀二掷开关集总参数滤波器模型,以此分析其等效分布参数电路,设计出了118GHz星载辐射计用单刀二掷开关准单片,开关电路尺寸6×2.5×0.1mm~3.通过开关模块封装用波导-微带过渡和键合金带插损的分析研究,研制出了低插损的118GHz开关模块,在110~120GHz,测得开关插损小于3.0dB,插损典型值2.6dB;开关隔离度大于22dB;开关响应时间、导通时间、关断时间、恢复时间分别小于18ns、20ns、10ns、18ns,该准单片作为通道切换开关可集成应用于118GHz收发组件中.     

一种单端匹配式PIN单刀单掷功率开关芯片

采用PIN二极管工艺技术,设计、制作了一种微波单端匹配式PIN单刀单掷功率开关芯片,并给出了详细测试曲线.该开关由四级PIN二极管组成,采用单端匹配结构.工作频率8～10 GHz,整个带内插入损耗小于0.7 dB,输出端口驻波比小于1.4:1,输入端口开关态驻波比均小于1.4:1,在9 GHz点频下测得1 dB压缩点输入功率大于31 dBm,芯片内部集成偏置电路,采用+5 V/-5 V供电,在+5 V工作条件下,电流20 mA.该芯片面积为2.0 mm×1.4 mm.     

基于滤波器综合分析法的118 GHz单刀二掷开关

采用滤波器综合分析方法, 基于分立式AlGaAs/GaAs异质结PIN二极管, 根据其等效寄生参数, 综合出单刀二掷开关集总参数滤波器模型, 以此分析其等效分布参数电路, 设计出了118 GHz星载辐射计用单刀二掷开关准单片, 开关电路尺寸6×2.5×0.1 mm3.通过开关模块封装用波导-微带过渡和键合金带插损的分析研究, 研制出了低插损的118 GHz开关模块, 在110~120 GHz, 测得开关插损小于3.0 dB, 插损典型值2.6 dB;开关隔离度大于22 dB;开关响应时间、导通时间、关断时间、恢复时间分别小于18 ns、20 ns、10 ns、18 ns, 该准单片作为通道切换开关可集成应用于118 GHz收发组件中.     

基于Q-MMIC技术的W波段低成本PIN管开关（英文）

采用低成本方法设计了一款W波段单刀单掷开关.通过在单独加工的石英基片无源电路上安装倒装PIN管,获得了一款W波段准毫米波单片(Q-MMIC)开关.为了获得低损耗、高隔离度性能,开关设计中采用了3-D PIN管模型和电路补偿结构.测试结果表明开关在88 GHz时插入损耗最小,最小值为0.5 dB;在80~101 GHz频率范围内,开关导通时的插入损耗小于2 dB;在84~104 GHz频率范围内,开关隔离度大于30 dB.整个开关电路尺寸为1.5 mm×3.0 mm.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.