微波法制备高活性H1-xSr2Nb3-xMoxO10 (x = 0, 0.05, 0.1, 0.15 and 0.2) 光催化剂

通过微波辅助法制备出高活性H1-xSr2Nb3-xMoxO10光催化材料,制备过程和时间均被大大缩短。采用X射线粉末衍射（XRD）、扫描电镜（SEM）、紫外-可见吸收吸收光谱（UV-Vis DRS）等表征其材料性能。考察了催化材料在40W汞灯辐照下催化降解甲基橙的催化性能。实验结果表明,MoO3的掺入量为15%（摩尔分数）时,材料的光催化性能最优。     

Sn掺杂对(In0.95-xSnxFe0.05)2O3薄膜的结构、电学及磁特性的影响

我们利用脉冲激光沉积的方法制备了一系列(In0.95-xSnxFe0.05)2O3 (x=0~0.09)薄膜,并在其中发现了室温铁磁性。X射线衍射结果表明锡与铁离子已掺入氧化铟晶格。随着锡的掺入,样品内的载流子浓度得到了很大的提高,但相应的铁磁性却几乎没有变化。我们认为氧空位相关的束缚磁极化子模型能够跟好的解释我们的铁掺杂氧化铟薄膜中的铁磁耦合的机制,而载流子传导的RKKY相互作用则不适用于这一系统。     

溅射压力对制备a-GaAs1-xNx 薄膜光学常数的影响

采用反应磁控溅射法在室温条件下制备了a-GaAs_1-xN_x 薄膜。实验测定了薄膜厚度、氮含量、载流子浓度和光学透过率及并研究了其随溅射压的变化。系统研究了溅射压对所制备薄膜的光学带隙、折射率和色散参数的影响。所制备的薄膜为直接带隙材料,利用Cauchy和Wemple模型能够很好地拟合所制备薄膜的折射率色散曲线。     

Etch damage evaluation on (Bi4−xLax)Ti3O12 thin films during the etch process using inductively coupled plasma sources

The etching mechanism of (Bi_4−xLa_x)Ti₃O₁₂ (BLT) thin films in Ar/Cl₂ inductively coupled plasma (ICP) and plasma-induced damages at the etched surfaces were investigated as a function of gas-mixing ratios. The maximum etch rate of BLT thin films was 50.8 nm/min of 80% Ar/20% Cl₂. From various experimental data, amorphous phases on the etched surface existed on both chemically and physically etched films, but the amorphous phase was thicker after the 80% Ar/20% Cl₂ process. Moreover, crystalline “breaking” appeared during the etching in Cl₂-containing plasma. Also the remnant polarization and fatigue resistances decreased more for the 80% Ar/20% Cl₂ etch than for pure Ar plasma etch.     

Fabrication and electrical characteristics of ultrathin (HfO2)x(SiO2)1−x films by surface sol-gel method and reaction-anneal treatment

Hafnium oxide (HfO₂) films were deposited on Si substrates with a pre-grown oxide layer using hafnium chloride (HfCl₄) source by surface sol-gel process, then ultrathin (HfO₂)_x(SiO₂)_1−x films were fabricated due to the reaction of SiO₂ layer with HfO₂ under the appropriate reaction-anneal treatment. The observation of high-resolution transmission electron microscopy indicates that the ultrathin films show amorphous nature. X-ray photoelectron spectroscopy analyses reveal that surface sol-gel derived ultrathin films are Hf-Si-O alloy instead of HfO₂ and pre-grown SiO₂ layer, and the composition was Hf_0.52Si_0.48O₂ under 500 °C reaction-anneal. The lowest equivalent oxide thickness (EOT) value of 0.9 nm of film annealed at 500 °C has been obtained with small flatband voltage of −0.31 V. The experimental results indicate that a simple and feasible solution route to fabricate (HfO₂)_x(SiO₂)_1−x composite films has been developed by means of combination of surface sol-gel and reaction-anneal treatment.     

Kinetic Studies of the Interfacial Reaction of the Ba2YCu3O6+x Superconductor with a CeO2 Buffer

Interfacial reactions between the Ba₂YCu₃O_6+x superconductor and the CeO₂ buffer layers employed in coated conductors have been modeled experimentally by investigating the kinetics of the reaction between Ba₂YCu₃O_6+x films and CeO₂ substrates. At 810°C, the Ba₂YCu₃O_6+x -CeO₂ join within the BaO-Y₂O₃-CeO₂-CuO _x quaternary system is nonbinary, thereby establishing the phase diagram topology that governs the Ba₂YCu₃O_6+x /CeO₂ reaction. At a mole ratio of Ba₂YCu₃O_6+x :CeO₂ of 40:60, a phase boundary was found to separate two four-phase regions. On the Ba₂YCu₃O_6+x -rich side of the join, the four-phase region consists of Ba₂YCu₃O_{6 +x} , Ba(Ce_1−z Y _z )O_3−x , BaY₂CuO₅, and CuO _x ; on the CeO₂ rich side, the four phases were determined to be Ba(Ce_1−z Y _z ) O_3−x , BaY₂CuO₅, CuO _x and CeO₂. The Ba₂YCu₃O_6+x /CeO₂ reaction is limited by solid-state diffusion, and the reaction kinetics obey the parabolic rule, x = Kt ^1/2, where x = thickness of the reaction layer, t = time, and K = a constant related to the rate constant; K was determined to be 1.6 × 10⁻³ μm/s^1/2 at 790°C and 4.7 × 10⁻³ μm/s^1/2 at 830°C. The activation energy for the reaction was determined to be E _act = 2.67 × 10⁵ J/mol using the Arrhenius equation.     

A thin transition film formed by plasma exposure contributes to the germaniumsurface hydrophilicity

Plasma treatment and 10% NH₄OH solution rinsing were performed on a germanium (Ge) surface. It was found that the Ge surface hydrophilicity after O₂ and Ar plasma exposure was stronger than that of samples subjected to N₂ plasma exposure. This is because the thin GeO_x film formed on Ge by O₂ or Ar plasma is more hydrophilic than GeO_xN_y formed by N₂ plasma treatment. A flat (RMS<0.5 nm) Ge surface with high hydrophilicity (contact angle smaller than 3°) was achieved by O₂ plasma treatment, showing its promising application in Ge low-temperature direct wafer bonding.     

Structural and interfacial properties of high-k HfOxNy gate dielectric films

The thermal stability and interfacial characteristics for hafnium oxynitride (HfO_xN_y) gate dielectrics formed on Si (1 0 0) by plasma oxidation of sputtered HfN films have been investigated. X-ray diffraction results show that the crystallization temperature of nitrogen-incorporated HfO₂ films increases compared to HfO₂ films. Analyses by X-ray photoelectron spectroscopy confirm the nitrogen incorporation in the as-deposited sample and nitrogen substitution by oxygen in the annealed species. Results of FTIR characterization indicate that the growth of the interfacial SiO₂ layer is suppressed in HfO_xN_y films compared to HfO₂ films annealed in N₂ ambient. The growth mechanism of the interfacial layer is discussed in detail.     

Electrodepositing ZnxMnyOz alloys from zinc oxide to manganese oxide

Electrodeposition has emerged as a practical and simple method to synthesise semiconductor materials under different forms, thin films or nanostructured layers. This work reports on the cathodic electrodeposition of ZnMnO thin layers using both zinc and manganese chlorides as precursors. The composition of thin films can be varied from binary zinc oxide to manganese oxide varying the Mn/(Mn+Zn) ratio between 0 and 1. The composition of Zn_xMn_yO_z films was obtained by energy dispersive spectroscopy. Zn_1−xMn_xO films with Mn/Zn ratio less than 10% exhibit a crystalline wurtzite structure typical of ZnO fully oriented in the (0 0 2) direction. Higher Mn content leads to deformation of the ZnO lattice and the wurtzite structure is no longer maintained. X-ray photoelectron spectroscopy points out that Mn₃O₄ tends to be deposited when a high Mn/Zn ratio is used in the starting solution. Magnetic measurements on films with Mn/(Zn+Mn) ratio near 1 reveal magnetic characteristics similar to Mn₃O₄ compounds. The transmission spectra of Zn_xMn_yO_z show the typical absorption edge of crystalline ZnO while the wurtzite structure is maintained and it shifts to higher wavelengths when Mn content increases.     

Optical characterization of as-prepared and rapid thermal oxidized partially strain compensated Si1−x−y GexCy films

The optical properties of as-prepared and rapid thermal oxidized (RTO) heteroepitaxial Si_1−x−yGe_xC_y alloys grown on Si substrate have been characterized using spectroscopic ellipsometry. The critical points E₁, E₀′, E₂ band gaps were determined by line shape fitting in the second derivative spectra of the pseudo-dielectric functions. For as-prepared films, the E₁ gap increases with C concentration and a linear dependence on C content was observed. However, the E₂ gap decreases as the C concentration increases. For the RTO samples, the amplitude of E₂ transition reduces rapidly and the E₁ transition shifts to a lower energy. The reduction in the amplitude of E₂ transitions is due to the presence of oxide layer. A high Ge content layer and the low C content in the RTO films account for the E₁ shift to lower energy and the increase of the refractive indices.     

Hybrid functional calculations on the band gap bowing parameters of InxGa1-xN

The electronic band structures and band gap bowing parameters of In_xGa_1-xN are studied by the firstprinciples method based on the density functional theory. Calculations by employing both the Heyd-ScuseriaErnzerh of hybrid functional（HSE06） and the Perdew-Burke-Ernzerhof（PBE） one are performed. We found that the theoretical band gap bowing parameter is dependent significantly on the calculation method, especially on the exchange-correlation functional employed in the DFT calculations. The band gap of In_xGa_1-xN alloy decreases considerably when the In constituent x increases. It is the interactions of s–s and p–p orbitals between anions and cations that play significant roles in formatting the band gaps bowing. In general, the HSE06 hybrid functional could provide a good alternative to the PBE functional in calculating the band gap bowing parameters.     

Chemical–Mechanical Polishing of CdTe and ZnxCd1?xTe Single Crystals by H2O2(HNO3)–HBr–Organic Solvent Etchant Compositions

Chemical–mechanical polishing of CdTe and Zn _x Cd_1−x Te single-crystal surfaces by bromine-evolving compositions based on aqueous solutions of H₂O₂(HNO₃)–HBr–solvent has been investigated. The dependences of the chemical–mechanical polishing rate on the dilution of the base polishing etchant for various organic components have been determined. The surface condition after such polishing has been investigated using profilometry. The polishing etchant compositions for CdTe and Zn _x Cd_1−x Te single-crystal surfaces and the chemical polishing conditions have been optimized.     

Amorphous Ta-nanocrystalline RuOx diffusion barrier for lower electrode of high density memory devices

The effects of the amount of RuO₂ added in the Ta film on the electrical properties of a Ta-RuO₂ diffusion barrier were investigated using n⁺⁺-poly-Si substrate at a temperature range of 650–800°C. For the Ta layer prepared without RuO₂ addition, Ta₂O₅ phase formed after annealing at 650°C by reaction between Ta and external oxygen, leading to a higher total resistance and a non-linear I-V curve. Meanwhile, in the case of the Ta film being deposited with RuO₂ incorporation, not only a lower total resistance and ohmic characteristics exhibited, but also the bottom electrode structure was retained up to 800°C, attributing to the formation of a conductive RuO₂ crystalline phase in the barrier film by reaction with the indiffused oxygen because of a Ta amorphous structure formed by chemially strong Ta-O or Ta-Ru-O bonds and a large amount of conductive RuO₂ added. Since a kinetic barrier for nucleation in formation of the crystalline Ta₂O₅ phase from an amorphous Ta(O) phase is much higher than that of crystalline RuO₂ phase from nanocrystalline RuO_x phase, the formation of the RuO₂ phase by reaction between the indiffused oxygen and the RuO_x nanocrystallites is kinetically more favorable than that of Ta₂O₅ phase.     

Structural analysis of Ge x Si1−x /Si layers by remote plasma-enhanced chemical vapor deposition on Si (100)

In this work, remote plasma-enhanced chemical vapor deposition (RPCVD) has been used to grow Ge _x Si_1−x /Si layers on Si(100) substrates at 450° C. The RPCVD technique, unlike conventional plasma CVD, uses an Ar (or He) plasma remote from the substrate to indirectly excite the reactant gases (SiH₄ and GeH₄) and drive the chemical deposition reactions. In situ reflection high energy electron diffraction, selected area diffraction, and plan-view and cross-sectional transmission electron microscopy (XTEM) were used to confirm the single crystallinity of these heterostructures, and secondary ion mass spectroscopy was used to verify abrupt transitions in the Ge profile. XTEM shows very uniform layer thicknesses in the quantum well structures, suggesting a Frank/ van der Merwe 2-D growth mechanism. The layers were found to be devoid of extended crystal defects such as misfit dislocations, dislocation loops, and stacking faults, within the TEM detection limits (∼10⁵ dislocations/cm²). Ge _x Si_1−x /Si epitaxial films with various Ge mole fractions were grown, where the Ge contentx is linearly dependent on the GeH₄ partial pressure in the gas phase for at leastx = 0 − 0.3. The incorporation rate of Ge from the gas phase was observed to be slightly higher than that of Si (1.3:1).     

Growth of lanthanum oxide films for application as a gate dielectric in CMOS technology

We have investigated properties of insulating lanthanum oxide (La₂O₃) films in connection with the replacement of silicon oxide (SiO₂) gate dielectrics in new generation of CMOS devices. The La₂O₃ layers were grown using metal organic chemical vapour deposition (MOCVD) at 500 °C. X-ray diffraction analysis revealed polycrystalline character of the films grown above 500 °C. The X-ray photoemission spectroscopy detected lanthanum carbonate as a principal impurity in the films and lanthanum silicate at the interface with silicon. Density of oxide charge, interface trap density, leakage currents and dielectric constant ( κ) were extracted from the C-V and I-V measurements. Electrical properties, in particular dielectric constant of the MOCVD grown La₂O₃ are discussed with regard to the film preparation conditions. The as grown film had κ11. Electrical measurements indicate possible presence of oxygen vacancies in oxide layer. The O₂-annealed La₂O₃ film had κ17.     

Comparative study on the influence of Al component at GaAlAs layer for GaAs/AlGaAs photocathode

We designed two transmission-mode GaAs/AlGaAs photocathodes with different AlxGa_1-xAs layers, one has an Al_xGa_1-xAs layer with the Al component ranging from 0.9 to 0, and the other has a fixed Al component 0.7. Using the first-principle method, we calculated the electronic structure and absorption spectrum of Al_xGa_1-xAs at x=0, 0.25, 0.5, 0.75 and 1, calculation results suggest that with the increase of the Al component, the band gap of Al_xGa_1-xAs increases. Then we activated the two samples, and obtained the spectral response curves and quantum efficiency curves; it is found that sample 1 has a better shortwave response and higher quantum efficiency at short wavelengths. Combined with the band structure diagram of the transmission-mode GaAs/AlGaAs photocathode and the fitted performance parameters, we analyze the phenomenon. It is found that the transmission-mode GaAs/AlGaAs photocathode with variable Al component and various doping structure can form a two-stage built-in electric field, which improves the probability of shortwave response photoelectrons escaping to the vacuum. In conclusion, such a structure reduces the influence of back-interface recombination, improves the shortwave response of the transmission-mode photocathode.     

Electrical characteristics of diodes fabricated in selective Si/Si1−x Ge x epitaxial layers

Diodes have been fabricated in layers of Si_1−x Ge _x and silicon deposited selectively on patterned wafers, and the electrical characteristics of the diodes have been examined. For 50 nm thick Si_1−x Ge _x layers containing about 22% Ge, the forward characteristics of larger diodes are nearly ideal. However, the reverse leakage current is higher when the edges of the diode intersect the oxide defining the selectively deposited layers than when the diode edges are separated from this oxide. The diode characteristics are more ideal when the diode edges are aligned along the [100] directions than when aligned along the [110] directions. Higher-temperature hydrogen pre-treatments before epitaxial deposition can degrade the diode characteristics.     

Growth of GaAs1−xPx/GaAs and InAsxP1−x/InP strained quantum wells for optoelectronic devices by gas-source molecular beam epitaxy

In this paper we show that pseudomorphically strained heterostructures of InAs _x P_1−x /InP may be an alternative to lattice-matched heterostructures of In_1−x Ga _x As _y P_1−y /InP for optoelectronic applications. We first studied the group-V composition control in the gas-source molecular beam epitaxy (GSMBE) of the GaAs_1-x P _x /GaAs system. Then we studied GSMBE of strained InAs _x P_1−x /InP multiple quantum wells with the ternary well layer in the composition range 0.15 <x < 0.75. Structural and optical properties were characterized by high-resolution x-ray rocking curves, transmission electron microscopy, absorption and low-temperature photoluminescence measurements. High-quality multiple-quantum-well structures were obtained even for highly strained (up to 2.5%) samples. The achievement of sharp excitonic absorptions at 1.06, 1.3 and 1.55μm at room temperature from InAs _x P_1−x /InP quantum wells suggests the possibility of long-wavelength optoelectronic applications.     

Effect of Rapid Thermal Annealing on Sputtered CaCu<Subscript>3</Subscript>Ti<Subscript>4</Subscript>O<Subscript>12</Subscript> Thin Films

Calcium copper titanium oxide (CaCu₃Ti₄O₁₂, abbreviated to CCTO) films were deposited on Pt/Ti/SiO₂/Si substrates at room temperature (RT) by radiofrequency magnetron sputtering. As-deposited CCTO films were treated by rapid thermal annealing (RTA) at various temperatures and in various atmospheres. X-ray diffraction patterns and scanning electron microscope (SEM) images demonstrated that the crystalline structures and surface morphologies of CCTO thin films were sensitive to the annealing temperature and ambient atmosphere. Polycrystalline CCTO films could be obtained when the annealing temperature was 700°C in air, and the grain size increased signifi- cantly with annealing in O₂. The 0.8-μm CCTO thin film that was deposited at RT for 2 h and then annealed at 700°C in O₂ exhibited a high dielectric constant (ε′) of 410, a dielectric loss (tan δ) of 0.17 (at 10 kHz), and a leakage current density (J) of 1.28 × 10⁻⁵ A/cm² (at 25 kV/cm).     

Chemical compositions and optical properties of HfOxNy thin films at different substrate temperatures

High-k HfO_xN_y thin films have been grown by radio frequency (rf) reactive sputtering of metal Hf target in N₂/Ar/O₂ ambient at different substrate temperatures. The chemical compositions of the films have been investigated as a function of substrate temperature by X-ray photoelectron spectroscopy (XPS). XPS measurements showed that nitrogen concentration increases with an increase in substrate temperature. Room-temperature spectroscopic ellipsometry (SE) with photon energy 0.75–6.5 eV was used to investigate the optical properties of the films. SE results demonstrated that refractive index n increases with an increase in substrate temperature. Based on TL parameters which were obtained from the best fit results used in a simulation of the measured spectra, meanwhile, we conclude that the energy band gap (E_g) decreases with an increase in substrate temperature.