两种材料的性质对双材料界面裂纹能量释放率及应力强度因子的影响

在实际工程中,结构往往是由多种材料构成,而裂纹经常在两种材料的界面上扩展.针对双材料界面裂纹,建立相应的计算模型.用能量释放率来描述裂纹的扩展情况,并根据界面裂纹能量释放率解析计算方法对不同的材料性质、外荷载、构件厚度,以及裂纹两侧不同的材料宽度对裂纹扩展时的能量释放率和应力强度因子进行仿真分析,得到了能量释放率和两种材料的弹性模量、外荷载及构件厚度之间的关系变化的曲线,以及裂纹两侧不同的材料宽度和应力强度因子之间的关系.并对界面裂纹和单一材料裂纹的情况进行分析、比较.     

化学机械抛光中Si/Cu/Ta/low-k界面剥离和断裂特性研究

超大规模集成电路随着布线层数增加和线宽的缩小,low-k材料的介电常数进一步降低,多孔low-k材料力学性能随之降低,使得晶圆在化学机械抛光(Chemical mechanical polishing,CMP)中面临的主要问题是Cu/Ta/low-k或者超低k材料的界面剥离。针对Si/Cu/Ta/low-k在CMP过程中的承载特性,建立单层布线和多层布线体系的界面力学模型,采用断裂力学理论和有限元法研究Si/Cu/Ta/low-k界面在CMP过程中界面的应力分布规律和界面裂纹的断裂强度。采用能量释放率来描述裂纹的扩展情况,根据界面裂纹能量释放率数值计算方法对裂纹长度、材料性质及不同的布线层数对裂纹扩展时的界面断裂/剥离特性进行仿真分析,得到界面应力分布、能量释放率、相位角与裂纹长度、材料性能、布线层数之间的关系变化曲线。结果表明:随着low-k力学性能降低和布线层数增加,裂纹能量释放率升高,界面裂纹更容易扩展。     

三维编织陶瓷基复合材料的断裂韧性

纤维与基体之间的弱化界面能够增加陶瓷基复合材料的韧性,却使得裂纹在编织CMC界面上扩展.在对编织CMC断裂试验的形态观察基础上,本文从界面断裂理论上剖析了编织结构,研究了材料的裂纹扩展路径以及侵入角γ对材料断裂韧性的影响,提出了用能量释放率表征三维编织陶瓷基复合材料断裂韧性的方法,为实验分析提供了一条计算道路.     

复合材料界面断裂的光弹性研究

使用了光弹性方法初步研究了复合材料的界面断裂规律 ,观察了裂纹沿界面的扩展过程 ,界面的应力分布 ,并结合断裂力学方法计算了复合材料界面的脱粘强度。实验现象揭示了当裂纹扩展到界面附近时 ,若基体和增强项的强度都大于界面结合强度 ,裂纹前端的应力首先通过界面脱粘而释放掉一部分 ,裂纹越过基体先沿着界面扩展 ,达到一定程度后基体再发生基体裂纹扩展     

焊趾位置表面裂纹疲劳扩展形状计算

针对结构中出现的表面裂纹诱发断裂现象,利用断裂力学理论中裂纹尖端应力强度因子与裂纹扩展能量释放率的关系,依据裂纹扩展时裂纹前沿各点的有效能量释放率相等,在考虑裂纹闭合效应的基础上提出一种表面裂纹扩展形状演化计算方法。采用提出的方法计算了T型焊接结构焊趾位置表面裂纹在拉伸疲劳载荷作用下的表面裂纹形状参数函数关系,模拟出表面裂纹疲劳扩展时的形状演化过程。进行了T型焊接试件的表面裂纹扩展有限元模拟和试验,结果与理论计算结果基本一致,验证了基于能量释放率的结构表面裂纹疲劳扩展形状演化计算方法的有效性。     

双金属板软化界面的止裂与分层机理

采用带软化界面层的双金属层状板,分析了裂纹垂直于界面扩展过程中的力学行为.带单边裂纹的钢/铝层板的实验表明,裂尖到达界面时裂纹扩展速率降低;载荷增高后,易在界面上产生分层.利用有限元软件分析了裂纹前沿应力和应变的变化.计算结果表明,软铝界面层出现较大塑性应变,增加了裂纹扩展阻力,使裂纹扩展应力降低,而界面分层应力提高,导致了裂纹扩展速率降低和界面分层现象.     

螺杆泵定子橡胶疲劳裂纹扩展寿命预测

对非线性弹性断裂能量释放率和裂纹扩展速度的关系进行研究,建立了橡胶材料的疲劳裂纹扩展寿命预测模型.对带有预制切口的橡胶试件进行疲劳试验,试验疲劳寿命与理论预测疲劳寿命误差值为8.72%,验证此法预测螺杆泵定子橡胶的裂纹扩展寿命是可行的.对螺杆泵进行有限元计算和力学分析,确定螺杆泵最大等效应力和最小等效应力,进而计算螺杆泵各段模型危险疲劳位置的应变能释放率范围,预测螺杆泵定子橡胶的疲劳扩展寿命,并与螺杆泵实际寿命基本吻合,为螺杆泵疲劳寿命的预测研究提供了具有一定实用性的理论及方法.     

热障涂层层状裂纹的位置对断裂性能的影响

广泛应用于热能动力的热障涂层在高温工作环境下,由于温度梯度产生的热应力不匹配会导致热障涂层层裂或剥落失效。本文针对热障涂层层裂问题,考虑热应力不匹配因素,建立热障涂层层裂I/II复合型断裂准则,并针对分层裂纹在陶瓷层与粘结层界面上和附近的3种位置存在形式,进行了热障涂层结构单裂纹层裂的算例分析。结果表明界面处层裂纹对应变能释放率影响最大。     

橡胶纯剪试件断裂力学分析

在橡胶材料纯剪试件中,当裂纹的长度和试件的高度尺寸接近时,应变能释放率与裂纹尺寸无关,由于存在这个特点,纯剪试件经常被用来研究橡胶材料的断裂属性。文中对橡胶纯剪试件在试件中心线上分别存在中心裂纹和边缘裂纹,以及粘接界面分别存在中心裂纹和边缘裂纹的情况进行非线性有限元分析,并将有限元计算的应变能释放率与已存在的解进行比较。对于长裂纹,有限元解与已存在的解吻合较好;但是对于小裂纹,有限元解与已存在的解之间仍然存在一些差异。     

韧性硬化材料裂纹扩展分形研究

基于分形理论，推出了韧性金属硬化材料裂纹扩展的分形运动学公式，得出了动、静态断裂能量释放率与分形裂纹扩展速度、ＨＲＲ场角分布函数、微结构特征量？？ｃ，以及分形维数Ｄｆ的关系，从而得出了材料断口裂纹分形扩展速度的计算表达式，经分析表明，宏观测量的裂纹扩展速度ｖ０小于分形裂纹扩展速度ｖ，理论分析结果与试验结果趋于一致。     

铝合金管材无芯模冲切过程的有限元模拟

对铝合金管的冲切过程进行了有限元模拟,刀具采用刚体模型,工件采用弹塑性模型,材料断裂破坏采用Normalized Cockcroft&Latham破坏准则,分析了冲切过程中冲切力、等效应力的变化,得出了弹性变形、塑性变形、塑性变形至裂纹扩展、断裂始终贯穿于整个冲切过程之中。通过模拟切口与实际切口的对比以及模拟切屑形状与实际切屑形状的对比,说明了模拟过程的有效性。     

器件韧性镀膜微划痕破坏机理研究

对硅基体上之韧性镀膜（铝膜）的粘结强度及破坏机理进行微划痕实验及理论研究,从实验中观察出该体系的破坏特征,进而测量出微划前水平驱动力、划痕深度随划前水平位移并伴随着界面脱胶发生的变化规律,针对微刈痕破坏特征,建立了双粘聚力模型,并对由微划痕引起的界面弹塑性脱胶进行了数值模拟,给出界面脱胶时能量释放率随其他材料参数变化的理论预测曲线,并将预测值与文中的铝／硅实验结果及与文献中关于铂／氧化镍的实验结果进行对比,达到基本符合。通过以对韧性薄膜／脆性基体的微划痕实验研究和理论分析,获得如下主要结论：（1）韧性膜的微划痕破坏特征为,当划刀尖端接近界面时,将突然发生薄膜测界面的脱胶现象,并在界面附近脆性基一侧形成界面裂纹并扩展;微划痕的水平驱动力表征了整个薄膜脱胶体系的能量释放率;薄膜或涂层材料的塑性变形对微划痕过程有较强的抑制作用。（2）界面的分离强度和材料的剪切强度对微划痕过程有重要的影响。（3）划痕刀片的几何特征角对刻痕水平驱动力影响不大。     

Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique

Deformations of a Si-epoxy-FR4 (simplified flip chip) structure under thermal testing were inspected with a real-time Moiré technique. Specimens without cracks and specimens with a crack at the silicon-epoxy interface were prepared. The measurement results showed that the maximum deformation appeared at the edge. When the specimen was cooled to 20 °C, there was residual plastic deformation in the specimen. The creep effect was more dominant in the FR4-epoxy interface. Upon cooling to 20 °C, the specimen experienced partial strain recovery. To characterize the behavior of the interfacial crack, stress intensity factors K_I and K_II, and the strain energy release rate G in the vicinity of the crack tip were calculated using the measured deformations to conduct a quantitative study. It was observed that a sharp strain gradient occurred at the crack tip. K_I and K_II were dependent on temperature, and G was dominated by K_I for the interfacial crack in the specimen.     

应力比r对构件疲劳裂纹扩展的影响分析

应用能量释放率法及Paris公式对疲劳裂纹扩展问题进行了研究,详细分析比较了在不同应力比r作用下,对箱形构件未穿透型裂纹剖面各积分点的应力强度因子及裂纹扩展速率的影响.所得结论可为工程设计及裂纹无损检测人员提供一定参考.     

The stacking fault energy and delamination wear of single-phase f.c.c. metals

The role of the stacking fault energy (SFE) in the delamination wear of single-phase f.c.c. metals is discussed, based on the data obtained with four different copper-based solid solutions and with aluminum, nickel and AISI 304 stainless steel. Since crystal plasticity (and thus the SFE) affects all aspects of delamination wear (i.e. surface traction, plastic strain accumulation, crack nucleation and crack propagation) and since the interactions between them are complex, there is no simple general relationship between the SFE and the wear rate.     

Fracture analysis of electronic ic package in reflow soldering process

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C (t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.     

Indentation-induced buckling of organic coatings part II: measurements with impacting particles

The impact-induced buckling and delamination of a thin coating was analysed for the purpose of predicting the amount of coating removed when a single particle was launched, at a given velocity, against a coated substrate. A novel post-buckling analysis is presented in which the coating is modelled as a clamped disk prevented from buckling at an arbitrarily set inner radius, due to the presence of the indenting particle. A method for calculating the arrest strain energy release rate and mode mix of interfacial delamination cracks, based on the coupling of the presented buckling analysis with an existing strain energy release rate analysis is then presented. A method to estimate the critical interfacial shear stress at crack initiation is also outlined. An accompanying paper compares experimental results with the results of this analysis, and shows how the results can be used in the context of blast cleaning.     

3D finite element analysis of stress distributions and strain energy release rates for adhesive bonded flat composite lap shear joints having pre-existing delaminations

The rate of propagation of embedded delamination in the strap adherend of lap shear joint (LSJ) made of carbon/epoxy composites has been evaluated employing three-dimensional non-linear finite elements. The delamination has been presumed to pre-exist in the thin resin layer between the first and second plies of the strap adherend. The inter-laminar peel and shear stress distributions have been studied in details and are seen to be predominantly three-dimensional in nature. The components of strain energy release rate (SERR) corresponding to the opening, sliding and cross sliding modes of delamination are significantly different at the two fronts of the embedded delamination. The sequential release of multi-point constraint (MPC) finite elements in the vicinity of the delamination fronts enables to simulate the growth of the delamination at either ends. This simulation procedure can be utilized effectively for evaluation of the status of the structural integrity of the bonded joints.     

Energy release rate of postbuckled laminates with a through-width delamination

The strain energy release rate is calculated for buckled one-dimensional delamination (through-width delamination) in composite laminates subjected to in-plane compression. A crack closure method based on plate finite elements is used in this analysis. For some laminates containing a one-dimensional delamination in cylindrical bending, closed form solutions are available. The present finite element solutions show excellent agreement with the analytical solutions. The strain energy release rate for various types of laminates is also calculated using the present finite element method. The results show that the strain energy release rate strongly depends on the type of laminate.