一种改进型有源电感的设计

本文首先分析了普通的接地有源电感,随后提出了一种改进型的有源电感,并给出了其等效电路图以及每个元件值的表达式,最后基于0.6um CMOS工艺,利用HSPICE工具进行仿真,仿真结果表明:电路工作频率范围为IMHz-1.4GHz,最佳工作频率范围为600MHz-900MHz.在这个范围内该有源电感的电感值和Q值都可以达到很大.同时验证了反馈电阻Rf对Q值和Q值达到最大时的频率改变的影响.     

适用于RF MEMS能量耦合传输的高Q值电感

利用MEMS微电镀工艺技术制作了一种新型的适用于RF MEMS能量耦合传输的高Q值电感,采用ANSOFT公司的HFSS优化平面螺旋电感的结构。在具有高电阻率的玻璃衬底上溅射0.5μm的铜层作为下电极;PECVD淀积厚度为1μmSiO2作为中间介质层;在介质层上结合厚胶光刻技术电镀厚为22μm的铜作为电感线圈。这套电感制作工艺流程简单、易于与IC制备工艺集成。本文制备的微机械电感在微型植入系统中具有广阔的应用前景。测量结果表明:当工作频率在1GHz左右时,微电感的电感值达到55nH,Q值最大可达到25。     

片上射频磁介质电感的设计与仿真

片上无源电感是RF IC中需求很高的器件.将适宜的磁材料引入到射频微电感中,既可有效地提升电感L值,从而使电感所需面积减小,又能保持甚或提升电感Q值,是实现高性能、小尺寸射频微电感的一种非常有前景的方法.我们设计了不同结构的磁介质微电感,通过软件仿真研究了电感结构和材料参数变化对电感性能的影响,为研制小尺寸、高性能片上磁介质电感提供了理论指导.     

射频螺线管微电感的设计和仿真

为了获得高性能MEMS螺线管微电感,考虑了几何结构参数对微电感性能的影响,用HFSS软件对特定结构的微电感进行仿真,仿真结果与实验研制的测量结果基本相符.测试结果表明微电感在较宽的工作频率范围内具有高Q值,可以应用在无线通讯领域.     

使用Q值提升技术的增益可调GSM低噪声放大器的设计

现代CMOS工艺的发展使得在CMOS工艺上设计射频IC前端成为可能。但在传统CMOS工艺集成的片上螺旋电感品质因数(Q)偏低,大大影响其性能。通过引入负电导实现螺旋电感Q值提升,并将其应用于共栅低噪声放大器的设计。     

LTCC平面螺旋电感参数提取方法分析

电感元件在微波多芯片组件（MCM）设计中具有重要地位,其基于参数提取的宏模型是系统仿真的关键。介绍了修正π平面螺旋电感高频等效电路模型及模型参数提取的方法,通过实测数据分析了在不同线宽、不同间距、不同圈数情况下的电感有效值及Q值。研究结果对低温共烧陶瓷（LTCC）平面螺旋电感的应用具有指导意义。     

衰减法测Q值的充电电路设计

一、前言 我们研制的HL2801型数字式自动Q表是一种智能化综合性高频阻抗测量仪器。它可以在50KH_z-30MH_z频率范围内对电感、电容、电阻及阻抗网络的各项高频阻抗参数进行测量。HL2801型Q表Q值的测量是采用对数衰减振荡原理实现的。     

充电电流对测量电感值的影响

本文介绍采用向被测电感充放电来测量电感值的方法,并分析不同的充电电流对测量值的影响。用示波器看电压电流波形,并分析各部分波形的产生原因及其所代表的信息。用这种测量方法设计试验电路找出电压波形中反映电感值的信号送到单片机测量出电感值,证明可以测量小电感值的空心电感。通过分析电压电流波形及不同充电电流条件下的数据,证明充电电流大有利于测量电感值。     

集成电路矩形互连线二维电容及随频率变化电感的联合计算方法

提出一种电容电感联合算法,可计算全频率范围内随频率变化的电感,同时得到电容矩阵,该算法利用电路模型法得到低频下若干频率的电感值;利用边界元法得到电容矩阵,并对电容矩阵求逆得到电流完全分布在导体表面时的电感值,由集肤深度得到该电感值对应的频率,对上述离散频率的电感值利用三次样条函数插值,得到整个频率范围内电感的变化曲线。算法避免了求解Helmholtz议程,极大地简化了算法,数值结果表明,该算法是可行的。     

电感参数可视化测量方法研究

电感器有很多参数,其中最重要的两个参数决定了电感器的性能：电感值和饱和电流。既有的电感参数测量方法要么能比较精确地测量电感值,要么能用其他辅助手段测量饱和电流,但都不能同时测量电感值和饱和电流。结合数字存储示波器特殊的单次触发和图形显示技术,设计简易的电阻电感串联测量电路,根据电感值的测量定义,测量出电感两端的电压值以及取样电阻的电流变动值,从而计算出电感值。数字存储示波器显示测量曲线的拐点,即可求出电感饱和电流。通过实验验证,此方法能得到精确的电感值,同时能得到直观的饱和电流值。方法原理简单,设计合理,易于操作,是在实验室缺少LCR测试仪的情况下一个经济有效的电感参数测量方法。     

High-performance inductors using capillary based fluidic self-assembly

In this paper, a batch microfabrication process is presented for creating high aspect ratio, micron-sized helical and toroidal inductors with Q greater than or equal to 50 at multi-GHz frequencies. With a maximum processing temperature of only 220/spl deg/C, the inductors can be fabricated on top of standard CMOS wafers. This process can also be used to create "inductor chiplets", which are polymer-encapsulated inductors with the same form factor as an EIA (Electronics Industries Association) standard 0201 surface mount device. The chiplets can be assembled onto CMOS wafers using a fluidic microassembly technique. This technique allows for multiple electrical interconnects to the inductor chiplets. The 40-/spl mu/m gap between the substrate and assembled inductor increases the Q by a factor of /spl sim/3 compared to as-fabricated inductors. Assembled and as-fabricated inductors have been characterized on similar substrates and have maximum Q values of 50 and 15 with resonant frequencies of 10 GHz and 9 GHz, respectively. Performance of the assembled inductors is nearly comparable to that of inductors as fabricated and tested on quartz substrates.     

空调EMI电源滤波电路设计与仿真

为提高空调产品的电磁兼容特性,针对典型空调EMI电源滤波电路,提出基于ANSYS仿真软件的EMI滤波PCB设计与仿真方法。分别对滤波电路中的X电容、Y电容、共模电感、差模电感等进行单独建模,搭建完整滤波电路,通过Designer对其进行S参数仿真,利用Q3D准确提取PCB的寄生参数,通过网络分析仪测试相应的滤波PCB,验证该仿真方法的正确性与有效性。     

Design and analysis of a novel MEMS spiral inductor with high quality factor

Microsystem Technologies - In this paper a novel spiral inductor with high quality (Q)-factor is presented. Non-uniform current density distribution, especially in inner turn, increases the...     

High performance suspended spiral inductor and band-pass filter by wafer level packaging technology

Suspended inductors and 2.45 GHz BPF with patterned ground shields on the lossy silicon substrate by using Cu/BCB based wafer level packaging and bulk Si etching technologies were fabricated. Thick BCB interlayer is used as the supporting dielectric and the backside cavity is easily removed by using a two-step back-etching process. The fabricated 2.7 nH inductor has a maximum Q factor 49 at 8.2 GHz and high Q factors more than 22 in the broadband frequency range from 1 to 10 GHz. And the realized 2.45 GHz BPF has the insertion loss of 3.0 dB and the return loss of more than 14 dB at the pass band. It is also featured by more than 48 and 25 dB attenuation at 0.9 and 1.8 GHz respectively, with the second harmonic rejection being 33 dB.

     

一种RF MEM电感及其LC低通滤波器的模拟和设计

模拟并设计了一种基于表面微机械加工的平面MEM电感,提出了它的等效电路模型并给出模型中参数的提取方法。由模拟结果验证了该等效电路具有较高的精度,误差在8%以内。设计的一个3.6nH的平面MEM电感的品质因数超过20,自谐振频率超过15GHz。由平面MEM电感构成的5阶LC低通滤波器的-3dB带宽为3.7GHz,0~3GHz内的插入损耗低于1dB。     

Temperature compensated high efficiency inductor current sensor

Inductor current sensing is very important in the control and monitoring of switching power converters. Traditional low cost implementation using a sensing resistor in series with the inductor will reduce the overall efficiency of the power converter. Conventional Hall effect current sensor could also be used to detect the inductor current. However, it will significantly increase the production cost of power converters. One simple and low cost implementation is to add a resistor–capacitor (RC) network in parallel with the inductor so that the inductor current can be derived from the added circuitry. The problem with RC sensing network is that the sensed variable is very sensitive to temperature variations. In this paper, a novel inductor current sensor using low cost negative temperature coefficient (NTC) thermistors to compensate the variation in the parasitic resistance of the inductor due to temperature changes is proposed. The changes in the cutoff frequency and steady state gain are also compensated by the added NTC thermistor circuit. With the compensated network, the sensed inductor current derived from the modified RC network will be independent of temperature variations. The compensated network can be applied to inductors fitted to power converters. Although experimental studies based on a buck converter were carried out to illustrate the correctness of the improved sensing technique, the proposed technique is applicable to other converter topologies.     

交错并联Boost PFC升压电感研究

本文分析了在电感电流断续模式下，交错并联的两个Boost PFC电路采用分立电感与耦合电感的工作过程。相对于分立电感，采用耦合电感的Boost PFC电路，存在电感峰值电流大，输入电流谐波分量高，功率因数低等问题。针对这些问题，采用了一种新颖的集成电感，并利用Gyrator-capacitor法对该集成电感的绕线方式建立了PSpice仿真模型。通过仿真，验证了这种集成电感能很好地克服耦合电感存在的缺点，其工作特性接近于两个分立电感。