应变Si1-xGex pMOSFET反型沟道空穴低场迁移率模型

在考虑应变对SiGe合金能带结构参数影响的基础上,提出了一个半经验的应变Sil-xGex/Si pMOSFET反型沟道空穴迁移率模型.在该模型中,给出了迁移率随应变的变化,并且考虑了界面陷阱电荷对载流子的库仑散射作用.利用该模型对室温下空穴迁移率随应变的变化及影响空穴迁移率的因素进行了分析讨论.     

应变Si1-x Gex pMOSFET反型沟道空穴低场迁移率模型

在考虑应变对SiGe合金能带结构参数影响的基础上,提出了一个半经验的应变Sil-xGex/Si pMOSFET反型沟道空穴迁移率模型.在该模型中,给出了迁移率随应变的变化,并且考虑了界面陷阱电荷对载流子的库仑散射作用.利用该模型对室温下空穴迁移率随应变的变化及影响空穴迁移率的因素进行了分析讨论.     

应变Si/SiO2界面对NMOS沟道电子迁移率的影响研究

本文提出全新的半经验应变Si NMOS反型沟道电子迁移率模型,此模型考虑了晶格散射,离化杂质散射,表面声子散射,界面电荷散射以及界面粗糙散射等散射机制对反型沟道电子迁移率的影响,并考虑了反型层电子的屏蔽效应。利用Matlab软件对所建模型进行了模拟,模拟结果与实验数据符合较好。     

SiO2/SiC界面对4H-SiC n-MOSFET反型沟道电子迁移率的影响

提出了一种基于器件物理的4H-SiC n-MOSFET反型沟道电子迁移率模型.该模型包括了界面态、晶格、杂质以及表面粗糙等散射机制的影响,其中界面态散射机制考虑了载流子的屏蔽效应.利用此模型,研究了界面态、表面粗糙度等因素对迁移率的影响,模拟结果表明界面态和表面粗糙度是影响沟道电子迁移率的主要因素.其中,界面态密度决定了沟道电子迁移率的最大值,而表面粗糙散射则制约着高场下的电子迁移率.该模型能较好地应用于器件模拟.     

SiO_2/SiC界面对4H-SiC n-MOSFET反型沟道电子迁移率的影响

提出了一种基于器件物理的4 H- Si C n- MOSFET反型沟道电子迁移率模型.该模型包括了界面态、晶格、杂质以及表面粗糙等散射机制的影响,其中界面态散射机制考虑了载流子的屏蔽效应.利用此模型,研究了界面态、表面粗糙度等因素对迁移率的影响,模拟结果表明界面态和表面粗糙度是影响沟道电子迁移率的主要因素.其中,界面态密度决定了沟道电子迁移率的最大值,而表面粗糙散射则制约着高场下的电子迁移率.该模型能较好地应用于器件模拟.     

GaN n-MOSFET反型沟道电子迁移率模型

在器件物理的基础上,提出了一种半经验的GaN n-MOSFET反型沟道电子迁移率模型.该模型考虑了位错、界面态、光学声子、离化杂质、表面粗糙、声学声子,以及高场对迁移率的影响.模拟结果表明,界面态和位错是影响沟道迁移率的主要因素,尤其是界面态,它决定了迁移率的最大值,而位错密度的增加使迁移率减小.此外,表面粗糙散射和高场散射主要影响高场下载流子迁移率.由此可见,GaN n-MOSFET沟道迁移率的提高依赖于晶体质量和界面质量的提高.     

PbSe外延薄膜空穴迁移率及其声子散射机理

采用分子束外延技术生长了非人为掺杂的PbSe单晶薄膜,研究了薄膜中声子散射对空穴迁移率的影响.并用霍尔效应和变温电阻率测量方法分析了电学特性,得到PbSe薄膜均具有P型导电性,载流子浓度为(5～8)×1017cm-3,室温空穴迁移率为～300cm2/(V·s),随温度降低迁移率增大,77K温度下的迁移率达到3×10cm2/(V·s).通过对PbSe薄膜中的载流子散射机理的理论分析,表明在77～295K温度范围内,PbSe的长纵光学波散射是影响载流子迁移率的主要机制.同时,Raman光谱测量显示,在温度≥203K时,不仅观察到了PbSe长纵光学声子散射LO(Г),还观察到了其他光学声子的散射,这些观察到的声子散射影响了PbSe的空穴迁移率.     

PbSe外延薄膜空穴迁移率及其声子散射机理

采用分子束外延技术生长了非人为掺杂的PbSe单晶薄膜,研究了薄膜中声子散射对空穴迁移率的影响.并用霍尔效应和变温电阻率测量方法分析了电学特性,得到PbSe薄膜均具有P型导电性,载流子浓度为(5～8)×1017cm-3,室温空穴迁移率为～300cm2/(V·s),随温度降低迁移率增大,77K温度下的迁移率达到3×10cm2/(V·s).通过对PbSe薄膜中的载流子散射机理的理论分析,表明在77～295K温度范围内,PbSe的长纵光学波散射是影响载流子迁移率的主要机制.同时,Raman光谱测量显示,在温度≥203K时,不仅观察到了PbSe长纵光学声子散射LO(Г),还观察到了其他光学声子的散射,这些观察到的声子散射影响了PbSe的空穴迁移率.     

量子点场效应单光子探测器二维电子气电子迁移率分析

设计了一种基于场效应晶体管的量子点场效应单光子探测器,利用二维弛豫时间的近似理论建立了二维电子气电子迁移率的散射模型,通过求解量子点场效应单光子探测器GaAs/AlxGa1-xAs二维电子气系统电子和声子相互作用的Hamiltonian函数,得到了不同温度、不同Al组分以及不同二维电子气电子面密度条件下晶格振动散射对探测器二维电子气电子迁移率的影响.仿真结果显示,提高二维电子气的电子面密度浓度和适当增大Al组分,并降低工作温度,有助于探测器获得更高的二维电子气电子迁移率.     

叠层高k栅介质中远程界面粗糙散射的理论模型

利用双子带近似,从理论上研究了远程界面粗糙散射对叠层高k栅介质MOSFET反型载流子迁移率的退化作用,模拟了叠层高k栅介质结构参数和材料参数对远程界面粗糙散射的影响。结果表明,对于精确的迁移率模型,远程界面粗糙散射必须加以考虑,另外,在设计叠层高k栅介质MOSFET时,在EOT得到满足的条件下,尽可能利用具有较高介电常数的界面层和具有较低介电常数的高k栅介质,可以减小迁移率退化。     

On the universality of inversion layer mobility in Si MOSFET's:Part I-effects of substrate impurity concentration

This paper reports the studies of the inversion layer mobility in n- and p-channel Si MOSFET's with a wide range of substrate impurity concentrations (10¹⁵ to 10¹⁸ cm^-3). The validity and limitations of the universal relationship between the inversion layer mobility and the effective normal field (E_eff) are examined. It is found that the universality of both the electron and hole mobilities does hold up to 10¹⁸ cm ^-3. The E_eff dependences of the universal curves are observed to differ between electrons and holes, particularly at lower temperatures. This result means a different influence of surface roughness scattering on the electron and hole transports. On substrates with higher impurity concentrations, the electron and hole mobilities significantly deviate from the universal curves at lower surface carrier concentrations because of Coulomb scattering by the substrate impurity. Also, the deviation caused by the charged centers at the Si/SiO₂ interface is observed in the mobility of MOSFET's degraded by Fowler-Nordheim electron injection     

A comprehensive model for inversion layer hole mobility forsimulation of submicrometer MOSFET's

A comprehensive model of effective (average) mobility and local-field mobility for holes in MOSFET inversion layers is presented. The semiempirical equation for effective mobility, coupled with the new local-field mobility model, permits accurate two-dimensional simulation of source-to-drain current in MOSFETs. The model accounts for the dependence of mobility on transverse and longitudinal electric fields, channel doping concentration, fixed interface charge density, and temperature. It accounts not only for the scattering by fixed interface charges, and bulk and surface acoustic phonons, but it also correctly describes screened Coulomb scattering at low effective transverse fields (near threshold) and surface roughness scattering at high effective transverse fields. The model is therefore applicable over a much wider range of conditions compared to earlier reported inversion layer hole mobility models while maintaining a physically based character     

Fabrication and mobility characteristics of SiGe surface channel pMOSFETs with a HfO/sub 2//TiN gate stack

This paper describes an extensive experimental study of TiN/HfO/sub 2//SiGe and TiN/HfO/sub 2//Si cap/SiGe gate stacked-transistors. Through a careful analysis of the interface quality (interface states and roughness), we demonstrate that an ultrathin silicon cap is mandatory to obtain high hole mobility enhancement. Based on quantum mechanical simulations and capacitance-voltage characterization, we show that this silicon cap is not contributing any silicon parasitic channel conduction and degrades by only 1 /spl Aring/ the electrical oxide thickness in inversion. Due to this interface optimization, Si/sub 0.72/Ge/sub 0.28/ pMOSFETs exhibit a 58% higher mobility at high effective field (1 MV/cm) than the universal SiO/sub 2//Si reference and a 90% higher mobility than the HfO/sub 2//Si reference. This represents one of the best hole mobility results at 1 MV/cm ever reported with a high-/spl kappa//metal gate stack. We thus validate a possible solution to drastically improve the hole mobility in Si MOSFETs with high-/spl kappa/ gate dielectrics.     

Physics of Hole Transport in Strained Silicon MOSFET Inversion Layers

A comprehensive quantum anisotropic transport model for holes was used to study silicon PMOS inversion layer transport under arbitrary stress. The anisotropic band structures of bulk silicon and silicon under field confinement as a twodimensional quantum gas are computed using the pseudopotential method and a six-band stress-dependent k.p Hamiltonian. Anisotropic scattering is included in the momentum-dependent scattering rate calculation. Mobility is obtained from the Kubo–Greenwood formula at low lateral field and from the fullband Monte Carlo simulation at high lateral field. Using these methods, a comprehensive study has been performed for both uniaxial and biaxial stresses. The results are compared with device bending data and piezoresistance data for uniaxial stress, and device data from strained Si channel on relaxed SiGe substrate devices for biaxial tensile stress. All comparisons show a very good agreement with simulation. It is found that the hole band structure is dominated by 12 “wings,” where mechanical stress, as well as the vertical field under certain stress conditions, can alter the energies of the few lowest hole subbands, changing the transport effective mass, density-of-states, and scattering rates, and thus affecting the mobility.     

A universal electron mobility model of strained Si MOSFETs based on variational wave functions

A new model is proposed to describe the electron mobility enhancement in strained Si MOSFETs inversion layers using the variational wave functions in the triangular potential approximation. Phonon scattering and surface roughness scattering are included in this model and electron mobility enhancements due to the suppression of these two scatterings are accounted for, respectively. A process-dependent interface parameter is introduced to fit with various technologies. Results from the model show good agreement with experiments for different Ge mole fractions and for a wide range of vertical effective field and temperature. The model is very interesting for implementation in conventional device simulators.     

Influence of high channel doping on the inversion layer electron mobility in strained silicon n-MOSFETs

In this letter, we investigate the dependence of electron inversion layer mobility on high-channel doping required for sub-50-nm MOSFETs in strained silicon (Si), and we compare it to co-processed unstrained Si. For high vertical effective electric field E/sub eff/, the electron mobility in strained Si displays universal behavior and shows enhancement of 1.5-1.7/spl times/ compared to unstrained Si. For low E/sub eff/, the mobility for strained Si devices decreases toward the unstrained Si data due to Coulomb scattering by channel dopants.     

Thickness Dependence of Hole Mobility in Ultrathin SiGe-Channel p-MOSFETs

A fundamental understanding of the mechanisms responsible for the dependence of hole mobility on SiGe channel layer thickness is presented for channel thicknesses down to 1.8 nm. This understanding is critical to the design of strained SiGe p-MOSFETs, as lattice mismatch limits the thickness of SiGe that can be grown on Si and as Ge outdiffusion during processing reduces the Ge fraction. Temperature-dependent measurements are used to extract the phonon-limited mobility as a function of SiGe channel thickness for strained Si_0.57Ge_0.43 heterostructures on bulk Si. The hole mobility is shown to degrade significantly for channel thickness below 4 nm due to a combination of phonon and interface scattering. Due to the finite nature of the quantum-well barrier, SiGe film thickness fluctuation scattering is not significant in this structure for channel thickness greater than 2.8 nm.     

An experimental study on transport issues and electrostatics of ultrathin body SOI pMOSFETs

We present an experimental study of the transport properties (low field hole mobility /spl mu//sub h/) and electrostatics (threshold voltage V/sub th/, and gate-to-channel capacitance C/sub gc/) of ultrathin body (UTB) SOI pMOSFETs using a large RingFet structure. Body thicknesses were /spl sim/4.3 nm to 50 nm. We find that 1) hole mobility decreases significantly as T/sub Si/<10 nm, and tends to show negligible dependence on the transverse electric field for extremely thin T/sub Si/ (<6 nm) and 2) a V/sub th/ shift of /spl sim/150 mV occurs over the studied T/sub Si/ range, accompanied by enhancement of weak inversion capacitance in thin body devices. Simulations were performed to provide insight into the experimental observations.     

GeOI pMOSFETs空穴迁移率的物理模型

A physical model of hole mobility for germanium-on-insulator p MOSFETs is built by analyzing all kinds of scattering mechanisms, and a good agreement of the simulated results with the experimental data is achieved, confirming the validity of this model. The scattering mechanisms involved in this model include acoustic phonon scattering, ionized impurity scattering, surface roughness scattering, coulomb scattering and the scattering caused by Ge film thickness fluctuation. The simulated results show that the coulomb scattering from the interface charges is responsible for the hole mobility degradation in the low-field regime and the surface roughness scattering limits the hole mobility in the high-field regime. In addition, the effects of some factors, e.g. temperature, doping concentration of the channel and the thickness of Ge film, on degradation of the mobility are also discussed using the model, thus obtaining a reasonable range of the relevant parameters.