在陶瓷和铜基体上化学镀Ni-B镀层

以二甲基胺硼烷(DMAB)或硼氢化物作还原剂的 Ni-B 法化学镀镍层具有良好的可焊性和(?)焊性,并已在电子工业中应用.该法可在金属基体、ABS 塑料和印刷线路板上镀镍,但用在陶瓷基体上的报导则     

ABS塑料表面无钯活化化学镀铜

以20 g/L硫酸铜(CuSO_4)溶液为预活化液、50 g/L次亚磷酸钠(NaH_2PO_2)酸性溶液为活化液,在高温条件下直接还原吸附在丙烯腈-丁二烯-苯乙烯(ABS)塑料上的铜离子形成活化中心,实现了ABS塑料表面无钯活化化学镀铜。通过单因素分析法研究了基体预活化时间、活化液p H值、活化温度及时间对基体镀层覆盖率的影响。采用扫描电镜与能谱仪对活化后基体的表面形貌和元素成分进行分析,利用X射线衍射仪分析了镀层结构,并通过高低温冲击法对镀层结合性进行评价。结果表明,当预活化时间为20 min,活化液p H值为3,活化温度为70℃,活化时间为10 min时,活化效果最佳;活化后,基体表面生成大量胞状铜微粒,对化学镀铜具有较强的催化作用;施镀后,镀层结构均匀致密,覆盖率为100%,结合性良好。     

石墨烯复合浆料应用于ABS塑料电镀前表面处理

采用石墨烯等碳纳米材料与溶剂及多种助剂混合研磨,制备了稳定的石墨烯复合导电浆料.将导电浆料喷涂于丙烯腈-丁二烯-苯乙烯共聚物(ABS)表面获得ABS/石墨烯材料,赋予ABS塑料优良的导电性能,继而进行电镀处理.为了提高石墨烯涂层与ABS塑料表面的结合力,对ABS塑料进行了不同的表面处理,包括磨砂、有机溶剂微腐蚀和化学粗...     

微塑料对重金属Cr(Ⅵ)和Pb(Ⅱ)的吸附特征研究

通过氧化-紫外老化的实验室模拟老化法对原始微塑料进行老化,研究原始和老化聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯(PS)、聚氯乙烯(PVC)和聚乳酸(PLA)微塑料在水溶液中对Cr(Ⅵ)、Pb(Ⅱ)的吸附特征。SEM、BET、XRD、XPS和FTIR结果表明,氧化-紫外老化法增加微塑料表面粗糙度、孔隙体积和含氧官能团。动力学和等温线吸附实验结果表明,原始微塑料和老化微塑料对Cr(Ⅵ)和Pb(Ⅱ)的吸附分别以单层的物理吸附和多层的化学吸附为主。微塑料对重金属Cr(Ⅵ)和Pb(Ⅱ)的吸附能力和吸附特点与微塑料种类有关。可生物降解微塑料PLA对Cr(Ⅵ)和Pb(Ⅱ)均表现出较强的吸附能力。     

也谈"ABS塑料化学镀镍工艺"

ABS塑料化学镀镍经粗化、敏化、活化等工序,利用ABS塑料结构的特殊性,在其表面上刻蚀出无数个微小空穴,使具有催化活性的金属微粒吸附在空穴壁上形成催化活性中心。化学镀液中的镍离子在催化中心的作用下,被还原成金属镍原子而沉积下来。本文介绍了ABS塑料化学镀镍的工艺流程及工艺规范,并详述了配方。     

元素分析仪法测定本体法ABS的组成

针对本体法丙烯腈-丁二烯-苯乙烯共聚物(ABS)工艺及产品特点,用元素分析仪法测定了本体法ABS原样、苯乙烯-丙烯腈共聚物(SAN)基体树脂、接枝SAN橡胶中的氮含量,计算了橡胶上的SAN表观接枝率及ABS中橡胶量、接枝SAN橡胶量等参数,验证了计算方法的可靠性、合理性。运用SAN表观接枝率和扫描电子显微镜照片.说明了不同本体法工艺生产ABS树脂组成差异的根源。     

综述文献选编

一、塑料制造通用塑料的工业制造方法化学装置 1989 31(3)41～50(日) 综述了五种主要塑料:PVC、PS、LDPE、HDPE(含LLDPE)及PP的制造工艺,也讨论了AS及ABS的本体法工艺、LDPE的管式法与釜式法工艺、HDPE及     

ABS塑料表面化学镀镍工艺研究

为了改善丙烯腈-丁二烯-苯乙烯(ABS)塑料化学镀镍工艺,实现表面金属化,拓宽其应用领域,对ABS塑料表面制备金属镍镀层的化学镀工艺进行优化,研究了施镀时间、敏化温度和活化温度对ABS塑料表面化学镀镍层的表面形貌、显微硬度、表面粗糙度的影响。采用扫描电子显微镜观察镀层的表面微观形貌,对镀层硬度和表面粗糙度进行测量。优化后的工艺条件为:敏化45℃,20 min;活化45℃,20 min;施镀45℃,30 min。在10~30 min施镀时间内,ABS塑料表面化学镀镍层厚度随施镀时间而增加,表面粗糙度降低,显微硬度提高。     

微生物对聚乙烯塑料的降解性能研究

塑料通常被分为聚乙烯(PE)、聚丙烯(PP)、聚氯乙烯(PVC)、聚苯乙烯(PS)以及丙烯腈-丁二烯-苯乙烯共聚合物(ABS).其中,聚乙烯在农业的发展中用途最广,聚乙烯薄膜对于保持土壤湿度,调节土壤温度以及限制杂草生长等方面具有重要的作用.然而,相关研究表明,聚乙烯薄膜在自然条件下难以降解,大量聚乙烯薄膜的使用对生态...     

ABS塑料小件化学镀银及银层氯化的研制

在H2SO4/H2O2混合液中对ABS塑料进行表面粗化,然后进行化学镀银,再用FeCl3溶液氯化镀银层,制备出心电图仪(ECG)用一次性Ag/AgCl电极。研究了活化时间和装载量对化学镀银增重及电阻的影响。采用扫描电镜(SEM)和X射线衍射(XRD)技术分析了镀层的表面形貌和物相组成,分别用四探针法和冷热循环法测试了镀层表面的方块电阻及镀层与基体的结合力。结果表明,粗化处理后的ABS塑料表面粗糙度增大,亲水性增加。适宜的活化时间和化学镀银装载量分别为5 min和80 cm2/L。此条件下制备的化学镀银层均匀致密,与基体的结合力强。氯化前后镀银层的导电性均良好,表面方块电阻分别为30 mΩ/□和53.6 mΩ/□。测得Ag/AgCl心电电极的交流阻抗≤3 kΩ,直流失调电压≤100 mV,内部噪音≤150μV,模拟除颤恢复≤3 kΩ,偏置电流耐受度≤100 mV,符合国家医药行业YY/T 0196–2005标准。     

Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate

Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.     

适于塑料基材的水溶性脱漆剂研究

电动车塑料外壳回收业发展迅速,但是缺乏高效、低耗的专用脱漆剂.本文根据溶解度参数相近原则和溶剂化原则,设计了适于ABS塑料基体表面不饱和聚酯和丙烯酸酯共聚物涂层的水溶性脱漆剂.以芳香醇为主溶剂,添加一元醇、乙酸和非离子型表面活性剂A作为助剂,通过正交试验获得了水溶性脱漆剂配方.试验结果表明,该脱漆剂的渗透、剥离能力较强,对ABS基材无损伤,在室温下脱漆时间约20 min,2 h内挥发率低于7%,每升溶液可以脱掉表面积为450～500 cm2的漆膜.     

浅谈ABS塑料件涂装质量的提升

通过对公司目前ABS件涂装时存在的涂膜缺陷,从毛坯注塑问题、毛坯材质问题及施工产生的涂膜问题3方面进行分析,采取有效措施,从而提高ABS件涂装质量。     

附着增进剂对塑料涂料在聚碳酸酯底材上应用的影响

聚碳酸酯具有良好的硬度、耐热性与透明性,所以广泛用于塑料相关领域,然而塑料涂料对于PC底材或是ABS/PC复合塑料很容易出现附着不良的问题,尤其是涂膜经过温、湿度环境测试后,附着不良的情况更为严重。试验附着增进剂添加在双组分聚氨酯涂料与紫外光固化涂料中对PC底材的附着效果,结果显示,选择适合的附着增进剂可以显著改善涂料对PC底材的附着效果,并且通过温、湿度环境测试。     

ABS塑料与电镀层结合力差的原因分析及其控制

分析了ABS塑料在电镀铜/镍/铬时镀层出现起泡及结合力测试时镀层脱落的主要原因,包括塑件基体状态不良,注塑成型参数欠佳,电镀前处理不当,相邻镀层表面活性差等.给出了提高ABS塑件镀层结合力的措施,如选择优质的电镀级ABS塑料,控制成型工艺参数,改善前处理粗化及电镀工序中的活化处理等.强调了采用正确的结合力测试方法的重要性.     

紫外辅助增强ABS与镀层间粘结性的研究

在紫外光照射下利用环境友好的H_2SO_4-MnO_2-H_3PO_4-H_2O四元微蚀体系对丙烯腈-丁二烯-苯乙烯共聚物(ABS)进行微蚀处理,研究了紫外光功率及紫外光照射时间对ABS表面形貌、表面亲水性及粘结强度的影响。结果表明,在H_2SO_4-MnO_2-H_3PO_4-H_2O四元微蚀体系中,当微蚀时间为10 min,紫外光照射功率分别为300 W和500 W,照射时间分别为8 min和6 min时,ABS基板中的聚丁二烯相与聚丙烯腈-苯乙烯相之间存在较大的微蚀速率差,ABS基板表面的微孔数量多、致密且均匀,ABS基板的表面由憎水性变为强的亲水性,粘结强度分别为1.08 kN/m和1.10 kN/m,相较于四元微蚀体系在55℃无紫外光辅助照射下微蚀处理10 min后所得的0.64 kN/m,粘结强度显著提高。     

低温等离子处理ABS的预电镀性能研究

通过低温等离子体表面处理对丙烯腈-丁二烯-苯乙烯（ABS）表面进行刻蚀;以乙烯基三甲氧基硅烷、γ-巯丙基三甲氧基硅烷、γ-氨丙基三乙氧基硅烷为主体的无钯敏化、活化液对ABS进行表面镀镍,通过傅里叶变换全反射红外光谱（ATR-FTIR）、接触角测量仪和扫描电子显微镜（SEM）等探究了电镀ABS的性能,并根据GB/T 9286—2021,用90°黏合强度测试法测试塑料与金属层之间的黏附牢固程度。结果表明,当处理时间为300 s、功率为600 W时,ABS电镀预处理效果最佳,此时结合强度达到0.94 kN/m。     

基于盲孔法的ABS热焊板件残余应力测量

采用盲孔法对4种丙烯腈–丁二烯–苯乙烯塑料(ABS)热焊板进行了残余应力的测量,获得了这4种热焊板焊趾区的残余应力数据,结果发现,ABS经过热焊成型后容易在焊趾区形成较高的残余应力,随着测量时间的延长,热焊板焊趾区的残余应力逐渐增大,在测量7 min后释放完全。为了验证盲孔法应用于塑料热焊板残余应力检测的可行性,对ABS热焊板母材区和焊趾区以及热处理前后焊趾区的残余应力进行了测量,同时测试了4种热焊板的焊接强度,发现母材区的残余应力低于焊趾区,80℃热处理后焊趾区的残余应力比热处理前的低,残余应力较低的热焊板具有较高的焊接强度,这些结果均表明盲孔法对塑料热焊板件残余应力测量结果具有一定的参考价值。     

Influence of Experimental Setup and Plastic Deformation on the Shaft-Loaded Blister Test

In the shaft-loaded blister test (SLBT), plastic deformation often occurs at the contact area between the shaft tip and adhesive layer, leading to a larger displacement (blister height) than if the film was loaded elastically. As a consequence, incorporating the displacement variable into the analysis can result in misleading values of the applied strain energy-release rate, G. In this work, the influence of plastic yielding at the contact area on G of a thin film was investigated as a function of some common SLBT experimental variables, namely, substrate hole diameter, film thickness, and shaft-tip diameter. Test specimens consisted of plies of pressure-sensitive adhesive tape adhered to a rigid glass substrate. G was calculated from the following Equations: (1) load-based, (2) hybrid, (3) displacement-based, and (4) combination. Decreasing the film thickness, increasing the hole diameter, or decreasing the shaft-tip diameter lead to more plastic yielding at the contact area as well as to an increase in blister height. The increased blister height resulting from plastic deformation leads to disagreement among the values of G calculated from the different Equations when the displacement variable was included in the calculation. However, the load-based equation, which does not include the displacement, was determined to be independent of plastic yielding and the “correct” equation for calculating G. In addition, the film tensile rigidity (Eh) was calculated using an experimental compliance calibration. The effects of film thickness on the mechanical behavior of the film (bending plate vs. stretching membrane) as well as methods to determine the displacement resulting from plastic deformation are also discussed.     

Preparation and characterization of delafossite CuCrO2 film on flexible substrate

Delafossite CuCrO₂ film was successfully prepared on a flexible plastic substrate using a heat transfer process. The metallic acetate of the first layer decomposed to form a carbonized layer for use as a release layer. The thin film was deposited on the first layer by chemical solution deposition and heat treated to form a CuCrO₂ film. After that, the delafossite CuCrO₂ film was transferred from a Si substrate to a polymethyl methacrylate (PMMA) substrate. The CuCrO₂/PMMA film structure, morphology, and optical properties were studied by different characterization techniques. X-ray diffraction analysis and Raman spectrum analysis confirmed that the delafossite CuCrO₂ film was transferred onto the PMMA substrate. XPS analysis showed that the metallic acetate was annealed in N₂ to form a carbonized layer. The resistivity of the CuCrO₂/PMMA was gauged by a four-point probe method, and the visible light transmittance was approximately 58%.