Epoxy–imide resins based on bis (carboxyphthalimide)s

Epoxy–imide resins have been obtained through the reaction of Araldite GY 250 (diglycidylether of bisphenol-A and epichlorohydrin; difunctional) and Araldite EPN 1138 (Novolac-epoxy resin; polyfunctional) with bis(carboxyphthalimide)s derived from 4,4′-diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfone, 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylmethane and trimellitic anhydride. For each epoxy-imide resin system, epoxy equivalent to carboxy equivalent ratio has been optimised to obtain the maximum tensile lap shear adhesive strength on stainless steel substrates at room temperature. The lap shear strength at 100, 150, and 175°C has been determined for the optimum ratio. Araldite EPN-1138-based systems give the lap shear strength of 141–182 kg/cm² at room temperature for the optimum compositions and retain about 84–100% of the lap shear strength at 150°C. Araldite GY-250-based systems have lap shear strength of 183–193 kg/cm² and retain 76–84% of the lap shear strength at 150°C except for the one cured with bis (carboxyphthalimide) prepared from 4,4′-diaminodiphenylmethane, which retains only 17% of the lap shear strength. Among the systems studied, Araldite GY 250 cured with bis (carboxyphalimide) synthesized from 3,3′-diaminodiphenylsulfone appears to be the best, retaining 75% (138 kg/cm²) of the lap shear strength at 175°C.     

Epoxy-Imide Resins from N-(4- and 3-Carboxyphenyl) Trimellitimides: Modified with Reactive Rubbers

ABSTRACT

Epoxy-imide resins obtained through the reaction of epoxy resins such as Araldite® GY 250/Araldite® EPN 1138 with N-(4- and 3-carboxyphenyl)trimellitimides (IDA-I and IDA-II, respectively) have been modified with 10 wt% of epoxidized hydroxyl-terminated polybutadiene (EHTPB), 10 phr of carboxyl-terminated butadiene-acrylonitrile liquid copolymer (CTBN-L), and 10 phr of carboxyl-terminated butadiene-acrylonitrile solid copolymer (CTBN-S) without sacrificing much of their performance at elevated temperatures. Adhesive lap shear strength on stainless steel substrate at room temperature and at 100, 125, and 150°C has been evaluated for the modified and unmodified systems. CTBN-S offers a remarkable increase of 13 MPa and 8 MPa in the room temperature adhesive strength of GY 250-based system and EPN 1138-based system, respectively. EHTPB gives only a marginal improvement and CTBN-L offers an improvement by 4 MPa for GY 250-based system whereas CTBN-L reduces the adhesive strength of EPN 1138-based system. SEM studies suggest that in general, the modification with EHTPB and CTBN-L results only in improving the ductility of epoxy-imide systems, whereas the modification with CTBN-S results in phase separation of rubber particles in the epoxy-imide matrix.     

Influence of aliphatic amine epoxy hardener on the adhesive properties of blends of mono‐carboxyl‐terminated poly(2‐ethylhexyl acrylate‐co‐methyl methacrylate) with epoxy resin

The adhesive properties have been investigated in blends of mono‐carboxyl‐terminated poly(2‐ethylhexyl acrylate‐co‐methyl methacrylate) with diglycidyl ether of bisphenol A and three different aliphatic amine epoxy hardener. The adhesives properties are evaluated in steel alloy substrate using single‐lap shear test. The copolymers are initially miscible in the stoichiometric blends of epoxy resin and hardener at room temperature. Phase separation is noted in the course of the polymerization reaction. Different morphologies are obtained according to the amine epoxy hardener. The most effective adhesive for steel–steel joints in single‐lap shear test is the blends using 1‐(2‐aminoethyl)piperazine (AEP) as hardener. This system shows the biggest lap shear strength. However, the modified adhesives show a reduction in the mechanical resistance. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Two‐component acrylic structural adhesive initiated by tributylborane for untreated PET adhesion

In order to improve the adhesion strength of acrylic adhesive to untreated poly(ethylene terephthalate) (PET) substrate, two‐component acrylic structural adhesives initiated by tributylborane were prepared. The effects of acrylic monomers, elastomers, decomplexers, and oligomers on the adhesion properties of two‐component acrylic structural adhesive were investigated in sequence. It is found that the shear strength on PET of adhesives toughened by acrylonitrile–butadiene–styrene copolymer and carboxyl‐terminated butadiene–acrylonitrile copolymer is higher than that of commercial adhesives Dp8010NS and Loctite 3030. A tailored oligomer was synthesized from hydroxyl propyl–terminated polydimethylsiloxane and 3‐isopropenyl‐α,α‐dimethylbenzyl isocyanate. It is also noticed that premature failure usually takes place in the lap shear test samples due to the brittleness of the acrylic adhesive, except in the sample of adhesive modified by tailored oligomer. Excellent adhesion to the PET substrate is achieved by this adhesive modified by tailored oligomer, with a lap shear strength above 11 MPa and T‐peel strength up to 5.34 N/mm. Additionally, the resulting adhesive is qualified for the structural bonding of PET materials. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46612.     

Adhesive and thermal characteristics of maleimide-functional novolac resins

A novel, addition-curable maleimide-functional novolac phenolic resin was evaluated for adhesive properties such as lap shear strength and T-peel strength using aluminium adherends, when thermally self-cured and cocured with epoxy resins. The adhesive properties of the self-cured resin, although inferior at ambient temperature, improved at high temperature and were found to depend on the cure conditions. When cocured with epoxy resin, the adhesive properties improved significantly and showed a strong dependence on the nature of the epoxy resin used, on the stoichiometry of the reactants, on the concentration of imide groups in the phenolic resin, and on the extent of polymerization of the maleimide groups. Optimum adhesive properties were obtained for novolac resins with a moderate concentration of maleimide groups, taken on a 1 : 1 hydroxyl–epoxy stoichiometry with a novolac epoxy resin. In comparison to the conventional novolac, the imide–novolac contributed to improved adhesion and better adhesive property retention at higher temperature when cured with the novolac–epoxy resin. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 695–705, 1999     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Heterocyclic‐based epoxy‐terminated structural adhesive. II. Curing,adhesive strength,and thermal stability

We studied the curing behavior of heterocyclic‐based epoxy‐terminated resins using diaminodiphenyl ether, diaminodiphenyl sulfone, benzophenone tetracarboxylicdianhydride, and the commercial hardener of Ciba‐Geigy's two‐pack Araldite as curing agents. The adhesive strength of the adhesives was measured by various ASTM methods such as lap‐shear, peel, and cohesive tests on metal–metal, wood–wood, and wood–metal interfaces. All of these results were compared with those of an epoxy resin prepared from bisphenol‐A and epichlorohydrin resin with an epoxy equivalent value of 0.519. The thermal stability of both the virgin resin and its cured form was also studied by thermogravimetric analysis. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 3520–3526, 2002     

Fabrication and evaluation of structural film adhesive using oxazolidinone modified novolac epoxy resin

Epoxy film adhesives are of prime importance for the fabrication of lightweight honeycomb structures for aerospace industries. This work involves the synthesis of oxazolidinone modified epoxy novolac resin (EPN-OXA) via the reaction of EPN and toluene diisocyanate. EPN-OXA was characterized by Fourier transform infrared spectroscopy, nuclear magnetic resonance spectroscopy, gel permeation chromatography, and epoxy equivalent weight. EPN-OXA was blended with solid epoxy resin, polyethersulfone (PES) toughened liquid epoxy resin, dicyandiamide, and aluminum powder to fabricate a film adhesive curing at 170–180 °C. Effect of additives and curative on the adhesive property was studied to optimize the composition. Effect of PES on the optimized composition was studied in detail. The best composition exhibited lap shear strength of 370 ± 10 kgf cm⁻² at 25 °C and the strength was retained to 75% at −196 °C and 52% at 120 °C. PES significantly enhanced the interfacial strength at different temperatures (~1.6-fold at −196 and 25 °C and ~1.8-fold at 120 °C). It also improved tensile strength and fracture toughness by 1.4- and 2-fold, respectively. The toughening effect of PES was further confirmed by scanning electron microscopy images. PES marginally reduced the glass-transition temperature and it exhibited no effect on thermal stability. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47520.     

An epoxy-terminated structural adhesive. II. Curing,adhesive strength,and flammability characteristics

Curing characteristics and the curing schedule of an epoxy-terminated polymer (ETP) were investigated using diaminodiphenyl ether (DADPE), diaminodiphenyl sulfone (DADPS), diaminodiphenyl methane (DADPM), and the hardener of a commercial epoxy, two-pack Araldite (Ciba-Geigy), as curing agents. The adhesive strength of the ETP was measured by various ASTM methods like lap-shear, cohesion, and adhesion tests on metal-metal, wood-metal, wood-wood, and metal-polymer interfaces. All these results are compared with Araldite GY250, a two-pack Araldite (Ciba-Geigy). The flame retardancy of virgin ETP, ETP-Araldite GY250 blends, and various commercial-grade fire-resistant epoxies was measured. A structure flammability correlation for the ETP-Araldite GY250 blends is also reported.     

Polyimides derived from 1,4‐bis [3‐oxy‐(N‐aminophthalimide)] benzene

A novel diamine, 1,4‐bis [3‐oxy‐(N‐aminophthalimide)] benzene (BOAPIB), was synthesized from 1,4‐bis [3‐oxy‐(N‐phenylphthalimide)] benzene and hydrazine. Its structure was determined via IR, ¹H NMR, and elemental analysis. A series of five‐member ring, hydrazine‐based polyimides were prepared from this diamine and various aromatic dianhydrides via one‐step polycondensation in p‐chlorophenol. The inherent viscosities of these polyimides were in the range of 0.17–0.61 dL/g. These polymers were soluble in polar aprotic solvents and phenols at room temperature. Thermogravimetric analysis (TGA) showed that the 5% weight‐loss temperatures of the polyimides were near 450°C in air and 500°C in nitrogen. Dynamic mechanical thermal analysis (DMTA) indicated that the glass‐transition temperatures (T_gs) of these polymers were in the range of 265–360°C. The wide‐angle X‐ray diffraction showed that all the polyimides were amorphous. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Diallyl bisphenol A—novolac epoxy system cocured with bisphenol‐A‐bismaleimide—cure and thermal properties

Novolac epoxy (EPN)—2,2′‐diallyl bisphenol A (DABA) resin system was modified by cocuring it with bisphenol A bismaleimide (BMI). Molar concentration of BMI in the stochiometric blend of EPN and DABA was varied from 0.5 to 2.0. The cure optimization was done using DSC, IR spectroscopy, and rheological studies. The curing proceeded by phenol‐epoxy and Alder‐ene reactions. The performance of the ternary Epoxy‐Allyl phenolic‐Bismaleimide system was evaluated through their thermal and dynamic mechanical characterization. BMI improved the overall thermal stability and the modulus of the resultant composites. The increase in BMI concentration in the system resulted in enhanced glass transition temperature with a consequent improvement in high temperature performance typically estimated by their lap shear strength at high temperatures. The high temperature performance of the epoxy‐phenol‐bismaleimide (EPB) system was found to be far superior to the epoxy‐phenol (EP)system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis and properties of some novel,soluble and light‐coloured,aromatic poly(amide–imide) copolymers

A new type of tetraimide‐dicarboxylic acid (I) was synthesized starting from the ring‐opening addition of m‐aminobenzoic acid (m‐ABA), 4,4′‐oxydiphthalic anhydride (ODPA) and 4,4′‐methylenedianiline (MDA) at a 2:2:1 molar ratio in N‐methyl‐2‐pyrrolidone (NMP), followed by cyclodehydration to the diacid I. A series of soluble and light‐coloured poly(amide–imide–imide)s (III_a–j) was prepared by triphenyl phosphite‐activated polycondensation from the tetraimide‐diacid I with various aromatic diamines (II_a–j). All films cast from DMAc had cutoff wavelengths shorter than 400 nm (376–393 nm) and had b* values between 20.46 and 40.67; these polymers were much lighter in colour than those of the corresponding trimellitimide series. All polymers were readily soluble in a variety of organic solvents such as NMP, N,N‐dimethylacetamide, dimethyl sulfoxide, and even in the less polar m‐cresol and pyridine. Compared with those of corresponding ODPA–MDA polyimide, the solubilities of poly(amide–imide–imide)s III_a–j were greatly improved. Polymers III_a–j afforded tough, transparent, and flexible films, which had tensile strengths ranging from 82 to 105 MPa, elongations at break from 8 to 14%, and initial moduli from 2.0 to 2.2 GPa. The glass transition temperature of polymers were recorded at 255–288 °C. They had 10% weight loss at a temperature above 540 °C and left more than 60% residue even at 800 °C in nitrogen. © 2002 Society of Chemical Industry     

Effect of thermal shock on interlaminar strength of thermally aged glass fiber‐reinforced epoxy composites

Glass fiber/epoxy composites were thermally conditioned at 50, 100, 150, 200, and 250°C for different periods of time and then immediately quenched directly in ice‐cold water from each stage of conditioning temperature. The polymerization or depolymerization by thermal conditioning and the debonding effect by concurrently following thermal shock in polymer composites are assessed in the present study. The short‐beam shear tests were performed at room temperature on the quenched samples to evaluate the value of interlaminar shear strength of the composites. The short conditioning time followed by thermal shock resulted in reduction of shear strength of the composites. The strength started regaining its original value with longer conditioning time. Conditioning at 250°C and thereafter quenching yielded a sharp and continuous fall in the shear strength. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2062–2066, 2006     

Synthesis and characterization of new thermally stable poly(ester‐imide)s derived from 2,2′‐bis(4‐trimellitimidophenoxy)biphenyl and 2,2′‐bis(4‐trimellitimidophenoxy)‐1,1′‐binaphthyl and various aromatic dihydroxy compounds

A series of new alternating aromatic poly(ester‐imide)s were prepared by the polycondensation of the preformed imide ring‐containing diacids, 2,2′‐bis(4‐trimellitimidophenoxy)biphenyl (2a) and 2,2′‐bis(4‐trimellitimidophenoxy)‐1,1′‐binaphthyl (2b) with various aromatic dihydroxy compounds in the presence of pyridine and lithium chloride. A model compound (3) was also prepared by the reaction of 2b with phenol, its synthesis permitting an optimization of polymerization conditions. Poly(ester‐imides) were fully characterized by FTIR, UV‐vis and NMR spectroscopy. Both biphenylene‐ and binaphthylene‐based poly(ester‐imide)s exhibited excellent solubility in common organic solvents such as tetrahydrofuran, m‐cresol, pyridine and dichloromethane. However, binaphthylene‐based poly(ester‐imide)s were more soluble than those of biphenylene‐based polymers in highly polar organic solvents, including N‐methyl‐2‐pyrrolidone, N,N‐dimethylacetamide, N,N‐dimethylformamide and dimethyl sulfoxide. From differential scanning calorimetry thermograms, the polymers showed glass‐transition temperatures between 261 and 315 °C. Thermal behaviour of the polymers obtained was characterized by thermogravimetric analysis, and the 10 % weight loss temperatures of the poly(ester‐imide)s was in the range 449–491 °C in nitrogen. Furthermore, crystallinity of the polymers was estimated by means of wide‐angle X‐ray diffraction. The resultant poly(ester‐imide)s exhibited nearly an amorphous nature, except poly(ester‐imide)s derived from hydroquinone and 4,4′‐dihydroxybiphenyl. In general, polymers containing binaphthyl units showed higher thermal stability but lower crystallinity than polymers containing biphenyl units. Copyright © 2005 Society of Chemical Industry     

Morphologies and properties of cured epoxy/brominated‐phenoxy blends

Morphologies of cured epoxy/brominated‐phenoxy blends were observed by scanning transmission electron microscopy (STEM) and energy dispersive X‐ray fluorescence spectroscopy (EDX). When brominated‐phenoxy content was 30 wt %, cocontinuous phase structures between cured epoxy and brominated‐phenoxy were found. Since every loss tangent (tan δ) curve as a function of temperature on dynamic mechanical analysis (DMA) showed 2 peaks at 128°C and 155°C respectively, cured epoxy phases and brominated‐phenoxy phases were incompatible together and T_gs of cured epoxy phases were not decreased. Tensile strength and tensile elongation of the cured blends were increased together. T‐peel adhesion strength and the lap‐shear adhesion strength were also increased together. These phenomena could be due to the cocontinuous structures consisted by the rigid cured epoxy phases of thermosets and ductile the brominated‐phenoxy phases of thermoplastics. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1702–1713, 2007     

Synthesis and characterization of new cardo poly(ether imide)s derived from 9,9‐bis [4‐(4‐aminophenoxy)phenyl]xanthene

A series of new cardo poly(ether imide)s bearing flexible ether and bulky xanthene pendant groups was prepared from 9,9‐bis[4‐(4‐aminophenoxy)phenyl]xanthene with six commercially available aromatic tetracarboxylic dianhydrides in N,N‐dimethylacetamide (DMAc) via the poly(amic acid) precursors and subsequent thermal or chemical imidization. The intermediate poly(amic acid)s had inherent viscosities between 0.83 and 1.28 dL/g, could be cast from DMAc solutions and thermally converted into transparent, flexible, and tough poly(ether imide) films which were further characterized by X‐ray and mechanical analysis. All of the poly(ether imide)s were amorphous and their films exhibited tensile strengths of 89–108 MPa, elongations at break of 7–9%, and initial moduli of 2.12–2.65 GPa. Three poly(ether imide)s derived from 4,4′‐oxydiphthalic anhydride, 4,4′‐sulfonyldiphthalic anhydride, and 2,2‐bis(3,4‐dicarboxyphenyl))hexafluoropropane anhydride, respectively, exhibited excellent solubility in various solvents such as DMAc, N,N‐dimethylformamide, N‐methyl‐2‐pyrrolidinone, pyridine, and even in tetrahydrofuran at room temperature. The resulting poly(ether imide)s with glass transition temperatures between 286 and 335°C had initial decomposition temperatures above 500°C, 10% weight loss temperatures ranging from 551 to 575°C in nitrogen and 547 to 570°C in air, and char yields of 53–64% at 800°C in nitrogen. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Modification of high‐performance polymer composite through high‐energy radiation and low‐pressure plasma for aerospace and space applications

In this investigation, attempts are made to modify a high‐performance polymer such as polybenzimidazole (PBI) (service temperature ranges from ?260°C to +400°C) through high‐energy radiation and low‐pressure plasma to prepare composite with the same polymer. The PBI composites are prepared using an ultrahigh temperature resistant epoxy adhesive to join the two polymer sheets. The service temperature of this adhesive ranges from ?260°C to +370°C, and in addition, this adhesive has excellent resistance to most acids, alkalis, solvents, corrosive agents, radiation, and fire, making it extremely useful for aerospace and space applications. Prior to preparing the composite, the surface of the PBI is ultrasonically cleaned by acetone followed by its modification through high‐energy radiation for 6 h in the pool of a SLOWPOKE‐2 (safe low power critical experiment) nuclear reactor, which produces a mixed field of thermal and epithermal neutrons, energetic electrons, and protons, and γ‐rays, with a dose rate of 37 kGy/h and low‐pressure plasma through 13.56 MHz RF glow discharge for 120 s at 100 W of power using nitrogen as process gas, to essentially increase the surface energy of the polymer, leading to substantial improvement of its adhesion characteristics. Prior to joining, the polymer surfaces are characterized by estimating surface energy and electron spectroscopy for chemical analysis (ESCA). To determine the joint strength, tensile lap shear tests are performed according to ASTM D 5868–95 standard. Another set of experiments is carried out by exposing the low‐pressure plasma‐modified polymer joint under the SLOWPOKE‐2 nuclear for 6 h. Considerable increase in the joint strength is observed, when the polymer surface is modified by either high‐energy radiation or low‐pressure plasma. There is further significant increase in joint strength, when the polymer surface is first modified by low‐pressure plasma followed by exposing the joint under high‐energy radiation. To simulate with spatial conditions, the joints are exposed to cryogenic (?196°C) and high temperatures (+300°C) for 100 h. Then, tensile lap shear tests are carried out to determine the effects of these environments on the joint strength. It is observed that when these polymeric joints are exposed to these climatic conditions, the joints could retain their strength of about 95% of that of joints tested under ambient conditions. Finally, to understand the behavior of ultrahigh temperature resistant epoxy adhesive bonding of PBI, the fractured surfaces of the joints are examined by scanning electron microscope. It is observed that there is considerable interfacial failure in the case of unmodified polymer‐to‐polymer joint whereas surface‐modified polymer essentially fails cohesively within the adhesive. Therefore, this high‐performance polymer composite could be highly useful for structural applications in space and aerospace. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1959–1967, 2006     

Synthesis and properties of poly(ether imide)s derived from 2,5‐bis(3,4‐dicarboxyphenoxy)biphenyl dianhydride and aromatic ether–diamines

A series of poly(ether imide)s (PEIs) with light colors and good mechanical properties were synthesized from 2,5‐bis(3,4‐dicarboxyphenoxy)biphenyl dianhydride and various aromatic ether–diamines via a conventional two‐step polymerization technique that included ring‐opening polyaddition at room temperature to poly(amic acid)s (PAAs) followed by thermal imidization. The precursor PAAs had inherent viscosities ranging from 0.71 to 1.19 dL/g and were solution‐cast and thermally cyclodehydrated to flexible and tough PEI films. All of the PEI films were essentially colorless, with ultraviolet–visible absorption cutoff wavelengths between 377 and 385 nm and yellowness index values ranging from 10.5 to 19.9. These PEIs showed high thermal stabilities with glass‐transition temperatures of 206–262°C and decomposition temperatures (at 10% weight loss) higher than 478°C. They also showed low dielectric constants of 3.39–3.72 (at 1 MHz) and low water absorptions below 0.85 wt %. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Relationships between stoichiometry,microstructure, and properties for amine‐cured epoxies

Changes in microstructure and mechanical properties are investigated as a function of epoxy–amine stoichiometry. The epoxy–amine system studied exhibits a two‐phase structure consisting of a hard microgel phase and a dispersed phase of soft, unreacted and/or partially reacted material. The size distribution of the microgel regions tends to increase with increasing amine content. Concurrently, the connectivity of the softer phase increases dramatically. This two‐phase structure is inherently fractal, exhibiting a single glass transition temperature, T_g. The T_g and elevated‐temperature properties of the epoxy are directly correlated with crosslink density and the percentage of microgel phase observed in microstructure studies. The fracture toughness at room temperature increases with increasing amine content, most likely due to the increased presence of the soft phase, which absorbs more energy during crack growth. Changes in modulus values at 30°C with stoichiometry are explained by considering the effective aspect ratio of the polymer structure in the determination of sample rigidity. Relationships between microgel sizes and the sizes of interphase regions that form in composite and adhesive systems are also discussed in terms of interphase properties. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 699–712, 1999     

Effects of 4,4′‐diaminodiphenyl ether on the structures and properties of isocyanate‐based polyimide foams

A series of thermal insulation, acoustic absorption isocyanate‐based lightweight polyimide (PI) foams with 4,4′‐diaminodiphenyl ether (ODA) units were prepared from polyaryl polymethylene isocyanate (PAPI) and the esterification solution derived from pyromellitic dianhydride (PMDA) and ODA. The structures and properties of the PI foams prepared with different molar ratio of ODA/PMDA were investigated in detail. The results show that the ODA units have great influence on the foam properties. With the increase of the ODA units, the density decreases firstly and then increases. When the molar ratio of ODA/PMDA is 3/10, the foam reaches the minimum density (13.7 kg/m³). Moreover, with increasing the ODA units, the acoustic absorption properties increase firstly and then decrease owing to the variation of the average cell diameter of the PI foams. All PI foams show excellent thermal stability, and the 5% and 10% weight loss temperature are in the range of 250–270 °C and 295–310 °C, respectively. In addition, the PI foams present low thermal conductivity and thermal diffusivity. Furthermore, the mechanical property was also evaluated and the compressive strength of the PI foams is in the range of 33.0–45.7 kPa. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46029.