Surface modification of Ar plasma‐pretreated high density polyethylene (HDPE) film via UV‐induced graft copolymerization with glycidyl methacrylate (GMA) and 2‐hydroxyethylacrylate (HEA) was carried out to improve the adhesion with evaporated copper. The surface compositions of the modified HDPE surfaces were characterized by X‐ray photoelectron spectroscopy (XPS). The adhesion strengths of evaporated copper with the graft‐copolymerized HDPE films were affected by the Ar plasma pretreatment time, the monomer concentration used for graft copolymerization, and the graft concentration. Post‐treatments, such as plasma post‐treatments after graft copolymerization and thermal treatment (curing) after metalization, further enhanced the adhesion strength of the Cu/HDPE laminates. The T‐type peel strengths of the laminates involving the graft‐modified and plasma posttreated HDPE films were greater than 15 N/cm. The enhanced adhesion strength resulted from the strong affinity of the graft chains for Cu and the fact that the graft chains were covalently tethered on the HDPE surface. XPS characterization of the delaminated surfaces of the Cu/HDPE laminates revealed that the failure mode of the laminates with T‐peel adhesion strengths greater than 5 N/cm was cohesive in nature. 相似文献
Electroless plating of copper via a tin‐free activation process was carried out effectively on two types of fluorinated polyimide (FPI) films modified by UV‐induced surface graft copolymerization with N‐containing monomers, such as 1‐vinylimidazole (VIDz) and 4‐vinyl pyridine (4VP). The graft copolymerization of VIDz and 4VP was carried out on the argon (Ar) plasma‐pretreated FPI films via a solvent‐free process under atmospheric conditions. X‐ray photoelectron spectroscopy (XPS) results showed that the VIDz graft‐copolymerized FPI surface (the VIDz‐g‐FPI surface) and 4VP graft‐copolymerized FPI surface (the 4VP‐g‐FPI surface) were much more susceptible to the electroless deposition of metals via the Sn‐free process than the pristine FPI surfaces, and the FPI surfaces modified by Ar plasma pretreatment alone. T‐peel adhesion strengths above 9 N/cm were achieved for the electrolessly deposited copper on both VIDz‐g‐FPI surfaces (the Cu/VIDz‐g‐FPI assemblies) and 4VP‐g‐FPI surfaces (the Cu/4VP‐g‐FPI assemblies). These adhesion strength values were much higher than those obtained for assemblies involving electrolessly deposited copper on pristine or on Ar plasma pretreated FPI films. The high adhesion strength of the Cu/VIDz‐g‐FPI and Cu/4VP‐g‐FPI assemblies was attributed to the synergistic effect of spatial interactions of the grafted VIDz or 4VP polymer chains with the copper atoms, and the fact that the VIDz or 4VP polymer chains were covalently tethered on the FPI surfaces. XPS results also revealed that the Cu/VIDz‐g‐FPI and Cu/4VP‐g‐FPI assemblies delaminated by cohesive failure inside the FPI films. 相似文献
Surface modifications of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film via UV-induced graft copolymerization with glycidyl methacrylate (GMA) and 1-vinylimidazole (VIDz) were carried out to improve the adhesion with evaporated aluminum metal. The surface compositions of the graft copolymerized PTFE films were studied by X-ray photoelectron spectroscopy (XPS). The adhesion strength of the evaporated aluminum to the surface graft copolymerized PTFE film was affected by the type of monomer used for graft copolymerization, the graft concentration, the plasma post-treatment of the graft copolymerized PTFE surface prior to metallization, and the extent of thermal treatment after metallization. The optimum T-peel adhesion strengths of the Al/PTFE laminates were in excess of 10 and 5 N/cm, respectively, for the GMA and VIDz graft copolymerized PTFE films. These adhesion strengths are significantly higher than those obtained between the evaporated aluminum and the pristine or plasma-pretreated PTFE film. The mechanism of adhesion enhancement and the failure of the metal-polymer assembly were also investigated. It was observed that the failure occurred within the PTFE film. The strong adhesion between Al and PTFE arises from the charge-transfer interaction between the Al atom and the epoxide moiety of the grafted GMA polymer, as well as from the fact that the graft chains are covalently tethered on the PTFE film surface as a result of the grafting process. 相似文献
Surface modifications of pristine and ozone-pretreated low-density polyethylene (LDPE) films were carried out via UV-induced graft copolymerization with a photoinitiator-containing, epoxy-based commercial monomer (DuPont Somos? 6100 for solid imaging and optical lithography) and also with the photoinitiator-free acrylic acid (AAc). The chemical composition and microstructure of the graft copolymerized surfaces were studied by angle-resolved X-ray photoelectron spectroscopy (XPS). The concentration of surface grafted polymer increased with the UV illumination time and the monomer concentration. For LDPE films graft copolymerized with the epoxy-based monomer, surface chain rearrangement was not observed or was less well pronounced, due to the partial crosslinking of the grafted chains. Simultaneous photografting and photolamination between two LDPE films, or between a LDPE film and a poly(ethylene terephthalate) (PET) film, in the presence of either monomer system, were also investigated. The photolamination rates and strengths depend on the ozone pretreatment time, the UV illumination time, and the UV wavelength, as well as on the nature of the substrate materials. A shear adhesion strength approaching 150 N/cm2 could be achieved with either monomer system, provided that the polymer films were pretreated with ozone. The failure mode of the photolaminated surfaces was cohesive in nature in the case of the photoinitiator-containing epoxy monomer, but was either cohesive or adhesional in nature (depending on the substrate assembly) in the case of the photoinitiator-free AAc monomer. 相似文献
An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The film composite achieved a 90°-peel adhesion strength above 15 N/cm. The strong adhesion of the epoxy resin to PTFE arose from the fact that the epoxide groups of the grafted GMA chains were cured into the epoxy resin matrix to give rise to a highly crosslinked interphase, as well as the fact that the GMA chains were covalently tethered on the PTFE film surface. Delamination of the composite resulted in cohesive failure inside the PTFE film and gave rise to an epoxy resin surface with a covalently-adhered fluoropolymer layer. The surface composition and microstructures of the GMA graft-copolymerized PTFE (GMA-g-PTFE) films and those of the delaminated epoxy resin and PTFE film surfaces were characterized by X-ray photoelectron spectroscopy (XPS), water contact angle and scanning electron microscope (SEM) measurements. The delaminated epoxy resin surfaces were highly hydrophobic, having water contact angles of about 140°C. The value is higher than that of the pristine PTFE film surface of about 110°. The epoxy resin samples obtained from delamination of the epoxy/GMA-g-PTFE composites showed a lower rate of moisture sorption. All the fluorinated epoxy resin surfaces exhibited rather good stability when subjected to the Level 1 hydrothermal reliability tests. 相似文献
An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The film composite achieved a 90°-peel adhesion strength above 15 N/cm. The strong adhesion of the epoxy resin to PTFE arose from the fact that the epoxide groups of the grafted GMA chains were cured into the epoxy resin matrix to give rise to a highly crosslinked interphase, as well as the fact that the GMA chains were covalently tethered on the PTFE film surface. Delamination of the composite resulted in cohesive failure inside the PTFE film and gave rise to an epoxy resin surface with a covalently-adhered fluoropolymer layer. The surface composition and microstructures of the GMA graft-copolymerized PTFE (GMA-g-PTFE) films and those of the delaminated epoxy resin and PTFE film surfaces were characterized by X-ray photoelectron spectroscopy (XPS), water contact angle and scanning electron microscope (SEM) measurements. The delaminated epoxy resin surfaces were highly hydrophobic, having water contact angles of about 140°C. The value is higher than that of the pristine PTFE film surface of about 110°. The epoxy resin samples obtained from delamination of the epoxy/GMA-g-PTFE composites showed a lower rate of moisture sorption. All the fluorinated epoxy resin surfaces exhibited rather good stability when subjected to the Level 1 hydrothermal reliability tests. 相似文献
Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly deposited copper. X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) results revealed that the pyridine groups in the plasma polymerized 4VP (pp‐4VP) layer could be preserved to a large extent under proper glow discharge conditions. The grafted 4VP layer with well‐preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl2) during the electroless plating of copper, but also as an adhesion promotion layer for the electrolessly deposited copper. The T‐peel adhesion strength of the electrolessly deposited copper with both the 4VP plasma‐polymerized FPI (pp‐4VP‐FPI) film and the 4VP graft‐copolymerized FPI (4VP‐g‐FPI) film was much higher than that of the electrolessly deposited copper with the pristine or the Ar plasma‐treated FPI films. The high adhesion strength between the electrolessly deposited copper and the surface‐modified FPI film was attributed to the fact that the plasma‐polymerized and the UV graft‐copolymerized 4VP chains were covalently tethered on the FPI surfaces, as well as the fact that these grafted 4VP polymer chains were spatially and reactively distributed into the copper matrix.
A novel method for preparing composites of polyimides (PI) laminated to poly(tetrafluoroethylene) (PTFE) films is reported. PI/PTFE composites were developed through thermal imidization of poly(amic acid) (PAA) precursors on surface-modified PTFE films. Surface modification of PTFE films was carried out via Ar plasma pretreatment of the films, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The surface composition and topography of the graft copolymerized PTFE films and the delaminated PI and PTFE surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), respectively. The adhesion strengths of the PI (imidized PAA) on the GMA graft copolymerized PTFE films were evaluated as a function of various thermal imidization schedules. The adhesion reliability of the PI/PTFE composites was tested by a series of hydrothermal cycles. The development of strong Tpeel adhesion strengths of about 8 N/cm with excellent reliability for the PI/PTFE composites was attributable to the synergistic effect of coupling the curing of the epoxide functional groups of the grafted GMA chains with the imidization process of the PAA and the fact that the GMA chains were covalently tethered onto the PTFE surface. The PI/PTFE composites delaminated via cohesive failure inside the PTFE substrates. The delaminated PI film with a covalently adhered 'rough' PTFE surface layer exhibited a water contact angle as high as 140°. 相似文献
The adhesion between a poly(tetrafluoroethylene) (PTFE) film and a gold substrate was achieved by surface graft copolymerization of glycidyl methacrylate (GMA) on an argon plasma-pretreated PTFE film at elevated temperature with simultaneous lamination to a surface-modified gold substrate. The plasma pretreatment introduces peroxides which are thermally degraded into radicals to initiate the graft copolymerization of GMA on the PTFE surface. The gold surface, on the other hand, was first pretreated with 3-mercaptopropionic acid (MPA), 3-mercaptopropionic acid-2-ethylhexyl ester (MPAEE), or (3-mercaptopropyl)trimethoxysilane (MPTMS) to form self-assembled monolayers (SAMs) and then subjected to Ar plasma treatment. The simultaneous graft copolymerization and lamination of the PTFE film to the gold surface was carried out in the presence of GMA and an amine hardener at an elevated temperature under atmospheric conditions. The modified surfaces and interfaces were characterized by X-ray photoelectron spectroscopy (XPS) and contact angle measurements. The gold/GMA/PTFE assembly exhibited a T-peel adhesion strength above 10 N/cm and the joint delaminated by cohesive failure inside the bulk of the PTFE film. The strong adhesion of the Au/PTFE laminate is the result of concurrent graft copolymerization on both the Ar plasma-pretreated PTFE surface and the SAM of the Au surface to form a covalent network. The network is further strengthened by the crosslinking reaction promoted by the presence of the hardener. 相似文献
Surface thermal graft copolymerization with concurrent lamination was carried out between an Ar plasma pretreated poly(vinyh'dene fluoride) (PVDF) film and a copper foil in the presence of a small quantity of a N-containing monomer, such as 4-vinyl pyridine (4-VPN) and acryloyl morpholine (ACMO), under atmospheric conditions and in the complete absence of an added polymerization initiator and system degassing. The adhesion strength, as reported by T-peel strength, was dependent on the argon plasma pretreatment time of the PVDF film, the thermal lamination temperature and the type of monomer. An optimum T-peel adhesion of about 10 N/cm was readily achieved in the Cu/PVDF laminate for grafting and lamination carried out in the presence of 4-VPN. A lower adhesion strength was obtained using ACMO and other N-containing monomers. The chemical compositions of the graft copolymerized and delaminated sample surfaces were studied by X-ray photoelectron spectroscopy (XPS). The failure mode of the Cu/4-VPN/PVDF assembly was a combined adhesional and cohesive failure. The strong adhesion between the Cu foil and the PVDF film arises from the strong charge transfer interaction between Cu and the pyridine ring, as well as the fact that the graft chains are covalently tethered on the PVDF films surfaces as a result of surface graft copolymerization. 相似文献
Surface modifications of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film were carried out via near-UV light-induced graft copolymerization with glycidyl methacrylate (GMA). The structure and chemical composition of the copolymer surface and interface were studied by angle-resolved X-ray photoelectron spectroscopy (XPS). For PTFE substrate with a substantial amount of grafting, the grafted GMA polymer penetrates or becomes partially submerged beneath a thin surface layer of dense substrate chains to form a stratified surface microstructure. The concentration of the surface-grafted GMA polymer increases with the plasma pretreatment time, the near-UV light illumination time, and the monomer concentration. The GMA graft copolymerized PTFE surfaces adhere strongly to one another when brought into direct contact and cured (i) in the presence of a diamine alone or (ii) in the presence of an epoxy adhesive (epoxy resin plus diamine curing agent). In the presence of diamine alone, failure occurs in the interfacial region. For epoxy adhesive-promoted adhesion, the failure mode is cohesive, i.e. it takes place in the bulk of one of the delaminated PTFE films. The lap shear strengths in both cases increase with the amount of surface-grafted epoxide polymer. The development of the adhesion strength depends on the concentration of the surface graft, the microstructure of the graft copolymerized PTFE surface, the interfacial reactions, and the nature of the bonding agent. 相似文献
Surface modification of H2 plasma-pretreated poly(tetrafluoroethylene) (PTFE) films, either by plasma polymerization and deposition of GMA, or by UV-induced graft copolymerization with glycidyl methacrylate (GMA), was carried out for adhesion enhancement with the electrolesslydeposited copper. XPS and FTIR results revealed that the epoxide groups in the plasma-polymerized GMA (pp-GMA) layer had been preserved to various extents, depending on the glow discharge conditions. The T-peel adhesion test results showed that the adhesion strengths of the electrolesslydeposited copper on both the pp-GMA modified PTFE (pp-GMA-PTFE) film and the GMA graftcopolymerized PTFE (GMA-g-PTFE) film were much higher than that of the electrolessly-deposited copper on the pristine or the H2 plasma-treated PTFE film. The high adhesion strength between the electrolessly-deposited copper and the surface-modified PTFE film was attributed to the fact that the plasma-polymerized and the UV graft-copolymerized GMA chains were covalently tethered on the H2 plasma-pretreated PTFE surface, as well as the fact that these GMA chains were spatially and interactively distributed into the copper matrix. 相似文献
The surface modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) films via UV-induced graft copolymerization with either 3-(trimethoxysilyl)propyl methacrylate (TM-SPMA) or glycidyl methacrylate (GMA) was carried out to enhance their adhesion to electrolessly deposited copper. The surface compositions of the PTFE films at various stages of surface modification and electroless plating were studied by X-ray photoelectron spectroscopy (XPS). The adhesion strength of the graft-copolymerized PTFE film to the electrolessly deposited copper was affected by the type of monomer used for graft copolymerization, the graft concentration, the plasma post-treatment time after graft copolymerization, and the extent of thermal post-treatment after metallization. The maximum T-peel strength achieved between the electrolessly deposited copper and the GMA graft-copolymerized PTFE film was about 11 N/cm. This adhesion strength represented a more than 20-fold increase over what could be achieved when the PTFE film was treated by Ar plasma alone. The mechanisms of the adhesion strength enhancement and the failure mode in the metal-polymer laminates were also investigated. It was found that the failure was cohesive in nature within the PTFE film. 相似文献