改性环氧丙烯酸酯胶粘剂的合成与性能

本文研究了环氧丙烯酸酯的改性，采用双马来酰亚胺、环氧树脂、丙烯酸酯、改性剂为主要原料合成了改性环氧丙烯酸酯胶粘剂．运用IR、DSC等分析测试手段研究了该胶粘剂的固化行为。运用TGA、DTA等分析手段研究了该胶粘剂固化后的热稳定性．同时，用改性环氧丙烯酸酯胶粘剂制得了聚酰亚胺薄膜挠性印刷电路基板并测试了有关性能．     

氟橡胶-金属粘接用环氧胶固化动力学研究

采用具有高热变形温度的砜类聚合物制备的增粘剂,配制了可用于氟橡胶与金属粘接的环氧胶粘剂,通过凝胶时间的测定、差式扫描量热法(DSC)和傅立叶变换红外光谱(FTIR)研究了胶粘剂的固化反应过程及动力学。结果表明,胶粘剂在固化反应过程中有一个宽广且平缓的放热峰,对固化十分有利。胶粘剂固化反应表观活化能为63.8 kJ/mol,固化反应级数为0.891。     

胶粘剂中丙烯酰胺及丙烯酸酯类残留单体释放量和含量的研究

采用袋式法对固化后的胶粘剂中丙烯酰胺及丙烯酸酯类残留单体进行释放量测定，研究了固化时间、试验温度及加热时间对这两类物质释放量的影响。研究结果表明：适当延长固化时间，对减少胶粘剂固化后的单体残留有明显作用；袋式法中试验温度为60℃时，胶粘剂中残留单体的释放量远大于试验温度为40℃对应的释放量，表明温度对胶粘剂残留单体的释放具有较大的影响；气袋的加热时间不同会对胶粘剂中残留单体的释放量造成影响，因此应选择合适的加热时间，避免残留单体未检出或过饱和情况；通过对各类胶粘剂固化后的残留单体进行释放量和含量情况分析，可以更加充分地了解各类胶粘剂的组成成分及环保性能；数据对比结果表明，胶粘剂中丙烯酰胺及丙烯酸酯类残留单体的释放量与含量基本呈正相关。     

高分子异氰酸酯胶粘剂的固化过程与性能评价研究

高分子异氰酸酯胶粘剂固化过程中的反应会对其结构造成影响,为此研究高分子异氰酸酯胶粘剂的固化过程与性能评价,降低其固化反应影响。采用双酚A二缩水甘油醚(E-51)和二苯甲烷二异氰酸酯(MDI)为主要原料制备高分子异氰酸酯胶粘剂样品,通过红外光谱仪和差式扫描量热仪分析其在不同固化温度下的固化反应,评价其黏度、剪切性能、T剥离强度以及固化时间。固化过程分析结果表明:胶粘剂样品分别在52℃、106℃、263℃三个固化温度下,出现放热峰峰值;固化温度低于150℃、205℃、240℃时,胶粘剂样品呈现三种结构,分别为异氰脲酸酯、恶唑烷酮和恶唑烷酮结构。力学性能评价结果显示,固化温度越高,胶粘剂样品的黏度和剪切强度越好,固化温度达到205℃以上,试样的T剥离强度先增加后减小,在R=1.4时达到最高T剥离强度145.6N/25mm,选择184∶TPO为2∶1时光引发效果较好。     

低收缩添加剂对聚酯树脂固化的影响

本文采用SPI法测定加入不同含量低收缩添加剂（LPA）的不饱和聚酯树脂的固化放热曲线。研究了低收缩添加剂的用量，以及中低温固化体系对不饱和聚酯树脂的凝胶时间，固化时间，放热峰温度，固化放热量的影响。     

桥梁加固用环氧树脂胶粘剂体系固化动力学研究

制备了三种温度环境条件固化剂,对照组不经处理直接调配,常温组在19～24℃条件下处理7 d,低温组在4℃条件下处理7 d。将制备完成后的三种固化剂与环氧树脂按照质量比4∶10充分混合,并按照相关规定测试三组试验材料的力学性能,使用差示扫描量热法分析环氧树脂胶粘剂体系的固化动力学性能。研究结果表明:两种温度环境配制的环氧树脂胶粘剂体系的力学性能均有提高,升温速率快,放热峰向高温方向移动;经计算反应活化能为59.79 kJ/mol,反应级数为0.95;低温固化后的试验样品存在明显放热峰,常温固化后的试验样品转变为玻璃化状态。     

橄榄油-脲醛树脂胶的固化特性研究

以甲醛与尿素缩聚反应生成脲醛树脂为基础,加入橄榄油与三乙醇胺形成的三乙醇胺皂化物,合成了橄榄油-脲醛树脂胶粘剂,主要探讨了胶粘剂的固化特性。研究结果表明:橄榄油的加入延长了脲醛树脂胶粘剂的固化时间,增大了固化反应起始反应温度和放热峰值温度。此外,橄榄油的加入降低了胶膜硬度的同时,大幅提升了胶粘剂的耐水性能。     

配方精选

丙烯酸酯结构胶合剂,室温固化胶粘剂,耐低温结构胶粘剂,改性丙烯酸酯结构胶粘剂,反应型丙烯酸酯胶粘剂[编者按]     

常温固化聚丙烯酸酯胶粘剂

分析了丙烯酸酯的反应特点,介绍了第一、二、三代丙烯酸酯胶粘剂、丙烯酸酯厌氧胶粘剂、丙烯酸压敏胶粘剂以及α-氰基丙烯酸酯胶粘剂这几种常温固化丙烯酸酯胶粘剂的组分、应用及其研究进展.     

高性能丙烯酸酯结构胶的研制

以氯磺化聚乙烯为弹性体，用环氧丙烯酸酯预聚体改性，使胶粘剂固化形成半互穿网络，提高了丙烯酸酯胶粘剂的耐热、耐水等综合性能。本文就弹性体、环氧丙烯酸酯预聚体、引发剂和硅烷偶联剂进行了系统的研究。所研制的胶粘剂综合性能优异，其室温拉伸剪切强度为24．2MPa，120℃为16．3MPa，90℃水中浸泡96h后仍高达201MPa。     

低放热室温固化环氧胶粘剂的制备及其性能研究

在聚硫醇固化剂中加入巯基乙酸制备出低放热的双组分室温固化环氧胶粘剂,探讨了E-44、E-51以及A l(OH)3的加入量对A组分粘度的影响,测试了加入不同促进剂时环氧胶粘剂的性能,研究了DMP-30加入量对胶体热性能的影响,考察了巯基乙酸的用量对胶粘剂耐水性的影响。结果表明,DMP-30的质量分数为10%时,热变形温度最佳,加入巯基乙酸后,环氧胶的耐水性提高显著,当巯基乙酸的质量分数为2%时,环氧胶粘剂的放热峰为80.1℃,凝胶时间为27~30 min,拉伸剪切强度为24.2 MPa。     

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

This paper presents detailed curing kinetics models for two thermoset adhesives. The cure kinetics were characterized using differential scanning calorimetry in both anisothermal and isothermal modes. The Sestak–Berggren autocatalytic model was applied to describe the anisothermal cure kinetics of the two adhesives with the Malek and undetermined coefficients methods determining their kinetic parameters. The Kamal autocatalytic model was adopted for the isothermal curing processes with the Kenny analytical-graphical method determining the kinetic parameters. A modified Kamal model was developed by introducing a concept of the maximum degree of cure (DOC) and temperature-depended kinetic parameters to describe the isothermal cure kinetics of the adhesive with a typical exothermic peak, and an extended Kamal model was further proposed by adding an initial-phase-control term to the modified Kamal model to describe the isothermal cure kinetics of the adhesive with two exothermic peaks. The results showed that the presented curing kinetics models with the determined parameters can precisely predict the evolutions of the DOC of the two thermoset adhesives in both anisothermal and isothermal modes.     

桐油改性双环戊二烯不饱和树脂的固化研究

采用红外光谱(FT-IR)和示差扫描量热法(DSC)对桐油改性DCPD-UPR的固化特性和固化动力学进行了研究。利用Kissinger方程和Crane方程计算得到桐油改性DCPD-UPR的表观活化能94.03 kJ/mol,反应级数为0.94,指前因子为2.185×1012。利用T-β外推法确定了桐油改性DCPD-UPR的固化温度为107.28℃,后处理温度为120.65℃。较未改性的DCPD-UPR,桐油改性DCPD-UPR的固化放热曲线平缓,放热峰温度低,固化时间长,可以避免树脂固化成型时翘曲、开裂等现象的发生。     

纳米粒子改性环氧树脂固化反应动力学研究

采用示差扫描量热仪(DSC)研究了不同用量纳米Al2O3粒子改性的环氧树脂基体的固化反应动力学,根据DSC实验的结果采用Kissinger和Crane方法计算得到不同树脂体系的固化动力学参数并研究了固化度与温度之间的关系。结果表明,纳米粒子的加入使固化的起始温度与终止温度降低,并缩短了固化时间。随着纳米粒子含量的增加,改性树脂体系固化反应放热峰的峰值温度逐渐降低,固化反应的表观活化能降低,但反应频率因子及反应级数基本不变。     

Cure simulations of thick adhesive bondlines for wind energy applications

Curing of adhesive bondlines is a critical and time-consuming operation in wind turbine blade manufacturing. Significant variation in adhesive thickness can lead to important differences in thermal histories trough the adhesive bonds due to the exothermic nature of the cure process. Reducing bondline cure cycle time and avoiding adhesive overheating are two competing factors in the design of cure temperature cycles. Predictive models on the impact of adhesive thickness variability in bondline cure temperature cycle is currently limited. Adhesive curing and temperature evolution can be simulated by finite element (FE) models coupling the heat transfer problem with the cure kinetics of the adhesive. The cure kinetics of the adhesive system was characterized by isothermal differential scanning calorimetry experiments and implemented in the FE software Abaqus/CAE by user subroutines. Predictions from the FE model were validated experimentally against temperature readings from the curing of 10, 20, and 30 mm thick adhesive bondlines. To highlight the role that predictive models potentially have in the optimization of bondline cure cycles a 2D cross section model representing the trailing edge of a wind turbine blade was used as case study. It was demonstrated that computational models enable customizing cure profiles for nonuniform adhesive thicknesses, ensuring fully cured bondlines with acceptable mechanical properties.     

改性咪唑的合成及其促进EP/己二酰肼固化体系的研究

以顺丁烯二酸作为2-乙基-4-甲基咪唑(EMI)的改性剂,合成出一种潜伏性促进剂——改性咪唑,并采用红外光谱(FT-IR)法对其结构进行了表征。以己二酰肼作为环氧树脂(EP)的固化剂,考察了改性咪唑对EP/己二酰肼胶粘剂的凝胶时间、固化特性、室温储存期和粘接性能等影响。结果表明:当w(改性咪唑)=1.5%时,改性咪唑对EP/己二酰肼体系具有较好的促进作用(体系放热温度下降了20℃左右);该胶粘剂的固化条件为"110℃/1 h→130℃/1 h",室温储存期超过60 d,并具有粘接性能优、耐水性能好等特点。     

Accelerated-curing epoxy structural film adhesive for bonding lightweight honeycomb sandwich structures

Accelerating the curing of epoxy/aromatic amine adhesives and improving their toughness are challenges in heat-resistant epoxy structural adhesives. Herein, we report an epoxy/aromatic amine adhesive accelerated curing system with an oxo-centered trinuclear (chromium III) complex, which is toughened using a thermoplastic block copolymer (TPBC). The reaction characteristics, heat resistance, microstructure, and bonding properties of the accelerated epoxy adhesives were analyzed. The reaction peak temperature of the epoxy with 3% catalyst was 113.1°C, which was 113.6°C lower than that of epoxy without catalyst, and the modified epoxy resin demonstrated a potential for rapid curing at medium temperature. The glass transition temperature of the TPBC-toughened epoxy adhesive was 125°C after curing, indicating excellent thermal stability after medium temperature curing. The introduction of the TPBC increased the single-lap shear strength of the epoxy adhesive without reducing its heat resistance. The shear strength at room temperature and 120°C of the modified epoxy adhesive with 50 phr of TPBC was 25.2 and 10.9 MPa, respectively. Moreover, the epoxy film adhesive exhibited outstanding bonding properties when used in the bonding of lightweight honeycomb sandwich structures.     

Curing of unsaturated polyester resins with low exotherm peak

The curing behavior of an unsaturated polyester resin with low exotherm peak was studied by a standard procedure and by differential scanning calorimetry (DSC). A copper salt and α-methylstyrene were used as the polymerization retarders. The influence of the retarders on the exotherm peak temperature, gelation time, exothermic heat and the polymerization kinetics was investigated.     

端氨基丁腈橡胶增韧环氧-聚酰胺胶粘剂的研究

通过DSC,扫描电镜分析及剪切和剥离强度性能测试研究了端氨基液体丁腈橡胶(ATBN)改性环氧-聚酰胺体系的固化动力学,粘接性能及增韧相态。结果表明,根据Ellerstein法和峰值法计算得到的固化反应活化能分别为为73.6 kJ/mol和65.7 kJ/mol,体系最佳固化温度为41～97℃。固化体系中橡胶相粒径大小对胶粘剂性能有较大影响,60℃和室温固化体系分散相粒子平均粒径分别为1～2μm,0.5μm。粒径1～2μm时体系的增韧效果最佳,粘接性能优异。