印制电路词汇（23）

1381 suIfuric acid Copper plating:硫酸铜电镀 现在的硫酸铜电镀法通常用于电子产品、塑料材料的电镀,其镀液成分以硫酸、硫酸铜为主,根据需要添加各种添加剂、光泽剂。代表性镀液组成如下:100-250g/L硫酸、适量光泽剂、镀液温度25℃-35℃,阴极电流密度1-10A/dm2。     

激光诱导背向湿式刻蚀过程中工作液体的研究

为了使用低成本的红外光纤激光器对蓝宝石进行高效率高质量的加工, 采用激光诱导背向湿式刻蚀方法进行了理论分析和实验验证, 研制了一种新型的活性高且稳定性高的混合溶液, 硫酸铜的质量浓度为28g/L、次磷酸钠的质量浓度为40g/L、氨水的质量浓度为45g/L、pH值为12。在相同的加工条件下, 采用硫酸铜水溶液和混合溶液对蓝宝石进行切割。结果表明, 蓝宝石在混合溶液中的切割效率高出硫酸铜水溶液中的5倍左右; 采用混合溶液对蓝宝石进行成形切割, 加工出了高质量的异形蓝宝石零件。此研究对提高低功率激光作用下蓝宝石的加工效率有一定的指导意义。     

平板显示器中ITO透明电极制备的研究

利用光刻技术和湿法刻蚀技术制备ITO透明电极,借助视频显微仪和台阶仪观测电极形状和表面形貌.比较了不同溶液的刻蚀效果,指出采用盐酸加三氯化铁溶液刻蚀效果最佳,分别讨论了HCl含量和ReCl3含量变化对ITO膜刻蚀速率的影响.最后指出在25士2℃的环境下,刻蚀液HCl、H20和FeCl3·6H2O的配比满足3 L:1 L:(20～30 g)时,ITO膜的刻蚀速率能达到1 nm/s,所制备的透明电极边缘整齐无钻蚀,适合于制备平板显示器中的透明精细电极.     

印制电路铜面化学镀银及其高频信号传输损耗研究

传统还原型化学镀银溶液采用单一络合剂体系,存在镀液稳定性差、且由其产出的产品镀层均匀性差的问题,影响了产品的导电效果以及粗糙程度,不能满足高频信号传输对印制电路板的制作要求。在传统单一络合剂还原型化学镀银的工艺基础上,通过优化实验设计、实验室测试、粗糙度测试以及SEM测试,对化学镀银配方进行了研究与优化设计,得出了最佳的化学镀银工艺条件与双络合剂体系配方：银离子15 g/L,氨水50 ml/L,乙二胺20 ml/L,甲醛25 ml/L,乙醇25 ml/L,温度45℃,操作时间5 min,得到的化学银镀层光亮均匀、无发黄发灰现象,通过测试发现该化学镀银溶液稳定性提升,降低了工业成本,改善了粗糙程度,能够满足高频信号传输对印制电路板的制作要求,更好地应用于高频信号传输领域中。     

高稳定性化学镀铜液的参数优化

采用单因素实验法,以镀液稳定性、镀速及镀层光亮度为指标,优化了化学镀铜液参数以提高镀液稳定性,并研究了添加剂对镀液电化学极化性能的影响。试验结果表明:随着Cu SO4·5H2O和HCHO浓度的增加,镀液稳定性有所下降;适量的络合剂和稳定剂的加入能有效提高镀液稳定性。采用优化后的镀液施镀30 min,镀速为4.93μm/h;施镀后的镀液在80℃水浴中的稳定时间大于2 h;所得铜层为具有金属光泽的淡粉红色,铜颗粒排列紧密;镀铜层电阻率低至3.67×10–8Ω·m,铜层与基体之间的附着强度提高至10 N/mm2。     

pH值及NaOH对化学镀银包铜粉镀覆过程的影响

采用化学镀法制备了不同加载量的树枝状银包铜粉,研究了镀液的pH值及NaOH的添加方式和添加量对镀覆过程的影响,并采用SEM、EDS、化学分析和氧化增重法对粉体性能进行了分析。结果表明:镀液pH值的最佳范围为11.0～11.5,NaOH的最佳质量浓度为10 g/L,直接加入主盐络合;在最佳工艺下,测得银包铜粉银的平均质量分数为23.06%±0.54%,银的平均转化率为98.0%±0.5%,微区表面银含量为质量分数39.17%～90.31%;所得银包铜粉包覆完全,抗氧化性良好。     

后处理对铝电解电容器阳极箔比容的影响

采用硫酸-盐酸体系环保型铝电解电容器用阳极箔腐蚀工艺,硝酸溶液作后处理液,结合SEM分析,探讨了硝酸后处理在阳极箔表面的清洗机理,研究了直流电侵蚀后,硝酸后处理对阳极箔比容的影响。结果表明:在硝酸溶液温度为65℃、清洗时间为250 s的条件下,阳极箔比容随着硝酸质量浓度的增加而增加,当硝酸质量浓度增至35 g/L时,阳极箔比容达到最大值0.70×10–6 F/cm2。硝酸质量浓度继续增加,阳极箔比容逐渐减小。最佳后处理参数为:硝酸质量浓度为35 g/L,处理温度为65℃,清洗时间为250 s。     

带状电缆连接器光亮镀硬金新工艺

一、概述以前我所镀金一直采用氰化镀金,设计部门反映用氰化镀金所得到的镀层往往不耐磨,有时插拔几十次,金层就没有了。为此,设计人员在80年给我们下达了一项研制光亮镀硬金任务,并根据国外同类产品镀层状况,进行了摸底试验,向我们提出了五项关于研制光亮镀硬金的具体技术指标:(1)元件锡青铜镀镍镀硬金;(2)镀金层耐磨性经2000次插拔不呈现底层金属;(3)镀金层的显微硬度为170～180kg/mm~2;(4)镀金层经高温200℃～220℃二小时     

锌铬膜涂液的研究

本文通过正交试验优化了锌铬膜涂液的成分，并研究了涂液组成对涂层耐蚀性能的影响，通过试验最终得出了制备锌铬膜的最佳成分及工艺参数为Zn粉：250g／l、Al粉：80g／L、铬酐：50g/L、硼酸：10g/L，乙二醇：90g/L，烧结温度：300℃，烧结时间为30min.     

铅和锡在氟硼酸镀液中电极过程的研究

本文用循环伏安法和稳态电位扫描法研究了铅和锡在氟硼酸镀液中的电极过程。实验表明,Pb~(2+)和Sn~(2+)的阴极还原反应为准可逆并由扩散控制的电极过程。相应的峰电流(I_p)和极限电流(I_d)与铅锡在镀液中的浓度成很好的线性关系。这是电化学法分析铅或锡浓度的依据。求出了扩散系数和扩散层厚度分别为D_(pb)~2=0.31×10~(-5),D_(sn)~(2+)=0.70×10~(-5)δ_(pb)~(2+)=1.2×10~(-2),δ_(sn)~(2+)=1.5×10~(-2)。另外,由稳态阴极和阳极电极过程的研究,得出了当阴极电流密度为1—1.5A/dm~2时镀液中合理的Pb和Sn浓度范围为8—12g/L和15—25g/L,合理的阳极电流密度为0.9A/dm~2,阳阴极面积比应在1.1—1.7之间。可采取调节ia的方法控制镀液中Sn~(2+)的浓度。     

连续工艺合成高纯碱式碳酸镍的研究

为得到高纯碱式碳酸镍,以电解镍新液为镍源,工业碳酸钠为沉淀剂,开展了连续反应工艺合成碱式碳酸镍的研究,并利用扫描电镜(SEM)和X射线衍射仪(XRD)对产品的形貌和结构分别进行了表征。试验结果表明,在镍离子质量浓度50 g/L、反应温度55℃、pH值8.30、沉淀剂Na2CO3质量浓度120 g/L、停留时间25~30 h以及搅拌速度500 r/min的条件下进行合成反应,可得到一种类球形、致密且表面光滑的高纯碱式碳酸镍产品。     

Does Salt Concentration Matter? New Insights on the Intercalation Behavior of PF6−${\rm{PF}}_6^ - $ into Graphite Cathode for the Dual-Ion Battery

A high-concentration electrolyte is favored in dual-ion batteries (DIBs) due to the lower onset potential for anion intercalation, higher specific discharge capacity, and better oxidation stability. Inspired by the correlation between the high-concentration electrolytes and localized high-concentration electrolytes, it is suspected that it is not the salt concentration but the solution structure of the electrolyte that determines the intercalation behavior of anion into graphite cathode. To prove the viewpoint, a series of electrolytes are prepared by controlling the salt concentration or solution structure and the intercalation behavior of $P{F}_6^{-}$ within the graphite cathode is investigated in Li||graphite and graphite||graphite cells. It is found that $P{F}_6^{-}$ anions exhibit similar onset potentials and specific discharge capacities in the electrolytes with different salt concentrations but similar solution structures. This study provides a new perspective on designing promising electrolytes for DIBs, which can accelerate the further exploitation of high-performance DIBs.     

Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)

Electroless nickel and immersion gold plating technologies (e-Ni/Au) have traditionally been used almost exclusively within the electronics industry to create a solderable surface on substrate materials, e.g. laminate boards. Recent advances in these plating technologies, along with the inherent low costs associated with electroless plating processes, have enabled the extension of their utilization into a variety of semiconductor applications, e.g. wafer level pad metallization. This paper describes the electroless nickel and immersion gold processes for both aluminum- and copper-based semiconductors. The nickel plating bath is a hypophosphite-based solution and the gold bath is a cyanide-free sulfate-based solution. For aluminum-based integrated circuits a zincation process is used to initiate nickel growth, and for copper, palladium is used to catalyze the surface. Tight control of the chemistries, equipment, and run-time process variables are required to ensure repeatability. Thin film Auger analysis of the as-plated films shows well-defined layers of high purity gold and nickel/phosphorous. Adhesion of the e-Ni/Au layers was evaluated by measuring the load required to shear I/O pads plated with tall nickel bumps. Integrity of the nickel was further evaluated by subjecting the structures to multiple temperature cycles and test for pad shear strength. Results show no degradation in shear load or failure mode.The deposition of nickel and gold onto the I/O pad surfaces enables the subsequent use of both wire bond and flip chip (lead-based and lead-free alloys) interconnect methods. The integrity of gold wire bonds to the e-Ni/Au plated I/O pad was evaluated using ball shear, wire pull, and the corresponding failure analysis of each. Results show values well above product specifications, with wire pull failure modes in the wire and intermetallic failure in the ball shear studies. For flip chip applications, the e-Ni/Au layer was evaluated using stencil-printing technology to deposit several different solder alloys. In the current investigation, two test vehicles were successfully bumped with both 63Sn/37Pb and 90Pb/10Sn lead-based solder alloys, as well as the 95.5Sn/3.8Ag/0.7Cu lead-free alloy. In order to evaluate the compatibility of these alloys with the electroless nickel layer, solder bump shear tests were performed as a function of number of reflow cycles. Results show no degradation in shear load or failure mode among all three of the alloys tested, indicating no critical nickel consumption (i.e., excessive intermetallic growth) during reflow. Additional tests were performed comparing nickel under-bump-metallurgy (UBM) thicknesses of 1, 2 and 5 μm. Again, no critical nickel consumption was detected.     

镀镍光纤抗拉强度及其影响因素

针对以硫酸镍为主盐所得镀镍光纤表面质量较差、镀层内应力大和抗拉强度低等问题,采用氨基磺酸镍为主盐在化学镀镍后的光纤表面电镀镍。对比研究了两种工艺所得镀镍光纤的表面质量和抗拉强度,与FiberGuide所售镀金光纤进行了对比。结果表明:以氨基磺酸镍为主盐所得镀镍光纤表面比以硫酸镍为主盐所得镀镍光纤表面更加光滑致密;氨基磺酸镍镀镍光纤的抗拉强度(877.20 MPa)比硫酸镍镀镍光纤的抗拉强度(511.11 MPa)提高41.73%,与FiberGuide所售镀金光纤的抗拉强度(718.99 MPa)相当;光纤表面有机物涂层的去除方法,包括光纤钳和化学浸泡去除方法,可能影响最终镀层表面质量。     

铝合金化学镀镍工艺研究与应用

报道一种在铝合金元件上实施化学镀镍的工艺方法。该方法包括在改进的锌酸 溶液中经二闪浸锌处理后,以碱性化学镀镍作底层,然后进行酸性化学镀镍,能在铝合金（ＬＹ１２ｃｚ、ＬＤ３１等）表面获得光亮的、具有优异附着力和良好的防腐蚀性能及其综合物理、化学特性的化学镀镍（Ｎｉ－Ｐ）层。     

Highly Porous Materials as Tunable Electrocatalysts for the Hydrogen and Oxygen Evolution Reaction

The facile preparation of highly porous, manganese doped, sponge‐like nickel materials by salt melt synthesis embedded into nitrogen doped carbon for electrocatalytic applications is shown. The incorporation of manganese into the porous structure enhances the nickel catalyst's activity for the hydrogen evolution reaction in alkaline solution. The best catalyst demonstrates low onset overpotential (0.15 V) for the hydrogen evolution reaction along with high current densities at higher potentials. In addition, the possibility to alter the electrocatalytic properties of the materials from the hydrogen to oxygen evolution reaction by simple surface oxidation is shown. The surface area increases up to 1200 m²g^?1 after mild oxidation accompanied by the formation of nickel oxide on the surface. A detailed analysis shows a synergetic effect of the oxide formation and the material's surface area on the catalytic performance in the oxygen evolution reaction. In addition, the synthesis of cobalt doped sponge‐like nickel materials is also delineated, demonstrating the generality of the synthesis. The facile salt melt synthesis of such highly porous metal based materials opens new possibilities for the fabrication of diverse electrode nanostructures for electrochemical applications.     

Solution‐Processed,Alkali Metal‐Salt‐Doped,Electron‐Transport Layers for High‐Performance Phosphorescent Organic Light‐Emitting Diodes

High‐performance, blue, phosphorescent organic light‐emitting diodes (PhOLEDs) are achieved by orthogonal solution‐processing of small‐molecule electron‐transport material doped with an alkali metal salt, including cesium carbonate (Cs₂CO₃) or lithium carbonate (Li₂CO₃). Blue PhOLEDs with solution‐processed 4,7‐diphenyl‐1,10‐phenanthroline (BPhen) electron‐transport layer (ETL) doped with Cs₂CO₃ show a luminous efficiency (LE) of 35.1 cd A^?1 with an external quantum efficiency (EQE) of 17.9%, which are two‐fold higher efficiency than a BPhen ETL without a dopant. These solution‐processed blue PhOLEDs are much superior compared to devices with vacuum‐deposited BPhen ETL/alkali metal salt cathode interfacial layer. Blue PhOLEDs with solution‐processed 1,3,5‐tris(m‐pyrid‐3‐yl‐phenyl)benzene (TmPyPB) ETL doped with Cs₂CO₃ have a luminous efficiency of 37.7 cd A^?1 with an EQE of 19.0%, which is the best performance observed to date in all‐solution‐processed blue PhOLEDs. The results show that a small‐molecule ETL doped with alkali metal salt can be realized by solution‐processing to enhance overall device performance. The solution‐processed metal salt‐doped ETLs exhibit a unique rough surface morphology that facilitates enhanced charge‐injection and transport in the devices. These results demonstrate that orthogonal solution‐processing of metal salt‐doped electron‐transport materials is a promising strategy for applications in various solution‐processed multilayered organic electronic devices.     

碳酸镍沉淀过程的研究以及介孔氧化镍的制备

Nickel carbonate and nickel oxide are important inorganic fine chemicals, widely used in chemical, metallurgical, electronic and energy sources industries. The research was beginning with studying the effects of anions on precipitation process of nickel carbonate. Activity coefficient shows the effect size of the microcosmic effects between ions and solvent. Meissner's semi empirical model was applied to calculate the average activity coefficients of nickel carbonate in different electrolyte solutions at different conditions. And the conditional solubility of nickel carbonate was also calculated. The calculated results show that activity coefficients of NiCO3 in sodium sulphate solutions are less than that in sodium chloride solutions, and the solubilities in sodium sulphate solutions are larger. To improve the confidence of the calculations, Bromley's and Pitzer's models were also applied to calculate activity coefficients. The calculation results of Bromley's and Pitzer's models are very close to Meissner's results. And then experiments were carried out to measure the surface tensions, and contact angles of solutions on NiCO3 surface. According to the experiment results, the solid-liquid interface tension between NiCO3 and sodium sulphate solution is larger than that between NiCO3 and sodium chloride solution. And the tiny crystal NiCO3 has larger solubility in sodium sulphate solutions, which indicates that crystallization of NiCO3 in sodium sulphate solution is more difficult than in sodium chloride solution. The influence of SO 42- and Cl- on precipitation and crystallization process of NiCO3 was also studied based on crystal dynamics. The supersaturations at different initial concentration of reaction system were compared. Diffusion coefficients of ions were described by Glasstone's model. The diffusion coefficients of Ni2+ and CO 32- in chloride solutions are larger than those in sulphate solutions. In sulphate solutions, the diffusion coefficients and supersaturation are both less, therefore nucleation and growth rates are more slowly. Furthermore, the experiments of crystallization dynamics show that the reaction of nickel carbonate precipitation is a first order reaction while the reaction rate constant is about 0.02 min-1. Based on the theoretical analysis above, technology process of nickel carbonate precipitation was studied subsequently. The effects of nickel salt, feeding mode, controlling pH, reaction temperature and aging condition on purity, particle size, appearance of product and recovery ratio of nickel were investigated. Then using industrial nickel electrolyte solution and sodium carbonate as the raw materials, nickel carbonate product with nickel content of about 51%,average particle size of 17 μm was prepared at optimal conditions, and the recovery ratio of nickel is around 99.5%. Nickel carbonate with high purity was obtained via an innovative impurity removal process, called wash-dry-rewash-redry process. The sodium and chlorine qualitative contents of the nickel carbonate purified by the innovative method are both less than 0.01% and the sulphate content is no more than 0.1%. The mechanism of sodium and chlorine adsorption onto nickel carbonate's surface was discussed, using Stern's model of electric double layer. Moreover computational simulation technology was applied to investigate on how anions affect the crystallization of NiCO3 at atom scale. The lattice structure was relaxed before establishing crystal surfaces. The computational unit cell parameters are very close to the experimental data. Five main surfaces were studied, i.e. the (104), (100), (110), (001) and (101) surfaces. SO 42- substitutes the CO 32- on the outmost layer. Cl- adsorbs onto the surfaces and has relative weaker interaction with the surfaces. Compared with only hydrated surfaces, the growth rates of defected hydrated surfaces significantly decrease, especially for SO 24- defected ones. The (104) surface is the most stable surface and is mainly expressed in the equilibrium morphology of the resulting crystal. Finally, based on the study of nickel carbonate synthesis, nickel oxide with mesoporous structure was prepared by adding template into the nickel source and calcination. The effects of types of surfactant, dosage of surfactant, calcination temperature and calcination time on pore structure and specific surface area of nickel oxide were investigated. The results show that the surface area of the nickel oxide prepared by sodium dodecyl sulphate (SDS, anion surfactant) is much larger than those of which prepared by CTAB and octadecylamine. It is suggested that the inorganic species, basic nickel carbonate, is interacted with the template, SDS, by electrostatic attraction force. The precursor hardly has any surfactant residue after calcination. Nickel oxide with high specific surface area (>200 m2· g-1) is synthesized by adding low amount of template at the mole ratio of SDS:Ni less than 0.1:1.0. The nickel oxide has H3 type hysteresis and the pore size distribution mainly ranges from 2 nm to 10 nm. And it has good thermal stability.     

氯化钾溶液的激光诱导击穿光谱研究

利用脉冲Nd:YAG激光器、光谱仪I、CCD等设备设计了一套激光诱导击穿光谱测试实验装置,并采用该装置对氯化钾溶液的全谱进行了测量,得到了含量为1mg/l的镁(Mg),3mg/l的钙(Ca),20mg/l的钠(Na)的线状谱线。实验结果表明,对氯化钾溶液做定性分析时,延时是一个非常重要的参数。合理地选取延时,利用激光诱导击穿光谱方法可以快速准确地同时检测到多种微量金属元素。同时定性分析也证明了利用激光诱导击穿光谱方法探测废水中的微量有毒金属的可行性。