共查询到20条相似文献,搜索用时 0 毫秒
1.
Alpha-lead dioxide was deposited by anodization of alkaline solution containing HPbO2- anions. Scanning electron microscopy (SEM) results show that the morphology is remarkably affected by the current density, concentration of HPbO2- anions, bath temperature and electroplating time. Compact and well adherent layers are possibly obtained under conditions of current densities ≤3 mA/cm2, electrolyte containing 4 mol/L NaOH and 0.12-0.14 mol/L lead (Ⅱ ), bath temperature of 40 ℃, and electroplating time of 2 h. EDS analyses show that the PbO2 deposited in alkaline condition is highly non-stoichiometric at high current density. 相似文献
2.
采用循环伏安和线性扫描伏安法研究水对摩尔比为2:1的AlCl3-BMIC离子液体电化学性质的影响。结果表明:随着含水量的增加,铝的还原峰电流密度减小,阴极和阳极极化过电位增加,槽电压不断升高。当离子液体含水量低于1.39 mol/L时,电流效率稳定在94%~95%;继续增加含水量到1.67 mol/L时,电流效率从94%下降到64.7%。当离子液体含水量低于1.39 mol/L时,沉积层变得更致密;当含水量增加到1.67 mol/L时,沉积层变得疏松。离子液体含水量为1.39 mol/L时,铝的纯度超过99.9%。 相似文献
3.
在摩尔比为2:1的AlCl_3-[bmim]Cl离子液体中,加入一定量的甲苯,控制阴极电流密度,在基体铁片上获得银白色和平整致密的铝镀层。循环伏安实验表明离子液体中沉积铝源于Al_2Cl_7~-的还原,还原峰电位为-0.34V;当电流密度为20mA/cm~2时,最大电流效率达97%;所得铝镀层的厚度与电镀时间呈抛物线关系;在电流密度小于35mA/cm~2时,镀层厚度随电流密度增大呈逐渐递增趋势;扫描电镜、X射线能谱对铝镀层分析结果表明(45±2)℃温度得到平整致密纯度高的铝镀层;当电流密度为20mA/cm~2时,铝镀层呈薄片状生长,随电流密度的增大,镀铝层形貌由片状向粒状过渡,并伴随着晶粒的细化。 相似文献
4.
5.
1 Introduction Titanium implants have been used widely for various types of bone-anchored reconstructions due to their excellent corrosion resistance and mechanical properties. However, titanium exhibits poor osteoinductive properties, fortunately, which… 相似文献
6.
采用光纤激光器对铝/钢异种金属搭接接头进行激光填丝熔钎焊试验研究。分析了送丝速度对焊缝成形质量、金属间化合物层厚度及力学性能的影响。试验结果表明,选择适当的送丝速度,利用铝和钢的不同熔点,使铝母材刚好熔化但是钢母材不熔化,熔化的铝母材与填充金属一起铺展在钢母材表面并与其实现钎焊连接,可形成优质的熔钎焊接头。当送丝速度小于3.5 m/min时,易形成硬脆性金属间化合物而导致焊缝开裂。金属间化合物层厚度应控制在一定范围内,方可保证接头性能。当送丝速度为4.5 m/min时,焊接接头强度有所提高,其线载荷达到203.5 N/mm,约为铝合金母材抗拉强度的83.7%。 相似文献
7.
8.
周惦武 《稀有金属材料与工程》2015,44(10):2440-2444
对1.8 mm厚AZ91镁合金和1.2 mm厚6016铝合金平板试件进行激光搭接焊试验,利用体视显微镜、卧式金相显微镜、扫描电镜、X射线衍射仪、电子显微硬度仪、微机控制电子万能试验机等手段研究镁/铝焊缝的表面成形性、接头区域的金相组织、界面元素分布、断口形貌、主要物相、显微硬度与接头力学性能。结果表明:激光功率1900 W,焊接速度50 mm/s,离焦量f为0,Ar气保护气体流量为15 L/min时,焊缝表面成形性良好,热影响区窄,晶粒细化;焊接接头平均抗拉强度和抗剪强度分别为13.99和12.79 MPa,镁侧和铝侧焊缝硬度均高于母材;剪切断口较平坦、光滑,出现相互平行的疲劳条纹;拉伸断口存在较多高度不一致的解理台阶,呈脆性断裂特征;镁/铝焊缝界面存在Mg17Al12、Mg2Al3主要物相,其中Mg17Al12脆性相高温下比Mg2Al3延性相结构稳定,是镁/铝焊接接头呈现脆性特征和较难实现焊接的主要原因。 相似文献
9.
对1.5 mm厚6061铝合金和2 mm厚316L不锈钢进行搭接焊,所选焊丝为4043铝硅焊丝。运用扫描电镜、能谱仪、X射线衍射仪、显微硬度计及万能拉伸试验机研究了焊接工艺参数对焊缝成形及焊接接头界面组织与力学性能的影响。研究结果表明,焊接参数对焊接接头宏观形貌有显著的影响,钎焊界面处不可避免的生成以FeAl3,Fe2Al5为主的金属间化合物相。拉剪试样断裂于钎焊金属间化合物层处,金属间化合物层厚度过大或过小都会影响焊接接头抗剪强度,厚度为1.5 μm时试样抗剪强度最高可达50 MPa。 相似文献
10.
采用脉冲旁路耦合电弧MIG焊、CMT及激光焊方法实现铝/镀锌钢板搭接焊,对焊缝界面微观组织、形貌及元素成分进行了观察分析,并测试了其力学性能.结果表明,三种焊接方法均可以实现铝/镀锌钢板异种金属的优质连接,获得成形良好的焊缝,搭接接头的抗拉剪强度均可以达到铝合金母材的80%以上,拉伸试样断裂在焊缝铝合金母材热影响区.当母材热输入及工艺合适时,三种方法下搭接接头界面处均形成一主要成分为Fe2Al5和FeAl3,平均厚度约为8 μm的金属间化合物,而且控制金属间化合物的生成是获得铝/钢焊接优质接头的关键. 相似文献
11.
12.
为明确铝/钢电磁脉冲焊接过程金属粒子运动对界面连接性能的影响,基于金属粒子流形成机理,对界面形貌及抗剪强度进行分析.结果表明,金属粒子滞留界面造成铝局部熔化,钢粒子原位生成FeAl,形成未结合区;沿着焊接方向,分射流对铝板压入作用逐渐增大,形成冶金结合的界面,并伴有富铝金属间相,直缝区为FeAl + Fe2Al5,小波区为Fe2Al5 + FeAl3,大波区为FeAl + FeAl3;铝钢焊接界面过渡区由塑变铝压入钢形成,铝侧焊缝的外边缘存在钢粒子,而钢侧焊缝存在熔融铝携带钢粒子,主要为FeAl + Fe2Al5 + FeAl3,且在焊缝内侧滞留了大量金属粒子,并以椭圆环的形式分布,在焊缝外侧,金属粒子滞落铝板表面造成凹坑,但在钢板表面为嵌入的片状铝;因此,在金属粒子滞留,并产生较多金属间化合物的位置成为剪切试验断裂源;通过波长公式调整搭接间隙,减少粒子滞留界面,椭圆焊缝断裂于铝材,提高了接头强度. 相似文献
13.
采用直径1.6 mm的CuSi3焊丝对钢/铝异种金属进行激光填丝熔钎焊.使用光学显微镜观察了焊缝宏观成形,利用SEM,EDS,XRD分析了接头微观组织,通过原位纳米压痕仪和拉伸试验机测试了接头力学性能.结果表明,采用CuSi3焊丝实现了6061铝合金和镀锌板的激光搭接熔钎焊,优化了工艺参数,获得了成形良好的焊缝.焊缝呈现三个特征区:钢侧界面区、焊缝中心区和铜焊丝/铝过渡区.进一步研究表明,铜焊丝/铝过渡区组织包含Cu9Al4和CuAl2金属间化合物,呈现带状、粗大骨架状、细小骨架状夹杂层片状和树枝状四种形貌.铜焊丝/铝过渡区硬度远高于相邻区域,粗大骨架状区域硬度最高达到9.97 GPa,拉伸断裂于粗大骨架状区域,断口呈现脆性断裂. 相似文献
14.
15.
16.
17.
91W-6Ni-3Fe难熔合金、TiAl合金和铁基合金在熔铝中的耐腐蚀行为(英文) 总被引:1,自引:0,他引:1
采用静态浸没腐蚀试验研究91W-6Ni-3Fe难熔合金(91W)、TiAl金属间化合物和两种常用铁基合金(QT700和H13 钢)在750℃铝液当中的腐蚀性能。通过3D光学显微镜、SEM、EDS 和XRD研究样品的表面形貌,腐蚀界面和相组成。结果表明:91W具有最好的耐铝液腐蚀性能,QT700次之,H13再次之,TiAl合金的耐铝液腐蚀性能最差。四种金属材料的腐蚀失重均符合抛物线规律,材料在经过一开始的加速腐蚀阶段后,腐蚀速率趋于稳定。材料在铝液当中溶解遵循扩散-反应机制,91W材料在铝液当中的腐蚀主要由扩散这一速控步骤所决定,而TiAl合金的腐蚀性能差主要是由于TiAl-(TiAl3)-Al扩散偶反应具有较低的激活能。 相似文献
18.
Gang CHENG Qiang XU Xi ZHAO Fei DING Jing ZHANG Xing-jiang LIU Dian-xue CAO 《中国有色金属学会会刊》2013,23(5):1367-1374
A novel type of porous magnesium electrode with a stable 3D copper foam as current collectors for the organic magnesium-air battery was prepared by both amperostatic and pulsed electrodeposition of magnesium on copper foam substrates in an electrolyte of 1 mol/L EtMgBr/THF solution, respectively. Optimal parameters of the pulsed electrodeposition were obtained using a bending cathode at the right angle. The surface morphology of the porous electrode was investigated by SEM, and the discharging performance of the porous magnesium electrode was detected by the chronoamperometric measurement. The electrochemical stability of 3D copper foam current collectors was examined by cyclic voltammetry, SEM and ICP-OES analyses. The results show that the rate capability of the porous magnesium electrode with a stable 3D copper foam as a current collector is better than that of the planar magnesium electrode, and the rate capability of the porous magnesium electrode prepared by the pulsed electrodeposition is superior to that of the porous magnesium electrode prepared by the amperostatic electrodeposition. The 3D structure of copper foam current collectors of the porous magnesium electrode could keep stable during the discharging process. 相似文献
19.
钢/铝异种金属双熔池TIG熔钎焊接头的显微组织与力学性能 总被引:2,自引:0,他引:2
采用电弧加热镀锌钢板,通过热传导使铝合金熔化,形成两个互不接触的熔池,实现钢/铝异种金属搭接熔钎焊;利用扫描电镜(SEM)与能谱(EDS)对连接界面的微观组织进行观察与分析.结果表明:在连接界面形成两种金属间化合物,一种为接近铝合金母材呈针状或絮状的FeAl3,另一种为接近钢呈舌状或条状的Fe2Al5;反应层FeAl3的厚度在连接界面上的分布大致均匀;而反应层Fe2Al5的厚度从焊缝中心向两侧逐渐变薄;随着焊接线能量的升高,接头的承载能力呈先增大而后减小的趋势,最高承载能力可达177.2 N/mm,为铝合金母材强度的84%. 相似文献
20.
Ji Y. KwonJi Heon Ryu Yoon S. Jung Seung M. Oh 《Journal of Alloys and Compounds》2011,509(28):7595-7599
A Cu3Sn film electrode (thickness = ca. 3 μm) is prepared by DC magnetron sputtering deposition of Sn on Cu substrate and subsequent annealing at 300 °C for 30 h. At 25 °C, this Cu-Sn binary intermetallic compound is inactive for lithiation, but becomes active at elevated temperatures due to facilitation of Cu-Sn bond cleavage for the conversion-type lithiation. The lithiated product at 120 °C is the most Li-rich Li-Sn alloy (Li17Sn4). Upon de-lithiation, the Cu-Sn intermetallics of different compositions are generated by the reaction between the metallic Sn that is restored from Li17Sn4 and the idling metallic Cu. The nature of the resulting intermetallics is dependent on the de-lithiation temperature: Cu10Sn3 at 120 °C and Cu6Sn5 at 25 °C. Only the latter is active for lithiation in the subsequent room-temperature cycling. That is, Cu3Sn is thermo-electrochemically activated to be Cu6Sn5 by lithiation at 120 °C and subsequent de-lithiation at 25 °C. The higher lithiation activity observed with the more Sn-rich phase (Cu6Sn5) compared to the initial one (Cu3Sn) has been accounted for by the higher equilibrium lithiation potential (thermodynamic consideration) and smaller number of Cu-Sn bonds to be broken (kinetic consideration). 相似文献