微波退火非晶硅薄膜低温晶化研究

多晶硅薄膜晶体管以及其独特的优点在液晶显示领域中起着重要的作用。为了满足在普通玻璃衬底上制备多晶硅薄膜晶体管有源矩阵液晶显示器,低温制备（＜600℃高质量多晶硅薄膜已成为研究热点。文章研究了一种低温制备多晶硅薄膜的新工艺;微波退火非晶硅薄膜固相晶化法,利用X射线衍射、拉曼光谱和扫描电镜分析了微波退火工艺对非晶硅薄膜固相晶化的影响,成功实现了低温制备多晶硅薄膜。     

铝诱导晶化法制备多晶硅薄膜

多晶硅薄膜在微电子和能源科学领域有着广泛的应用.本文介绍了利用铝诱导晶化非晶硅制备多晶硅薄膜的方法,叙述了铝诱导晶化法制备多晶硅薄膜的一般过程,着重讨论了铝诱导晶化非晶硅的机理和在制备过程中各种参数对多晶硅薄膜质量的影响.     

铝诱导晶化法制备多晶硅薄膜

多晶硅薄膜在微电子和能源科学领域有着广泛的应用.本文介绍了利用铝诱导晶化非晶硅制备多晶硅薄膜的方法,叙述了铝诱导晶化法制备多晶硅薄膜的一般过程,着重讨论了铝诱导晶化非晶硅的机理和在制备过程中各种参数对多晶硅薄膜质量的影响.     

铝诱导晶化法制备多晶硅薄膜

多晶硅薄膜在微电子和能源科学领域有着广泛的应用。本文介绍了利用铝诱导晶化非晶硅制备多晶硅薄膜的方法,叙述了铝诱导晶化法制备多晶硅薄膜的一般过程,着重讨论了铝诱导晶化非晶硅的机理和在制备过程中各种参数对多晶硅薄膜质量的影响。     

微波退火法低温制备多晶硅薄膜晶体管

多晶硅薄膜晶体管以其独特的优点在液晶显示领域中有着重要位置。为了满足在普通玻璃衬底上制备多晶硅薄膜晶体管有源矩阵液晶显示器,低温制备（小于600℃）高质量多晶硅薄膜已成为研究热点,文章利用微波加热技术,采用非晶硅薄膜微波退火固相晶化法低温制备出多晶硅薄膜晶体管,研究了微波退火工艺对多晶硅薄膜晶体管电学性能的影响。     

铝膜沉积温度对铝诱导结晶化多晶硅薄膜性能的影响

以超白玻璃为衬底,采用热丝化学气相沉积法沉积初始非晶硅膜,经自然氧化形成二氧化硅层,最后利用磁控溅射 法在不同衬底温度下沉积铝膜,制备了glass/Si/SiO/Al叠层结构并对其进行铝诱导晶化形成多晶硅薄膜.用X射线衍射,光学显微镜和拉曼光谱对样品进行了分析.结果表明,铝诱导晶化制备的多晶硅薄膜的晶粒大小随着铝膜沉积...     

激光晶化制备多晶硅薄膜技术

激光晶化是一种制作晶硅薄膜器件(如薄膜晶体管、太阳能电池)很有效的技术.展望了低温多晶硅薄膜的应用前景,详细介绍了近几年激光晶化制备多晶硅薄膜技术的研究成果,并就激光对非晶硅作用的原理作了简单讨论.     

微波退火法制备多晶硅薄膜的电学特性研究

为实现多晶硅薄膜晶体管有源矩阵液晶显示器的实用化与产业化 ,低温 (<6 0 0°C)、快速制备高质量多晶硅薄膜已成为研究热点。文中将微波加热技术应用于金属诱导 a- Si薄膜横向晶化工艺中 ,成功实现了低温快速制备多晶硅薄膜。通过薄膜电阻率的测试 ,分析了多晶硅薄膜的电学特性。     

连续氩氪离子激光晶化非晶硅薄膜的研究

为了研究连续激光晶化非晶硅薄膜中激光功率密度对晶化效果的影响,利用磁控溅射法制备非晶硅薄膜,采用连续氩氪混合离子激光器对薄膜进行退火晶化,用显微喇曼光谱测试技术和场发射扫描电子显微镜研究了薄膜在5ms固定时间下不同激光功率密度对晶化效果的影响,并对比了普通玻璃片和石英玻璃两种衬底上薄膜晶化过程的差异。结果表明,在一定激光功率密度范围内(0kW/cm2~27.1kW/cm2),当激光功率密度大于15.1kW/cm2时,普通玻璃衬底沉积的非晶硅薄膜开始实现晶化;随着激光功率密度的增大,晶化效果先逐渐变好,之后变差;激光功率密度增大到24.9kW/cm2时,薄膜表面呈现大面积散落的苹果状多晶硅颗粒,晶粒截面尺寸高达478nm ;激光功率密度存在一个中间值,使得晶化效果达到最佳;石英衬底上沉积的非晶硅薄膜则呈现与前者不同的结晶生长过程,当激光功率密度为19.7kW/cm2时,薄膜表面呈现大晶粒尺寸的球形多晶硅颗粒,并且晶粒尺寸随着激光功率密度的增大而增大,在 27.1kW/cm2处晶粒尺寸达到最大5.38m。研究结果对用连续激光晶化法制备多晶硅薄膜的研究具有积极意义。     

高温处理对镍诱导晶化硅上的薄膜晶体管性能的影响

采用标准双栅 CMOS工艺在镍诱导非晶硅横向晶化形成的多晶硅上制造了高性能的薄膜晶体管 ,并详细研究了器件制备前高温预处理对薄膜晶体管性能的影响 .实验发现不同的温度处理 ,将引起器件性能的显著变化 .在10 0 0℃预处理温度下获得了最好的器件性能 .10 0 0℃在 NMOS管中测得的电子迁移率达 314 cm2 / (V· s) ,分别比在 110 0℃和未做高温处理下的大 10 %和 2 2 % .10 0 0℃下器件的最大开关电流比也达到了 3× 10 8.对器件的进一步重复性研究证实了上述结果的可靠性     

用微硅层析法制作的微型硅传感器

主要介绍1种用硅的微机械加工技术研制的硅电容式传感器，采用电容层析法(ECT)技术可检测尺寸为50μm左右的微小粒子。其中的主要技术有硅材料的微机械加工技术，特厚光刻胶的匀胶曝光技术，微集成电镀技术。     

Silicon CREATiONS

正About SilicoN Creations Silicon Creations provides world class silicon IP for precision and general purpose timing(PLLs),SerDes and high-speed differential IOs.We have a deep commitment to our customer's success and to providing complete support.Our careful development procedures and strong QA result in robust and correct designs.And in our labs we comprehensively test all key blocks.As a     

硅光子学

硅光子学有六个主要研究领域,包括产生光、在硅中选择地引导和传输光、编码光、探测光、包装器件和智能地控制这一切光子功能。综述了以上各领域的研究进展。     

Silicon Microrefrigerator

We fabricated a silicon microrefrigerator on a 500-$mu$m-thick substrate with the standard integrated circuit (IC) fabrication process. The cooler achieves a maximum cooling of 1$^circ$C below ambient at room temperature. Simulations show that the cooling power density for a$hbox40times hbox40 muhboxm^2$device exceeds 500$hboxW/cm^2$. The unique three-dimensional (3-D) geometry, current and heat spreading, different from conventional one-dimensional (1-D) thermoelectric device, contribute to this large cooling power density. A 3-D finite element electrothermal model is used to analyze non-ideal factors inside the device and predict its limits. The simulation results show that in the ideal situation, with low contact resistance, bulk silicon with 3-D geometry could cool$sim hbox20 , ^circhboxC$with a cooling power density of 1000$hboxW/cm^2$despite the low thermoelectric figure-of-merit (ZT) of the material. The large cooling power density is due to the geometry dependent heat and current spreading in the device. The non-uniformity of current and Joule heating inside the substrate also contributes to the maximum cooling of silicon microrefrigerator, exceeding 30% limit given in one–dimensional thermoelectric theory$DeltaT_max=hbox0.5hboxZT_c^2$, where$T_c$is the cold side temperature. These devices can be used to remove hot spots on a chip.     

Silicon optics

Arroyo Optics, a flexible wavelength management solution manufacturer, and Lightcross Inc, a manufacturer of integrated, silicon-based optical products for telecoms equipment have agreed to merge. Arroyo Optics, the resulting company, will comprise technologies and products developed with over $50m of combined R&D capital provided by private equity investors. Both companies focus on products targeting fibre optics infrastructure applications.Visit www.three-fives.com for the latest advanced semiconductor industry news     

Silicon Photonics

After dominating the electronics industry for decades, silicon is on the verge of becoming the material of choice for the photonics industry: the traditional stronghold of III-V semiconductors. Stimulated by a series of recent breakthroughs and propelled by increasing investments by governments and the private sector, silicon photonics is now the most active discipline within the field of integrated optics. This paper provides an overview of the state of the art in silicon photonics and outlines challenges that must be overcome before large-scale commercialization can occur. In particular, for realization of integration with CMOS very large scale integration (VLSI), silicon photonics must be compatible with the economics of silicon manufacturing and must operate within thermal constraints of VLSI chips. The impact of silicon photonics will reach beyond optical communication-its traditionally anticipated application. Silicon has excellent linear and nonlinear optical properties in the midwave infrared (IR) spectrum. These properties, along with silicon's excellent thermal conductivity and optical damage threshold, open up the possibility for a new class of mid-IR photonic devices     

标准单元ASIC／FPGA的权衡与结构化ASIC

看来您已认定,采取购买并组装现成的专用标准产品(ASSP),如嵌入式控制器、外设芯片等,然后再编写您自己的软件这种做法将不能使您设计的产品与您竞争对手的产品有足够大的差别.因此,您会决定选择芯片级设计.两大硅平台竞争对手及其各自的折衷方案已经在各种工业论坛上引起广泛的争论.不过如果您刚涉足这场争论,则很有必要了解下述有关争论的概要.