准分子激光微加工技术结合模塑技术加工微流控芯片

利用准分子激光微加工技术与模塑技术相结合的方法制造微流控芯片。用准分子激光在玻璃基胶层上刻蚀出加工质量较高的微流控生物芯片形貌,通过电铸技术对微流控芯片进行复制,得到反向金属模具。用金属模具通过注塑成型技术用聚碳酸酯注塑出微流控芯片。系统研究了准分子激光的能量密度和工作台移动速度对胶层微通道加工质量的影响;测量并分析了激光刻蚀加工出的微流控芯片原型、电铸的反向金属模板和注塑成型后的微流控芯片的轮廓精度和表面粗糙度,上表面尺度偏差不大于2μm,底面粗糙度小于20 nm。对注塑出的微流控芯片和激光直写刻蚀的几何结构相同的微流控芯片的流动性能进行比较测试。在流速较小时,用激光微加工技术与模塑技术相结合的方法加工的微通道比准分子激光直写法所加工的微通道流动性能更好。     

集成电极的PDMS-玻璃微流控芯片的制备

微流控芯片在分析化学和生物检测方面有着广阔的应用前景。对集成电极的PDMS-玻璃微流控芯片的制备工艺进行了研究与分析。最终使用SU-8快速制备阳模,使用PDMS转移图形得到具有微流控通道的PDMS盖片;在玻璃基板上加工Pt电极,除了需要外露的部分电极外,其他部分以薄层PDMS保护,得到电极基板;将PDMS盖片与电极基板半固化键合制得同时具有加热和温度传导电极以及CE高压电极的PDMS-玻璃芯片。ANSYS模拟分析证明加热芯片热惯性小,加热时温度分布效果好。     

PDMS微流控芯片中的微通道加工技术

传统加工方法制作PDMS微流控芯片中的微通道存在诸多限制,特别是难以实现复杂三维微通道的加工。首先介绍了微通道的传统加工方法,接着简要介绍了不同3D打印技术的基本原理,最后重点阐述了3D打印技术在PDMS微流控芯片微通道加工中的应用。未来,微流控芯片中微通道的加工将会向着高通量、低成本、高精度、三维化、集成化、微型化的方向发展。3D打印、以纳米压印为主要代表的微纳制造技术与传统微通道成型技术的不断融合,为研究人员提供了更多的思路,必将成为微通道加工中的重要技术手段,推动微流控芯片在生物医学、检验检疫、分析化学等领域更广泛的应用。     

压力加工与铸造、成形工艺

0611622 微流控芯片金属模具制备工艺研究[刊,中]／李建华／／微细加工技术．-2005,(4)．-56-58,75(D) 为了解决SU-8光刻胶电铸金属模具中遇到的光刻胶脱落和电铸后去胶难等同题,提出了采用硅橡胶 (PDMS)微复制与电铸毛细管电泳芯片金属模具相结合的新工艺。该方法首先用SU-8光刻胶制备通道阳     

一种高效低成本制作三维聚焦微流沟道的方法

为了使用微流体细胞仪实现对细胞的精确计数,设计和制作了能够真正实现三维聚焦功能的微流沟道。首先用Ansys软件对微流沟道的结构进行了优化设计,利用斜曝光工艺制作了SU-8微流沟道模具;然后利用聚二甲基硅氧烷(PDMS)对SU-8模具进行倒模,得到其负模结构,对负模结构进行表面处理后,进行二次倒模,得到与原SU-8微流沟道结构一致的PDMS复制品;最后用荧光检测方法对封装好的PDMS微流沟道的封装和聚焦效果进行了测试。结果表明:该芯片结构可靠,可以满足进一步的流体聚焦检测要求,采用该方法生产的微流沟道具有生产周期短、成本低、效率高和结构可靠的特点。     

基于硅模具制作的纳米裂纹及应变传感器

纳米裂纹制造技术作为一种非传统的纳米加工技术被应用于纳米线条、纳流控芯片和传感器等众多研究领域,然而纳米裂纹生成的随机性及其图案的不确定性限制了该项技术的发展.利用硅模具以及二次倒模工艺,在聚二甲基硅氧烷(PDMS)基底表面制作相互平行且分布均匀的金纳米裂纹.硅模具上带有利用硅各向异性腐蚀工艺加工出的V型沟槽结构,通过...     

基于石蜡打印的PDMS微流控芯片制备及实验应用

介绍了一种基于数字化石蜡液滴微喷射技术制作微流控芯片的方法及其应用,制作的聚二甲基硅氧烷(PDMS)微流控芯片可用于微液滴的生成和两相流的微混合。实验所需玻璃微喷嘴制备简单、成本低廉。石蜡阳模的形状可自主设计,通过调节驱动电压、驱动频率和加热温度可控制石蜡液滴尺寸及石蜡线宽。利用此方法在石英玻璃基底上打印出石蜡阳模,通过PDMS溶液浇注、固化、倒模、清洗再与石英玻璃基板键合等一系列工艺,最终可实现不同内径、不同流道形状的PDMS芯片,制作过程方便快捷,成品质量较好,设计自由度较高。最终通过调整系统各项参量制作出流道内径约为235μm的PDMS微流控芯片,并利用所制作的十字型流道PDMS微流控芯片生成了微液滴,用螺旋形流道的PDMS微流控芯片完成了亮蓝、柠檬黄两种颜色水溶液的微混合。     

一种聚合物实心微针的制作方法

为实现制作微针加工工艺简单、加工周期短及成本低的目的,提出了一种制作聚合物微针的新方法,这种聚合物微针的制作过程主要包括三个部分:微针原始模具的制作、聚合物微针模具的制作和浇铸工艺复制微针。通过KOH腐蚀液刻蚀晶面为{100}的Si片和紫外线对准光刻SU8胶得到由Si-SU8胶构成的原始模具,再在该模具上注入聚二甲基硅氧烷(PDMS)进行转模,固化脱模后在PDMS微针二级模具表面溅射一层Cu/Cr金属薄膜,然后再注入PDMS,得到最终的聚合物微针模具,对该模具进行浇铸工艺,便可批量制作微针。通过浇注PDMS获得微针初始结构,使针尖和针体合为一体,提高了脱模的可靠性;通过改变设计,能得到不同截面尺寸和长度的微针,因此这种方法具有很高的灵活性。     

用于流式细胞电穿孔的微流控芯片的研究

细胞转染在基因工程、细胞生物学、临床医疗等领域有着十分重要的应用，我们提出一种集成微电极的微流控电穿孔芯片，可实现有效的单细胞电转染，通过微纳制造工艺在玻璃衬底上加工三组叉指微电极和一组平行微电极，利用软光刻工艺制备 PDMS微流体通道层，经表面改性后，将两者键合，形成微流控电穿孔芯片，实验中采用HeLa细胞进行电穿孔操 作，在15Vpp(电压峰峰值)，300ｋＨｚ交流电压下，有效导入荧光染料的活细胞占总数的48.72％，成功实现了单细胞电穿孔。     

基于PDMS薄膜的微透镜制作方法

提出了一种基于聚二甲基硅氧烷(PDMS)薄膜的软模压印制作微透镜的方法。首先,采用具有钝化层的普通硅片作为基底加工出PDMS薄膜;然后,将薄膜粘于刻有对应孔径的硅模板上,薄膜在负压作用下产生凹陷,滴入快速固化的光固化树脂,固化后得到反向的模具作为制备微透镜结构的母板;最后,通过两次复制模具的方法,在PDMS上得到和母板一致的微透镜。实验测试了微透镜的厚度、焦距和成像效果,结果表明所得微透镜具有良好的表面形貌和聚光效果。这种制作方法可以极大地缩短微透镜的加工时间,并降低成本,为制作微透镜提供了一种简捷的方法。     

Fully automated hot embossing processes utilizing high resolution working stamps

Nanoimprint lithography (NIL) is a fast replication technology for structures with sizes ranging from micrometer down to few nanometers range. This paper describes the technology for imprinting of polymer substrates as well as spin-on polymers by using soft working stamp materials. A fully automated hot embossing system, the EVG®750 was built to use this rapid replication processes. By utilizing soft working stamps, we demonstrate the possibility to replicate, in fully automated mode, both high-aspect ratio features in thermoplastic materials as needed for microfluidic lab-on-chip applications as well as high resolution features down to 50 nm in polymer that can be used as templates for pattern transfer in the fabrication of plasmonic substrates for bio-sensing applications.     

Passive alignment method of polymer PLC devices by using a hot embossing technique

A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.     

微流控通道加工技术的研究进展

在微流控芯片中,微通道是进行微分析的重要保证,其成型质量直接影响芯片的分析性能.从加工机理、技术特点以及适用范围等方面对激光直写加工、光刻加工、热压印技术、微细铣削加工和3D打印等微流控通道主要加工方法进行了阐述,并总结了这几种加工技术的优缺点,这为实际生产提供了一定参考.最后,对微流控通道加工技术的发展进行了展望,未...     

微流控芯片热压键合设备的结构设计

以塑料微流控芯片的热压加工技术为基础,以实现自动化和批量化为目标,对芯片热压键合设备的机械结构进行设计研究,在保证芯片受压均匀的情况下,对设备机身的结构、加压方式等进行了分析,确定设备机身采用闭式双立柱结构,上部加压方式,通过力矩电机、螺旋升降机带动压头完成压力输出,并对压头的运动进行导向。实验表明,在热压芯片时,该设备能够将优化的工艺参数复现,制作的芯片质量稳定,一致性好。     

Printing via hot embossing of optically variable images in thermoplastic acrylic lacquer

A novel printing process via hot embossing of either grating or micro-mirror microstructures has been demonstrated in thermoplastic acrylic lacquer. Embossing experiments were performed in the temperature range 100-150 °C and at 80 kN force. The range of microstructures has included a dot-matrix hologram, grating-based optically variable devices (OVDs) and a micro-mirror based OVD. High quality replicas of each type of device have been fabricated using this process. Embossed replicas of grating-based OVDs have shown optical effects including image switching and color movement. For devices based on micro-mirror arrays, the embossed replicas have shown an optically variable switch between a portrait and a non-portrait image. Printing via an embossing process offers the possibility of incorporating optically variable devices into documents without the use of hot stamping foil. This is particularly relevant for documents based on polymeric substrates such as credit cards and polymer banknotes.     

Deformation behavior of solid polymer during hot embossing process

Though hot embossing is a well known technique for the fabrication of polymer based micro-device, the deformation behavior of solid polymer during hot embossing process is not investigated clearly. In this paper, the deformation behavior of solid polymer was observed by two methods, synchronous observation and asynchronous analysis. A finite element simulation and a phenomenological model were used to evaluate the deformation behavior of solid polymer during hot embossing. Results showed that the deformation of solid polymer during embossing process included two stages. One was a stress concentration and strain hardening stage, which occurred during the heating and applying pressure process. The “swallowtails” induced by incomplete filling generate at this stage. The other was a stress relaxation and deformation recovery stage, which occurred during the remaining temperature and pressure process. The “swallowtails” were eliminated at this stage. The second stage was significant for improving replication precision, but it had not been reported before.     

Development of a novel,low-viscosity UV-curable polymer system for UV-nanoimprint lithography

There are two basic types of nanoimprint lithography: hot embossing using thermoplastic or thermosetting polymers and UV-based nanoimprint lithography (UV-NIL) using UV-curable polymer systems. Since the interest in UV-NIL has been constantly increasing within the last years, the need of suitable low-viscosity resists has increased, too. The availability of such materials is one key element of the UV-NIL technology. In this contribution a novel, spin-coatable polymer system for UV-NIL is presented. Suitable polymer components were evaluated using photoDSC analysis. Their ratio was adjusted in such a way that the overall dynamic viscosity of the mixture remained low which was beneficial for the flow behaviour. Film thicknesses in the range of 150–500 nm could be obtained by spin-coating. The new polymer system was characterised in UV-NIL processes and in plasma etching investigations. Imprinted micrometer as well as nanometer scale patterns with feature sizes in the range of 30 nm to several microns are shown.     

热压印中聚合物的研究

在纳米压印技术中,热压印是普遍采用的压印方法。聚合物是压印的媒介,通过对聚合物加热、加压、冷却使聚合物成型,达到转印图形的目的。为了提高热压印技术和压印图形的精度,对聚合物受热后的特性以及聚合物的填充机理进行分析。通过实验得出,聚合物中的气体可以导致聚合物填充不完全,图形产生气泡,严重影响了图形的精度。聚合物的填充速度与模板的图案有关,平坦的模板比带有深孔的模板填充速度快。最后通过参数优化,得出高分辨率的压印图形。     

聚合物微结构超声压印精密加工系统研究

超声压印技术是一种聚合物微结构成形的新方法。针对微米级超声加工系统的高精度和高可靠性的要求,设计了用于聚合物微结构超声压印的精密加工系统,推导了换能器动力学模型并求解特征参数,进行了有限元仿真与优化,并搭建了基于压力反馈的精密压印测控平台。实验结果与理论分析结果吻合,设计的换能器系统改善了微米级加工中的加工精度、能量控制和可靠性,为快速批量精密压印成形的加工系统提供了设计和优化方法。     

Replication of high ordered nano-sphere array by nanoimprint lithography

High ordered nano-sphere array patterns on Si substrate were fabricated using nanoimprint lithography. First, using hot embossing method, poly vinyl chloride (PVC) based polymer replica template was duplicated from original high ordered nano-sphere array patterns, which was fabricated by evaporation method. The monolayer transferring condition can be achieved by varying hot embossing pressure. Then, through UV nanoimprint lithography with the replicated polymer template, imprinted patterns, which has high ordered nano-sphere array patterns, was successfully fabricated on Si and flexible PET substrate.